WO2012000371A1 - Dc/dc module power supply - Google Patents

Dc/dc module power supply Download PDF

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Publication number
WO2012000371A1
WO2012000371A1 PCT/CN2011/075364 CN2011075364W WO2012000371A1 WO 2012000371 A1 WO2012000371 A1 WO 2012000371A1 CN 2011075364 W CN2011075364 W CN 2011075364W WO 2012000371 A1 WO2012000371 A1 WO 2012000371A1
Authority
WO
WIPO (PCT)
Prior art keywords
power supply
circuit board
module power
patch
board
Prior art date
Application number
PCT/CN2011/075364
Other languages
French (fr)
Chinese (zh)
Inventor
张滨
陈丽霞
张洋
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2012000371A1 publication Critical patent/WO2012000371A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Definitions

  • the present invention relates to a direct current/direct current (DC/DC) module power supply, and more particularly to a vertical DC/DC module power supply.
  • DC/DC direct current/direct current
  • DC/DC module power supplies are widely used in the fields of switching equipment, access equipment, mobile communications, microwave communications, optical transmission, and routers, automotive electronics, and aerospace. In the communications field, communication systems are typically powered by -48V or +24V. There will be one or more DC/DC module power supplies in the system that convert the DC-powered voltage to the required operating voltage on the board. With the increasing demand for power density and conversion efficiency of DC/DC module power supplies in the communication field, it is very urgent to provide a miniaturized, high-efficiency, and reliable DC/DC module power supply, and DC/DC modules. The change in the package structure of the power supply is a solution for achieving miniaturization and high efficiency.
  • a common DC/DC module power supply consists of a set of printed circuit boards, circuit device layouts, and pins for electrical connections.
  • the DC/DC module power supply package mainly has two structures: plug-in package and chip package.
  • the connection between the DC/DC module power supply of the plug-in package and the system board requires the use of through holes, and the DC/DC module power supply
  • the system board and the module power supply are connected through the soldering through holes on the system board.
  • the current main structure of the chip package DC/DC module power supply is a horizontally placed structure, and the horizontally placed structure is mainly used with a ball grid. Ball Grid Array (BGA) package or single-terminal soldered structure.
  • BGA Ball Grid Array
  • the DC/DC module power supply of the chip package structure is structurally prone to problems such as flatness of soldering and strength after soldering.
  • the technical problem to be solved by the present invention is to provide a DC/DC module power supply to improve the system.
  • the degree of integration In order to solve the above problem, the present invention considers that the DC/DC module power supply can be connected to the system board in a patch connection manner, wherein the connection between the DC/DC module power supply and the system is connected by a vertical patch, wherein Solder pads are provided on the connection plane between the circuit board of the DC/DC module power supply and the system board, which is used to increase the connection strength between the DC/DC module power supply and the system board, and is also used as a heat sink member.
  • the present invention discloses a DC/DC module power supply, which includes a circuit board, and further includes one or more positioning members, the positioning member has an insert at one end and a patch at the other end, wherein The insert of the positioning member corresponds to a through hole connecting the circuit board; the patch of the positioning member is connected to the system board.
  • the insert of the positioning member is correspondingly connected to the through hole of the circuit board by welding; the patch of the positioning member is connected to the system board by reflow soldering.
  • the power source further includes a positioning card, wherein the positioning card is used to connect one or more of the positioning members into one body according to a distance between the through holes of the circuit board.
  • the circuit board is vertically connected to the system board.
  • the circuit board includes a connection plane, and the connection plane is provided with a solder pad;
  • the circuit board is vertically connected to the system board through the solder pads.
  • the DC/DC module power supply also includes a patch member, wherein the patch member is coupled to the top of the circuit board.
  • the patch member is in the form of a sheet or a flap.
  • the patch member is bonded to the top of the circuit board by a thermally conductive insulating paste.
  • FIG. 1 is a schematic diagram of a connection between a DC/DC module power supply and a system board according to an embodiment of the present invention
  • FIG. 2 is a component diagram of a DC/DC module power supply according to an embodiment of the present invention
  • FIG. 3 is a DC/DC according to an embodiment of the present invention.
  • Figure 4 is a schematic view of a heat dissipating patch structure according to an embodiment of the present invention
  • Figure 5 is a schematic view of a connector according to an embodiment of the present invention
  • Figure 6 is a schematic view of an application example.
  • This embodiment discloses a DC/DC module power supply, the DC/DC module power supply including at least a circuit board and one or more positioning members. The functions of each part are described below.
