CN101867286B - DC/ DC module power supply - Google Patents
DC/ DC module power supply Download PDFInfo
- Publication number
- CN101867286B CN101867286B CN201010215030.6A CN201010215030A CN101867286B CN 101867286 B CN101867286 B CN 101867286B CN 201010215030 A CN201010215030 A CN 201010215030A CN 101867286 B CN101867286 B CN 101867286B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- power source
- modular power
- power supply
- paster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Abstract
The invention discloses a DC/ DC module power supply, and relates to DC/ DC module power supply technology. The DC/ DC module power supply comprises a circuit board and a plurality of locating components, wherein one end of each locating component is provided with a plug-in piece, and the other end thereof is provided with a paster; the plug-in pieces of the locating components are correspondingly connected with through holes of the circuit board; and the pasters of the locating components are connected with a system board. By adopting the technical scheme, the DC/ DC module power supply can improve the power density and the heat dissipation capability of the DC/ DC module power supply, increases the arrangement density of the system board, and enhances the welding reliability of the DC/ DC module power supply on the system board.
Description
Technical field
The present invention relates to DC/DC modular power source, particularly relate to a vertical DC/DC modular power source.
Background technology
As DC/DC modular power source, be widely used for the communications fields such as switching equipment, access device, mobile communication, microwave communication, optical transport, router, and the field such as automotive electronics, Aero-Space.In the communications field, communication system is generally power with-48V or+24V.Have one or more DC/DC modular power source in system, the voltage transitions of direct current supply is become the operating voltage that wiring board needs.Require more and more higher along with in communication field to the power density of DC/DC modular power source and conversion efficiency etc., a miniaturization is provided, high efficiency, reliable DC/DC modular power source becomes very urgent demand, and the change of the encapsulating structure of DC/DC modular power source realizes miniaturization, high efficiency a solution.
The structure of common a kind of DC/DC modular power source composition mainly comprises: one group of printed circuit board (PCB), circuit devcie layout, for compositions such as the contact pins that is electrically connected.The encapsulation of DC/DC modular power source mainly contains plug-in unit encapsulation and paster encapsulates two kinds of structures, the connection of DC/DC modular power source between system board of plug-in unit encapsulation needs to adopt through hole, the pin of DC/DC modular power source realizes the connection of system board and modular power source by the welding connecting hole on system board, the main version that the DC/DC modular power source of paster encapsulation is current is the structure of horizontal positioned, the pin of the structure of horizontal positioned mainly adopts BGA (Ball GridArray, ball grid array) to encapsulate or single terminal welded structure form., from structure, easily there are some problems of flatness as welding in the DC/DC modular power source of paster encapsulating structure, and the problem etc. of intensity after welding when applying.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of DC/DC modular power source, to improve the integrated level of system.
In order to solve the problem, it is considered herein that DC/DC modular power source can be connected with system board with paster connected mode, wherein, the mode that connection between DC/DC modular power source and system adopts vertical paster to connect, solder pad can be provided further on the circuit printing plate of DC/DC modular power source and the connection plane of system board, for increasing the bonding strength of DC/DC modular power source and system board, use as radiating element simultaneously.
Particularly, the invention discloses a kind of DC/DC modular power source, comprise circuit board and some align members, described align member one end is plug-in unit, and the other end is paster, and wherein, the plug-in unit correspondence of described align member connects the through hole of described circuit board; The paster of described align member connects described system board.
Further, in above-mentioned power supply, the plug-in unit of described align member connects the through hole of described circuit board with welding manner correspondence; The paster of described align member connects described system board with solder reflow.
Further, above-mentioned power supply also comprises positioning cards, this positioning cards, for according to the distance between the through hole of described circuit board, is connected as one by some described align members.
Wherein, described circuit board is vertically connected on described system board.
Described circuit board comprises connection plane, and described connection plane is provided with solder pad;
Described circuit board is vertically connected on described system board by described solder pad.
This DC/DC modular power source also comprises patch member, and this patch member is connected to the top of described circuit board.
Described patch member is sheet or tabs shape.
