CN220368591U - Power supply device - Google Patents

Abstract

The power supply device comprises a system board, a power module and a ceramic capacitor. The system board includes a first face and a second face facing opposite. The power module is arranged on the first surface, the power module comprises a circuit board, a magnetic core assembly, plug-in pins and patch pins, the circuit board comprises two surfaces and four side surfaces, at least part of the magnetic core assembly penetrates through the circuit board, the circuit board is perpendicular to the system board, at least part of the patch pins are arranged on one side surface, facing the system board, of the four side surfaces, and the plug-in pins and the patch pins are connected to the system board. The ceramic capacitor is arranged in the vertical projection of the power module on the second surface and is electrically connected to the power module through the system board.

Description

Power supply device

Technical Field

The present disclosure relates to the field of power electronics, and more particularly, to an assembly structure (e.g., a power supply device) of a power module, where power pins of the power module are connected to a system board in a surface-mounted manner, so as to facilitate positioning of a multilayer ceramic capacitor, increase the number of the multilayer ceramic capacitors, and improve overall power density.

Background

The connection between the server power module and the system board is intended to meet the power transfer requirements while making the most efficient use of space layout possible. In the current common system using a universal redundant power supply (Common Redundant Power Supplies, CRPS), pins of a power module on a system board are connected with the system board through a plug-in unit. Due to the soldering process requirements used for soldering the plug-in, no other devices can be present in a certain area around the pins, for example in the range of 3mm, which makes the arrangement of the power module intangibly occupy more system board resources and affects the filtering effect. Furthermore, due to the limitation of the welding process, the distance between the power module and the output multi-layer ceramic capacitor (multi-layer ceramic capacitor, MLCC) is far, and the number of MLCCs is limited in space. Due to the location and number limitations of the MLCCs, all current needs to flow through the output inductor in order to reduce ripple, and thus the via (via) and pad (pad) currents on the inductor side are concentrated, with large losses.

Therefore, how to develop an assembly structure of a power module, the power pins of the power module are connected with the system board in a form of a surface-mounted mounting device, so as to facilitate the close position of the multilayer ceramic capacitors, increase the number of the multilayer ceramic capacitors, and improve the overall power density, which is a very important problem in the field.

Disclosure of Invention

The power pin of the power module is connected with the system board in a surface-mounted type mounting device mode, so that the positions of the multilayer ceramic capacitors are close to each other, the number of the multilayer ceramic capacitors is increased, and the overall power density is improved.

Another object of the present utility model is to provide a power supply device. The power module and the ceramic capacitor are respectively and electrically connected to two opposite surfaces of the system board through a surface adhesion technology, and are connected to the ceramic capacitor through the via hole and the bonding pad in the system board, so that the limitation that devices cannot be arranged in a certain range near the pins of the welding plug-in is avoided, the electric conduction distance from the power module to the ceramic capacitor is reduced, and the efficiency of electric transmission is improved. Furthermore, the surface-mounted patch pins can be matched with the plug-in pins of the through hole plugging technology to be connected with the system board, the surface-mounted patch pins are used as main electrical transmission paths, and the plug-in pins are used as signal transmission paths. The matching of the plug pins and the mounting holes can further provide the alignment of the patch pins and the surface pads during reflow soldering. Compared with the traditional method that only the through hole plugging technology is used for connecting the power module and the system board, the power pins of the power module are electrically connected to the system board in a surface-mount mode and are electrically connected to the ceramic capacitors through the through holes and the bonding pads of the system board, and the circuit loss (trace loss) of the main board is obviously reduced compared with the prior art under the half-load operation condition of the redundant power supply. On the other hand, the electric conduction distance is shortened by the configuration, and the effect of saving the configuration space is achieved. The saved configuration space can be used for adding ceramic capacitors, copper buses, output capacitors or other electronic devices, and further improves the overall power density. Along with the increase of the number of the ceramic capacitors, the gain filtering effect is facilitated, copper bars serving as filtering inductors can be omitted, more configuration and application are realized, and the competitiveness of products is enhanced.