  • the circuit board comprises a printed circuit board and a device for implementing the circuit function; wherein the circuit board is vertically connected to the system board, preferably, the connection plane connecting the circuit board and the system board may also be provided with one or more solder pads (eg, Copper), in this way, the DC/DC module power supply of the present invention can be soldered to the corresponding pad window on the system board through the solder pad, thereby enhancing the welding strength of the DC/DC module power supply and the system board, and connecting the plane
  • the solder pads on the board (such as copper) can also achieve heat dissipation, which increases the efficiency of the module power supply.
  • the positioning component is used for realizing a reliable connection between the power supply of the DC/DC module and the system board, and one end is a plug-in and the other end is a patch, wherein the plug-in of the positioning component is connected by means of plug-in welding Connected to the through hole on the circuit board, the patch of the positioning member is connected to the system board by means of chip reflow soldering; preferably, a positioning card can be used, and the positioning card can be according to the distance between the through holes on the circuit board
  • One or more locating members are united for ease of assembly, in which case the positioning card and its associated one or more locating members may be integrally formed as a connector.
  • the positioning card connects one or more positioning members as a unitary finger according to the distance between the through holes on the circuit board, and the positioning card sets the distance between the positioning members as the distance between the through holes of the circuit board, or The distance between the positioning members is set to an integral multiple of the distance between the through holes of the board.
  • the DC/DC module power supply may further include a patch member connected to the top of the circuit board to ensure the planarity of the top of the DC/DC module power supply, so that the placement machine sucks
  • the DC/DC module power supply can be assembled to the system board by sucking the top of the DC/DC module power supply.
  • the patch member can be pasted on the top of the DC/DC module power supply through a thermal paste.
  • the chip member can use a material with good heat dissipation, so that heat dissipation can be performed on the device that needs heat dissipation in the DC/DC module power supply, thereby improving the efficiency of the module power supply.
  • the shape of the patch member may be a sheet shape and pasted on the top surface of the circuit board.
  • the shape of the patch member may be a flap, the main body of the flap is pasted on the top surface of the circuit board to realize the patch function, and the folded portion of the flap is pasted on the device for realizing the circuit function on the side of the circuit board, Achieve heat dissipation bonding.
  • Embodiment 1 A DC/DC module power supply in this embodiment, as shown in FIG. 1, a DC/DC module power supply 12 is applied to a system board, and a DC/DC module power supply 12 is provided by a circuit board (ie, a printed circuit board 121 and implemented).
  • the circuit function device 122) and the connector 13 are composed of two parts, wherein the connector 13 is reliably soldered to the printed circuit board 121 by via reflow soldering, and the DC/DC module power supply is realized by the connector 13 to realize the DC/DC module. A reliable connection between the power supply and the system board.
  • connection plane of the DC/DC module power supply and the system is provided with a copper-clad pad, which can enhance the connection between the DC/DC module power supply and the system board, and achieve the function of heat dissipation.
  • the DC//DC module power supply 12 satisfies the requirements of the heat dissipation of the device, and can directly borrow the plane of the device on the DC//DC module power supply 12 (for example, the top surface of the circuit board) when the chip is mounted, so there is no application sticker. Sheet member.
  • Embodiment 2 This embodiment proposes a preferred DC/DC module power supply that is vertically mounted on a system board to form a system product, as shown in FIG.
  • the system product 10 includes a motherboard (i.e., system board) 11 of a system to which one or more vertically mounted DC/DC module power supplies 12 of the present embodiment are soldered. Among them, the connection between the DC/DC module power supply and the system board is reflow soldered with a patch.
  • the structure of the DC/DC module power supply 12, as shown in FIG. 3, includes a circuit board 121 (including a printed circuit board and devices for realizing circuit functions), a connector 13 and a patch member 14.
  • the circuit board 121 is provided with a through hole for connecting with the plug end of the connector 13 by means of plug-in soldering to realize the connection between the connector 13 and the circuit board 121.
  • the circuit board A plurality of solder pads (ie, copper clad) 1211 are disposed on the connection plane 1212 soldered to the system board, as shown in FIG.
  • the solder pads are soldered to the corresponding patch pad windows on the system board to improve the reliability of the DC/DC module power supply on the system board.
  • the solder pads on the connection plane can also increase the heat dissipation area of the DC/DC module power supply.
  • the chip member 14 is bonded to the top of the circuit board 121 by a thermal conductive adhesive, so that when the DC/DC module power supply is assembled, the nozzle of the placement machine sucks the plane to serve as a patch, and in this embodiment, the sticker
  • the sheet member is a flap which is shaped like an N shape, that is, the patch member extends from the top of the circuit board to the device in the circuit board for realizing the circuit function, thereby dissipating heat for the device functioning.
