CN210928114U - Heat dissipation type light multilayer circuit board - Google Patents
Heat dissipation type light multilayer circuit board Download PDFInfo
- Publication number
- CN210928114U CN210928114U CN201921004329.XU CN201921004329U CN210928114U CN 210928114 U CN210928114 U CN 210928114U CN 201921004329 U CN201921004329 U CN 201921004329U CN 210928114 U CN210928114 U CN 210928114U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- layer
- circuit board
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 60
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 11
- 239000010439 graphite Substances 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- -1 copper Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat dissipation type light multilayer circuit board, which comprises a solder mask layer, a first circuit layer, a hard insulating substrate, a second circuit layer and an insulating base which are sequentially stacked; a welding gap is formed in the solder mask layer, a heat dissipation ceramic frame is fixed in the welding gap and surrounds the inner side of the welding gap, a bonding pad is fixed on the first circuit layer and is surrounded by the heat dissipation ceramic frame; a heat dissipation notch is formed in the hard insulating substrate, the heat dissipation notch and the welding notch are symmetrical relative to the first circuit layer, and a heat dissipation ceramic plate is arranged in the heat dissipation notch; a conduction column is connected between the first circuit layer and the second circuit layer, and the heat conduction bottom plate is a graphite plate. The utility model discloses can effectively carry out heat conduction to electronic component, avoid the heat to gather between electronic component and circuit board, have good heat dispersion, in addition, ensure that the weight of circuit board can obtain effectively lightening when guaranteeing the performance.
Description
Technical Field
The utility model relates to a circuit board specifically discloses a heat dissipation type light multilayer circuit board.
Background
The multilayer Circuit board, also called pcb (printed Circuit board) multilayer board, multilayer printed board, refers to a printed board with more than two layers, which is composed of connecting wires on an insulating substrate and bonding pads for assembling and welding electronic components, and has the functions of conducting the circuits of all layers and insulating each other.
The circuit board is an electrical connection carrier of electronic components, and plays a very critical role in each electronic product. Electronic components are welded on a circuit board, heat is generated when the electronic components work, the heat dissipation of the electronic components is untimely due to long-time work, heat is accumulated between the circuit board and the electronic components, particularly the heat dissipation efficiency of a multilayer circuit board with large thickness is lower, and the accumulated heat can continuously affect the electronic components and the circuit board, so that the service life and the performance of the electronic components and the circuit board are reduced.
SUMMERY OF THE UTILITY MODEL
In view of the above, there is a need to provide a heat dissipation type light-weight multilayer circuit board, which has good heat dissipation performance and can effectively reduce the weight of the whole structure.
In order to solve the prior art problem, the utility model discloses a heat dissipation type light multilayer circuit board, which comprises a solder mask layer, a first circuit layer, a hard insulating substrate, a second circuit layer, an insulating base and a heat conduction bottom plate which are sequentially stacked; a welding gap is formed in the solder mask layer, a heat dissipation ceramic frame is fixed in the welding gap and surrounds the inner side of the welding gap, a bonding pad is fixed on the first circuit layer and is surrounded by the heat dissipation ceramic frame; a heat dissipation notch is formed in the hard insulating substrate, the heat dissipation notch and the welding notch are symmetrical relative to the first circuit layer, and a heat dissipation ceramic plate is arranged in the heat dissipation notch; a conduction column is connected between the first circuit layer and the second circuit layer, and the heat conduction bottom plate is a graphite plate.
Furthermore, a plurality of integrally formed heat dissipation salient points are arranged on the solder mask layer.
Further, the bonding pad is a silver bonding pad.
Further, the conducting column is a graphite column.
Furthermore, a soft insulating layer is arranged between the hard insulating substrate and the second circuit layer.
Furthermore, the hard insulating substrate is an epoxy resin substrate, and the soft insulating layer is a heat dissipation silica gel layer.
The utility model has the advantages that: the utility model discloses a heat dissipation type light multilayer circuit board sets up special heat radiation structure around installing electronic component on the circuit board, can effectively carry out the heat conduction to electronic component, avoids the heat to gather between electronic component and circuit board, has good heat dispersion, and in addition, the circuit board bottom is provided with the heat-conducting plate of electrostatic discharge function, and the density of heat-conducting plate structure is low, ensures that the weight of circuit board can obtain effectively lightening when guaranteeing the performance.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
The reference signs are: the circuit board comprises a solder mask layer 10, a welding gap 11, a heat dissipation ceramic frame 12, a heat dissipation bump 13, a first circuit layer 20, a pad 21, a conduction column 22, a hard insulating substrate 30, a heat dissipation gap 31, a heat dissipation ceramic plate 32, a second circuit layer 40, an insulating base 50, a heat conduction bottom plate 60 and a soft insulating layer 70.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1.
