CN112038054B - Voltage regulation module - Google Patents

Voltage regulation module Download PDF

Info

Publication number
CN112038054B
CN112038054B CN202010217191.2A CN202010217191A CN112038054B CN 112038054 B CN112038054 B CN 112038054B CN 202010217191 A CN202010217191 A CN 202010217191A CN 112038054 B CN112038054 B CN 112038054B
Authority
CN
China
Prior art keywords
circuit board
printed circuit
voltage regulation
regulation module
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010217191.2A
Other languages
Chinese (zh)
Other versions
CN112038054A (en
Inventor
金达
熊雅红
崔俊国
宿清华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to CN202210238614.8A priority Critical patent/CN114446592A/en
Priority to CN202210238612.9A priority patent/CN114446591A/en
Priority to US16/887,026 priority patent/US11134571B2/en
Publication of CN112038054A publication Critical patent/CN112038054A/en
Priority to US17/170,537 priority patent/US11395409B2/en
Priority to US17/575,562 priority patent/US11564318B2/en
Application granted granted Critical
Publication of CN112038054B publication Critical patent/CN112038054B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • H01F27/26Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/266Fastening or mounting the core on casing or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/40Structural association with built-in electric component, e.g. fuse
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/02Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/02Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/02Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H02M3/1584Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/22Conversion of dc power input into dc power output with intermediate conversion into ac
    • H02M3/24Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
    • H02M3/28Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/02Conversion of ac power input into dc power output without possibility of reversal
    • H02M7/04Conversion of ac power input into dc power output without possibility of reversal by static converters
    • H02M7/12Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/21Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/217Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065Mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2814Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2819Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262Arrangements for regulating voltages or for using plural voltages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/041Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • H05K2201/086Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1003Non-printed inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10053Switch
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10272Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors

Abstract

The utility model relates to a voltage regulation module, include first printed circuit board, switch circuit and second printed circuit board, first printed circuit board contains first face and second face, contain first lead joining region on the second face of first printed circuit board, switch circuit sets up on the first face of first printed circuit board, switch circuit leads joining region electricity through the guide hole in the first printed circuit board and is connected with first, second printed circuit board contains first face and second face, the first face of second printed circuit board contacts with the second face of first printed circuit board, and contain the second and lead joining region, the second leads joining region and first lead joining region looks rigid coupling, contain on the second face of second printed circuit board and leads joining portion, lead joining portion and second lead joining region electricity through the guide hole in the second printed circuit board and be connected, and lead joining portion and system board electricity and be connected.