  • the patch member 14 in this embodiment is as shown in FIG.
  • the patch member is mainly divided into two segments, wherein a patch function surface 141 as a DC/DC module power supply 12 is connected to the top surface of the circuit board, and the other portion serves as a heat dissipation bonding function surface 142, which is bonded by thermal conductive insulation.
  • a power device that needs to dissipate heat on a circuit board ie, a device that implements circuit functions in a circuit board
  • the chip member also has a section on the other side of the board (ie, there is no circuit function in the board)
  • the connecting device 13 is a device that connects the electrical and mechanical connections between the DC/DC module power supply and the system board. As shown in FIG. 6, one or more positioning members 131 and positioning cards 132 are included.
  • one end (1311) of the positioning member 131 is a cylindrical insert, which is used for welding with a through hole connected to the DC/DC module power supply printed circuit board, and the other end (1312) is a square patch for DC
  • the /DC module power supply is connected to the system board.
  • Positioning the cards connects the plurality of positioning members in one piece according to the distance between the through holes of the printed circuit board to facilitate assembly.
  • the distance between the positioning members is equal to the distance between the through holes of the printed circuit board, or the distance between the positioning members is equal to an integral multiple of the distance between the through holes of the printed circuit board.
  • the through-hole soldering end 1311 is soldered to the through hole 1211 of the printed circuit board, and the patch soldering end 1312 is soldered to the system board.
  • the DC/DC module power supply of the vertical patch proposed by the present invention is characterized by miniaturization and vertical mounting. Due to its chip package structure, reliability and heat dissipation area are increased when copper is soldered on the side of the printed circuit board.
  • the patch structure of the DC/DC module power supply proposed by the present invention is compatible with heat dissipation for the device.
  • the technical solution of the present invention can improve the power density and heat dissipation capability of the DC/DC module power supply, increase the density of the layout of the system board, and enhance the reliability of welding of the DC/DC module power supply on the system board.

Abstract

A DC/DC module power supply (12) includes a circuit board (121) and one or more orientation members (13). One terminal of each of the orientation members (13) is a plug-in unit, and another terminal is a surface-mounting pad. The plug-in units of the orientation members (13) are correspondingly connected with the through-holes of the circuit board (121), and the surface-mounting pads of the orientation members (13) are connected to a system board (11). This construction could improve the power density and the heat-dissipation capability of the DC/DC module power supply (12), and also improve the layout density of the system board (11) and enhance the soldering reliability of the DC/DC module power supply (12) onto the system board (11).

Description

一种 DC / DC模块电源  DC/DC module power supply
技术领域 本发明涉及直流 /直流（ Direct Current/ Direct Current, DC / DC )模块电 源， 尤其涉及一个立式 DC/DC模块电源。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a direct current/direct current (DC/DC) module power supply, and more particularly to a vertical DC/DC module power supply.
背景技术 Background technique
DC / DC模块电源广泛地用于交换设备、 接入设备、 移动通讯、 微波通 讯、 光传输、 和路由器等通信领域， 汽车电子， 以及航空航天等领域。 在通 信领域里通信系统一般是以 - 48V或 + 24V电源供电。 系统中会有一个或多 个 DC / DC模块电源， 将直流供电的电压转换成线路板上需要的工作电压。 随着通讯领域对 DC / DC模块电源的功率密度和转换效率等要求越来越高， 提供一个小型化，高效率，且可靠的 DC / DC模块电源成为非常迫切的需求， 而 DC/DC模块电源的封装结构的变化是实现小型化， 高效率的一种解决方 案。 常见的一种 DC / DC模块电源组成的结构主要包括： 一组印刷电路板、 电路器件布局、 以及用于电气连接的插针等。 DC / DC模块电源的封装主要 有插件封装和贴片封装两种结构 ,插件封装的 DC / DC模块电源在和系统板 之间的连接需要釆用通孔， DC/DC模块电源的弓 I脚通过系统板上的焊接通孔 实现系统板和模块电源的连接， 贴片封装的 DC/DC模块电源目前的主要的 结构形式为水平放置的结构，水平放置的结构的引脚主要釆用球栅阵列（Ball Grid Array, BGA )封装或者单端子焊接的结构形式。 贴片封装结构的 DC / DC模块电源， 从结构上看， 在应用时容易出现一些如焊接的平面度的问题， 以及焊接后的强度的问题等。  DC/DC module power supplies are widely used in the fields of switching equipment, access equipment, mobile communications, microwave communications, optical transmission, and routers, automotive electronics, and aerospace. In the communications field, communication systems are typically powered by -48V or +24V. There will be one or more DC/DC module power supplies in the system that convert the DC-powered voltage to the required operating voltage on the board. With the increasing demand for power density and conversion efficiency of DC/DC module power supplies in the communication field, it is very urgent to provide a miniaturized, high-efficiency, and reliable DC/DC module power supply, and DC/DC modules. The change in the package structure of the power supply is a solution for achieving miniaturization and high efficiency. A common DC/DC module power supply consists of a set of printed circuit boards, circuit device layouts, and pins for electrical connections. The DC/DC module power supply package mainly has two structures: plug-in package and chip package. The connection between the DC/DC module power supply of the plug-in package and the system board requires the use of through holes, and the DC/DC module power supply The system board and the module power supply are connected through the soldering through holes on the system board. The current main structure of the chip package DC/DC module power supply is a horizontally placed structure, and the horizontally placed structure is mainly used with a ball grid. Ball Grid Array (BGA) package or single-terminal soldered structure. The DC/DC module power supply of the chip package structure is structurally prone to problems such as flatness of soldering and strength after soldering.
