CN214708464U

CN214708464U - Controller

Info

Publication number: CN214708464U
Application number: CN202120865854.1U
Authority: CN
Inventors: 廖志俊
Original assignee: Bosch Automotive Products Suzhou Co Ltd
Current assignee: Bosch Automotive Products Suzhou Co Ltd
Priority date: 2021-04-26
Filing date: 2021-04-26
Publication date: 2021-11-12
Anticipated expiration: 2031-04-26

Abstract

A controller, comprising: a housing defining a mounting space, the housing having a protrusion on an inner sidewall thereof; a heat radiation base enclosing the installation space in a first direction, the heat radiation base having a bottom surface and a heat conduction portion protruding from the bottom surface; a printed circuit board mounted in the mounting space, the heat conduction portion being located on a side of the printed circuit board facing the bottom surface of the heat dissipation base in the first direction; and the field effect tubes are fixed on the printed circuit board and are respectively arranged between the protruding part and the heat conducting part in an interference fit manner. The printed circuit board of the controller has a large using area, is low in cost and provides better holding force and improves heat conduction efficiency.

Description

Controller

Technical Field

The utility model relates to a controller field especially relates to a controller for electronic equipment of riding.

Background

The controller is a core component of the electric riding device. The input end and the output end of the controller are respectively connected with the storage battery and the motor and are used for converting the direct current output by the storage battery into alternating current in an inverted mode so as to drive the motor to work. Electronic components with high power, such as metal-oxide semiconductor field effect transistors (MOSFETs), in the controller generate a large amount of heat during operation, so that the heat dissipation characteristic of the controller is an important point in the design of the controller. In the existing scheme, the MOSFET tube is horizontally arranged on the outer side of the printed circuit board and above the heat conducting mountain, and is pressed on the heat conducting mountain from top to bottom through the controller shell; or the MOSFET is vertically arranged above the printed circuit board and on the inner side of the heat conducting mountain in a standing mode, and the MOSFET is pressed on the heat conducting mountain from inside to outside through the spring plates.

In the first method, the compression of the MOSFET tube is performed after the controller housing is mounted, which may result in a blind mounting situation, and the resulting mounting error may result in insufficient compression force. The second approach requires a correspondingly higher height of the thermal bumps to accommodate the vertical standing MOSFET tubes, which is detrimental to the rapid heat transfer to the heat sink base, and the use of the spring also increases the cost of the controller. In both of the above two ways, part of the structure is located on the side of the printed circuit board, which reduces the usable area of the printed circuit board, and the use of a large-sized printed circuit board increases the size of the controller.

Therefore, there is a need to overcome the problems of the prior art.

SUMMERY OF THE UTILITY MODEL

The purpose of the application is to overcome the defects and solve the problem that the heat dissipation performance of the controller with the MOSFET is poor. The method is realized by the following scheme:

there is provided a controller comprising:

the shell defines a mounting space, and the inner side wall of the shell is provided with a protruding part;

a heat dissipation base enclosing an installation space in a first direction, the heat dissipation base having a bottom surface and a heat conduction portion protruding from the bottom surface;

a printed circuit board mounted in the mounting space, the heat conduction portion being located on a side of the printed circuit board facing a bottom surface of the heat dissipation base in the first direction;

and the field effect transistors are positioned between the printed circuit board and the bottom surface of the heat dissipation base and fixed on the printed circuit board, and are respectively arranged between the protruding part and the heat conduction part in an interference fit manner with the protruding part.

Further, the heat conducting portion has a heat conducting wall, the field effect transistor has a pin soldered to the printed circuit board and a package body connected to the pin, the package body has a package face and a heat radiating face which are arranged oppositely, the heat radiating face is arranged to face the heat conducting wall, and the protruding portions are pressed against the package faces of the plurality of field effect transistors respectively so that the heat radiating faces of the plurality of field effect transistors are pressed against the heat conducting wall.

Further, the case has an opening communicating with the mounting space, the heat dissipation base closes the opening in the first direction, the printed circuit board is substantially perpendicular to the first direction, the heat conduction wall extends on the bottom surface in a second direction perpendicular to the first direction, and the heat conduction wall is substantially parallel to the mounting direction.