Described patch member is bonded in the top of described circuit board by thermal conductive insulation glue.
Adopt technical solution of the present invention, power density and the heat-sinking capability of DC/DC modular power source can be improved, and improve the density of the layout of system board, strengthen the soldering reliability of DC/DC modular power source on system board.
Accompanying drawing explanation
Fig. 1 is DC/DC modular power source and the schematic diagram be connected between system board;
Fig. 2 is the component diagram of DC/DC modular power source;
Fig. 3 is DC/DC modular power source printed circuit board schematic diagram;
Fig. 4 is heat radiation paster structure part schematic diagram;
Fig. 5 is connector schematic diagram;
Fig. 6 is application example schematic diagram.
Embodiment
Below in conjunction with drawings and the specific embodiments, technical solution of the present invention is described in further details.
A kind of DC/DC modular power source, at least comprises circuit board and some align members.Introduce functions below.
Circuit board comprises the device of printed circuit board and realizing circuit function;
Wherein, circuit board is vertically connected on system board, preferably, the connection plane that circuit board is connected with system board also can arrange one or more solder pad (as covering copper), like this, namely by solder pad, DC/DC modular power source proposed by the invention is welded on corresponding pad openings on system board, strengthen the weld strength of DC/DC modular power source and system board, the solder pad (as covering copper) connected in plane can also reach thermolysis simultaneously, thus improves the efficiency of modular power source.
Align member, be connected with reliable between system board for realizing DC/DC modular power source, its one end is plug-in unit, the other end is paster, wherein, the plug-in unit of align member is by the through hole on the corresponding connecting circuit board of plug-in unit welding manner, and the paster of align member is then by paster solder reflow connected system plate;
Preferably, can adopt a positioning cards, some align members can connect as one according to the distance between the through hole on circuit board by this locator card, can be convenient to assembling, now, and can using overall as connector for some align members of positioning cards and connection thereof.Wherein, some align members are connected as one finger according to the distance between the through hole on circuit board by positioning cards, distance between each align member is set to the distance between the through hole of circuit board by positioning cards, or the integral multiple of distance between the through hole distance between each align member being set to circuit board.
Also have in some preferred schemes, DC/DC modular power source can also comprise a patch member, this patch member is connected to the top of circuit board, to ensure the flatness at DC/DC modular power source top, this DC/DC modular power source can be assembled on system board by the top of the suction nozzle absorption DC/DC modular power source of such chip mounter.Wherein, this patch member can be pasted onto the top of DC/DC modular power source by heat-conducting glue.Further, the material that this patch member can adopt heat radiation good, so just can dispel the heat to needing in DC/DC modular power source the device dispelled the heat, thus improve the efficiency of modular power source.Particularly, the shape of patch member can be sheet, is pasted onto the end face of circuit board.Or the shape of patch member can be one folding piece, the main body in this tabs is pasted onto the end face of circuit board to realize paster function, and the folded part of tabs is pasted onto on the device of realizing circuit function of circuit board side, to realize attachment function of dispelling the heat.
Introduce several preferred DC/DC modular power source proposed according to technical solution of the present invention below.
Embodiment 1
DC/DC modular power source in the present embodiment, as shown in Figure 1, DC/DC modular power source 12 is applied on system board, DC/DC modular power source 12 is made up of circuit board (i.e. the device 122 of printed circuit board 121 and realizing circuit function), connector 13 two parts, wherein, connector 13 connects mode by Through-hole reflow and is reliably welded on printed circuit board 121, and DC/DC modular power source realizes DC/DC modular power source by connector 13 and is connected with reliable between system board.The connection plane that this DC/DC modular power source is connected with system is provided with and covers copper pad, the connection of DC/DC modular power source and system board can be strengthened, and reach the effect of heat radiation.This kind of DC//DC modular power source 12 meets the demands due to the heat radiation of its device, and directly can use the plane (end face of such as circuit board) of the device on DC//DC modular power source 12 when carrying out paster, therefore does not apply patch member.
