CN215184686U - Socket with improved structure - Google Patents

Socket with improved structure Download PDF

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Publication number
CN215184686U
CN215184686U CN202121614679.5U CN202121614679U CN215184686U CN 215184686 U CN215184686 U CN 215184686U CN 202121614679 U CN202121614679 U CN 202121614679U CN 215184686 U CN215184686 U CN 215184686U
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China
Prior art keywords
wall
heat sink
heat
capacitor
socket
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Active
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CN202121614679.5U
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Chinese (zh)
Inventor
王冠
成励翊
居志胜
龙海岸
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Ningbo Gongniu Digital Technology Co Ltd
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Ningbo Gongniu Digital Technology Co Ltd
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Priority to CN202121614679.5U priority Critical patent/CN215184686U/en
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Abstract

The utility model relates to the technical field of sockets, in particular to a socket; the socket comprises a shell and a PCBA module, and the PCBA module is arranged in the shell; the PCBA module comprises a PCBA component and a radiating fin, and the radiating fin is matched with the PCBA component and used for guiding out heat generated by the PCBA component; the radiating fins are attached to or distributed opposite to the inner wall of the shell. The utility model discloses a socket can improve the radiating effect.

Description

Socket with improved structure
Technical Field
The utility model relates to a socket technical field particularly, relates to a socket.
Background
In order to meet the increasing power supply requirements of electrical appliances and digital equipment, the socket can generally meet the requirement of increasing the number of hole sites. There are many types of sockets available on the market, and one of them is a polyhedral socket (also called a magic cube socket). Each jack of the socket is distributed on different surfaces of the cube, so that mutual interference when a plurality of electric devices are connected simultaneously is avoided; convenient to carry, novel structure and individuality.
The appearance form of the polyhedral socket puts requirements on the design of an internal structure, is different from the linear structure arrangement of a conventional patch board, and needs to reasonably stack components such as ground, fire, a zero-conduction structure, an insulating part, a protective door (a safety door), a strong and weak electric module, a transformation conversion structure, a USB interface and the like in a smaller volume, so that the polyhedral socket is kept compact and does not waste any space.
However, the polyhedral socket provided by the related art still has the problem of poor heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a socket, it can improve the radiating effect.
The embodiment of the utility model is realized like this:
the utility model provides a socket, include:
a housing;
the PCBA module is arranged in the shell; the PCBA module comprises a PCBA component and a radiating fin, and the radiating fin is matched with the PCBA component and used for guiding out heat generated by the PCBA component; the radiating fins are attached to or distributed opposite to the inner wall of the shell.
In an alternative embodiment, the heat sink is provided with a first mounting space, and the PCBA component comprises a MOS embedded in the first mounting space.
In an alternative embodiment, the heat sink comprises a heat sink body, a first heat dissipation wall and a second heat dissipation wall, wherein the first heat dissipation wall and the second heat dissipation wall are both arranged on the heat sink body, and the heat sink body, the first heat dissipation wall and the second heat dissipation wall jointly enclose a first installation space; the radiating fin body is attached to or distributed opposite to the inner wall of the shell.
In an optional embodiment, the first heat dissipation wall and the second heat dissipation wall are connected at an included angle, and both the first heat dissipation wall and the second heat dissipation wall are connected at an included angle with the heat sink body.
In an alternative embodiment, the heat sink includes a heat sink body and a third heat sink wall, the third heat sink wall being disposed at the heat sink body; the PCBA component also comprises a capacitor, and the capacitor is in contact with the third heat dissipation wall; the radiating fin body is attached to or distributed opposite to the inner wall of the shell.
In an alternative embodiment, the PCBA assembly includes at least two capacitors, and the at least two capacitors are in contact with the two side walls of the third heat dissipation wall, respectively.
In an alternative embodiment, the third heat dissipation wall includes a first wall and a second wall connected at an included angle, a second installation space is formed between the first wall and the second wall, the capacitor is disposed in the second installation space, and the capacitor is in contact with at least one of the first wall and the second wall.