Description

Voltage regulation module
Technical Field
The present disclosure relates to a voltage regulating module, and more particularly, to a voltage regulating module with reduced thickness.
Background
Referring to fig. 1A and 1B, fig. 1A is a schematic structural diagram of a conventional electronic device, and fig. 1B is a schematic structural diagram of the voltage regulation module shown in fig. 1A. As shown in fig. 1A and 1B, the conventional electronic device 1 adopts a horizontal power supply structure and includes a Central Processing Unit (CPU) 11, a voltage regulating module 12 and a system board 13, wherein the voltage regulating module 12 includes an output capacitor 14. The voltage regulating module 12 is configured to convert the received input voltage into a regulated voltage and provide the regulated voltage to the cpu 11, and the voltage regulating module 12 and the cpu 11 are both disposed on the first surface of the system board 13. In addition, in order to meet the requirement of load dynamic switching, the output end of the voltage regulation module 12 is close to the power supply input end of the central processing unit 11. The output capacitor 14 is disposed on a second surface of the system board 13 opposite to the first surface, and is adjacent to the power supply input terminal of the cpu 11.
In addition, the voltage regulation module 12 further has a printed circuit board 15 and a magnetic component 16. The magnetic assembly 16 is disposed on the printed circuit board 15, and a switch assembly may be disposed in a gap between the printed circuit board 15 and the magnetic assembly 16. The printed circuit board 15 is disposed on a first surface of the system board 13, such that heat generated by the voltage regulating module 12 can be transmitted to the system board 13 through the printed circuit board 15, and then dissipated by a heat dissipation system (not shown) of the system board 13.
However, since the power density requirement of the system board 13 is higher and the thickness requirement of the system board 13 is thinner and thinner, the thickness dimension of the voltage regulating module 12 is smaller and smaller, for example, less than 5mm, even less than or equal to 3mm, so that the technology of stacking the switching circuit and the magnetic component 16 of the voltage regulating module 12 on the printed circuit board 15 in the conventional electronic device 1 is not satisfactory due to the limitation of the thickness. In addition, most conventional voltage regulation modules 12 employ multiple planar windings in a multi-layer printed circuit board to meet the requirements of a multi-phase voltage step-down circuit, but the multi-layer printed circuit board will increase the thickness of the whole electronic device 1.
Therefore, there is a need to develop a voltage regulation module to solve the problems of the prior art.
Disclosure of Invention
The present disclosure is directed to a voltage regulation module, which can achieve the technical effect of reducing the thickness dimension.
To achieve the above objective, an embodiment of the present disclosure provides a voltage regulation module, which includes a first printed circuit board, at least one switch circuit, and a second printed circuit board. The first printed circuit board comprises a first surface and a second surface which are opposite, the second surface of the first printed circuit board comprises at least one first conducting area, and the at least one first conducting area forms at least one of a positive output end, a negative output end or a positive input end of the voltage regulating module. The switch circuit is arranged on the first surface of the first printed circuit board and is electrically connected with the first conducting area through the guide hole in the first printed circuit board. The second printed circuit board comprises a first surface and a second surface which are opposite, the first surface of the second printed circuit board is adjacent to and in contact with the second surface of the first printed circuit board, the first surface of the second printed circuit board comprises at least one second conducting area, the second conducting area is arranged corresponding to the corresponding first conducting area and is fixedly connected and electrically connected with the corresponding first conducting area, the second surface of the second printed circuit board comprises at least one conducting part, the conducting part is electrically connected with the corresponding second conducting area through a guide hole in the second printed circuit board, and the second printed circuit board is electrically connected with the system board through the conducting part, wherein the at least one second conducting area forms at least one of a positive output end, a negative output end or a positive input end of the voltage regulating module, and the at least one conducting part forms at least one of a positive output end, a negative output end or a positive input end of the voltage regulating module.
Drawings
Fig. 1A is a schematic structural diagram of a conventional electronic device.
Fig. 1B is a schematic structural diagram of the voltage regulation module shown in fig. 1A.
Fig. 2 is a schematic structural diagram of a voltage regulation module according to a first preferred embodiment of the present disclosure.
Fig. 3 is an exploded view of the voltage regulation module shown in fig. 2.
Fig. 4 is a schematic structural diagram of another view angle of the voltage regulation module shown in fig. 2.
Fig. 5 is an equivalent circuit diagram of the voltage regulation module shown in fig. 2.
Fig. 6 is a schematic structural diagram of a voltage regulation module according to a second preferred embodiment of the present disclosure.
Fig. 7 is an exploded view of the voltage regulation module shown in fig. 6.
Fig. 8 is a schematic structural diagram of a voltage regulation module according to a third preferred embodiment of the present disclosure.
Fig. 9 is a schematic structural diagram of another view angle of the voltage regulating module shown in fig. 8.
Fig. 10 is a schematic structural diagram of a voltage regulation module according to a fourth preferred embodiment of the present disclosure.
Fig. 11 is a schematic structural diagram of another view angle of the voltage regulation module shown in fig. 10.
Fig. 12 is a schematic structural diagram of a voltage regulation module according to a fifth preferred embodiment of the present disclosure.
Fig. 13 is an exploded view of the voltage regulation module shown in fig. 12.
Fig. 14 is an exploded structure diagram of a voltage regulation module according to a sixth preferred embodiment of the present disclosure.
Fig. 15 is an exploded view of the voltage regulation module shown in fig. 14 from another perspective.
Fig. 16 is an exploded view schematically illustrating a voltage regulation module according to a seventh preferred embodiment of the present disclosure.
Fig. 17 is an exploded view of the voltage regulation module shown in fig. 16.
Wherein the reference numerals are as follows:
1: existing electronic device
11: central processing unit
12: voltage regulation module
13: system board
14: output capacitor
15: printed circuit board
16: magnetic assembly
2. 2a, 2b, 2c, 2d, 2e, 2 f: voltage regulation module
Cin: input capacitance
Cout: output capacitor
21: switching circuit
L: inductance
SW: first end
Vin +: positive input end
Vin-: negative input terminal
Vo +: positive output terminal
Vo-: negative output end
22: control circuit
PWM1, PWM2, PWM3, PWM 4: pulse width control signal
3: first printed circuit board
31: first side
311: first through hole
32: second surface
321: second through hole
33: containing space
34: the first groove
35: second groove
36: side wall
4: metal winding
41: third through hole
42: first end
43: second end
44: inner side wall
5: magnetic core assembly
51: upper magnetic core
52: lower magnetic core
53: side column
54: center post
70: input capacitance
71: first positive output conductive connection region
72: first negative output conductive connection region
73: first positive input conducting area
74: first signal conducting area
75: positive output lead connection part
75 a: positive output lead plating pattern
76: negative output lead-in part
76 a: negative output lead-in plating pattern
77: positive input lead connection part
77 a: positive input lead portion plating pattern
78: signal connecting part
78 a: signal lead-in part electroplating pattern
81: the first plastic packaging layer
82: second plastic packaging layer
9: second printed circuit board
91: first side
92: second surface
931: second positive output conducting region
932: second negative output conductive connection region
933: second positive input lead region
934: second signal conducting area
941: positive output lead connection part
942: negative output lead-in part
943: positive input lead connection part
944: signal connecting part
951: a first accommodation groove
952: second accommodation groove
Detailed Description
Some exemplary embodiments that incorporate the features and advantages of the present disclosure will be described in detail in the specification which follows. It is to be understood that the disclosure is capable of various modifications in various embodiments without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.
Referring to fig. 2 to 5, fig. 2 is a schematic structural diagram of a voltage regulation module according to a first preferred embodiment of the present disclosure, fig. 3 is a schematic structural diagram of an explosion of the voltage regulation module shown in fig. 2, fig. 4 is a schematic structural diagram of another view angle of the voltage regulation module shown in fig. 2, and fig. 5 is an equivalent circuit diagram of the voltage regulation module shown in fig. 2. As shown in the figure, the voltage regulating module 2 of the present embodiment can be applied in an electronic device and connected to a system board or a carrier board (not shown) in the electronic device by soldering. The voltage regulating module 2 shown in fig. 2 may form the circuit structure shown in fig. 5, and in the circuit structure shown in fig. 5, the voltage regulating module 2 includes at least two single-phase buck circuits (or boost circuits, or buck-boost circuits), at least one input capacitor Cin, and an output capacitor Cout. The voltage regulating module 2 of the present embodiment includes four single-phase voltage-reducing circuits, and each single-phase voltage-reducing circuit includes a driver switch unit 21 (hereinafter referred to as a switch circuit 21) having a driver and a switch component, and an inductor L, in other words, the voltage regulating module 2 includes four switch circuits 21 and four inductors L.
The second end of each switch circuit 21 is connected in series to the first end SW of the corresponding inductor L to form a single-phase buck circuit, and the first ends of the four single-phase buck circuits (i.e., the first end of each switch circuit 21) are electrically connected in parallel and then electrically connected to the input capacitor Cin of the voltage regulation module 2 to form the input end (including the positive input end Vin + and the negative input end Vin-) of the voltage regulation module 2, the first end of the input capacitor Cin is electrically connected to the positive input end Vin + of the voltage regulation module 2, and the second end of the input capacitor Cin is electrically connected to the negative input end Vin-of the voltage regulation module 2. The second terminals of the four single-phase voltage-reducing circuits (i.e., the second terminal of each inductor L) are electrically connected in parallel and then electrically connected to the output capacitor Cout, so as to form the output terminal (including the positive output terminal Vo + and the negative output terminal Vo-, wherein the negative output terminal Vo-is connected to the negative input terminal Vin-by a short circuit) of the voltage regulating module 2, the first terminal of the output capacitor Cout is electrically connected to the positive output terminal Vo + of the voltage regulating module 2, and the second terminal of the output capacitor Cout is electrically connected to the negative output terminal Vo-of the voltage regulating module 2.
In some embodiments, the switch circuit 21 constituting the voltage regulation module 2 of fig. 5 includes a transistor switch and a driver for driving the transistor switch. The voltage regulating module 2 further comprises a control circuit 22, the control circuit 22 generates four sets of pulse width control signals PWM1, PWM2, PWM3 and PWM4 by sampling the output voltage of the voltage regulating module 2 and the required current, wherein two adjacent sets of pulse width control signals are all out of phase by 90 degrees, such as the pulse width control signals PWM1 and PWM2, the pulse width control signals PWM2 and PWM3, the pulse width control signals PWM3 and PWM4, the pulse width control signals PWM4 and PWM1, and each of the pulse width control signals PWM1, PWM2, PWM3 and PWM4 is used to control the corresponding single-phase voltage dropping circuit, such as the pulse width control signal PWM1 is used to control the first-phase voltage dropping circuit, the pulse width control signal PWM2 is used to control the second-phase voltage dropping circuit, the pulse width control signal PWM3 is used to control the third-phase voltage dropping circuit, and the pulse width control signal PWM4 is used to control the fourth-phase voltage dropping circuit.