Further, the protruding portion includes a plurality of convex strips that extend on the inside wall of casing along the installation direction, a plurality of convex strips along the second direction is arranged at intervals each other.

Further, the convex strip extends to the top wall of the shell on the inner side wall of the shell, and the convex strip is provided with a guide bevel angle at the end far away from the top wall.

Furthermore, the field effect transistors are sequentially fixed on the printed circuit board along a direction perpendicular to the mounting direction, and the packaging body exceeds the edge of the printed circuit board in the first direction.

Further, in the controller according to any of the above claims, an insulating thermal pad is provided between the heat dissipation surface of the fet and the thermal conductive wall.

Furthermore, the heat dissipation base is also provided with a plurality of upright posts which are provided with screw holes and are formed by the bottom surface of the heat dissipation base and/or the heat conducting part in a protruding mode, and the printed circuit board is fixedly arranged on the upright posts through mutual matching of screws and the screw holes.

Further, the heat dissipation base, the heat conduction portion, and the pillar are integrally formed by die-casting an aluminum alloy.

Further, the controller according to any one of the preceding claims, wherein the controller is applied to an electric riding device, the controller comprises a plurality of binding posts, one ends of the binding posts are fixed on the printed circuit board, the other ends of the binding posts extend out of the housing, and the controller electrically contacts and fixes the binding post for connecting the battery and the motor to the end of the binding post extending out of the other end of the housing through a fastener.

As can be seen from the above description, the controller of the embodiment of the present application realizes a large use area of the printed circuit board by designing the field effect transistor and the heat dissipation portion below the printed circuit board; simultaneously through the interference fit of the sand grip on field effect transistor and the casing inner wall, lean on each field effect transistor respectively on the heat conduction portion, provide better holding power and improved heat conduction efficiency. In addition, no additional reed structure is required to tightly hold the fet on the heat conducting portion, saving cost and improving assembly efficiency.

Drawings

The features, characteristics, advantages and benefits of the present invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings.

FIG. 1 illustrates a partially cut-away schematic diagram of a controller, according to one embodiment;

FIG. 2 is an exploded view of the controller of FIG. 1;

FIG. 3 is a perspective view of the housing of the controller of FIG. 2;

fig. 4 is a schematic diagram showing a cross-sectional structure of the controller in fig. 1.

Detailed Description

Some embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 4, a controller of an embodiment is shown, which is applied to an electric riding device such as an electric bicycle, a two-wheeled electric vehicle, and the like. The electric riding device is powered by a battery (such as a storage battery) to enable a motor (of a direct current type, an alternating current type, a series excitation type, a separate excitation type and the like) to drive the electric riding device to run. Referring to fig. 1 to 3, the controller 100 includes a controller housing 10, a heat sink 11, a printed circuit board 12, and a plurality of fets 13. Wherein, the housing 10 comprises a top wall 103 and a side wall extending along the edge of the top wall 103 for defining an installation space, the housing 10 has an opening communicating with the installation space, and the top wall 103 has a plurality of openings 101 communicating with the installation space. The inner side wall 102 of the housing 10 has a protrusion. The heat radiation base 11 closes the opening in the first direction D1. The heat dissipating base 11 has a heat conducting portion 112 protruding from a bottom surface 111 of the heat dissipating base 11, the heat conducting portion 112 has a heat conducting wall 113, and an insulating heat conducting pad 115 is disposed on the heat conducting wall 113. The heat conduction portion 112 further has a plurality of posts 114 protruded from the heat conduction portion 112, the ends of the posts 114 have screw holes, and further, the posts 114 are protruded from the bottom surface 111 of the heat dissipation base 11, and the printed circuit board 12 is fixed to the posts 114 by mutual engagement of the screws and the screw holes, whereby the printed circuit board 12 is mounted in the mounting space substantially perpendicularly to the first direction D1. The heat conduction portion 112 is located on a side of the printed circuit board 12 facing the bottom surface 111 of the heat dissipation base 11 in the first direction D1, that is, between the printed circuit board 12 and the bottom surface 111 of the heat dissipation base 11. In the present embodiment, the heat conduction portion 112 is not disposed between the printed circuit board 12 and the inner sidewall 102, that is, the heat conduction portion 112 is not disposed at the side of the printed circuit board 12, which can make the printed circuit board 12 have a large usable area. In the present embodiment, the heat radiation base 11, the heat conduction portion 112, the heat conduction wall 113, and the pillar 114 are integrally formed by die-casting an aluminum alloy.