In an optional embodiment, the heat sink body is provided with an explosion-proof hole, and the explosion-proof hole is opposite to the capacitor.
In an alternative embodiment, the heat sink is provided with glue holes.
In an alternative embodiment, the heat sink is provided with solder tails, and the PCBA component is provided with solder tail holes, the solder tails being plugged into the solder tail holes.
The utility model discloses the beneficial effect of socket includes: the socket provided by the embodiment of the utility model comprises a shell and a PCBA module, wherein the PCBA module is arranged in the shell, the PCBA module comprises a PCBA component and a radiating fin, and the radiating fin is matched with the PCBA component and is used for guiding out heat generated by the PCBA component; the radiating fins are attached to or distributed opposite to the inner wall of the shell. Because the heat sink is attached to or relatively distributed with the inner wall of the housing, heat conducted from the PCBA assembly to the heat sink can be reliably conducted to the housing for heat dissipation, and therefore the heat dissipation effect of the socket is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is an exploded schematic view of a socket according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a PCBA assembly in an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a PCBA module according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a heat sink in an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a PCBA module in an embodiment of the present invention;
fig. 6 is an exploded view of a portion of a PCBA module according to an embodiment of the present invention.
Icon: 010-a socket; 100-a housing; 110-a first housing; 120-a second housing; 200-PCBA module; 300-a heat sink; 310-a heat sink body; 311-a first heat dissipation wall; 312-a second heat dissipation wall; 313 — a first installation space; 314-a third heat dissipation wall; 315-a first wall; 316-a second wall; 317-a second installation space; 318-fourth heat dissipation wall; 319-avoidance slot; 321-explosion-proof holes; 322-drilling glue holes; 330-solder leg; 331-a first heat dissipation side plate; 332-a second heat dissipation side plate; 333-a third heat dissipation side plate; 400-a PCBA component; 410-MOS; 420-solder pin holes; 431-a PCB board; 432-a USB circuit board; 441-a first capacitance; 442-a second capacitance; 443-third capacitance; 444-fourth capacitance; a 445-X capacitance; 450-a transformer; 460-mylar flakes; 461-heat sink plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the utility model is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element to be referred must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, the present embodiment provides a socket 010, which may be a polyhedral socket (also called a magic cube socket); of course, the socket 010 may also refer to a conventional strip-shaped patch panel, and is not particularly limited herein.
The socket 010 comprises a housing 100 and a PCBA module 200, wherein the PCBA module 200 is arranged in the housing 100; the PCBA module 200 includes a PCBA component 400 and a heat sink 300, the heat sink 300 is matched with the PCBA component 400 for guiding out heat generated by the PCBA component 400; the heat sink 300 is attached to or opposite the inner wall of the housing 100. Because the heat sink 300 is attached to or distributed opposite to the inner wall of the housing 100, the heat conducted from the PCBA assembly 400 to the heat sink 300 can be reliably conducted to the housing 100 for heat dissipation, thereby improving the heat dissipation effect of the socket 010.
Referring to fig. 1, the structure of the housing 100 may be configured as required, in which the housing 100 of the embodiment includes a first housing 110 and a second housing 120 that are fastened and connected to each other, the PCBA module 200 is disposed between the first housing 110 and the second housing 120, and the heat sink 300 and the side wall of the first housing 110 facing the second housing 120 are attached or distributed relatively, so as to reliably conduct heat to the first housing 110, thereby ensuring reliability of heat dissipation and improving heat dissipation effect. Of course, in other embodiments, the housing 100 may be a cube structure formed by splicing six side plates, the PCBA module is disposed in the mounting space formed by the six side plates, and the heat sink 300 is attached to or distributed opposite to the inner wall of one of the side plates, which is not limited in this respect.
The connection between the first housing 110 and the second housing 120 may be a snap connection or a connection with a fastener such as a screw, and is not particularly limited herein.
In order to ensure the reliability of the PCBA module 200 disposed between the first housing 110 and the second housing 120, the PCBA module 200 may also be snapped, bonded, or connected with fasteners such as screws to at least one of the first housing 110 and the second housing 120, which is not particularly limited herein.