In the present embodiment, the physical structure of the voltage regulating module 2 includes a first printed circuit board 3, at least one metal winding 4 and a magnetic core assembly 5. The first printed circuit board 3 includes a first surface 31, a second surface 32 and at least one accommodating space 33. In order to show the position of the accommodating space 33, the first pcb 3 is divided into two parts, i.e. a first surface 31 and a second surface 32, along the dotted line in fig. 2 and 3, and actually the first surface 31 and the second surface 32 of the first pcb 3 are integrally formed, and the first surface 31 and the second surface 32 of the first pcb 3 are disposed opposite to each other. The first surface 31 of the first printed circuit board 3 has at least one first through hole 311, such as four first through holes 311 shown in fig. 3. The second surface 32 of the first printed circuit board 3 has at least one second through hole 321, such as four second through holes 321 shown in fig. 3, and the position of each second through hole 321 corresponds to the position of the corresponding first through hole 311. The printed circuit board 3 of the present embodiment has four accommodating spaces 33, each accommodating space 33 is located in the first printed circuit board 3 and between the first surface 31 and the second surface 32, and each accommodating space 33 is communicated with the corresponding first through hole 311 on the first surface 31 and the corresponding second through hole 321 on the second surface 32.
As shown in fig. 3, the voltage regulating module 2 of the present embodiment includes four metal windings 4, the four metal windings 4 are wound in the same direction, each metal winding 4 may be made of copper, aluminum, an alloy thereof, or other metal materials with good conductive characteristics and low parasitic resistance, and each metal winding 4 is disposed in the corresponding accommodating space 33 and embedded in the first printed circuit board 3, wherein the four metal windings 4 are disposed at positions that can form a plane parallel to the first surface 31 and the second surface 32 of the first printed circuit board 3. Each metal winding 4 further includes a third through hole 41, and the third through hole 41 of each metal winding 4 is disposed at a position and in a shape corresponding to the corresponding second through hole 321 and the corresponding first through hole 311, wherein the third through hole 41 of each metal winding 4 may be formed by the inner sidewall 44 of the metal winding 4.
The core assembly 5 includes an upper core 51, a lower core 52, and at least one side post 53. The upper core 51 is disposed on the first printed circuit board 3 from the first surface 31 of the first printed circuit board 3, such as but not limited to the center position of the first printed circuit board 3, the lower core 52 is disposed on the first printed circuit board 3 from the second surface 32 of the first printed circuit board 3, and the lower cores 52 are disposed on the opposite sides of the first printed circuit board 3 corresponding to the positions of the upper cores 51. In addition, the magnetic core assembly 5 of the present embodiment includes four side pillars 53 located between the upper magnetic core 51 and the lower magnetic core 52, wherein the four side pillars 53 may be connected to the lower magnetic core 52 as shown in fig. 3, or the four side pillars 53 are connected to the upper magnetic core 51 (not shown), or the four side pillars 53 are independent from between the upper magnetic core 51 and the lower magnetic core 52 (not shown). When the upper core 51 and the lower core 52 of the core assembly 5 are assembled, each side pillar 53 passes through the corresponding second through hole 321 on the second surface 32 of the first pcb 3, the corresponding third through hole 41 on the metal winding 4, and the corresponding first through hole 311 on the first surface 31 of the first pcb 3, so that the upper core 51 and the lower core 52 are assembled to fasten the first pcb 3. In the present embodiment, each metal winding 4 is matched with the corresponding side pillar 53, so that the magnetic core assembly 5 and the four metal windings 4 are respectively matched with each other to form four inductors L, wherein the directions of the dc magnetic fluxes flowing through the four side pillars 53 are the same.
As can be seen from the above, the metal winding 4 of the voltage regulation module 2 of the present disclosure is embedded in the accommodating space 33 of the first printed circuit board 3, and the magnetic core assembly 5 is disposed on the first printed circuit board 3 in an up-and-down buckling manner, so that the inductance L formed by the metal winding 4 and the magnetic core assembly 5 of the voltage regulation module 2 of the present disclosure is partially (i.e., the metal winding 4) disposed in the first printed circuit board 3, and the other portion of the inductance L (i.e., the magnetic core assembly 5) is disposed on the first printed circuit board 3, so as to greatly reduce the height of the voltage regulation module 2 of the present embodiment compared with the arrangement manner that the magnetic assembly of the voltage regulation module in the existing electronic device is stacked on the printed circuit board. In addition, because the voltage regulation module 2 of the present disclosure utilizes the plurality of metal windings 4 embedded in the accommodating space 33 of the first printed circuit board 3 to meet the requirement of the multi-phase voltage-dropping circuit, compared with the existing voltage regulation module that utilizes the multi-layer planar windings in the multi-layer printed circuit board to achieve the multi-phase voltage-dropping circuit, the thickness of the voltage regulation module 2 of the present disclosure is much smaller than that of the existing voltage regulation module, and because the metal windings 4 have the advantages of smaller parasitic resistance and smaller power loss compared with the planar windings, the overall parasitic resistance of the voltage regulation module 2 of the present disclosure is smaller and the overall power loss is smaller.
In the present embodiment, the voltage regulating module 2 further includes at least one switch circuit 21, for example, four switch circuits 21 shown in fig. 2 and 3, the four switch circuits 21 are disposed on the first surface 31 of the first printed circuit board 3, two of the switch circuits 21 are adjacent to the first side of the upper magnetic core 51, and the other two switch circuits 21 are adjacent to the second side of the upper magnetic core 51 opposite to the first side of the upper magnetic core 51. In addition, the two switch circuits 21 adjacent to the first side of the upper core 51 are disposed in the same direction, and the two switch circuits 21 adjacent to the second side of the upper core 51 are disposed in the same direction, so that the disposed positions of the same pins of the two switch circuits 21 adjacent to the same side of the upper core 51 face the same direction.
The first printed circuit board 3 further includes at least one via (not shown), wherein the via can be but is not limited to a blind via, such as a laser blind via or a mechanical blind via, and the via is connected between the first surface 31 of the first printed circuit board 3 and the corresponding metal winding 4, and each switch circuit 21 is electrically connected to the first end 42 of the corresponding metal winding 4 through the corresponding via. In other embodiments, the switch circuits 21 may also be embedded in the first printed circuit board 3 (not shown), and the positions of the switch circuits 21 projected on the first surface 31 of the first printed circuit board 3 are partially overlapped with the positions of the corresponding accommodating spaces 34 projected on the first surface 31 of the first printed circuit board 3, in other words, the positions of the switch circuits 21 projected on the first printed circuit board 3 are partially overlapped with the positions of the corresponding metal windings 4 projected on the first surface 31 of the first printed circuit board 3, and the overlapped areas are the minimum limit values to form the areas required for electrically connecting the switch circuits 21 and the corresponding metal windings 4, so that the vias can connect the switch circuits 21 and the corresponding metal windings 4 with the shortest path.
In the embodiment, the magnetic core assembly 5 further includes a center pillar 54, the center pillar 54 can be penetrated by the first printed circuit board 3, and in order to penetrate the center pillar 54 through the first printed circuit board 3, the center through holes of the four metal windings 4 can be formed according to the placement positions and shapes of the four metal windings 4, and the positions and shapes of the center through holes of the four metal windings 4 are consistent with the positions and shapes of the center through holes on the first surface 31 and the second surface 32 of the first printed circuit board 3. Therefore, the center pillar 54 is disposed between the upper core 51 and the lower core 52, and the four side pillars 53 are disposed around the center pillar 54, and the center hole of the second surface 32 of the first pcb 3, the center hole of the four metal windings 4, and the center hole of the first surface 31 of the first pcb 3 are formed therein. In some embodiments, one end of the center pillar 54 is connected to the upper core 51 and located at the center of the upper core 51, and an air gap is formed between the other end of the center pillar 54 and the lower core 52, and in other embodiments, one end of the center pillar 54 is connected to the lower core 52 and located at the center of the lower core 52, and an air gap is formed between the other end of the center pillar 54 and the upper core 51. In addition, in other embodiments, the core element 5 may not include any center post, so that no central through hole is required on both the first surface 31 and the second surface 32 of the first printed circuit board 3, and the central positions on the first surface 31 and the second surface 32 of the first printed circuit board 3 can be configured as a clear area for placing any electronic component, planar winding, or conductive trace used as an electrical connection in the first printed circuit board 3.
In the present embodiment, the first printed circuit board 3 has a plurality of sidewalls 36, which are located between the first surface 31 and the second surface 32 of the first printed circuit board 3 and surround the first surface 31 and the second surface 32 of the first printed circuit board 3. The accommodating space 33 may be exposed to at least one of the sidewalls 36, and since the metal winding 4 is accommodated in the accommodating space 33, the metal winding 4 may be exposed to the sidewalls 36 through the exposed accommodating space 33, so as to embed the metal winding 4 with a larger size in the first printed circuit board 3, so that the voltage regulating module 2 may maximally and effectively utilize the space, and reduce the dc equivalent resistance of the metal winding 4.
In other embodiments, because the dc magnetic fluxes on the center pillar 54 are superimposed and the ac magnetic fluxes are cancelled, the core loss is small, and the material of the center pillar 54 may be different from the material of the four side pillars 53, for example, the material of the center pillar 54 is a high saturation magnetic density iron powder material, so as to further reduce the cross-sectional area of the center pillar 54, further increase the area of the metal winding 4, reduce the equivalent dc impedance of the metal winding 4, and further reduce the loss of the voltage regulating module 2.
Referring to fig. 4, the voltage regulation module 2 of the present embodiment further includes a first positive output conduction region 71, at least one first negative output conduction region 72, at least one first positive input conduction region 73, and a plurality of first signal conduction regions 74, wherein the first positive output conduction region 71, the first negative output conduction region 72, the first positive input conduction region 73, and the plurality of first signal conduction regions 74 are disposed on the second surface 32 of the first printed circuit board 3 and respectively form a positive output terminal Vo +, a negative output terminal Vo-, a positive input terminal Vin +, and a signal terminal corresponding to the voltage regulation module 2, and in addition, since the negative output terminal Vo-and the negative input terminal Vin-of the voltage regulation module 2 are connected in a short circuit manner, the first negative output conduction region 72 can also form a negative input terminal Vin-corresponding to the voltage regulation module 2. In the present embodiment, the shapes of the first positive output conducting region 71, the first negative output conducting region 72, the first positive input conducting region 73 and the first signal conducting regions 74 may be circular, rectangular, square, oval or rectangular, and are not limited thereto. In addition, the first printed circuit board 3 further includes at least one via (not shown), wherein the via can be but is not limited to a blind via, such as a laser blind via or a mechanical blind via, and the via is connected to the second surface 32 of the first printed circuit board 3 and the accommodating space 33, and the first positive output conducting area 73 is electrically connected to the second end 43 of the metal winding 4 through the via in the first printed circuit board 3, and further, the heat generated by the metal winding 4 can be conducted to the second surface 32 of the first printed circuit board 3 through the via. In addition, the voltage regulating module 2 further includes an input capacitor 70 disposed on the second surface 32 of the first printed circuit board 3 and located between the first positive input conducting region 73 and the first negative output conducting region 72, so as to be electrically connected to the first positive input conducting region 73 and the first negative output conducting region 72 through the wires in the first printed circuit board 3, respectively.