In order to achieve the above-mentioned object, the present disclosure provides a power supply device, which includes a system board, a power module, and a ceramic capacitor. The system board includes a first face and a second face facing opposite. The power module is arranged on the first surface, the power module comprises a circuit board, a magnetic core assembly, plug-in pins and patch pins, the circuit board comprises two surfaces and four side surfaces, at least part of the magnetic core assembly penetrates through the circuit board, the circuit board is perpendicular to the system board, at least part of the patch pins are arranged on one side surface, facing the system board, of the four side surfaces, and the plug-in pins and the patch pins are connected to the system board. The ceramic capacitor is arranged in the vertical projection of the power module on the second surface and is electrically connected to the power module through the system board.

In an embodiment, the vertical projection of the patch pins of the power module on the first surface and the vertical projection of the ceramic capacitor on the first surface at least partially overlap.

In one embodiment, the ceramic capacitor and the chip pins of the power module are electrically connected to the chip pins of the power module through a via (via) or a pad (pad) of the system board.

In one embodiment, the power module is a DC/DC module.

In one embodiment, the patch pins are power pins and the package pins are signal pins or fixed pins.

In one embodiment, the system board includes at least one mounting hole, and the circuit board includes at least one card pin protruding outward from one of the four sides toward the system board, and connected to the system board by a solder through the at least one mounting hole.

In an embodiment, the system board includes a surface mount pad disposed on the first surface, wherein the surface mount pad is aligned with the surface mount pad when the interposer leads of the circuit board pass through the mounting holes of the system board.

In one embodiment, the system board includes two mounting holes, the circuit board includes two card pins, and the assembly is inserted on the system board through the two mounting holes, wherein the ceramic capacitor is disposed between the two mounting holes.

In an embodiment, the power supply device further includes an output capacitor disposed on the first surface and adjacent to the power module.

In an embodiment, the power supply device further includes a copper bus disposed on the first surface and adjacent to the power module.

In one embodiment, the ceramic capacitor is electrically connected to the system board by a surface mount technology.

In one embodiment, the power supply device is applied to a universal redundant power supply.

Wherein the card pins extend from one of the four sides toward and are inserted into the system board.

In one embodiment, the card pin is a metal pin, one end of which is soldered to the circuit board and the other end of which is inserted into the system board.

In one embodiment, the patch pins extend from one of the four sides toward the system board to two surfaces of the circuit board, respectively.

In an embodiment, the power module further includes a copper bar, and the patch pins are connected to the system board through the copper bar.

Drawings

Fig. 1A schematically illustrates a perspective view of an assembly structure (e.g., a power supply device) of a power module according to a first embodiment of the present disclosure from an upper perspective;

fig. 1B schematically illustrates a perspective view of an assembled structure of a power module according to a first embodiment of the present disclosure from an upper perspective;

fig. 2 schematically shows an exploded view of an assembled structure of a power module of a first embodiment of the present disclosure;

fig. 3 schematically shows a side view of an assembled structure of a power module of a first embodiment of the present disclosure;

FIG. 4 schematically illustrates a partial cross-sectional view taken along line AB of FIG. 3;

fig. 5A schematically shows a top view of an assembled structure of a power module of a first embodiment of the present disclosure;

fig. 5B schematically illustrates a bottom view of an assembled structure of a power module of a first embodiment of the present disclosure;

fig. 6 schematically shows a structural exploded view of an assembled structure (e.g., a power supply device) of a power module of a second embodiment of the present disclosure;

fig. 7A schematically illustrates a top view of an assembled structure of a second embodiment power module of the present disclosure;

fig. 7B schematically illustrates a bottom view of an assembled structure of a power module of a second embodiment of the present disclosure;

fig. 8 schematically shows a structural exploded view of an assembled structure (e.g., a power supply device) of a power module of a third embodiment of the present disclosure;

fig. 9 schematically shows a structural exploded view of an assembled structure (e.g., a power supply device) of a power module of a fourth embodiment of the present utility model.

