CN218679491U

CN218679491U - Controller for interconnecting circuit boards

Info

Publication number: CN218679491U
Application number: CN202222120821.1U
Authority: CN
Inventors: 尹智斌; 廖声礼; 陈昌中; 陈海; 王星瑞; 刘爽
Original assignee: Gree Electric Appliances Inc of Zhuhai; Gree Wuhan Electric Appliances Co Ltd
Current assignee: Gree Electric Appliances Inc of Zhuhai; Gree Wuhan Electric Appliances Co Ltd
Priority date: 2022-08-11
Filing date: 2022-08-11
Publication date: 2023-03-21
Anticipated expiration: 2032-08-11

Abstract

The utility model provides a controller of circuit board interconnection belongs to circuit board technical field, and this controller includes the main part, is provided with circuit board subassembly in the main part. The circuit board assembly comprises a first circuit board and a second circuit board which are perpendicular to each other, wherein a bonding pad is arranged on the first circuit board, and a welding leg is arranged on the second circuit board; the second circuit board is inserted on the first circuit board, and a welding spot is formed between the welding pad and the welding foot, so that the second circuit board and the first circuit board form an integral structure. The two circuit boards of the controller are mutually spliced and then welded and fixed, so that the connection is stable and reliable; and the welding steps in the production process are few, so that the material can be saved, and the production efficiency can be improved.

Description

Controller for interconnecting circuit boards

Technical Field

The utility model relates to a circuit board technical field especially relates to a controller of circuit board interconnection.

Background

In line controllers are the end points and the interface devices of modems on the communication lines, typically for remote terminals or intelligent terminals. One or more circuit boards are arranged in the circuit controller to realize different function control. The different circuit boards need to be connected to each other for integration. The connections between the different circuit boards are usually made by connecting wires or pin sockets. The connecting wire is troublesome to connect and has the risk of easy falling; the pin base is connected without inserting wires, but the pin base needs to be welded on different circuit boards respectively, so that the welding steps are more, and the high-efficiency production is not facilitated.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems in the related art, the utility model aims to provide a controller with interconnected circuit boards, two circuit boards of the controller are mutually spliced and then welded and fixed, and the connection is stable and reliable; and the welding steps in the production process are few, so that the material can be saved, and the production efficiency can be improved.

A controller for interconnection of circuit boards comprises a main body, wherein a circuit board assembly is arranged in the main body and comprises a first circuit board and a second circuit board which are perpendicular to each other, a welding disc is arranged on the first circuit board, and a welding leg is arranged on the second circuit board; the second circuit board is inserted on the first circuit board, and a welding point is formed between the welding pad and the welding leg, so that the second circuit board and the first circuit board form an integral structure.

In the preferred technical solution of the present invention, the first circuit board is provided with a jack, and the edge of the jack is provided with a plurality of pads; the second circuit board is provided with a plug-in end matched with the jack, and the plug-in end is provided with a plurality of welding feet corresponding to the welding pads;

when the inserting end is inserted into the inserting hole, the plurality of welding pads are respectively in one-to-one correspondence with the plurality of welding feet, and the distance between any one welding pad and the corresponding welding foot is 0.1mm-0.3mm.

The utility model discloses in the technical scheme of preferred, the end of pegging graft is including the first cooperation portion and the second cooperation portion that connect gradually, a lateral wall of first cooperation portion with the second circuit board is connected, the cross sectional area of first cooperation portion is greater than the cross sectional area of second cooperation portion, the leg sets up on the second cooperation portion.

In the preferred technical solution of the present invention, the side wall of the first engaging portion is provided with a limiting protrusion, and the insertion hole is provided with a limiting groove adapted to the limiting protrusion;

when the inserting end is inserted into the inserting hole, the limiting convex strip is embedded into the limiting groove.

In the preferred embodiment of the present invention, the cross section of the limiting protrusion strip is in the shape of a semicircle, a rectangle or a triangle.

The utility model discloses in the technical scheme of preferred, each the pad structure is the same, and each the pad all includes interconnect's soldering segment, two the soldering segment is parallel to each other and dislocation connection.