Of course, the voltage regulation module of the present disclosure is not limited to be applied to a four-phase voltage reduction circuit, but may also be a two-phase voltage reduction circuit or other phase voltage reduction circuits. Referring to fig. 6 and 7, fig. 6 is a schematic structural diagram of a voltage regulation module according to a second preferred embodiment of the present disclosure, and fig. 7 is a schematic structural diagram of an explosion of the voltage regulation module shown in fig. 6. As shown in the figure, compared to the voltage regulating module 2 shown in fig. 2 to 4 that includes four unidirectional voltage-dropping circuits, the voltage regulating module 2a of the present embodiment includes only two unidirectional voltage-dropping circuits, in other words, in a physical structure, the voltage regulating module 2a includes only the first printed circuit board 3, two metal windings 4 wound in the same direction, the magnetic core assembly 5 and two switch circuits 21. The two switch circuits 21 of the voltage regulating module 2a of the present embodiment are disposed on the first surface 31 of the first printed circuit board 3, and both of the two switch circuits 21 are adjacent to the same side of the upper magnetic core 51, and the two switch circuits 21 are disposed in the same direction. In addition, the core assembly 5 of the voltage regulating module 2a of the present embodiment includes an upper core 51, a lower core 52, two side legs 53 and a center leg 54. Two side legs 53 are located between the upper core 51 and the lower core 52, wherein the two side legs 53 can be connected to the lower core 52 and disposed at opposite ends of the lower core 52 as shown in fig. 7, or the two side legs 53 are connected to the upper core 51 and disposed at opposite ends of the upper core 51, or the two side legs 53 are independent from the upper core 51 and the lower core 52, and the middle leg 54 is located between the upper core 51 and the lower core 52 and between the two side legs 53. In the present embodiment, each metal winding 4 is matched with the corresponding side pillar 53, so that the magnetic core assembly 5 and the two metal windings 4 are respectively matched with each other to form two inductors L, wherein the directions of the dc magnetic fluxes flowing through the two side pillars 53 are the same.
In the system application, in order to fix and electrically connect the voltage regulating module to the system board or the carrier board, a plurality of conductive portions are required to be disposed on the second surface of the first pcb for being fixedly connected to the system board or the carrier board, wherein the plurality of conductive portions respectively correspond to the plurality of conductive areas for transmitting the electrical energy or signals received by the plurality of conductive areas to the system board or the carrier board. Referring to fig. 8 and 9, fig. 8 is a schematic structural diagram of a voltage regulation module according to a third preferred embodiment of the present disclosure, and fig. 9 is a schematic structural diagram of another view angle of the voltage regulation module shown in fig. 8. As shown, compared to the voltage regulating module 2 shown in fig. 2 to 4, the voltage regulating module 2b of the present embodiment further includes a positive output conducting portion 75, at least one negative output conducting portion 76, at least one positive input conducting portion 77 and a plurality of signal conducting portions 78, which are formed by metal strips or metal blocks, wherein the positive output conducting portion 75, the at least one negative output conducting portion 76, the at least one positive input conducting portion 77 and the plurality of signal conducting portions 78 are disposed on the second surface 32 of the first printed circuit board 3, the conducting portions formed by the metal strips and/or metal blocks may be formed by copper, copper alloy or any metal with good electrical conductivity and small thermal resistance, and the shape of the metal strips or metal blocks may be circular, rectangular, square, oval or rectangular, and neither is limited. The voltage regulating module 2b is electrically connected to the system board by a plurality of conductive contacts (a positive output conductive contact 75, a negative output conductive contact 76, a positive input conductive contact 77, and a signal conductive contact 78) on the second surface 32 of the first printed circuit board 3. The positive output connecting portion 75 is disposed on the first positive output connecting portion 71 to transmit the power received by the positive output terminal Vo + to the system board, the negative output connecting portion 76 is disposed on the first negative output connecting portion 72 to transmit the power received by the negative output terminal Vo + to the system board, the positive input connecting portion 77 is disposed on the first positive input connecting portion 73 to transmit the power received by the positive input terminal Vin + to the system board, and each signal connecting portion 78 is disposed on the corresponding first signal connecting portion 74 to transmit the signal received by the signal terminal to the system board. In some embodiments, in order to allow the second side 32 of the first pcb 3 of the voltage regulating module 2b to be connected to the system board more smoothly, the heights of the plurality of conductors (the positive output conductor 75, the negative output conductor 76, the positive input conductor 77, and the plurality of signal conductors 78) may be adjusted to be the same as the height of the input capacitor 70 or the height of the lower core 52 of the core assembly 5.
In addition, in some embodiments, the voltage adjustment module may be further subjected to plastic packaging to reduce the problem of displacement or falling caused by re-reflow, for example, fig. 10 and 11, where fig. 10 is a schematic structural diagram of the voltage adjustment module according to a fourth preferred embodiment of the disclosure, and fig. 11 is a schematic structural diagram of another view angle of the voltage adjustment module shown in fig. 10. Compared to the voltage regulating module 2b shown in fig. 8 to 9, the voltage regulating module 2c of the present embodiment further includes a first molding compound layer 81 and a second molding compound layer 82, wherein the first molding compound layer 81 is disposed on the first surface 31 of the first printed circuit board 3, and is used to mold the switching circuit 21 on the first surface 31 of the first printed circuit board 3 shown in fig. 8, the upper magnetic core 51 of the magnetic core assembly 5, and all electronic components into a whole. The second molding compound layer 82 is disposed on the second surface 32 of the first printed circuit board 3, and is used to mold the input capacitor 70, the positive output conductive connection portion 75, the negative output conductive connection portion 76, the positive input conductive connection portion 77, the plurality of signal conductive connection portions 78, and all electronic components on the second surface 32 of the first printed circuit board 3 shown in fig. 9 into a whole. Of course, in some embodiments, the voltage regulation module may only include the first molding layer 81 or the second molding layer 82, without providing the first molding layer 81 and the second molding layer 82 at the same time. Furthermore, after the second plastic package layer 82 has plastic-packaged the second surface 32 of the first printed circuit board 3, the input capacitor 70, the positive output conductive connection portion 75, the negative output conductive connection portion 76, the positive input conductive connection portion 77, the plurality of signal conductive connection portions 78 and all electronic components, the second plastic package layer 82 may be polished to expose one end of the positive output conductive connection portion 75, one end of the negative output conductive connection portion 76, one end of the positive input conductive connection portion 77 and one end of each signal conductive connection portion 78 on the second surface 32 of the first printed circuit board 3 to the surface (not shown) of the second plastic package layer 82. Of course, a plurality of plating patterns may be formed on the surface of the second plastic package layer 82 by electroplating, each plating pattern is formed at a position corresponding to the conductive connection portion that is conductively connected to itself and exposes the surface of the second plastic package layer 82, for example, one end of the positive output conductive connection portion 75 is formed with the positive output conductive connection portion plating pattern 75a and may constitute the positive output end Vo + of the voltage adjusting module 2c, one end of the negative output conductive connection portion 76 is formed with the negative output conductive connection portion plating pattern 76a and may constitute the negative output end Vo of the voltage adjusting module 2c, one end of the positive input conductive connection portion 77 is formed with the positive input conductive connection portion plating pattern 77a and may constitute the positive input end Vin + of the voltage adjusting module 2c, and one end of each signal conductive connection portion 78 is formed with the signal conductive connection portion plating pattern 78a and may constitute the signal end of the voltage adjusting module 2 c. However, the number and the arrangement position of the plating patterns are not limited to those shown in fig. 11, and may be implemented in different ways according to actual requirements. In addition, when the plating area of the plating pattern is larger, the larger the area of the voltage regulating module 2c that can be soldered is, so when the system board is reflow-soldered again, the smaller the risk that the voltage regulating module 2c will fall off or shift due to being heated again is, and the current density of the solder joint is greatly reduced, and the reliability of the solder joint of the product is greatly improved.
In addition, in order to connect the first pcb of the voltage regulating module to the system board more smoothly, besides providing a corresponding connecting portion on each connecting portion as shown in fig. 8 and 9, a groove may be dug on the first pcb for placing the input capacitor and the magnetic core assembly, and each connecting portion may be located on the same plane as the input capacitor and the magnetic core assembly without providing a corresponding connecting portion on each connecting portion. Referring to fig. 12 and 13, fig. 12 is a schematic structural diagram of a voltage regulation module according to a fifth preferred embodiment of the present disclosure, and fig. 13 is a schematic structural diagram of an explosion of the voltage regulation module shown in fig. 12. As shown in fig. 12 and 13, compared to the voltage regulating module 2 shown in fig. 2 to 4, the first pcb 3 of the voltage regulating module 2d of the present embodiment further has a first groove 34 and a second groove 35. The first recess 34 is located on the second surface 32 of the first pcb 3 and is formed by recessing the second surface 32 of the first pcb 3, and the first recess 34 is communicated with the second through hole 321 of the second surface 32 of the first pcb 3 and is independent from the accommodating space 33, and the height of the first recess 34 located on the first pcb 3 is different from the height of the accommodating space 33 located on the first pcb 3, and the first recess 34 is used for accommodating the lower core 52 of the core assembly 5, wherein the depth of the first recess 34 is greater than or equal to the thickness of the lower core 52 of the core assembly 5, so that the surface of the lower core 52 is coplanar with the second surface 32 of the first pcb 3, or the surface of the lower core 52 is lower than the second surface 32 of the first pcb 3, thereby enabling a plurality of conducting areas (a first positive output conducting area 71, a second magnetic core 52, a first magnetic core 52, a second magnetic core 52, and a second magnetic core 52, a second magnetic core 52, a second magnetic core, a magnetic core 52, a second magnetic core, a second magnetic core, a third magnetic core, a second magnetic core, a second magnetic core, a second magnetic core, a second magnetic core, a magnetic, First negative output conducting region 72, first positive input conducting region 73, and a plurality of first signal conducting regions 74) can be tightly attached to the system board. The second groove 35 is adjacent to two opposite sides of the first groove 34, is formed by recessing the second surface 32 of the first printed circuit board 3, and is independent from the accommodating space 33, the height of the first groove 34 on the first printed circuit board 3 is different from the height of the accommodating space 33 on the first printed circuit board 3, and the second groove 35 is used for accommodating the input capacitor 70, wherein the depth of the second groove 35 is greater than or equal to the thickness of the input capacitor 70. Therefore, the surface of the input capacitor 70 is coplanar with the second side 32 of the first pcb 3, or the surface of the input capacitor 70 is lower than the second side 32 of the first pcb 3, so that the plurality of conductive pads disposed on the second side 32 of the first pcb 3 can be closely attached to the system board. Of course, in some embodiments, the voltage regulating module may only include the first groove 34 or the second groove 35, and the first groove 34 and the second groove 35 are not required to be provided at the same time.