[ symbolic description ]

1. 1a, 1b, 1c: assembling structure of power module

10: system board

11: first surface

12: a second surface

13. 13a: surface tin plate

14. 14a: mounting perforation

15: via hole

20. 20a, 20b: power module

21: circuit board

211: side surface

212. 213: surface of the body

22. 22a: patch pin

23. 23a: plug-in pin

231. 232: end of the device

24: power device

25: magnetic core of transformer

26: inductance magnetic core

27: ceramic capacitor

28: copper bar

30: ceramic capacitor

40: copper bus

41: output capacitor

D1, D2: minimum distance of separation

X, Y, Z: shaft

Detailed Description

Some exemplary embodiments that exhibit the features and advantages of the present disclosure are described in detail in the following description. It should be understood that the present disclosure is capable of modification in various other ways without departing from the scope of the disclosure, and that the description and drawings are intended to be illustrative in nature and not limiting. For example, if the disclosure below describes disposing a first feature on or over a second feature, it is intended to include embodiments in which the first feature is disposed in direct contact with the second feature, as well as embodiments in which additional features may be disposed between the first feature and the second feature such that the first feature and the second feature may not be in direct contact. In addition, various embodiments of the present disclosure may use repeated reference characters and/or marks. These repetition are for the purpose of simplicity and clarity and do not in itself dictate a relationship between the various embodiments and/or configurations of the depicted items. Moreover, spatially relative terms such as "upper," "lower," "inner," "outer," "top," "bottom," and the like may be used for convenience in describing the relationship of one component or feature to another component(s) or feature in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may also be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors of the spatially relative descriptors used herein interpreted accordingly. Further, when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. In addition, it will be understood that although the terms "first," "second," "third," etc. may be used in the claims to describe various elements, these elements should not be limited by these terms, and that these elements described in connection with the embodiments are represented by different reference numerals. These terms are used to distinguish one element from another. For example: a first component could be termed a second component, and, similarly, a second component could be termed a first component, without departing from the scope of the embodiments. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Fig. 1A and 1B schematically show a perspective view of an assembly structure (e.g., a power supply device) of a power module according to a first embodiment of the present disclosure. Fig. 2 schematically shows an exploded view of the assembly structure of the power module of the first embodiment of the present disclosure. Fig. 3 schematically shows a side view of an assembled structure of a power module according to a first embodiment of the present disclosure. Fig. 4 schematically shows a partial sectional view along line AB in fig. 3, wherein the portion to the left of the broken line is omitted. Fig. 5A schematically shows a top view of an assembled structure of a power module of a first embodiment of the present disclosure. Fig. 5B schematically shows a bottom view of an assembled structure of the power module of the first embodiment of the present disclosure. In this embodiment, an assembly structure (hereinafter or abbreviated as assembly structure) 1 of a power module is provided, which can be applied to a universal redundancy power supply (Common Redundant Power Supplies, CRPS). In the present embodiment, the assembly structure 1 includes a system board 10, a power module 20, and a ceramic capacitor 30. The ceramic capacitor can be one or a plurality of ceramic capacitors. The system board 10 is, for example, a universal redundant power board (main board) and includes a first side 11 and a second side 12 facing opposite. The power module 20 is disposed on the first surface 11 of the system board 10, and includes at least a chip pin 22. The patch pins 22 are located at the junction of the circuit board 21 and the system board 10, extend from the side 211 of the circuit board 21 facing the system board 10 to two surfaces 212, 213 of the circuit board 21, and are electrically connected to the system board 10 by a Surface-Mount Technology (SMT). The ceramic capacitor 30 is disposed on the second surface 12 of the system board 10, and is electrically connected to the power module 20 through the system board 10. In this embodiment, the ceramic capacitor 30 may also be electrically connected to the second surface 12 of the system board 10 by a surface adhesion technology. Of course, the power module 20 is not limited to a simple Surface-mounted Device (SMD). In other embodiments, the power module 20 may be mounted on the system board 10 by a surface mount technology (surface mount technology) and a Through hole technology (Through hole technology), respectively, and form electrical connection. It should be noted that the patch pins 22 spatially corresponding to the ceramic capacitors 30 are electrically connected to the first surface 11 of the system board 10 only by the surface adhesion technology. In the present embodiment, the ceramic capacitor 30 and the chip pins 22 of the power module 20 are electrically connected through a through hole (via) 15 or a pad (pad) (not shown) of the system board 10. It should be noted that the power module 20, the system board 10 and the ceramic capacitor 30 are stacked along the Z-axis direction, and the vertical projection of the patch pins 22 of the power module 20 on the first surface 11 and the vertical projection of the ceramic capacitor 30 on the first surface at least partially overlap. When the chip pins 22 of the power module 20 are used as output terminals, they are directly connected to the output ceramic capacitor 30 through the via holes 15 of the system board 10, which helps to reduce the current path and also helps to reduce the ripple.