发明内容 本发明所要解决的技术问题是， 提供一种 DC /DC模块电源， 以提高系 统的集成度。 为了解决上述问题， 本发明认为 DC/DC模块电源可以以贴片连接方式 与系统板相连， 其中， DC/DC模块电源与系统之间的连接釆用立式贴片连 接的方式， 其中， 可在 DC/DC模块电源的电路印制板与系统板的连接平面 上提供焊接焊盘， 用于增加 DC/DC模块电源与系统板的连接强度， 同时作 为散热器件使用。 为了解决上述技术问题， 本发明公开了一种 DC /DC模块电源， 该电源 包括电路板， 还包括一个或多个定位构件， 所述定位构件一端为插件， 另一 端为贴片， 其中， 所述定位构件的插件对应连接所述电路板的通孔； 所述定 位构件的贴片连接所述系统板。 本发明的电源中， 所述定位构件的插件以焊接方式对应连接所述电路板 的通孔； 所述定位构件的贴片以回流焊接方式连接所述系统板。 该电源还包括定位卡片， 其中， 该定位卡片用于根据所述电路板的通孔之间的距离， 将一个或多个所述 定位构件连接为一体。 本发明的电源中， 所述电路板垂直连接在所述系统板上。 本发明的电源中， 所述电路板包括连接平面， 所述连接平面上设置有焊 接焊盘； SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is to provide a DC/DC module power supply to improve the system. The degree of integration. In order to solve the above problem, the present invention considers that the DC/DC module power supply can be connected to the system board in a patch connection manner, wherein the connection between the DC/DC module power supply and the system is connected by a vertical patch, wherein Solder pads are provided on the connection plane between the circuit board of the DC/DC module power supply and the system board, which is used to increase the connection strength between the DC/DC module power supply and the system board, and is also used as a heat sink member. In order to solve the above technical problem, the present invention discloses a DC/DC module power supply, which includes a circuit board, and further includes one or more positioning members, the positioning member has an insert at one end and a patch at the other end, wherein The insert of the positioning member corresponds to a through hole connecting the circuit board; the patch of the positioning member is connected to the system board. In the power supply of the present invention, the insert of the positioning member is correspondingly connected to the through hole of the circuit board by welding; the patch of the positioning member is connected to the system board by reflow soldering. The power source further includes a positioning card, wherein the positioning card is used to connect one or more of the positioning members into one body according to a distance between the through holes of the circuit board. In the power supply of the present invention, the circuit board is vertically connected to the system board. In the power supply of the present invention, the circuit board includes a connection plane, and the connection plane is provided with a solder pad;
所述电路板通过所述焊接焊盘垂直连接在所述系统板上。 该 DC /DC模块电源还包括贴片构件， 其中， 该贴片构件连接在所述电路板的顶部。 本发明的电源中， 所述贴片构件为片状或折片状。 本发明的电源中， 所述贴片构件通过导热绝缘胶粘接在所述电路板的顶 部。 本发明的技术方案可以提高 DC/DC模块电源的功率密度和散热能力， 并提高系统板的布局的密度， 加强 DC/DC模块电源在系统板上的焊接可靠 性。 The circuit board is vertically connected to the system board through the solder pads. The DC/DC module power supply also includes a patch member, wherein the patch member is coupled to the top of the circuit board. In the power supply of the present invention, the patch member is in the form of a sheet or a flap. In the power supply of the present invention, the patch member is bonded to the top of the circuit board by a thermally conductive insulating paste. The technical solution of the invention can improve the power density and heat dissipation capability of the DC/DC module power supply, increase the density of the layout of the system board, and strengthen the welding reliability of the DC/DC module power supply on the system board.