Referring to fig. 2 and 3, the structure of the PCBA assembly 400 is configured as required, the PCBA assembly 400 of the present embodiment includes a PCB 431, a capacitor, a MOS410(Metal-Oxide-Semiconductor Field-Effect Transistor, MOS410, fet), and a USB circuit 432, and the capacitor, the MOS410, and the USB circuit 432 are all disposed on the PCB 431; the heat sink 300 is disposed on the PCB 431, and is engaged with the capacitor and the MOS410, and is used for guiding out heat generated by the capacitor and the MOS410, so as to ensure a good heat dissipation effect.
Optionally, the heat sink 300 is further matched with the USB circuit board 432, so as to simultaneously dissipate the heat generated by the USB circuit board 432, thereby ensuring a good heat dissipation effect.
Referring to fig. 2 and 4, the heat sink 300 of the present embodiment is provided with solder tails 330, the PCBA assembly 400 is provided with solder tail holes 420, and the solder tails 330 are inserted into the solder tail holes 420; this ensures positional reliability of the heat sink 300 in the PCBA package 400, and facilitates positioning of the heat sink 300 during assembly by the solder tails 330 and the solder tail holes 420 that are fitted to each other.
It should be noted that after the solder leg 330 is inserted into the solder leg hole 420, wave soldering may be performed on the solder leg 330, so that the heat sink 300 is reliably disposed on the PCBA assembly 400; because before wave soldering, the positioning is performed through the insertion of the solder leg 330 and the solder leg hole 420, the problems of insufficient solder, missing solder and solder looseness can be effectively solved, so that the reliability of soldering is ensured, and the good performance of the heat conduction performance of the heat sink 300 arranged on the PCBA assembly 400 is ensured.
Referring to fig. 2 and 4, the structure of the heat sink 300 may be set as required, the heat sink 300 of this embodiment includes a heat sink body 310, a first heat-dissipating side plate 331, a second heat-dissipating side plate 332, and a third heat-dissipating side plate 333, the first heat-dissipating side plate 331, the second heat-dissipating side plate 332, and the third heat-dissipating side plate 333 are all connected to the heat sink body 310 at an angle, and one ends of the first heat-dissipating side plate 331, the second heat-dissipating side plate 332, and the third heat-dissipating side plate 333 away from the heat sink body 310 are all provided with a solder leg 330; the number of the solder leg holes 420 arranged on the PCBA assembly 400 is the same as the number of the solder legs 330 arranged on the heat sink 300, and the solder legs 330 and the solder leg holes 420 are correspondingly spliced and matched one by one; the heat sink body 310 is attached to or disposed opposite to an inner wall of the housing 100, and specifically, the heat sink body 310 is attached to or disposed opposite to a side wall of the first casing 110 facing the second casing 120. This configuration further ensures the reliability of the heat sink 300 being provided to the PCBA assembly 400, and contributes to the reliability of the positioning of the heat sink 300; by the adhesion or relative distribution of the heat sink body 310 and the inner wall of the housing 100, the heat sink 300 can reliably conduct heat to the housing 100 for heat dissipation, thereby ensuring the reliability of heat dissipation.
Further, the heat sink body 310 is substantially a quadrilateral plate-shaped structure, the first heat dissipation side plate 331 and the second heat dissipation side plate 332 are distributed at intervals on two opposite sides of the heat sink body 310, the third heat dissipation side plate 333 is located between the first heat dissipation side plate 331 and the second heat dissipation side plate 332, and the extension surface of the first heat dissipation side plate 331 and the extension surface of the second heat dissipation side plate 332 are both perpendicular to the extension surface of the third heat dissipation side plate 333; in this way, the solder fillets 330 respectively disposed on the first heat-dissipating side plate 331, the second heat-dissipating side plate 332, and the third heat-dissipating side plate 333 are distributed in a substantially triangular shape, which is advantageous for ensuring reliable positioning of the heat sink 300 by the insertion of the solder fillets 330 and the solder fillet holes 420, and further ensuring reliability of the heat sink 300 in the PCBA assembly 400.