In the present embodiment, the power module 20 is, for example, a DC/DC module, and includes at least one DC/DC conversion circuit (not shown). In the present embodiment, the power module 20 includes at least a circuit board 21, a chip pin 22, a plug pin 23, and a magnetic core assembly such as a transformer core 25 or an inductor core 26. The circuit board 21 includes two surfaces 212, 213 and four sides, at least part of the magnetic core assembly passes through the circuit board 21, the circuit board 21 is vertically inserted into the first surface 11 of the system board 10 along the Z-axis direction, the circuit board 21 has a side 211 facing the system board 10, and the patch pins 22 are located on the side 211 of the circuit board 20 facing the system board 10 and extend to the two surfaces 212, 213 of the circuit board 21, respectively. The circuit board 21 is connected to the system board 10 through the card pins 23 and the patch pins 22. In the present embodiment, a plurality of power devices 24, a transformer core 25, and a transformer winding (not shown) are provided on the circuit board 21. The transformer winding is disposed on the circuit board 21, for example, integrally formed with the circuit board 21, and the transformer core 25 is disposed corresponding to the transformer winding. In this embodiment, the transformer core 25 and the transformer winding together constitute a transformer, such as a planar transformer. In addition, the power device 24 may be, for example, a metal oxide semiconductor field effect transistor (Metal Oxide Semiconductor Field Effect Transistor, MOSFET), an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT), or gallium nitride (GaN). The power device 24 and other devices such as ceramic capacitor 27 provided on the circuit board 21 are surface mount devices (Surface mounted device, SMD) and are connected to the circuit board 21 by a surface mount technology.

In the present embodiment, the power module 20 further includes an inductor winding (not shown) of an inductor core 26 disposed on the circuit board 21 to form an LLC resonant circuit, and the inductor core 26 and the inductor winding together form a resonant inductor. The inductance winding may be disposed on the circuit board 21, for example, the inductance winding is integrally formed with the circuit board 21. The inductance core 26 and the transformer core 25 may be arranged side by side, and the inductance core 26 is located between the transformer core 25 and the power device 24, so in this embodiment, the resonant inductor, the transformer and the power device 24 are integrated on the circuit board 21, and the windings of the resonant inductor and the windings of the transformer are formed on the circuit board 21, so that the volume of the power source can be greatly reduced and the external dimension of the power source can be reduced under the condition of ensuring the power density. In some embodiments, inductive core 26 and transformer core 25 may together form an integrated core. In other embodiments, the inductor core 26 and the transformer core 25 are separate core assemblies. Of course, the present disclosure is not limited thereto, and will not be described in detail.