附图概述 图 1为本发明实施例 DC/DC模块电源与系统板之间连接的示意图； 图 2为本发明实施例 DC/DC模块电源的部件图； 图 3为本发明实施例 DC/DC模块电源印制电路板示意图； 图 4为本发明实施例散热贴片结构件示意图； 图 5为本发明实施例连接器示意图； 图 6为应用实例示意图。 1 is a schematic diagram of a connection between a DC/DC module power supply and a system board according to an embodiment of the present invention; FIG. 2 is a component diagram of a DC/DC module power supply according to an embodiment of the present invention; FIG. 3 is a DC/DC according to an embodiment of the present invention. Figure 4 is a schematic view of a heat dissipating patch structure according to an embodiment of the present invention; Figure 5 is a schematic view of a connector according to an embodiment of the present invention; and Figure 6 is a schematic view of an application example.
本发明的较佳实施方式 为使本发明的目的、 技术方案和优点更加清楚明白， 下文中将结合附图 对本发明的实施例进行详细说明。 需要说明的是， 在不冲突的情况下， 本申 请中的实施例及实施例中的特征可以相互任意组合。 本实施例公开了一种 DC / DC模块电源，该 DC / DC模块电源至少包括 电路板和一个或多个定位构件。 下面介绍各部分功能。 电路板包括印制电路板和实现电路功能的器件； 其中， 电路板垂直连接在系统板上， 优选地， 电路板和系统板相连的连 接平面还可设置一个或多个焊接焊盘（如覆铜）， 这样， 即可通过焊接焊盘 将本发明所提出的 DC /DC模块电源焊接在系统板上相应的焊盘窗口， 从而 增强 DC /DC模块电源与系统板的焊接强度，同时连接平面上的焊接焊盘（如 覆铜）还可以达到散热作用， 从而提高模块电源的效率。 定位构件， 用于实现 DC/DC模块电源与系统板之间的可靠连接， 其一 端为插件， 另一端为贴片， 其中， 定位构件的插件通过插件焊接方式对应连 接电路板上的通孔， 定位构件的贴片则通过贴片回流焊接方式连接系统板； 优选的， 可以釆用一定位卡片， 该定位卡片可根据电路板上的通孔之间 的距离将一个或多个定位构件连接为一体， 可便于装配， 此时， 可将定位卡 片及其连接的一个或多个定位构件整体作为连接器。 其中， 定位卡片根据电 路板上的通孔之间的距离将一个或多个定位构件连接为一体指， 定位卡片将 各定位构件之间的距离置为电路板的通孔之间的距离， 或者将各定位构件之 间的距离置为电路板的通孔之间的距离的整数倍。 还有一些优选的方案中， DC/DC模块电源还可以包括一贴片构件， 该贴 片构件连接在电路板的顶部， 以保证 DC /DC模块电源顶部的平面性， 这样 贴片机的吸嘴吸取 DC / DC模块电源的顶部即可将该 DC / DC模块电源装配 到系统板上。 其中， 该贴片构件可以通过导热胶粘贴在 DC /DC模块电源的 顶部。 进一步地， 该贴片构件可以釆用散热良好的材料， 这样就可以对 DC /DC模块电源中需要散热的器件进行散热，从而提高模块电源的效率。具体 地， 贴片构件的形状可为片状， 粘贴在电路板的顶面。 或者贴片构件的形状 可为一折片， 该折片中的主体粘贴在电路板的顶面以实现贴片功能， 折片的 折叠部分粘贴在电路板侧面的实现电路功能的器件上 ,以实现散热粘结功能。 The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, in the case of no conflict, the features in the embodiments and the embodiments in the present application may be arbitrarily combined with each other. This embodiment discloses a DC/DC module power supply, the DC/DC module power supply including at least a circuit board and one or more positioning members. The functions of each part are described below. The circuit board comprises a printed circuit board and a device for implementing the circuit function; wherein the circuit board is vertically connected to the system board, preferably, the connection plane connecting the circuit board and the system board may also be provided with one or more solder pads (eg, Copper), in this way, the DC/DC module power supply of the present invention can be soldered to the corresponding pad window on the system board through the solder pad, thereby enhancing the welding strength of the DC/DC module power supply and the system board, and connecting the plane The solder pads on the board (such as copper) can also achieve heat dissipation, which increases the efficiency of the module power supply. The positioning component is used for realizing a reliable connection between the power supply of the DC/DC module and the system board, and one end is a plug-in and the other end is a patch, wherein the plug-in of the positioning component is connected by means of plug-in welding Connected to the through hole on the circuit board, the patch of the positioning member is connected to the system board by means of chip reflow soldering; preferably, a positioning card can be used, and the positioning card can be according to the distance between the through holes on the circuit board One or more locating members are united for ease of assembly, in which case the positioning card and its associated one or more locating members may be integrally formed as a connector. Wherein, the positioning card connects one or more positioning members as a unitary finger according to the distance between the through holes on the circuit board, and the positioning card sets the distance between the positioning members as the distance between the through holes of the circuit board, or The distance between the positioning members is set to an integral multiple of the distance between the through holes of the board. In some preferred embodiments, the DC/DC module power supply may further include a patch member connected to the top of the circuit board to ensure the