It should be noted that the solder tail holes 420 are opened on the PCB 431 to avoid interference with the operation and assembly of the capacitor, MOS410, and USB circuit board 432.
Referring to fig. 4 and 5, the heat sink 300 of the present embodiment is provided with a first mounting space 313, and the MOS410 is embedded in the first mounting space 313; this ensures reliability of heat dissipation of MOS410 by heat sink 300.
Further, the heat sink 300 further includes a first heat dissipation wall 311 and a second heat dissipation wall 312, the first heat dissipation wall 311 and the second heat dissipation wall 312 are both disposed on the heat sink body 310, and the heat sink body 310, the first heat dissipation wall 311 and the second heat dissipation wall 312 together enclose a first installation space 313; in this way, the heat generated by the MOS410 embedded in the first mounting space 313 can be simultaneously conducted through the heat sink body 310, the first heat dissipation wall 311, and the second heat dissipation wall 312, thereby further ensuring the reliability of heat dissipation.
Furthermore, the first heat dissipation wall 311 and the second heat dissipation wall 312 are connected at an included angle, and both the first heat dissipation wall 311 and the second heat dissipation wall 312 are connected with the heat dissipation fin body 310 at an included angle; this facilitates reliable installation of the heat sink 300 in the MOS410 by the first mounting space 313 formed between the first heat dissipation wall 311, the second heat dissipation wall 312, and the heat sink body 310, which facilitates heat dissipation on the one hand and positioning of the heat sink 300 when the heat sink 300 is mounted to the PCBA assembly 400 on the other hand.
The included angle between the first heat dissipation wall 311 and the second heat dissipation wall 312, and the included angle between the first heat dissipation wall 311 and the second heat dissipation wall 312 and the heat sink body 310 may be 90 °, 88 °, 92 °, and the like, and are not limited specifically herein.
Note that, in order to further ensure that the heat generated by the MOS410 can be reliably transmitted to the heat sink body 310 through the first heat dissipation wall 311 and the second heat dissipation wall 312, and then transmitted to the housing 100 for heat dissipation, both the first heat dissipation wall 311 and the second heat dissipation wall 312 are attached to the MOS 410.
Furthermore, the MOS410 is further attached to the heat sink body 310, so as to further ensure that heat generated by the MOS410 can be reliably conducted to the housing 100 through the heat sink 300, thereby ensuring a good heat dissipation effect.
With reference to fig. 4 and fig. 5, the heat sink 300 of the present embodiment further includes a third heat dissipating wall 314, wherein the third heat dissipating wall 314 is disposed on the heat sink body 310; the capacitor is in contact with the third heat dissipation wall 314; thus, the heat generated by the capacitor can be reliably conducted to the heat sink body 310 through the third heat sink wall 314 contacting the capacitor, and further conducted to the housing 100 through the heat sink body 310, so as to ensure the reliability of heat dissipation.
Further, the third heat dissipation wall 314 includes a first wall 315 and a second wall 316 connected at an included angle, a second installation space 317 is formed between the first wall 315 and the second wall 316, a capacitor is disposed in the second installation space 317, and the capacitor is in contact with at least one of the first wall 315 and the second wall 316; in this manner, the capacitor located in second mounting space 317 reliably conducts heat through at least one of first wall 315 and second wall 316, thereby ensuring reliability of heat dissipation, and the capacitor located in second mounting space 317 also facilitates positioning of heat spreader 300 when mounted to PCBA assembly 400, thereby ensuring that heat spreader 300 reliably mates with PCBA assembly 400.
The capacitor of the present embodiment is in contact with only the first wall 315 to conduct heat to the heat sink body 310 through the first wall 315; in other embodiments, the capacitor is in contact with both the first wall 315 and the second wall 316, or the capacitor is in contact with only the second wall 316.