The embodiment of the utility model discloses heat dissipation type light multilayer circuit board, including solder mask 10, first circuit layer 20, stereoplasm insulating substrate 30, second circuit layer 40, insulating base 50 and the heat conduction bottom plate 60 that stack gradually, can connect through glue between each layer, generally, first circuit layer 20 and second circuit layer 40 are the copper circuit layer, and insulating base 50 is the epoxy base; a welding gap 11 is arranged in the solder mask layer 10, a heat dissipation ceramic frame 12 is fixed in the welding gap 11, preferably, the heat dissipation ceramic frame 12 is connected with the welding gap 11 through glue, the heat dissipation ceramic frame 12 surrounds the inner side of the welding gap 11, a pad 21 is fixed on the first circuit layer 20, the pad 21 is fixedly connected with the first circuit layer 20, the pad 21 is communicated with the first circuit layer 20, the pad 21 is surrounded by the heat dissipation ceramic frame 12, an electronic element is welded on the pad 21, the electronic element is inserted into the heat dissipation ceramic frame 12, and the heat dissipation ceramic frame 12 is contacted with the side surface of the electronic element main body, so that the heat dissipation efficiency of the electronic element can be effectively improved, and the working performance of the electronic element can be improved; the hard insulating substrate 30 is provided with a heat dissipation notch 31, the heat dissipation notch 31 and the welding notch 11 are symmetrical about the first circuit layer 20, the heat dissipation notch 31 is provided with a heat dissipation ceramic plate 32, the heat dissipation ceramic plate 32 is positioned on one side, away from the welding pad 21, of the first circuit layer 20, the heat dissipation ceramic plate 32 can release heat generated by an electronic element, the performance of the electronic element can be effectively improved, the heat dissipation effect can be ensured and the cost can be saved due to the specific arrangement, the hard insulating substrate 30 is matched with the hard heat dissipation ceramic plate 32 to serve as a main body of the circuit board, and the firmness of the whole structure can be effectively improved; be connected with between first circuit layer 20 and the second circuit layer 40 and switch on post 22, set up according to the demand and switch on post 22 and can feed through the respective circuit of first circuit layer 20 and second circuit layer 40 that correspond, heat conduction bottom plate 60 is the graphite plate, has the performance of release static, and heat conductivility is good, and graphite density is little, and the graphite of same volume is lighter than metals such as copper, can effectively reduce the holistic weight of circuit board, more accord with the design demand of frivolous present.
The utility model discloses setting up special heat radiation structure around installing electronic component on the circuit board, can effectively conducting heat to electronic component, avoid the heat to gather between electronic component and circuit board, have good heat dispersion, in addition, the circuit board bottom is provided with the heat-conducting plate of electrostatic discharge function, and the density of heat-conducting plate structure is low, ensures that the weight of circuit board can obtain effectively lightening when guaranteeing the performance.
In this embodiment, a plurality of integrally formed heat dissipation bumps 13 are disposed on the solder mask layer 10, preferably, the solder mask layer 10 is a solder mask ink layer, the heat dissipation bumps 13 are in a hemispherical structure, and the heat dissipation bumps 13 can effectively increase the contact area between the whole solder mask layer 10 and the outside air, so as to increase the heat dissipation performance.
In the present embodiment, the pad 21 is a silver pad, and silver has good electrical conductivity and thermal conductivity, so that the connection performance between the electronic component and the first circuit layer 20 can be effectively improved, and the cost can be effectively reduced when the performance is improved by the targeted arrangement.
In the embodiment, the conductive column 22 is a graphite column, the graphite has good electrical conductivity and thermal conductivity, and the density of the graphite is smaller than that of most metals, so that the overall lightweight design of the circuit board can be further improved.
In the present embodiment, the soft insulating layer 70 is further provided between the hard insulating substrate 30 and the second circuit layer 40, so that the vibration resistance of the entire structure can be effectively improved.