The utility model discloses in the technical scheme of preferred, the pad with in the solder joint between the leg, will through wave-soldering first circuit board with second circuit board interconnect.

In the preferred technical solution of the present invention, the main body is provided with a heat dissipating plate, the heat dissipating plate comprises a first plate and a second plate which are connected with each other, a side wall of the first plate is connected with the first circuit board, and a side wall of the second plate is connected with the second circuit board; and the first plate body and the second plate body are both provided with radiating fins.

In the preferred technical solution of the present invention, a heat dissipation fan is disposed in the main body, and the heat dissipation fan is disposed toward the heat dissipation plate; the side wall of the main body is provided with heat dissipation holes, and the heat dissipation holes are located on one side of the circuit board assembly.

The utility model has the advantages that:

the utility model provides a pair of controller of circuit board interconnection is provided with circuit board subassembly in the main part of this controller. The circuit board assembly comprises a first circuit board and a second circuit board which are perpendicular to each other, the two circuit boards respectively realize different control functions, and the applicability of the controller is improved. The first circuit board is provided with a welding pad, the second circuit board is provided with a welding leg, the second circuit board is inserted into the first circuit board, a welding spot is formed between the welding pad and the welding leg, and the second circuit board and the first circuit board form an integral structure after wave soldering on the welding spot. The two circuit boards are welded and fixed after being mutually inserted, and switching intermediary materials such as connecting wires, needle seats and the like are not needed, so that the stability and reliability of connection among different circuit boards are ensured, the welding steps can be simplified, the materials are saved, and the production efficiency is improved.

Drawings

Fig. 1 is a schematic structural diagram of a controller interconnected by circuit boards according to the present invention;

fig. 2 is a perspective view of a circuit board assembly provided by the present invention;

fig. 3 is an exploded view of a circuit board assembly provided by the present invention;

fig. 4 is a schematic structural diagram of a bottom portion of a first circuit board provided by the present invention;

fig. 5 is a schematic structural view of the mating of the plug terminal and the jack provided by the present invention.

Reference numerals:

1. a main body; 11. a heat radiation fan; 12. heat dissipation holes; 13. a heat dissipation plate; 14. a heat dissipating fin; 100. a circuit board assembly; 110. a first circuit board; 120. a second circuit board; 130. welding spots; 140. a jack; 150. a plug end; 160. welding feet; 1401. a limiting groove; 1402. a bonding pad; 1501. a first fitting portion; 1502. a second fitting portion; 1503. limiting convex strips; 14022. and (7) welding.

Detailed Description

Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present invention have been illustrated in the accompanying drawings, it is to be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, the first information may also be referred to as second information, and similarly, the second information may also be referred to as first information, without departing from the scope of the present invention. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

As shown in fig. 1 to 5, the controller for interconnection of circuit boards claimed in the present application includes a main body 1, a circuit board assembly 100 is disposed in the main body 1, the circuit board assembly 100 includes a first circuit board 110 and a second circuit board 120 perpendicular to each other, a pad 1402 is disposed on the first circuit board 110, and a solder foot 160 is disposed on the second circuit board 120; the second circuit board 120 is plugged onto the first circuit board 110, and a solder joint 130 is formed between the solder pad 1402 and the solder tail 160, so that the second circuit board 120 and the first circuit board 110 form an integral structure.

Specifically, the first circuit board 110 is provided with an insertion hole 140, a plurality of pads 1402 are disposed at edges of the insertion hole 140, and the pads 1402 are disposed at edges of two opposite sidewalls of the insertion hole 140. The second circuit board 120 is provided with a plugging terminal 150 adapted to the plug 140, and the plugging terminal 150 is provided with a plurality of solder fillets 160 corresponding to the solder pads 1402. During the installation process, the insertion terminal 150 is inserted into the insertion hole 140, so as to realize the primary fixation of two different circuit boards.

When the inserting end 150 is inserted into the inserting hole 140, the two circuit boards are preliminarily fixed to each other, the plurality of bonding pads 1402 correspond to the plurality of solder tails 160 one by one, and the distance between any one bonding pad 1402 and the corresponding solder tail 160 is 0.1mm-0.3mm. In a more specific embodiment, in the solder joint 130 between the solder pad 1402 and the solder foot 160, the first wiring board 110 and the second wiring board 120 are connected to each other by wave soldering. After wave soldering is completed, solder paste is filled between the bonding pad 1402 and the solder tail 160, so that the connection of the two circuit boards is completed. In practical applications, the bonding pad 1402 and the solder foot 160 are made of copper.