In addition, in order to connect the voltage regulation module to the system board more smoothly, in addition to providing a corresponding conductive connection portion on each conductive connection region as shown in fig. 8 and 9 and digging a groove on the first printed circuit board as shown in fig. 12 and 13, the voltage regulation module may further provide a connection substrate (e.g., another printed circuit board) to be fixed and electrically connected to the system board. Referring to fig. 14 and 15, fig. 14 is an exploded view of a voltage regulation module according to a sixth preferred embodiment of the present disclosure, and fig. 15 is an exploded view of the voltage regulation module shown in fig. 14 from another view angle. As shown in fig. 14 and fig. 15, the voltage regulating module 2e of the present embodiment includes a first printed circuit board 3, a metal winding 4 and a magnetic core element 5, wherein the first printed circuit board 3, the metal winding 4 and the magnetic core element 5 are similar in structure and operation to the first printed circuit board 3, the metal winding 4 and the magnetic core element 5 shown in fig. 2-4, respectively, and therefore the same reference numerals are used to represent the similar structure and function and are not repeated herein. In this embodiment, the voltage regulating module 2e further includes a second printed circuit board 9, the second printed circuit board 9 includes a first surface 91 and a second surface 92 opposite to each other, the first surface 91 of the second printed circuit board 9 is adjacent to and in contact with the second surface 32 of the first printed circuit board 3, the second printed circuit board 9 is connected to the system board through the second surface 92 of the second printed circuit board 9, wherein the area of the second printed circuit board 9 is smaller than or equal to the area of the first printed circuit board 3, so that when the second printed circuit board 9 and the first printed circuit board 3 are fixedly mounted, the board edge plating area of the second printed circuit board 9 can be used for tin climbing, the fixing strength of the first printed circuit board 3 and the second printed circuit board 9 is enhanced, and the difficulty of fixing and mounting is reduced. In addition, the second printed circuit board 9 further includes a first receiving groove 951 and two second receiving grooves 952, the first receiving groove 951 penetrates through the second printed circuit board 9, when the second printed circuit board 9 contacts the first printed circuit board 3, the first receiving groove 951 is used for receiving the lower magnetic core 52 of the magnetic core assembly 5, wherein a plane size of the first receiving groove 951 is greater than or equal to a plane size of the lower magnetic core 52. The two second receiving grooves 952 penetrate through the second printed circuit board 9, and the two second receiving grooves 952 are adjacent to two opposite sides of the first receiving groove 951, when the second printed circuit board 9 contacts the first printed circuit board 3, the second receiving grooves 952 are used for receiving the corresponding input capacitors 70, wherein the plane size of the second receiving grooves 952 is greater than or equal to the overall size of the plurality of input capacitors 70 located in the second receiving grooves 952. In some embodiments, the first receiving groove 951 and the second receiving groove 952 are not limited to receiving the lower core 52 and the input capacitor 70 of the core assembly 5, but can also be used to receive a capacitor, a resistor, a power component, a chip, a magnetic component, or a mechanical component on the second surface 32 of the first pcb 3.
In this embodiment, the voltage regulating module 2e further includes a second positive output conducting area 931, at least one second negative output conducting area 932, at least one second positive input conducting area 933, and a plurality of second signal conducting areas 934, wherein the second positive output conducting area 931, the second negative output conducting area 932, the second positive input conducting area 933, and the plurality of second signal conducting areas 934 are disposed on the first surface 91 of the second printed circuit board 9, the second positive output conducting area 931 is disposed corresponding to and fixedly connected to the first positive output conducting area 71, the second negative output conducting area 932 is disposed corresponding to and fixedly connected to the first negative output conducting area 72, the second positive input conducting area 933 is disposed corresponding to and fixedly connected to the first positive input conducting area 73, each second signal conducting area 934 is disposed corresponding to and fixedly connected to the corresponding first signal conducting area 74, so that the second printed circuit board 9 can be fixedly connected to the first printed circuit board 3, the conductive areas can be fixed by welding or bonding with conductive adhesive, and the conductive areas can be circular, rectangular, square, elliptical or square, without limitation. In addition, the voltage regulating module 2e of the present embodiment further includes a positive output conducting portion 941, at least one negative output conducting portion 942, at least one positive input conducting portion 943 and a plurality of signal conducting portions 944, wherein the positive output conducting portion 941, the negative output conducting portion 942, the positive input conducting portion 943 and the plurality of signal conducting portions 944 are disposed on the second surface 92 of the second pcb 9, the positive output conducting portion 941 is electrically connected to the second positive output conducting portion 931 through a via in the second pcb 9, the negative output conducting portion 942 is electrically connected to the second negative output conducting portion 932 through a via in the second pcb 9, the positive input conducting portion 943 is electrically connected to the second positive input conducting portion 933 through a via in the second pcb 9, each signal conducting portion 944 is electrically connected to the corresponding second signal conducting portion 934 through a via in the second pcb 9, the voltage regulating module 2e of the present embodiment further utilizes a plurality of conductive portions (the positive output conductive portion 941, the negative output conductive portion 942, the positive input conductive portion 943 and the plurality of signal conductive portions 944) on the second surface 92 of the second pcb 9 to be fixed to and electrically connected to the system board. In addition, in the voltage regulation module 2e of the present embodiment, the plurality of conductive portions on the second printed circuit board 9 can be electrically connected to the corresponding conductive areas through the conductive holes in the second printed circuit board 9, or the side wall of the second printed circuit board 9, the inner side wall of the first receiving groove 951, or the inner side wall of the second receiving groove 952 can be electroplated by electroplating to form a board edge electroplating area, and the board edge electroplating area can be electrically connected to the plurality of conductive portions on the first surface 91 of the second printed circuit board 9 and the plurality of conductive portions on the second surface 92 of the second printed circuit board 9, respectively, so as to facilitate the side surface solder climbing when the second printed circuit board 9 is soldered to the first printed circuit board 3, and increase the stability, and it can be known that when the second printed circuit board 9 is soldered to the system board through the second surface 92 of the second printed circuit board 9, the side surface of the board circuit area can also be used for solder climbing, so that the second printed circuit board 9 is firmly mounted on the system board. In the above embodiment, the voltage regulation module 2e is disposed on the system board by using the second printed circuit board 9, so that the voltage regulation module 2e has a preferable flatness, and the manufacturing process of the voltage regulation module 2e can be further simplified.
Referring to fig. 16 and 17, fig. 16 is an exploded view of a voltage regulation module according to a seventh preferred embodiment of the present disclosure, and fig. 17 is an exploded view of the voltage regulation module shown in fig. 16. Compared to the input capacitor 70 of the voltage regulating module 2e shown in fig. 14 and 15 disposed on the first surface 31 of the first pcb 3, the input capacitor of the voltage regulating module 2f of this embodiment is embedded in the second pcb 9, and the input capacitor is electrically connected to the first surface 91 and the second surface 92 of the second pcb 9 through the via hole in the second pcb 9, so that the second pcb 9 of the voltage regulating module 2f of this embodiment does not need to have a second receiving groove for receiving the input capacitor, and the voltage regulating module 2f of this embodiment can form a plurality of conducting portions (the positive output conducting portion 941, the negative output conducting portion 942, the positive input conducting portion 943 and the plurality of signal conducting portions) with a larger area and flatness on the second surface 92 of the second pcb 9 by embedding the input capacitor in the second pcb 9 to be fixed and electrically connected to the system board 944, the process of the voltage regulation module 2f can also be simplified. In a similar manner, the voltage regulation module 2f of the present embodiment can further increase the area of the partial conducting area on the first surface 91 of the second printed circuit board 9 by embedding the input capacitor in the second printed circuit board 9, so that the fixing area between the first printed circuit board 3 and the second printed circuit board 9 can also be increased.
Of course, the second printed circuit board 9 is not limited to be applied to the voltage regulation module with the four-phase voltage reduction circuit, but may also be applied to the voltage regulation module with the two-phase voltage reduction circuit or other voltage reduction circuits, for example, the second printed circuit board is applied to the voltage regulation module with the two-phase voltage reduction circuit shown in fig. 6 and 7, and the first receiving groove, the second receiving groove, the plurality of conducting parts (the positive output conducting part, the negative output conducting part, the positive input conducting part and the plurality of signal conducting parts) and the plurality of conducting areas (the second positive output conducting area, the second negative output conducting area, the second positive input conducting area and the plurality of second signal conducting areas) on the second printed circuit board of the voltage regulation module with the two-phase voltage reduction circuit can be correspondingly arranged according to the position of the magnetic core assembly, or can be arranged according to the actual situation, and are arranged in a manner similar to the first receiving groove 951, the first receiving groove, the second conducting area and the second conducting area on the second printed circuit board 9 applied to the four-phase voltage reduction circuit, The second receiving cavity 952, the plurality of conductive connection portions (the positive output conductive connection portion 941, the negative output conductive connection portion 942, the positive input conductive connection portion 943 and the plurality of signal conductive connection portions 944) and the plurality of conductive connection regions (the second positive output conductive connection portion 931, the second negative output conductive connection portion 932, the second positive input conductive connection portion 933 and the plurality of second signal conductive connection portions 934), which are not described herein again. The voltage regulating module with two phase voltage-reducing circuits can be fixed and electrically connected with the system board by using the second printed circuit board, and certainly, the voltage regulating module with other phase voltage-reducing circuits can also be fixed and electrically connected with the system board by using the second printed circuit board, so the details are not repeated herein.
In summary, the metal winding of the voltage regulation module of the present disclosure is embedded in the accommodating space of the first printed circuit board, and the magnetic core assembly is disposed on the first printed circuit board in an up-down buckling manner, so that the inductance formed by the metal winding and the magnetic core assembly of the voltage regulation module of the present disclosure is partially (i.e., the metal winding) disposed in the first printed circuit board, and the other portion of the inductance (i.e., the magnetic core assembly) is disposed on the first printed circuit board, so that compared with the arrangement manner that the magnetic assembly of the voltage regulation module in the existing electronic device is stacked on the printed circuit board, the height of the voltage regulation module of the present embodiment is greatly reduced. In addition, because the voltage regulation module 2 of the present disclosure utilizes a plurality of metal windings to be embedded in the accommodation space of the first printed circuit board, so as to meet the requirement of the multi-phase voltage reduction circuit, compared with the existing voltage regulation module which utilizes a multi-layer planar winding in a multi-layer printed circuit board to realize the multi-phase voltage reduction circuit, the thickness of the voltage regulation module of the present disclosure is much smaller than that of the existing voltage regulation module, and because the metal windings have the advantages of smaller parasitic resistance and smaller power loss compared with the planar winding, the overall parasitic resistance of the voltage regulation module of the present disclosure is smaller and the overall power loss is smaller. In addition, the voltage regulation module of the present disclosure utilizes the plurality of conductive connection regions on the second surface of the second printed circuit board to be fixed and electrically connected to the system board, so as to increase the stability of the voltage regulation module disposed on the system board and simplify the process of the voltage regulation module.