In this example, the system board 10 includes at least one surface pad 13 and at least one mounting via 14. The surface mount pad 13 is disposed on the first surface 11 and spatially corresponds to the chip pin 22 of the power module 20. In this embodiment, the circuit board 21 further includes at least one card pin 23 protruding outward from the side 211 and spatially opposite to the mounting hole 14 on the system board 10. Wherein the card pins 23 of the circuit board 21 may be connected to the system board 10 by soldering through the mounting holes 14 of the system board 10. In other words, the power module 20 and the system board 10 also include a Through-hole technology (Through-hole technology) connection mode. In this embodiment, the chip pins 22 are aligned to the surface mount pads 13 for subsequent reflow soldering when the package pins 23 of the circuit board 21 pass through the mounting holes 14 of the system board 10. Of course, the present utility model is not limited thereto. On the other hand, since the electrical conduction distance between the chip pins 22 and the Surface Mount pads 13 by Surface Mount Technology (SMT) is smaller than the electrical conduction distance between the mounting holes of the package pins 23 by through-hole mounting Technology, the chip pins 22 of the power module 20 may be used for power transmission, and the package pins 23 may be used for signal transmission, for example. In this embodiment, the patch pins 22 are used as power pins, and the plug pins 23 may be electrically connected to the system board 10, or may be used only as fixing pins and mechanically connected to the system board 10. In other embodiments, a portion of the package pins 23 are used for electrical connection, and a portion of the package pins 23 are used for fixation. Of course, the present application is not limited thereto.

In this embodiment, the system board 10 includes at least two mounting holes 14 and the circuit board 21 includes at least two card pins 23. The card pins 23 are inserted through the mounting holes 14 on the system board 10. In this embodiment, the ceramic capacitor 30 is further disposed between the two mounting holes 14.

Since the package pins 23 on the power module 20 and the mounting holes 14 of the system board 10 are soldered by the through-hole plugging technique, no other device can be disposed within 3mm around the package pins 23 and the mounting holes 14. In the present embodiment, the card pin 23 and the ceramic capacitor 30 have a minimum distance D1 therebetween, wherein the minimum distance D1 is greater than 3mm. In addition, the mounting via 14 and the ceramic capacitor 30 have a minimum separation distance D2 therebetween, wherein the minimum separation distance D2 is at least 3mm. Therefore, the power module 20, the system board 10 and the ceramic capacitor 30 can be arranged to meet the requirement of the soldering process by the through hole plugging technology.

On the other hand, since the chip pins 22 of the power module 20 of the assembly structure 1 are electrically connected to the system board 10 by Surface-Mount Technology (SMT), the ceramic capacitors 30 may be disposed closer to the power module 20, and the number of the ceramic capacitors 30 may be further increased under the condition of meeting the standard specified size, so as to improve the overall power density. Of course, the space saved by the power module 20, the system board 10 and the ceramic capacitor 30 can be used for setting other components, which is not limited in this case.

In this embodiment, the assembly structure 1 applied to the redundant power supply may include a copper bus 40 disposed on the first surface 11 of the system board 10 and adjacent to the power module 20 to form an output inductor, so that the output current of the power module 20 can pass through the output inductor to reduce the ripple. Of course, the present disclosure is not limited thereto. In this embodiment, the assembly structure 1 further includes an output capacitor 41 disposed on the first surface 11 of the system board 10 and disposed adjacent to the power module 20 on the XY plane. Of course, in other embodiments, PFC modules, EMI modules, bus capacitors, connectors may be further provided on the system board 10. However, the configuration is not limited to the essential features of the present utility model, and will not be described herein.

It should be noted that, compared with the conventional method of connecting the power module and the system board only by the through-hole plugging Technology, the chip pins 22 of the power module 20 of the assembled structure 1 extend from the circuit board 21 to the two surfaces 212, 213 of the circuit board 21 toward the side 211 of the system board 10, and are electrically connected to the system board 10 by the Surface-Mount Technology (SMT) and are electrically connected to the ceramic capacitor 30 through the holes 15, so that the circuit loss of the motherboard is significantly reduced compared with the prior art under the half-load operation condition of the redundant power supply.