In the controller interconnected by the circuit board, the circuit board assembly 100 is arranged in the main body 1 of the controller. The circuit board assembly 100 includes a first circuit board 110 and a second circuit board 120 perpendicular to each other, and the two circuit boards respectively realize different control functions, thereby improving the applicability of the controller. The first circuit board 110 is provided with a bonding pad 1402, the second circuit board 120 is provided with a leg 160, the second circuit board 120 is inserted into the first circuit board 110, and a solder joint 130 is formed between the bonding pad 1402 and the leg 160, so that the second circuit board 120 and the first circuit board 110 form an integral structure. The two circuit boards are welded and fixed after being mutually inserted, and switching intermediary materials such as connecting wires, needle seats and the like are not needed, so that the stability and reliability of connection among different circuit boards are ensured, the welding steps can be simplified, the materials are saved, and the production efficiency is improved.

In a better embodiment, the plug-in terminal 150 includes a first mating portion 1501 and a second mating portion 1502 connected in sequence, a sidewall of the first mating portion 1501 is connected to the second circuit board 120, a cross-sectional area of the first mating portion 1501 is larger than a cross-sectional area of the second mating portion 1502, and the solder tail 160 is disposed on the second mating portion 1502. The first mating portion 1501, the second mating portion 1502 and the second circuit board 120 are integrated, and the solder disposed on the second mating portion 1502 is electrically connected to the circuit of the second circuit board 120, so that the first circuit board 110 and the second circuit board 120 are connected to each other after the solder pads 1402 are connected to the solder fillets 160. The shape of the insertion hole 140 is matched with the shape of the insertion end 150, that is, hole sites matched with the first matching portion 1501 and the second matching portion 1502 are arranged on the insertion hole 140, and different hole sites play a role in axially positioning the second circuit board 120, so that the second circuit board 120 is accurately positioned by being inserted on the first circuit board 110.

Further, a limit convex strip 1503 is arranged on the side wall of the first matching part 1501, and a limit groove 1401 matched with the limit convex strip 1503 is arranged in the insertion hole 140; more specifically, the cross section of the limiting convex strip 1503 is in the shape of a semicircle, a rectangle or a triangle. When the plug end 150 is inserted into the insertion hole 140, the limiting convex strip 1503 is embedded into the limiting groove 1401.

The limiting convex strip 1503 is arranged along the height direction of the inserting end 150, plays a role in positioning the connection of the two circuit boards, and is beneficial to improving the connection precision between the two circuit boards.

In a preferred embodiment, each of the pads 1402 has the same structure, and each of the pads 1402 includes two welding segments 14022 connected to each other, and the two welding segments 14022 are parallel to each other and are connected with each other in a staggered manner. The solder pad 1402 of the present application includes different solder segments 14022, and when the fillet 160 and the solder pad 1402 are soldered to each other, the molten solder is dispersed on the different solder segments 14022 of the solder pad 1402, the molecular tension of the solder is also dispersed on the different solder segments 14022, and the contraction amplitude of the solder on the solder pad 1402 is reduced, which can reduce the occurrence of the empty soldering phenomenon.

Further, a heat dissipation plate 13 is arranged in the main body 1, the heat dissipation plate 13 includes a first plate body and a second plate body that are connected with each other, one side wall of the first plate body is connected with the first circuit board 110, and one side wall of the second plate body is connected with the second circuit board 120; the first plate body and the second plate body are both provided with radiating fins 14. The heat dissipation plate 13 is connected to the first circuit board 110 and the second circuit board 120, respectively, which is beneficial to heat dissipation of different circuit boards. It should be noted that, a heat conductive silicone grease may be filled between the circuit board and the heat dissipation plate 13, so as to facilitate heat transfer from the circuit board to the heat dissipation plate 13. The heat radiation fins 14 contribute to the improvement of the heat radiation efficiency of the heat radiation plate 13.