Claims (17)

1. A voltage regulation module is disposed on a system board and includes:
a first printed circuit board including a first surface and a second surface opposite to each other, the second surface of the first printed circuit board including at least a first conductive area, wherein the at least a first conductive area constitutes at least one of a positive output terminal, a negative output terminal, or a positive input terminal of the voltage regulation module;
a magnetic core assembly disposed and electrically connected to the first printed circuit board;
at least one switch circuit, which is arranged on the first surface of the first printed circuit board and is electrically connected with the first conductive connection area through a guide hole in the first printed circuit board; and
a second printed circuit board including a first surface and a second surface opposite to each other, the first surface of the second printed circuit board being adjacent to and contacting with the second surface of the first printed circuit board, the first surface of the second printed circuit board including at least a second conductive region, the second conductive region being disposed corresponding to and fixedly connected to and electrically connected to the corresponding first conductive region, the second surface of the second printed circuit board including at least a conductive portion electrically connected to the corresponding second conductive region via a via hole in the second printed circuit board, the second printed circuit board being electrically connected to the system board via the conductive portion, wherein the at least a second conductive region constitutes at least one of the positive output terminal, the negative output terminal or the positive input terminal of the voltage regulating module, the at least a conductive portion constitutes the positive output terminal, the negative output terminal or the positive input terminal of the voltage regulating module, The second printed circuit board includes a first receiving groove, the first receiving groove penetrates through the second printed circuit board, and the first receiving groove is used for receiving the magnetic core assembly.
2. The voltage regulation module of claim 1, wherein the first side of the first printed circuit board has at least a first aperture, the second side of the first printed circuit board has at least a second aperture, and the first printed circuit board further comprises at least one receiving space disposed within the first printed circuit board and between the first side and the second side of the first printed circuit board and in communication with the first aperture and the second aperture.
3. The voltage regulation module of claim 2, wherein the voltage regulation module comprises at least one metal winding disposed in the accommodation space and embedded in the first printed circuit board, and the metal winding comprises a third through hole, and a position of the third through hole, a position of the second through hole, and a position of the first through hole correspond to each other.
4. The voltage regulation module of claim 3 wherein the at least one metal winding is a plurality of metal windings, and a plane defined by the plurality of metal windings is parallel to the first side and the second side of the first printed circuit board.
5. The voltage regulation module of claim 3 wherein the core assembly comprises an upper core, a lower core and at least one side post, the upper core is disposed on the first PCB from the first side of the first PCB, the lower core is disposed on the first PCB from the second side of the first PCB, the side post is disposed through the first through hole, the third through hole and the second through hole, the core assembly and the at least one metal winding cooperate to form at least one inductor.
6. The voltage regulation module of claim 5, wherein the first receptacle is configured to receive the lower core.
7. The voltage regulation module of claim 5, wherein the upper core has a first side and a second side opposite, the at least one switching circuit is a plurality of switching circuits, some of the switching circuits of the plurality of switching circuits are co-located and adjacent to the first side of the upper core, and other of the switching circuits of the plurality of switching circuits are co-located and adjacent to the second side of the upper core.
8. The voltage regulation module of claim 5, wherein the at least one switching circuit is a plurality of switching circuits disposed in a same direction and adjacent to one side of the upper core.
9. The voltage regulation module of claim 1 wherein the voltage regulation module further comprises at least one input capacitor disposed on the second side of the first printed circuit board.
10. The voltage regulation module of claim 9, wherein the second pcb comprises at least a second receiving slot, the second receiving slot penetrates the second pcb, and the second receiving slot is configured to receive the input capacitor.
11. The voltage regulation module of claim 1 wherein the voltage regulation module further comprises at least one input capacitor embedded within the second printed circuit board.
12. The voltage regulation module of claim 1, wherein the at least one first conductive connection region comprises a first positive output conductive connection region, a first negative output conductive connection region, a first positive input conductive connection region, and a plurality of first signal conductive connection regions, the at least one second conductive connection region comprises a second positive output conductive connection region, a second negative output conductive connection region, a second positive input conductive connection region, and a plurality of second signal conductive connection regions, the second positive output conductive connection region is disposed corresponding to and fixedly connected to the first positive output conductive connection region, the second negative output conductive connection region is disposed corresponding to and fixedly connected to the first negative output conductive connection region, the second positive input conductive connection region is disposed corresponding to and fixedly connected to the first positive input conductive connection region, and each of the second signal conductive connection regions is disposed corresponding to and fixedly connected to the corresponding first signal conductive connection region.
13. The voltage regulation module of claim 12 wherein the at least one connection portion comprises a positive output connection portion, a negative output connection portion, a positive input connection portion and a plurality of signal connection portions, the positive output connection portion is electrically connected to the second positive output connection portion through a via in the second printed circuit board, the negative output connection portion is electrically connected to the second negative output connection portion through a via in the second printed circuit board, the positive input connection portion is electrically connected to the second positive input connection portion through a via in the second printed circuit board, and each signal connection portion is electrically connected to the corresponding second signal connection portion through a via in the second printed circuit board.
14. The voltage regulation module of claim 1, wherein the area of the second printed circuit board is less than or equal to the area of the first printed circuit board.
15. The voltage regulation module of claim 1 wherein the second printed circuit board has a plurality of sidewalls disposed between and surrounding the first and second sides of the second printed circuit board, at least one of the plurality of sidewalls having a plating region electrically connected to the second conductive region and the conductive connection portion, respectively.
16. The voltage regulation module of claim 1, wherein the voltage regulation module further comprises at least one switching circuit and at least one metal winding, the switching circuit is disposed on the first side of the first printed circuit board, and the metal winding is embedded in the first printed circuit board, wherein a position of the switching circuit disposed on the first side of the first printed circuit board partially overlaps a position of the corresponding metal winding projected onto the first side of the first printed circuit board.
17. The voltage regulation module of claim 16 wherein the first printed circuit board further comprises at least one via therein, the via communicating between the first side of the first printed circuit board and the metal winding, and the switching circuit is electrically connected to a first end of the metal winding through the via.
CN202010217191.2A 2019-06-04 2020-03-25 Voltage regulation module Active CN112038054B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202210238614.8A CN114446592A (en) 2019-06-04 2020-03-25 Voltage regulation module
CN202210238612.9A CN114446591A (en) 2019-06-04 2020-03-25 Voltage regulation module
US16/887,026 US11134571B2 (en) 2019-06-04 2020-05-29 Voltage regulator module
US17/170,537 US11395409B2 (en) 2019-06-04 2021-02-08 Voltage regulator module
US17/575,562 US11564318B2 (en) 2019-06-04 2022-01-13 Voltage regulator module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2019104813668 2019-06-04
CN201910481366 2019-06-04