It should be noted that the included angle between the first wall 315 and the second wall 316 is substantially 90 °, so that the third heat dissipation wall 314 is substantially L-shaped, and the end of the second wall 316 far from the first wall 315 is connected to the third heat dissipation side plate 333; one end of the third heat-dissipating side plate 333 away from the second wall 316 is connected to one end of the second heat-dissipating wall 312 away from the first heat-dissipating wall 311, and the third heat-dissipating side plate 333 is substantially parallel to and opposite to the first heat-dissipating wall 311. In this manner, the mounting space collectively formed by the first, second, and third heat-dissipating side plates 315, 316, and 333, and the mounting space collectively formed by the third heat-dissipating side plate 333, the second heat-dissipating wall 312, and the first heat-dissipating wall 311, cooperate with various electrical components of the PCBA assembly 400 to ensure reliability and accuracy of assembly.
It should be understood that in other embodiments, the third heat dissipating wall 314 includes only the first wall 315, one end of the first wall 315 is directly connected to the third heat dissipating side plate 333 at an angle, and the second mounting space 317 is formed between the third heat dissipating wall 314 and the third heat dissipating side plate 333.
The number of capacitors included in the PCBA assembly 400 can be set as desired, and the PCBA assembly 400 of this embodiment includes at least two capacitors, and the at least two capacitors are respectively in contact with the side walls on both sides of the third heat dissipation wall 314; in this way, at least two capacitors can reliably conduct heat to the heat sink body 310 through the third heat dissipation wall 314, and further conduct heat to the housing 100 through the heat sink body 310, so as to ensure reliable heat dissipation.
Referring to fig. 5, one of the at least two capacitors is an X capacitor 445 (a capacitor for suppressing power supply emi (X2 (X1/X3/MKP)), and the other one is defined as a first capacitor 441, wherein the X capacitor 445 and the first capacitor 441 are disposed on the PCB 431, the first capacitor 441 is disposed in the second mounting space 317, the first capacitor 441 is in contact with one side of the third heat dissipation wall 314, the X capacitor 445 is in contact with the other side of the third heat dissipation wall 314, specifically, the first capacitor 441 is in contact with one side of the first wall 315, and the X capacitor 445 is in contact with the other side of the first wall 315; in this way, the heat of each capacitor can be reliably conducted through the third heat dissipation wall 314.
With reference to fig. 5, it should be noted that the PCBA assembly 400 of the present embodiment further includes a second capacitor 442, the second capacitor 442 is disposed on the PCB 431, and the second capacitor 442 is located in the second mounting space 317, along the length extension direction of the first wall 315, the first capacitor 441 and the second capacitor 442 are sequentially arranged, and the second capacitor 442 is in contact with the first wall 315; thus, the heat generated by the second capacitor 442 can be reliably conducted to the heat sink body 310 through the first wall 315, thereby ensuring a good heat dissipation effect.
It should be noted that, both the first capacitor 441 and the second capacitor 442 are in contact with one side of the first wall 315, and the X capacitor 445 is in contact with the other side of the first wall 315, so that the first wall 315 can be sandwiched between the X capacitor 445 and the first capacitor 441 and the second capacitor 442, and when the heat sink 300 is assembled, the position where the first wall 315 is disposed can be used for positioning, so as to further ensure the assembly reliability and stability of the heat sink 300, and further ensure a good heat dissipation effect.
Optionally, referring to fig. 4 and 5, PCBA assembly 400 further includes a third capacitor 443 and a fourth capacitor 444, heat sink 300 further includes a fourth heat dissipating wall 318 disposed on heat sink body 310, and the fourth heat dissipating wall 318 and the third heat dissipating side plate 333 are disposed on two opposite sides of heat sink body 310, respectively; along the length extension direction of first wall 315, first capacitor 441, second capacitor 442, and third capacitor 443 are sequentially arranged, fourth capacitor 444 and third capacitor 443 are arranged side by side, first capacitor 441, second capacitor 442, third capacitor 443, and fourth capacitor 444 are substantially L-shaped, and third capacitor 443 and fourth capacitor 444 are both in contact with one side of fourth heat dissipation wall 318, so that heat generated by third capacitor 443 and fourth capacitor 444 can be conducted by fourth heat dissipation wall 318, thereby ensuring reliability of heat dissipation and making PCBA assembly 400 compact.