Embodiment 2
The present embodiment proposes a kind of preferred DC/DC modular power source, and it is vertically mounted on system board and forms a system product, as shown in Figure 2.System product 10 comprises the motherboard (i.e. system board) 11 of a system, is welded with the DC/DC modular power source 12 that one or more vertically arranged the present embodiment propose above.
Wherein, the connection between DC/DC modular power source and system board adopts paster reflow soldering.The composition structure of DC/DC modular power source 12, as shown in Figure 3, comprises circuit board 121 (comprising the device of printed circuit board and realizing circuit function), connector 13 and patch member 14.
Circuit board 121 has through hole, and the mode that this through hole is used for being welded by plug-in unit is corresponding with the plug-in unit end in connector 13 to be connected with the connection realized between connector 13 and circuit board 121;
In the present embodiment, the connection plane 1212 that circuit board 121 and system board are welded to connect is provided with multiple solder pad (namely covering copper) 1211, as shown in Figure 4.Like this, when DC/DC modular power source is welded on system board 11, solder pad is welded to paster pad window corresponding on system board, to improve the soldering reliability of DC/DC modular power source on system board.Meanwhile, the solder pad connected in plane can also increase the area of dissipation of DC/DC modular power source.
Patch member 14 is bonded in circuit board 121 top by thermal conductive insulation glue, thus when assembling DC/DC modular power source, suction nozzle as chip mounter draws plane, play paster effect, and in the present embodiment, patch member is one folding piece, the similar N shape of its shape, namely patch member extends on the device of realizing circuit function circuit board from the top of circuit board, thus serves the effect of heat radiation for the device of realizing circuit function.
Particularly, the patch member 14 in the present embodiment as shown in Figure 5.Patch member is mainly divided into two sections, wherein, one section of paster functional surfaces 141 as DC/DC modular power source 12 is connected to the end face of circuit board, another section is as heat radiation attachment function face 142, the power device device of realizing circuit function (namely in circuit board) dispelled the heat is needed on circuit boards by heat conductive insulating adhesive glue bonding, simultaneously, in order to strengthen adhibit quality, patch member also has the another side of one section of stickup circuit board (namely not having that side of circuit function device in circuit board), thus effectively dispel the heat to the device of needs heat radiation, increase the area of dissipation of power device, improve the reliability of product.
Interface unit 13 is the devices of the electric and mechanical connection effect connected between DC/DC modular power source and system board, as shown in Figure 6, comprises some align members 131 and positioning cards 132.Wherein, one end (1311) of align member 131 is cylindrical plug-in unit, weld for corresponding with the through hole that DC/DC modular power source printed circuit board connects, the paster that the other end (1312) is tetragonal body, is connected with system board for DC/DC modular power source.Positioning cards, then connect as one this some align member according to the distance between the through hole of printed circuit board, so that assembling.Wherein, the distance between each align member equals the distance between the through hole of printed circuit board, or the distance between each align member equal printed circuit board through hole between the integral multiple of distance.Wherein, through hole welding ends 1311 is welded on through hole 1211 position of printed circuit board, and paster welding ends 1312 is welded on system board.
As can be seen from above-described embodiment, the DC/DC modular power source of vertical paster proposed by the invention, be characterized in miniaturized, vertical installation, due to its paster encapsulating structure, covers when brazing connects at printed circuit board side and adds reliability and area of dissipation.In addition, the paster structure of DC/DC modular power source proposed by the invention can the compatible heat radiation being used for device.
The above, be only preferred embodiments of the present invention, be not intended to limit protection scope of the present invention.Within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a DC/DC modular power source, comprises circuit board, it is characterized in that, also comprises some align members, and described align member one end is plug-in unit, and the other end is paster, and wherein, the plug-in unit correspondence of described align member connects the through hole of described circuit board; The paster connected system plate of described align member;
Described circuit board is vertically connected on described system board;
Described circuit board comprises connection plane, and described connection plane is provided with solder pad;
Described circuit board is vertically connected on described system board by described solder pad;
This power supply also comprises positioning cards, this positioning cards, for according to the distance between the through hole of described circuit board, is connected as one by some described align members; Be specially:
Distance between each align member is set to the integral multiple of the distance between the through hole of circuit board by positioning cards.