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202210238614.8A Division CN114446592A (en) 2019-06-04 2020-03-25 Voltage regulation module
CN202210238612.9A Division CN114446591A (en) 2019-06-04 2020-03-25 Voltage regulation module

Publications (2)

Publication Number Publication Date
CN112038054A CN112038054A (en) 2020-12-04
CN112038054B true CN112038054B (en) 2022-04-01

Family

ID=73578725

Family Applications (7)

Application Number Title Priority Date Filing Date
CN202010127444.7A Active CN112038052B (en) 2019-06-04 2020-02-28 Voltage regulation module and voltage regulation device suitable for same
CN202210554970.0A Pending CN114823063A (en) 2019-06-04 2020-02-28 Electronic device
CN202210565980.4A Pending CN114783727A (en) 2019-06-04 2020-02-28 Magnetic assembly
CN202210238612.9A Pending CN114446591A (en) 2019-06-04 2020-03-25 Voltage regulation module
CN202010216992.7A Active CN112038053B (en) 2019-06-04 2020-03-25 Voltage regulation module
CN202210238614.8A Pending CN114446592A (en) 2019-06-04 2020-03-25 Voltage regulation module
CN202010217191.2A Active CN112038054B (en) 2019-06-04 2020-03-25 Voltage regulation module

Family Applications Before (6)

Application Number Title Priority Date Filing Date
CN202010127444.7A Active CN112038052B (en) 2019-06-04 2020-02-28 Voltage regulation module and voltage regulation device suitable for same
CN202210554970.0A Pending CN114823063A (en) 2019-06-04 2020-02-28 Electronic device
CN202210565980.4A Pending CN114783727A (en) 2019-06-04 2020-02-28 Magnetic assembly
CN202210238612.9A Pending CN114446591A (en) 2019-06-04 2020-03-25 Voltage regulation module
CN202010216992.7A Active CN112038053B (en) 2019-06-04 2020-03-25 Voltage regulation module
CN202210238614.8A Pending CN114446592A (en) 2019-06-04 2020-03-25 Voltage regulation module