Further, the extension surface of the fourth heat dissipation wall 318 substantially perpendicularly intersects the extension surface of the first heat dissipation side plate 331 to substantially form an L-shaped structure, so that when the heat sink 300 is assembled, the first heat dissipation side plate 331 and the fourth heat dissipation wall 318 are used for positioning, thereby ensuring the assembly accuracy of the heat sink 300.
Referring to fig. 3, 4 and 5, the heat sink body 310 of the present embodiment is provided with an explosion-proof hole 321, and the explosion-proof hole 321 is opposite to the capacitor. The provision of the explosion proof hole 321 can improve the problem of the explosion-proof machine caused by the defective capacity.
Further, the heat sink body 310 of the present embodiment is provided with four explosion-proof holes 321, the four explosion-proof holes 321 are distributed in an L shape, and the four explosion-proof holes 321 are distributed in one-to-one correspondence with the first capacitor 441, the second capacitor 442, the third capacitor 443, and the fourth capacitor 444; thus, the problem of the fryer can be effectively improved.
Optionally, with continued reference to fig. 3, 4 and 5, the PCBA assembly 400 further includes a transformer 450, the transformer 450 is disposed on the PCB 431 and located in a space enclosed between the third heat dissipating wall 314 and the third heat dissipating side plate 333, and the transformer 450 is in contact with the second heat dissipating side plate 332; thus, the heat generated by the transformer 450 can be reliably transferred to the heat sink body 310 by the second heat-dissipating side plate 332, and then transferred to the housing 100 through the heat sink body 310, thereby ensuring a good heat-dissipating effect.
It should be noted that, in the present embodiment, the first radiating side plate 331, the second radiating side plate 332, the third radiating side plate 333, the first radiating wall 311, the second radiating wall 312, the third radiating wall 314 and the fourth radiating wall 318 are all integrally formed with the heat sink body 310; in other embodiments, the first heat dissipation side plate 331, the second heat dissipation side plate 332, the third heat dissipation side plate 333, the first heat dissipation wall 311, the second heat dissipation wall 312, the third heat dissipation wall 314, and the fourth heat dissipation wall 318 may also be welded to the heat sink body 310, which is not limited in particular.
It should be further noted that the MOS410, the capacitor, and the transformer 450 may also be in contact with the heat sink body 310, so as to directly conduct heat to the heat sink body 310, thereby ensuring reliability of heat dissipation.
Optionally, referring to fig. 3 and 5, an avoiding groove 319 is formed on a side of the heat sink body 310 of the embodiment, the USB circuit board 432 is inserted into the avoiding groove 319, and the USB circuit board 432 contacts with a groove wall of the avoiding groove 319, so that heat generated by the USB circuit board 432 is reliably transferred to the heat sink body 310.
Referring to fig. 3 and 5, the heat sink 300 of the present embodiment is provided with a glue applying hole 322, the glue applying hole 322 is used for filling the PCBA assembly 400 with the heat conductive glue, so that the heat generated by the PCBA assembly 400 can be conducted to the heat sink 300 through the heat conductive glue, thereby ensuring a good heat dissipation effect.
Further, the gluing hole 322 is formed in the heat sink body 310; so set up, be favorable to filling PCBA subassembly 400 with heat-conducting glue from last to down, and then be favorable to ensureing even, abundant the filling of heat-conducting glue, and then ensure heat conduction effect reliably.
The number of the glue applying holes 322 can be set as required, and the heat sink body 310 of the present embodiment is provided with three glue applying holes 322, wherein two glue applying holes 322 are arranged at intervals along the length extending direction of the fourth heat dissipating wall 318 and located between the third explosion-proof hole 321 and the second explosion-proof hole 321, and the other glue applying hole 322 is arranged adjacent to the third heat dissipating side plate 333; in this way, the thermal paste injected into the PCBA assembly 400 through the glue holes 322 is uniformly distributed, and heat is reliably conducted, thereby achieving a good heat dissipation effect.
In other embodiments, the number of the glue applying holes 322 may also be one, two, four, etc., and is not limited herein.