planarity of the top of the DC/DC module power supply, so that the placement machine sucks The DC/DC module power supply can be assembled to the system board by sucking the top of the DC/DC module power supply. Wherein, the patch member can be pasted on the top of the DC/DC module power supply through a thermal paste. Further, the chip member can use a material with good heat dissipation, so that heat dissipation can be performed on the device that needs heat dissipation in the DC/DC module power supply, thereby improving the efficiency of the module power supply. Specifically, the shape of the patch member may be a sheet shape and pasted on the top surface of the circuit board. Or the shape of the patch member may be a flap, the main body of the flap is pasted on the top surface of the circuit board to realize the patch function, and the folded portion of the flap is pasted on the device for realizing the circuit function on the side of the circuit board, Achieve heat dissipation bonding.
下面介绍几种依据本发明技术方案所提出的优选的 DC/DC模块电源。 实施例 1 本实施例中的 DC/DC模块电源， 如图 1所示， DC/DC模块电源 12应 用在系统板上， DC/DC模块电源 12由电路板 (即印制电路板 121和实现电 路功能的器件 122 )和连接器 13两部分组成， 其中， 连接器 13通过通孔回 流焊接方式可靠地焊接在印制电路板 121 上， DC/DC模块电源通过连接器 13实现 DC/DC模块电源与系统板之间的可靠连接。此 DC/DC模块电源与系 统连接的连接平面上设置有覆铜焊盘， 可以增强 DC/DC模块电源与系统板 的连接， 并达到散热的作用。 此款 DC//DC模块电源 12由于其器件的散热满 足要求，且进行贴片时可以直接借用 DC//DC模块电源 12上的器件的平面（例 如电路板的顶面） ， 故没有应用贴片构件。 实施例 2 本实施例提出一种优选的 DC/DC模块电源， 其垂直安装在系统板上形 成一系统产品， 如图 2所示。 系统产品 10包括一个系统的母板（即系统板） 11 , 上面焊接有 1个或多个垂直安装的本实施例所提出的 DC/DC模块电源 12。 其中， DC/DC模块电源和系统板之间的连接釆用贴片回流焊接。 DC/DC 模块电源 12的组成结构， 如图 3所示， 包括电路板 121 (包括印制电路板和 实现电路功能的器件 ) , 连接器 13及贴片构件 14。 电路板 121 上开有通孔， 该通孔用于通过插件焊接的方式与连接器 13 中的插件端对应连接以实现连接器 13与电路板 121之间的连接； 本实施例中，电路板 121与系统板焊接连接的连接平面 1212上设置有多 个焊接焊盘（即覆铜） 1211 , 如图 4所示。 这样， 在 DC/DC模块电源焊接 到系统板 11上时，将焊接焊盘焊接到系统板上对应的贴片焊盘窗即可， 以提 高 DC/DC模块电源在系统板上的焊接可靠性。 同时， 连接平面上的焊接焊 盘还可以增加 DC/DC模块电源的散热面积。 贴片构件 14通过导热绝缘胶粘接在电路板 121顶部，从而在装配 DC/DC 模块电源时， 作为贴片机的吸嘴吸取平面， 起到贴片作用， 并且在本实施例 中， 贴片构件为一折片， 其形状类似 N形， 即贴片构件从电路板的顶部延伸 至电路板中实现电路功能的器件上， 从而为实现电路功能的器件起到了散热 的作用。 具体地，本实施例中的贴片构件 14如图 5所示。贴片构件主要分为两段， 其中，一段作为 DC/DC模块电源 12的贴片功能面 141连接在电路板的顶面， 另一段作为散热粘结功能面 142, 通过导热绝缘粘结胶粘结在电路板上需要 散热的功率器件 （即电路板中实现电路功能的器件） ， 同时， 为了增强粘贴 性， 贴片构件还有一段粘贴电路板的另一侧面 （即电路板中没有电路功能器 件的那一侧） , 从而给需要散热的器件进行有效的散热， 增加功率器件的散 热面积， 提高产品的可靠性。 连接器件 13是连接 DC/DC模块电源与系统板之间的电气及机械连接作 用的器件， 如图 6所示， 包括一个或多个定位构件 131与定位卡片 132。 其 中， 定位构件 131 的一端 （1311 )为圓柱体的插件， 用于与 DC/DC模块电 源印制电路板连接的通孔对应焊接， 另一端 （1312 )为四方体的贴片， 用于 DC/DC模块电源与系统板连接。 定位卡片， 则根据印制电路板的通孔之间的 距离将这若干定位构件连接为一体， 以便于装配。 其中， 各定位构件之间的 距离等于印制电路板的通孔之间的距离， 或者各定位构件之间的距离等于印 制电路板的通孔之间的距离的整数倍。其中，通孔焊接端 1311焊接在印制电 路板的通孔 1211位置， 贴片焊接端 1312焊接在系统板上。 从上述实施例可以看出， 本发明所提出的立式贴片的 DC / DC模块电 源， 其特点是小型化， 以及立式安装。 由于其釆用贴片封装结构， 在印制电 路板侧边覆铜焊接时增加了可靠性和散热面积。 另外， 本发明所提出的 DC / DC模块电源的贴片结构可兼容用于器件的散热。 Several preferred DC/DC module power supplies according to the technical solution of the present invention are described below. Embodiment 1 A DC/DC module power supply in this embodiment, as shown in FIG. 1, a DC/DC module power supply 12 is applied to a system board, and a DC/DC module power supply 12 is provided by a circuit board (ie, a printed circuit board 121 and implemented). The circuit function device 122) and the connector 13 are composed of two parts, wherein the connector 13 is reliably soldered to the printed circuit board 121 by via reflow soldering, and the DC/DC module power supply is realized by the connector 13 to realize the DC/DC module. A reliable connection between the power supply and the system board. The connection plane of the DC/DC module power supply and the system is provided with a copper-clad pad, which can enhance the connection between the DC/DC module power supply and the system board, and achieve the function of heat dissipation. The DC//DC module power supply 12 satisfies the requirements of the heat dissipation of the device, and can directly borrow the plane of the device on the DC//DC module power supply 12 (for example, the top surface of the circuit board) when the chip is mounted, so there is no application sticker. Sheet member. Embodiment 2 This embodiment proposes a preferred DC/DC module power supply that is vertically mounted on a system board to form a system product, as shown in FIG. The system product 10 includes a motherboard (i.e., system board) 11 of a system to which one or more