Based on the above embodiment, the hard insulating substrate 30 is an epoxy resin substrate, and the soft insulating layer 70 is a heat dissipation silicone layer, which has good elasticity and good heat dissipation performance.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A heat dissipation type light multilayer circuit board is characterized by comprising a solder mask layer (10), a first circuit layer (20), a hard insulating substrate (30), a second circuit layer (40), an insulating base (50) and a heat conduction bottom plate (60) which are sequentially stacked; a welding gap (11) is formed in the solder mask layer (10), a heat dissipation ceramic frame (12) is fixed in the welding gap (11), the heat dissipation ceramic frame (12) surrounds the inner side of the welding gap (11), a pad (21) is fixed on the first circuit layer (20), and the pad (21) is surrounded by the heat dissipation ceramic frame (12); a heat dissipation notch (31) is formed in the hard insulating substrate (30), the heat dissipation notch (31) and the welding notch (11) are symmetrical about the first circuit layer (20), and a heat dissipation ceramic plate (32) is arranged in the heat dissipation notch (31); a conductive column (22) is connected between the first circuit layer (20) and the second circuit layer (40), and the heat-conducting bottom plate (60) is a graphite plate.
2. A heat dissipation type light-weight multilayer circuit board according to claim 1, wherein a plurality of integrally formed heat dissipation bumps (13) are provided on the solder resist layer (10).
3. A heat-dissipating light-weight multilayer circuit board according to claim 1, wherein the lands (21) are silver lands.
4. The heat-dissipating, lightweight multilayer circuit board according to claim 1, wherein the conductive via (22) is a graphite pillar.
5. The heat-dissipating light-weight multilayer circuit board according to claim 1, wherein a soft insulating layer (70) is further provided between the hard insulating substrate (30) and the second circuit layer (40).
6. The heat-dissipating type lightweight multilayer circuit board according to claim 5, wherein the hard insulating substrate (30) is an epoxy resin substrate, and the soft insulating layer (70) is a heat-dissipating silicone layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921004329.XU CN210928114U (en) | 2019-06-28 | 2019-06-28 | Heat dissipation type light multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921004329.XU CN210928114U (en) | 2019-06-28 | 2019-06-28 | Heat dissipation type light multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210928114U true CN210928114U (en) | 2020-07-03 |
Family
ID=71353133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921004329.XU Expired - Fee Related CN210928114U (en) | 2019-06-28 | 2019-06-28 | Heat dissipation type light multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210928114U (en) |
-
2019
- 2019-06-28 CN CN201921004329.XU patent/CN210928114U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3093885B1 (en) | Semiconductor device and semiconductor device manufacturing method | |
| EP2009966A1 (en) | Multi-layer electrically isolated thermal conduction structure for a circuit board assembly | |
| US8779603B2 (en) | Stacked semiconductor device with heat dissipation | |
| JP2003124524A (en) | High-flux led array | |
| JP6738785B2 (en) | Light emitting device and manufacturing method thereof | |
| JP2015111620A (en) | Light emitting device and manufacturing method of the same | |
| CN211743142U (en) | Double-chip heat-conducting patch diode | |
| CN107708286B (en) | Printed circuit board assembly | |
| CN111372393A (en) | QFN element mounting method for reducing welding voidage | |
| AU2008201050A1 (en) | Electronic-component-mounting board | |
| CN210928114U (en) | Heat dissipation type light multilayer circuit board | |
| KR101115403B1 (en) | Light emitting apparatus | |
| JP3164067U (en) | Circuit board | |
| CN111064344B (en) | Power module with bottom metal heat dissipation substrate | |
| TWI239603B (en) | Cavity down type semiconductor package | |
| JP3549316B2 (en) | Wiring board | |
| JP2017204589A (en) | Heat dissipation chip and heat dissipation structure | |
| CN214544925U (en) | Ceramic substrate | |
| CN111081662A (en) | Chip module, electronic module and preparation method | |
| CN216054694U (en) | Chip packaged by ceramic substrate | |
| CN214228544U (en) | Copper-based heat dissipation circuit board | |
| CN210956656U (en) | Chip packaging structure and memory | |
| KR101897304B1 (en) | Power module | |
| CN212967676U (en) | Heat dissipation chip and circuit board | |
| CN219226321U (en) | LED module with radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200703 |