It should be understood that in other embodiments, the gluing hole 322 may also be disposed on the first heat dissipation side plate 331, the second heat dissipation side plate 332, the third heat dissipation side plate 333, and the like, which are not particularly limited herein.
Referring to fig. 6, the PCBA module 200 of the present embodiment further includes a mylar sheet 460 and a heat dissipation plate 461, wherein the mylar sheet 460 is disposed on a side of the PCB 431 away from the heat dissipation plate 300, and the heat dissipation plate 461 is disposed on a side of the mylar sheet 460 away from the PCB 431. It should be noted that the mylar film 460 and the heat dissipation plate 461 are arranged in a similar manner as in the related art, and are not described again here.
The assembling process of the socket 010 of the present embodiment includes: assembling heat sink 300 to the PBCA assembly such that solder tails 330 are inserted into solder tail holes 420, and then performing wave soldering at solder tails 330; then the Mylar film 460 and the heat dissipation plate 461 are sequentially assembled on the PCBA assembly 400 and welded; injecting heat-conducting glue into the PCBA assembly 400 through the glue injection hole 322 to form the PCBA module 200; the PCBA module 200 is then disposed within the housing 100.
To sum up, the utility model provides a socket 010 has good radiating effect, can be favorable to improving components and parts such as explode machine, short circuit, burn out MOS410, unable work scheduling problem.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A socket, comprising:
a housing;
a PCBA module disposed within the housing; the PCBA module comprises a PCBA component and a radiating fin, and the radiating fin is matched with the PCBA component and used for guiding out heat generated by the PCBA component; the radiating fins are attached to or distributed opposite to the inner wall of the shell.
2. The socket of claim 1, wherein the heat sink is provided with a first mounting space, the PCBA component comprising a MOS, the MOS being embedded in the first mounting space.
3. The socket of claim 2, wherein the heat sink comprises a heat sink body, a first heat sink wall and a second heat sink wall, the first heat sink wall and the second heat sink wall are both disposed on the heat sink body, and the heat sink body, the first heat sink wall and the second heat sink wall together enclose the first mounting space; the radiating fin body is attached to or distributed opposite to the inner wall of the shell.
4. The socket of claim 3, wherein the first and second heat dissipating walls are angled to each other, and wherein the first and second heat dissipating walls are angled to each other with respect to the heat sink body.
5. The socket of claim 1 wherein said heat sink includes a heat sink body and a third heat sink wall, said third heat sink wall being disposed on said heat sink body; the PCBA component further comprises a capacitor, and the capacitor is in contact with the third heat dissipation wall; the radiating fin body is attached to or distributed opposite to the inner wall of the shell.
6. The socket of claim 5, wherein the PCBA assembly includes at least two capacitors, and at least two capacitors are in contact with two side walls of the third heat sink wall, respectively.
7. The socket of claim 5, wherein the third heat dissipating wall comprises a first wall and a second wall connected at an included angle, a second mounting space is formed between the first wall and the second wall, the capacitor is disposed in the second mounting space, and the capacitor is in contact with at least one of the first wall and the second wall.
8. The socket of claim 5, wherein the heat sink body defines an explosion-proof hole, the explosion-proof hole being opposite to the capacitor.
9. A socket according to any one of claims 1 to 8, wherein the heat sink is provided with glue holes.
10. A socket according to any one of claims 1 to 8, wherein the heat sink is provided with solder tails and the PCBA component is provided with solder tail holes into which the solder tails are inserted.
CN202121614679.5U 2021-07-15 2021-07-15 Socket with improved structure Active CN215184686U (en)

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Application Number Priority Date Filing Date Title
CN202121614679.5U CN215184686U (en) 2021-07-15 2021-07-15 Socket with improved structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121614679.5U CN215184686U (en) 2021-07-15 2021-07-15 Socket with improved structure

Publications (1)

Publication Number Publication Date
CN215184686U true CN215184686U (en) 2021-12-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121614679.5U Active CN215184686U (en) 2021-07-15 2021-07-15 Socket with improved structure

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Country Link
CN (1) CN215184686U (en)

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