The printed circuit board 12 includes an aluminum substrate, a copper-clad substrate, which are metal insulating substrates, and electronic components such as terminals, capacitors, power tubes, and the like, which are provided on the printed circuit board 12. Wherein, one end of the binding post (not shown in the figure) is fixed on the printed circuit board 12 and is electrically connected with the conductive trace in the copper-clad plate. The other end of the terminal post extends out of the opening 101 of the housing 10 and is electrically connected and fixed to a terminal for connection to an external device by a fastener such as a screw, a clip, or a spring. The terminals are used for transmitting large current, and the controller 100 is electrically connected to other parts of the riding device through the terminals. In this embodiment, the controller includes five terminals, two of the terminals are electrically connected to the positive and negative electrodes of the battery, and the remaining three terminals are electrically connected to the three-phase terminal UVW of the motor, respectively.

In addition, a plurality of field effect transistors 13 are fixed on the printed circuit board 12 and electrically connected to the conductive traces in the copper clad laminate. As shown, each of the nine fets is mounted in a row at two opposite edges of the pcb 12. The fet 13 has a plurality of pins 131 and a package connected to the pins 131, the package having a package surface 132 and a heat dissipation surface 133 disposed opposite to each other, and the fet 13 is fixed to the printed circuit board 12 by fixing the pins 131 to the printed circuit board 12 by soldering such as wave soldering. As shown in fig. 1 and 2, after the fet 13 is fixed to the printed circuit board 12, the fet 13 is located between the printed circuit board 12 and the bottom surface 111 of the heat sink base 11. And the package surface 132 and the heat dissipation surface 133 of the fet 13 are substantially parallel to the first direction D1, i.e., the fet 13 stands upright on the bottom surface of the printed circuit board 12. Further, the package face 132 of the package body exceeds the edge of the printed circuit board 12 in the first direction D1.

With continued reference to fig. 2, in the present embodiment, the heat-conducting wall 113 extends on the bottom surface 111 in a second direction D2 perpendicular to the first direction D1, and the heat-conducting wall 113 is substantially parallel to the first direction D1. When the fet 13 is fixed to the printed circuit board 12, the fet 13 is positioned between the heat-conducting wall 113 and the housing 10, and the heat-radiating surface 133 of the fet 13 is disposed facing the heat-conducting wall 113. The plurality of fets 13 are respectively in interference fit with the plurality of protrusions provided on the inner sidewall 102 so that the plurality of fets 13 are pressed against the heat-conducting wall 113 by the plurality of protrusions. Specifically, referring to fig. 3, fig. 3 shows a perspective view of the housing 10. The two inner side walls 102 of the housing 10 are opposite to each other, and each of the two inner side walls 102 includes nine protruding strips 104 extending on the inner side wall 102 along the first direction D1, and the nine protruding strips 104 are arranged at intervals along the second direction D2. Ribs 104 extend on inner side wall 102 to top wall 103 of housing 10, ribs 104 having guide bevels 105 at the end remote from top wall 103 (i.e., the end near the opening of housing 10). The ribs 104 face the fets 13 secured along the edges of the pcb.

When assembling the controller 100, the printed circuit board assembly having the terminals, the fets 13 and other electronic components mounted thereon as described above is first mounted on the heat sink 11 in the first direction D1, and the printed circuit board 12 is mounted in the mounting space by the bolts and the posts 114 protruding from the bottom surface 111 of the heat sink 11 and the heat conductive portions 112 respectively. At this time, the heat radiation surface 133 of the fet 13 faces the heat conduction wall 113 of the heat conduction portion 112.