2. power supply as claimed in claim 1, is characterized in that,
The plug-in unit of described align member connects the through hole of described circuit board with welding manner correspondence; The paster of described align member connects described system board with solder reflow.
3. power supply as claimed in claim 1 or 2, is characterized in that,
This DC/DC modular power source also comprises patch member, and this patch member is connected to the top of described circuit board.
4. power supply as claimed in claim 3, is characterized in that,
Described patch member is sheet or tabs shape.
5. power supply as claimed in claim 3, is characterized in that,
Described patch member is bonded in the top of described circuit board by thermal conductive insulation glue.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010215030.6A CN101867286B (en) | 2010-06-29 | 2010-06-29 | DC/ DC module power supply |
| PCT/CN2011/075364 WO2012000371A1 (en) | 2010-06-29 | 2011-06-07 | Dc/dc module power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010215030.6A CN101867286B (en) | 2010-06-29 | 2010-06-29 | DC/ DC module power supply |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101867286A CN101867286A (en) | 2010-10-20 |
| CN101867286B true CN101867286B (en) | 2015-05-13 |
Family
ID=42958879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010215030.6A Active CN101867286B (en) | 2010-06-29 | 2010-06-29 | DC/ DC module power supply |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101867286B (en) |
| WO (1) | WO2012000371A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101867286B (en) * | 2010-06-29 | 2015-05-13 | 中兴通讯股份有限公司 | DC/ DC module power supply |
| CN102569223B (en) * | 2012-01-11 | 2016-09-14 | 华为技术有限公司 | A kind of power device insulated heat radiation structure and circuit board, power-supply device |
| CN103943581B (en) * | 2013-01-23 | 2017-07-07 | 中兴通讯股份有限公司 | Power device packaging structure and method for packing |
| CN103596365B (en) * | 2013-11-28 | 2017-04-19 | 上海空间电源研究所 | Installation structure of power tubes and printed circuit board |
| CN107367803A (en) * | 2017-08-28 | 2017-11-21 | 华进半导体封装先导技术研发中心有限公司 | A kind of light module package structure and preparation method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101052273A (en) * | 2007-05-16 | 2007-10-10 | 艾默生网络能源有限公司 | PCB plate connection structure and connection method |
| CN101299426A (en) * | 2007-04-30 | 2008-11-05 | 华为技术有限公司 | Module and electronic device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4129514A1 (en) * | 1991-09-05 | 1993-03-11 | Telefunken Electronic Gmbh | PRINTED CIRCUIT WITH SURFACE MOUNTED PLUG |
| TWI282656B (en) * | 2000-08-29 | 2007-06-11 | Delta Electronics Inc | A small power supply apparatus capable of increasing heat sink and preventing over current load |
| JP2006050891A (en) * | 2004-07-08 | 2006-02-16 | Toshiba Tec Corp | Multi-phase version dc/dc converter apparatus |
| JP4830456B2 (en) * | 2005-11-11 | 2011-12-07 | パナソニック株式会社 | High voltage power supply |
| CN200962689Y (en) * | 2006-10-18 | 2007-10-17 | 中控科技集团有限公司 | Printed board connection structure |
| CN101867286B (en) * | 2010-06-29 | 2015-05-13 | 中兴通讯股份有限公司 | DC/ DC module power supply |
-
2010
- 2010-06-29 CN CN201010215030.6A patent/CN101867286B/en active Active
-
2011
- 2011-06-07 WO PCT/CN2011/075364 patent/WO2012000371A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101299426A (en) * | 2007-04-30 | 2008-11-05 | 华为技术有限公司 | Module and electronic device |
| CN101052273A (en) * | 2007-05-16 | 2007-10-10 | 艾默生网络能源有限公司 | PCB plate connection structure and connection method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101867286A (en) | 2010-10-20 |
| WO2012000371A1 (en) | 2012-01-05 |
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