vertically mounted DC/DC module power supplies 12 of the present embodiment are soldered. Among them, the connection between the DC/DC module power supply and the system board is reflow soldered with a patch. The structure of the DC/DC module power supply 12, as shown in FIG. 3, includes a circuit board 121 (including a printed circuit board and devices for realizing circuit functions), a connector 13 and a patch member 14. The circuit board 121 is provided with a through hole for connecting with the plug end of the connector 13 by means of plug-in soldering to realize the connection between the connector 13 and the circuit board 121. In this embodiment, the circuit board A plurality of solder pads (ie, copper clad) 1211 are disposed on the connection plane 1212 soldered to the system board, as shown in FIG. In this way, when the DC/DC module power supply is soldered to the system board 11, the solder pads are soldered to the corresponding patch pad windows on the system board to improve the reliability of the DC/DC module power supply on the system board. . At the same time, the solder pads on the connection plane can also increase the heat dissipation area of the DC/DC module power supply. The chip member 14 is bonded to the top of the circuit board 121 by a thermal conductive adhesive, so that when the DC/DC module power supply is assembled, the nozzle of the placement machine sucks the plane to serve as a patch, and in this embodiment, the sticker The sheet member is a flap which is shaped like an N shape, that is, the patch member extends from the top of the circuit board to the device in the circuit board for realizing the circuit function, thereby dissipating heat for the device functioning. Specifically, the patch member 14 in this embodiment is as shown in FIG. The patch member is mainly divided into two segments, wherein a patch function surface 141 as a DC/DC module power supply 12 is connected to the top surface of the circuit board, and the other portion serves as a heat dissipation bonding function surface 142, which is bonded by thermal conductive insulation. A power device that needs to dissipate heat on a circuit board (ie, a device that implements circuit functions in a circuit board), and at the same time, in order to enhance adhesion, the chip member also has a section on the other side of the board (ie, there is no circuit function in the board) On the side of the device, the device that needs to dissipate heat is effectively dissipated, the heat dissipation area of the power device is increased, and the reliability of the product is improved. The connecting device 13 is a device that connects the electrical and mechanical connections between the DC/DC module power supply and the system board. As shown in FIG. 6, one or more positioning members 131 and positioning cards 132 are included. Wherein, one end (1311) of the positioning member 131 is a cylindrical insert, which is used for welding with a through hole connected to the DC/DC module power supply printed circuit board, and the other end (1312) is a square patch for DC The /DC module power supply is connected to the system board. Positioning the cards connects the plurality of positioning members in one piece according to the distance between the through holes of the printed circuit board to facilitate assembly. Wherein, the distance between the positioning members is equal to the distance between the through holes of the printed circuit board, or the distance between the positioning members is equal to an integral multiple of the distance between the through holes of the printed circuit board. The through-hole soldering end 1311 is soldered to the through hole 1211 of the printed circuit board, and the patch soldering end 1312 is soldered to the system board. As can be seen from the above embodiments, the DC/DC module power supply of the vertical patch proposed by the present invention is characterized by miniaturization and vertical mounting. Due to its chip package structure, reliability and heat dissipation area are increased when copper is soldered on the side of the printed circuit board. In addition, the patch structure of the DC/DC module power supply proposed by the present invention is compatible with heat dissipation for the device.