Referring next to fig. 4, after the pcb assembly is assembled, the housing 10 is mounted on the heat sink base 11 along the first direction D1, and during the mounting process, the sealing surface 132 extends beyond the edge of the pcb 12 along the first direction D1, so that the guiding bevel 105 of the rib 104 first contacts the fet 13, and then the rib 104 is completely pressed against the sealing surface 132 of the fet 13 when the housing 10 is mounted on the heat sink base 11, guided by the guiding bevel 105. The heat radiating surface 133 of the fet 13 is pressed against the heat conducting wall 113 while the ribs 104 are pressed against it. Further, an insulating thermal pad 115 is disposed between the heat dissipating surface 133 and the thermal wall 113, the thermal pad 115 may be made of, for example, silicone material, the thermal pad 115 is used to fill the air gap between the heat dissipating surface 133 and the thermal wall 113 to achieve a good thermal conduction effect, and as described above, the fet 13 is tightly pressed against the thermal wall 113, and the heat generated by the fet 13 during the operation of the controller 100 is transferred to the thermal wall 113 and the thermal conductive portion 112 through the thermal pad 115 until the heat is dissipated to the external space through the heat dissipating base 11.

According to the above description, compared with the prior art, the controller 100 of the embodiment of the present application implements unrestricted printed circuit board by designing the fet and the heat dissipation portion below the printed circuit board, so that the printed circuit board has a larger usable area, and at the same time, a space for placing the heat conduction portion is reserved, and the heat conduction portion with large thickness is beneficial to quickly transferring heat to the heat dissipation base for discharging; meanwhile, each field effect tube is pressed against the heat conducting part through the interference fit of the field effect tube and the raised lines on the inner side wall of the shell, so that better holding force is provided, and the heat conducting efficiency is improved; in addition, the present controller 100 does not require an additional reed structure to tightly hold the fet on the heat conducting portion, saving cost and improving assembly efficiency.

Modifications and substitutions to the details may be made by those skilled in the art without departing from the spirit and scope of the invention. The scope of protection of the present invention is limited only by the claims.

Claims

1. A controller, comprising:

and the field effect transistors are fixed on the printed circuit board and are respectively arranged between the protruding part and the heat conducting part in an interference fit manner.

2. The controller of claim 1, wherein the thermal conductive portion has a thermal conductive wall, the fet has a pin soldered to the printed circuit board and a package connected to the pin, the package has an oppositely disposed package face and a heat dissipation face, the heat dissipation face is disposed toward the thermal conductive wall, and the protrusion presses against the package face of the plurality of fets such that the heat dissipation face of the plurality of fets is pressed against the thermal conductive wall.

3. The controller according to claim 2, wherein the housing has an opening communicating with the mounting space, the heat-dissipating base closes the opening in the first direction, the printed circuit board is substantially perpendicular to the first direction, the heat-conducting wall extends on the bottom surface in a second direction perpendicular to the first direction, and the heat-conducting wall is substantially parallel to the first direction.

4. The controller of claim 3, wherein the protrusion comprises a plurality of ribs extending along the first direction on an inner sidewall of the housing, the plurality of ribs being spaced apart from each other along the second direction.

5. The controller of claim 4, wherein the rib extends on an inner side wall of the housing to a top wall of the housing, the rib having a guide bevel at an end remote from the top wall.

6. The controller of claim 5, wherein the plurality of fets are sequentially secured to the pcb along an edge of the pcb facing the plurality of ribs, the encapsulant extending beyond the edge of the pcb in the first direction.

7. The controller of claim 2, wherein the heat dissipating surface of the fet and the thermally conductive wall have an insulating thermally conductive pad therebetween.

8. The controller of claim 7, wherein said heat sink base further comprises a plurality of posts having screw holes protruding from a bottom surface of said heat sink base and/or said heat conductive portion, said printed circuit board being fastened to said posts by means of screws engaged with said screw holes.

9. The controller of claim 8, wherein the heat sink base, the heat conducting portion and the post are integrally die cast from an aluminum alloy.

10. The controller according to any one of claims 1 to 9, applied to an electric riding device, comprising a plurality of terminals, one end of which is fixed to the printed circuit board, and the other end of which protrudes out of the case, wherein the controller electrically contacts and fixes a terminal connecting a battery and a motor to an end of the terminal protruding out of the other end of the case by a fastener.