Fig. 6 schematically shows a structural exploded view of an assembled structure (e.g., a power supply device) of a power module of a second embodiment of the present utility model. Fig. 7A schematically shows a top view of an assembled structure of a power module of a second embodiment of the present disclosure. Fig. 7B schematically shows a bottom view of an assembled structure of a power module of a second embodiment of the present disclosure. In the present embodiment, the assembly structure 1A is similar to the assembly structure 1 shown in fig. 1A to 5B, and the same component numerals represent the same components, structures and functions, and will not be repeated herein. In the present embodiment, the assembly structure 1a further omits the arrangement of the copper bus lines 40 and increases the number of the ceramic capacitors 30. The ceramic capacitors 30 are arranged in three rows between the two mounting holes 14, and the minimum distance D2 between the mounting holes 14 and the ceramic capacitors 30 can be maintained at least greater than 3mm. Since the chip pins 22 of the power module 20 are electrically connected to the system board 10 by Surface-Mount Technology (SMT) and electrically connected to the ceramic capacitors 30 through the holes 15, the configuration space can be effectively saved, and the number of the ceramic capacitors 30 can be increased. With the increase of the number of the ceramic capacitors 30, filtering is beneficial when the ceramic capacitors are applied to redundant power supplies, so that the copper bus 40 can be further omitted, and the saved space can be used for adding other devices, such as the output capacitor 41, so as to improve the overall power density. Of course, the present disclosure is not limited thereto. In other embodiments, the number and arrangement of the copper bus 40, the output capacitor 41, and the ceramic capacitor 30 can be further modified according to the practical application requirements. Of course, the present disclosure is not limited thereto, and will not be described in detail.

Fig. 8 schematically shows a structural exploded view of an assembled structure (e.g., a power supply device) of a power module of a third embodiment of the present utility model. In the present embodiment, the assembly structure 1B is similar to the assembly structure 1 shown in fig. 1A to 5B, and the same component numerals represent the same components, structures and functions, and will not be repeated herein. In this embodiment, the power module 20a further includes a plug-in pin 23a, which has one end 231 soldered to the circuit board 21 and the other end 232 inserted into the mounting hole 14a of the system board 10. Of course, the plug pins 23a may be used for electrical connection or for fixing. Therefore, the assembling structure 1b can be used for increasing the adjustability in assembling according to the actual application requirements.

Fig. 9 schematically shows a structural exploded view of an assembled structure (e.g., a power supply device) of a power module of a fourth embodiment of the present utility model. In the present embodiment, the assembly structure 1c is similar to the assembly structure 1 shown in fig. 1A to 5B, and the same component numerals represent the same components, structures and functions, and will not be repeated herein. In this embodiment, the power module 20b further includes a copper bar 28, and the chip pins 22a are connected to the corresponding surface pads 13a on the system board 10 via the copper bar 28. Therefore, the assembling structure 1c can further increase the adjustability during assembling according to the actual application requirement. Of course, the present disclosure is not limited thereto.