工业实用性 本发明的技术方案可以提高 DC/DC模块电源的功率密度和散热能力， 并提高系统板的布局的密度， 加强 DC/DC模块电源在系统板上的焊接可靠 性。 Industrial Applicability The technical solution of the present invention can improve the power density and heat dissipation capability of the DC/DC module power supply, increase the density of the layout of the system board, and enhance the reliability of welding of the DC/DC module power supply on the system board.

Claims

权 利 要 求 书 Claim
1、 一种 DC / DC模块电源， 该电源包括电路板， 还包括一个或多个定 位构件， 所述定位构件一端为插件， 另一端为贴片， 其中， 所述定位构件的 插件对应连接所述电路板的通孔； 所述定位构件的贴片连接所述系统板。 A DC/DC module power supply, comprising: a circuit board, further comprising one or more positioning members, wherein the positioning member has a plug at one end and a patch at the other end, wherein the plug of the positioning member corresponds to a connection a through hole of the circuit board; a patch of the positioning member is connected to the system board.
2、 如权利要求 1所述的电源， 其中， 所述定位构件的插件以焊接方式对应连接所述电路板的通孔； 所述定位 构件的贴片以回流焊接方式连接所述系统板。 2. The power supply according to claim 1, wherein the insert of the positioning member is correspondingly connected to the through hole of the circuit board by soldering; the patch of the positioning member is connected to the system board by reflow soldering.
3、 如权利要求 1所述的电源， 该电源还包括定位卡片， 其中， 该定位卡片用于根据所述电路板的通孔之间的距离， 将一个或多个所述 定位构件连接为一体。 3. The power supply of claim 1, further comprising a positioning card, wherein the positioning card is used to connect one or more of the positioning members according to a distance between the through holes of the circuit board. .
4、 如权利要求 1、 2或 3所述的电源， 其中， 所述电路板垂直连接在所述系统板上。 4. The power supply of claim 1, 2 or 3, wherein the circuit board is vertically connected to the system board.
5、 如权利要求 4所述的电源， 其中， 所述电路板包括连接平面， 所述连接平面上设置有焊接焊盘； 所述电路板通过所述焊接焊盘垂直连接在所述系统板上。 The power supply according to claim 4, wherein the circuit board includes a connection plane, and the connection plane is provided with a solder pad; the circuit board is vertically connected to the system board through the solder pad .
6、 如权利要求 1、 2或 3所述的电源， 该 DC / DC模块电源还包括贴片 构件， 其中， 该贴片构件连接在所述电路板的顶部。 6. The power supply of claim 1, 2 or 3, the DC/DC module power supply further comprising a patch member, wherein the patch member is attached to the top of the circuit board.
7、 如权利要求 6所述的电源， 其中， 所述贴片构件为片状或折片状。 7. The power supply according to claim 6, wherein the patch member is in the form of a sheet or a flap.
8、 如权利要求 6所述的电源， 其中， 所述贴片构件通过导热绝缘胶粘接在所述电路板的顶部。 8. The power supply of claim 6, wherein the patch member is bonded to the top of the circuit board by a thermally conductive insulating glue.
PCT/CN2011/075364 2010-06-29 2011-06-07 Dc/dc module power supply WO2012000371A1 (en)

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