Furthermore, a heat dissipation fan 11 is arranged in the main body 1, and the heat dissipation fan 11 is arranged towards the heat dissipation plate 13; the side wall of the main body 1 is provided with heat dissipation holes 12, and the heat dissipation holes 12 are located on one side of the circuit board assembly 100. The cooling fan 11 blows cold air to the heating panel 13 utilizes the air current to take away fast the heat of heating panel 13 makes main part 1 rapid cooling avoids in the long-time use main part 1 high temperature, breaks down.

For ease of description, spatially relative terms such as "over 8230 \ 8230;,"' over 8230;, \8230; upper surface "," above ", etc. may be used herein to describe the spatial relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; 'above" may include both orientations "at 8230; \8230;' above 8230; 'at 8230;' below 8230;" above ". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of protection of the present application is not to be construed as being limited. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board interconnected controller comprising a main body (1), a circuit board assembly (100) being disposed in the main body (1), characterized in that: the circuit board assembly (100) comprises a first circuit board (110) and a second circuit board (120) which are perpendicular to each other, wherein a bonding pad (1402) is arranged on the first circuit board (110), and a welding leg (160) is arranged on the second circuit board (120); the second circuit board (120) is inserted on the first circuit board (110), and a welding point (130) is formed between the welding pad (1402) and the welding foot (160), so that the second circuit board (120) and the first circuit board (110) form an integral structure.

2. A circuit board interconnect controller as recited in claim 1, wherein:

an insertion hole (140) is formed in the first circuit board (110), and a plurality of bonding pads (1402) are arranged at the edge of the insertion hole (140); the second circuit board (120) is provided with a plug-in end (150) matched with the jack (140), and the plug-in end (150) is provided with a plurality of welding feet (160) corresponding to the welding pads (1402);

when the inserting end (150) is inserted into the inserting hole (140), the plurality of bonding pads (1402) correspond to the plurality of welding feet (160) one by one, and the distance between any one bonding pad (1402) and the corresponding welding foot (160) is 0.1mm-0.3mm.

3. A circuit board interconnect controller according to claim 2, wherein:

the plug-in terminal (150) comprises a first matching portion (1501) and a second matching portion (1502) which are connected in sequence, one side wall of the first matching portion (1501) is connected with the second circuit board (120), the cross-sectional area of the first matching portion (1501) is larger than that of the second matching portion (1502), and the welding foot (160) is arranged on the second matching portion (1502).

4. A circuit board interconnect controller according to claim 3, wherein:

a limit convex strip (1503) is arranged on the side wall of the first matching part (1501), and a limit groove (1401) matched with the limit convex strip (1503) is arranged in the jack (140);

when the plug end (150) is inserted into the jack (140), the limiting convex strip (1503) is embedded into the limiting groove (1401).

5. A circuit board interconnect controller according to claim 4, wherein:

the cross section of the limiting convex strip (1503) is semicircular, rectangular or triangular.

6. A circuit board interconnect controller according to any of claims 1-5, wherein:

each welding pad (1402) is identical in structure, each welding pad (1402) comprises welding sections (14022) which are connected with each other, and the two welding sections (14022) are parallel to each other and are connected in a staggered mode.

7. A circuit board interconnect controller according to any of claims 1-5, wherein:

the first wiring board (110) and the second wiring board (120) are connected to each other by wave soldering in a solder joint (130) between the solder pad (1402) and the fillet (160).

8. A circuit board interconnect controller according to any of claims 1-5, wherein:

a heat dissipation plate (13) is arranged in the main body (1), the heat dissipation plate (13) comprises a first plate body and a second plate body which are connected with each other, one side wall of the first plate body is connected with the first circuit board (110), and one side wall of the second plate body is connected with the second circuit board (120); and the first plate body and the second plate body are both provided with radiating fins (14).

9. A circuit board interconnect controller according to claim 8, wherein:

a heat radiation fan (11) is arranged in the main body (1), and the heat radiation fan (11) faces the heat radiation plate (13); the side wall of the main body (1) is provided with heat dissipation holes (12), and the heat dissipation holes (12) are located on one side of the circuit board assembly (100).