In summary, the embodiment of the present disclosure provides an assembly structure of a power module, in which power pins of the power module are connected to a system board in a surface-mounted device manner, so as to facilitate the close positioning of the multilayer ceramic capacitors, increase the number of the multilayer ceramic capacitors, and improve the overall power density. The power module and the ceramic capacitor are respectively and electrically connected to two opposite sides of the system board through a surface adhesion technology, and are connected to the ceramic capacitor through a via hole and a bonding pad in the system board, so that the limitation that devices cannot be arranged in a 3mm area of a pin of the welding plug-in is avoided, the electric conduction distance from the power module to the ceramic capacitor is reduced, and the efficiency of electric transmission is improved. Furthermore, the surface-mounted patch pins can be matched with the plug-in pins of the through hole plugging technology to be connected with the system board, the surface-mounted patch pins are used as main electrical transmission paths, and the plug-in pins are used as signal transmission paths. The matching of the plug pins and the mounting holes can further provide the alignment of the patch pins and the surface pads during reflow soldering. Compared with the traditional method that the power module and the system board are connected only by a through hole plugging technology, the power pins of the power module are electrically connected to the system board in a surface-mounted mode and are directly and electrically connected to a plurality of ceramic capacitors through the through holes and the bonding pads of the system board, and the circuit loss of the main board is obviously reduced compared with the prior art under the half-load operation condition of using a redundant power supply. On the other hand, the electric conduction distance is shortened by the configuration, and the effect of saving the configuration space is achieved. The saved configuration space can be used for adding ceramic capacitors, copper buses, output capacitors or other electronic devices, and further improves the overall power density. Along with the increase of the number of the ceramic capacitors, the gain filtering effect is facilitated when the ceramic capacitors are applied to redundant power supplies, copper bars serving as filtering inductors can be omitted, more configuration and application are realized, and the competitiveness of products is enhanced.

The present application is modified in a manner that would be obvious to one skilled in the art without departing from the scope of the utility model as defined in the appended claims.

Claims (16)

1. A power supply device, comprising:

a system board including a first surface and a second surface facing opposite;

the power module is arranged on the first surface and comprises a circuit board, a magnetic core component, a plug-in pin and a patch pin, wherein the circuit board comprises two surfaces and four side surfaces, at least part of the magnetic core component penetrates through the circuit board, the circuit board is vertical to the system board, at least part of the patch pin is arranged on one side surface facing the system board in the four side surfaces, and the plug-in pin and the patch pin are connected to the system board; and

the ceramic capacitor is arranged in the vertical projection of the power module on the second surface and is electrically connected to the power module through the system board.

2. The power device of claim 1, wherein the vertical projection of the chip pins of the power module on the first surface and the vertical projection of the ceramic capacitor on the first surface are at least partially overlapped.

3. The power device of claim 1, wherein the ceramic capacitor is electrically connected to the chip pins of the power module through a via or a pad of the system board.

4. The power device of claim 1, wherein the power module is a DC/DC module.

5. The power supply device of claim 1, wherein the patch pins are power pins and the package pins are signal pins or fixed pins.

6. The power device of claim 1, wherein the system board includes at least one mounting hole, the card pin protruding outwardly from the four sides toward the side of the system board and being connected to the system board by a solder through the at least one mounting hole.

7. The power device of claim 6, wherein the system board includes a surface mount pad disposed on the first side, and wherein the surface mount pin is aligned to the surface mount pad when the interposer pin passes through the at least one mounting hole of the system board.

8. The power device of claim 6, wherein the system board includes two mounting holes, the power module includes two plug-in pins, the circuit board is inserted onto the system board through the two mounting holes, and wherein the ceramic capacitor is disposed between the two mounting holes.

9. The power device of claim 1, further comprising an output capacitor disposed on the first side and adjacent to the power module.

10. The power device of claim 1, further comprising a copper bus disposed on the first side and adjacent to the power module.

11. The power device of claim 1, wherein the ceramic capacitor is electrically connected to the system board by a surface mount technology.

12. The power supply device of claim 1, wherein the power supply device is applied to a universal redundant power supply.

13. The power device of claim 1, wherein the card pins extend from the four sides toward the side of the system board and are inserted into the system board.

14. The power supply device of claim 1, wherein the plug-in pin is a metal pin, one end of the metal pin is soldered to the circuit board, and the other end of the metal pin is inserted into the system board.

15. The power device of claim 1, wherein the patch pins extend from the one of the four sides toward the side of the system board to the two surfaces of the circuit board, respectively.

16. The power device of claim 1, wherein the power module further comprises a copper bar, the patch pin being connected to the system board via the copper bar.