Country Status (2)

Country Link
US (5) US11160167B2 (en)
CN (7) CN112038052B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114865917A (en) * 2021-02-04 2022-08-05 台达电子工业股份有限公司 Power conversion circuit
CN113746330A (en) * 2021-08-30 2021-12-03 西安交通大学 Gallium nitride integrated power module based on function multiplexing magnetic part
CN113674962A (en) * 2021-08-30 2021-11-19 西安交通大学 Four-phase symmetrical reverse coupling magnetic integrated inductor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102686025A (en) * 2012-05-07 2012-09-19 华为技术有限公司 Printed circuit board (PCB) of power supply module, power supply module and manufacturing method thereof
CN103219332A (en) * 2013-03-22 2013-07-24 吴江市首腾电子有限公司 Photoelectric element
CN104272883A (en) * 2012-03-02 2015-01-07 诺瓦利亚公司 Circuit board assembly
CN107437885A (en) * 2016-05-25 2017-12-05 台达电子企业管理(上海)有限公司 Power module and supply unit

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2252208B (en) * 1991-01-24 1995-05-03 Burr Brown Corp Hybrid integrated circuit planar transformer
US20030214800A1 (en) * 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
KR20010114120A (en) * 2000-06-21 2001-12-29 안태영 PCB Inductor and Transformer using the PCB Inductor
US7352269B2 (en) * 2002-12-13 2008-04-01 Volterra Semiconductor Corporation Method for making magnetic components with N-phase coupling, and related inductor structures
US7289329B2 (en) * 2004-06-04 2007-10-30 Siemens Vdo Automotive Corporation Integration of planar transformer and/or planar inductor with power switches in power converter
US7012414B1 (en) * 2004-08-19 2006-03-14 Coldwatt, Inc. Vertically packaged switched-mode power converter
TWI420286B (en) * 2009-08-06 2013-12-21 Delta Electronics Inc Power module and printed circuit board assembly thereof
TWI396368B (en) * 2009-11-19 2013-05-11 Delta Electronics Inc Integrated multi-inductor magnetic assembly and multi-loop power factor correction circuit
US8610533B2 (en) * 2011-03-31 2013-12-17 Bose Corporation Power converter using soft composite magnetic structure
CN102369790B (en) * 2011-09-14 2013-10-02 华为技术有限公司 Printed circuit board and power supply module
US10109404B2 (en) * 2013-08-30 2018-10-23 Virginia Tech Intellectual Properties, Inc. Low profile coupled inductor substrate with transient speed improvement
US9711279B2 (en) * 2013-10-28 2017-07-18 Infineon Technologies Austria Ag DC-DC converter assembly with an output inductor accommodating a power stage attached to a circuit board
US9641095B1 (en) 2014-02-21 2017-05-02 Pai Capital Llc Power converter output stage using heat dissipating bus bars
CN104980003B (en) * 2014-04-01 2017-10-10 台达电子企业管理(上海)有限公司 Power module and POL power modules
CN204013212U (en) 2014-06-06 2014-12-10 中兴通讯股份有限公司 A kind of DC/DC modular power source encapsulating structure
CN204497951U (en) 2014-11-21 2015-07-22 陕西中科天地航空模块有限公司 A kind of small power module power source
CN204497950U (en) 2014-11-21 2015-07-22 陕西中科天地航空模块有限公司 A kind of modular power source
US20160268034A1 (en) * 2015-03-13 2016-09-15 Bose Corporation Planar Magnetic Components and Assemblies
CN205142021U (en) 2015-09-25 2016-04-06 全汉企业股份有限公司 Transformer bank stay knot constructs and power supply device
CN205356864U (en) 2016-01-19 2016-06-29 陕西中科天地航空模块有限公司 Module power supply
US9729059B1 (en) * 2016-02-09 2017-08-08 Faraday Semi, LLC Chip embedded DC-DC converter
US10193442B2 (en) * 2016-02-09 2019-01-29 Faraday Semi, LLC Chip embedded power converters
US10129979B2 (en) * 2016-09-23 2018-11-13 Apple Inc. PCB assembly with molded matrix core
CN106384652A (en) 2016-10-26 2017-02-08 广州致远电子股份有限公司 Micro-power power module skeleton
CN108022917B (en) * 2016-10-28 2019-11-29 台达电子工业股份有限公司 Power module and its magnet assembly
US10062499B2 (en) * 2016-10-28 2018-08-28 Delta Electronics, Inc. Power module and magnetic component thereof
JP6766740B2 (en) * 2017-04-20 2020-10-14 株式会社村田製作所 Printed circuit board and switching regulator
US10548249B2 (en) 2017-09-27 2020-01-28 Intel Corporation Shielding in electronic assemblies
US20190354154A1 (en) * 2018-05-18 2019-11-21 Hewlett Packard Enterprise Development Lp Inductors
US11158451B2 (en) * 2018-10-09 2021-10-26 Delta Electronics, Inc. Power module
JP7326782B2 (en) * 2019-03-13 2023-08-16 Tdk株式会社 Transformers and power supplies
US20200350117A1 (en) * 2019-05-02 2020-11-05 Virginia Tech Intellectual Properties, Inc. Magnetic integration of matrix transformer with controllable leakage inductance
US20200411495A1 (en) * 2019-06-25 2020-12-31 Microsoft Technology Licensing, Llc Through-board decoupling capacitance arrangements for integrated circuit devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104272883A (en) * 2012-03-02 2015-01-07 诺瓦利亚公司 Circuit board assembly
CN102686025A (en) * 2012-05-07 2012-09-19 华为技术有限公司 Printed circuit board (PCB) of power supply module, power supply module and manufacturing method thereof
CN103219332A (en) * 2013-03-22 2013-07-24 吴江市首腾电子有限公司 Photoelectric element
CN107437885A (en) * 2016-05-25 2017-12-05 台达电子企业管理(上海)有限公司 Power module and supply unit

Also Published As

Publication number Publication date
CN112038053A (en) 2020-12-04
US20210161015A1 (en) 2021-05-27
US11395409B2 (en) 2022-07-19
US20200389978A1 (en) 2020-12-10
CN112038054A (en) 2020-12-04
CN114783727A (en) 2022-07-22
US20220007509A1 (en) 2022-01-06
CN112038053B (en) 2022-04-01
CN114446591A (en) 2022-05-06
CN114823063A (en) 2022-07-29
US20200389098A1 (en) 2020-12-10
US11558960B2 (en) 2023-01-17
CN112038052A (en) 2020-12-04
US11134571B2 (en) 2021-09-28
US20220141960A1 (en) 2022-05-05
CN112038052B (en) 2022-06-14
US11160167B2 (en) 2021-10-26
CN114446592A (en) 2022-05-06
US11564318B2 (en) 2023-01-24

Similar Documents

Publication Publication Date Title
US20230230749A1 (en) Power system
US9697947B1 (en) Vertical PCB surface mount inductors and power converters
CN112038054B (en) Voltage regulation module
US11419214B2 (en) Power supply module used in a smart terminal and power supply module assembly structure
JP6361827B2 (en) DC-DC converter and switching IC
CN111711358B (en) Voltage regulation module
US11923773B2 (en) Voltage regulator module
US11876084B2 (en) Power supply system
US9054088B2 (en) Multi-component chip packaging structure
CN112731996B (en) Voltage regulation module
CN115714062B (en) Switching power supply and computing device
US20220336138A1 (en) Magnetic device and power conversion module
CN115223778A (en) Magnetic assembly and power conversion module
CN115458290A (en) Power supply module

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant