CN104272883A - Circuit board assembly - Google Patents
Circuit board assembly Download PDFInfo
- Publication number
- CN104272883A CN104272883A CN201380023103.3A CN201380023103A CN104272883A CN 104272883 A CN104272883 A CN 104272883A CN 201380023103 A CN201380023103 A CN 201380023103A CN 104272883 A CN104272883 A CN 104272883A
- Authority
- CN
- China
- Prior art keywords
- substrate
- circuit board
- conductive region
- electrically conductive
- conductive ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D15/00—Printed matter of special format or style not otherwise provided for
- B42D15/0073—Printed matter of special format or style not otherwise provided for characterised by shape or material of the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
A circuit board assembly is described. The assembly comprises a module (2) which comprises a first substrate (7) having first and second faces (8, 9), a first conductive region (11) disposed on the first face of the first substrate and a hole (14) in or adjacent to the first conductive region and passing through the first substrate between the first and second faces. The assembly also comprises a circuit board (3) which comprises a second substrate (4) having first and second faces (5), a second conductive region (6) disposed on the first face of the second substrate. Conductive ink (15) is disposed in the hole and between the first and second substrates. The module is mounted to the circuit board and is arranged such that the hole lies over or adjacent to the second conductive region and the conductive ink provides an electrical connection between first and second conductive regions.
Description
Technical field
The present invention relates to a kind of circuit board assemblies.
Background technology
Electronic component is integrated in printed matter more and more, and as book, placard and greeting card, having more of becoming to make printed matter is interactive.The example of interactive printed matter has description in GB2464537A, WO2004077286A, WO2007035115A and DE19934312672A.
Usually, discrete device (as electric capacity) and packaging (as microcontroller) are installed to printed substrate, and printed substrate is installed to or be inserted in printed matter.
GB2453765A describes the contingent problem when conducting resinl is used to the device of such as light-emitting diode is attached to the strip conductor be supported on substrate.The separated region being deposited on the conducting resinl on strip conductor may be drawn together because of capillarity and thus between track, form short circuit.GB2453765A also describes the solution to this problem, between track, namely forms the physical barriers preventing conducting resinl from flowing, as slit.
Summary of the invention
The present invention seeks to be beneficial to and is integrated in goods by device, as in game machine, book, greeting card, the packing of product and placard.
According to a first aspect of the invention, provide a kind of circuit board assemblies, comprise: module, comprise there are the first and second contrary surfaces first substrate, be arranged on the first conductive region on the first surface of first substrate and in the first conductive region or near the first conductive region and between the first and second surfaces through the hole of first substrate; Circuit board, comprises the second substrate with the first and second contrary surfaces, the second conductive region be arranged on the first surface of second substrate; And be arranged on hole and neutralize electrically conductive ink between first and second substrate or conducting resinl.Module is installed in circuit board, and is arranged hole is positioned at above the second conductive region or near the second conductive region, and electrically conductive ink or conducting resinl provide electrical connection between the first and second conductive regions.
Therefore, liquid electrically conductive ink or conducting resinl can be used to and help module (wherein can comprise device) to be mounted to circuit board, such as, utilize capillarity.
Electrically conductive ink can comprise non-conductive adhesive.Electrically conductive ink or glue can be water base.Electrically conductive ink or glue can be solvent type.Electrically conductive ink can be curable, such as, utilize ultraviolet (UV) light.Electrically conductive ink or glue can take paste forms, i.e. conductive paste.
Circuit board assemblies can comprise: be arranged on multiple first conductive regions on the first surface of first substrate; Be arranged on multiple second conductive regions on the first surface of second substrate; Through multiple holes of first substrate in the first conductive region or near the first conductive region and between the first and second surfaces, at least some first conductive region is made to have corresponding hole; And the electrically conductive ink be arranged at least one some holes and between the first and second substrates or conducting resinl.At least one some holes with electrically conductive ink or conducting resinl is positioned at above the second corresponding conductive region or near the second conductive region of correspondence, and electrically conductive ink provides electrical connection between the first and second conductive regions.
First conductive region can comprise electrically conductive ink, as money base, copper base or carbon-based conductive ink.Electrically conductive ink can be printed, and such as, passes through flexographic printing.Electrically conductive ink can comprise non-conductive adhesive.Electrically conductive ink can be water base.Electrically conductive ink can be solvent type.Electrically conductive ink can be curable, such as, utilize ultraviolet (UV) light.First conductive region can comprise conductive foil.Conductive foil can be stamped.
Second conductive region can comprise electrically conductive ink, as money base, copper base or carbon-based conductive ink.Electrically conductive ink can be printed, and such as, passes through flexographic printing.Electrically conductive ink can comprise non-conductive adhesive.Electrically conductive ink can be water base.Electrically conductive ink can be solvent type.Electrically conductive ink can be curable, such as, utilize ultraviolet (UV) light.First conductive region can comprise conductive foil.Conductive foil can be stamped.
First substrate and/or second substrate can be flexible.First substrate and/or second substrate can comprise paper, card, hardboard or other similar fiber-based materials.Paper or card can comprise shapable paper or card.First substrate and/or second substrate can be formed (or " molding ").Such as, first substrate and/or second substrate can be embossing.First and/or second flexible base, board can comprise plastics.Such as, substrate can comprise polyethylene terephthalate (PET), polypropylene (PP) or PEN (PEN).First flexible base, board can comprise laminated sheet, such as, comprise and covered or be clipped in fiber-based material between one deck or two layers of plastic by one deck plastics.By using fiber-based material, less material can be used, can environmental protection be conducive to like this.Fiber-based material can comprise recycled materials.First substrate and/or second substrate can be rigidity.
Hole can be configured to promote capillarity.Such as, hole can have maximum gauge or the width of 1mm.Hole can have the diameter or width that are not less than 50 μm.Hole can be configured to accept a large amount of ink or glue.Such as, hole can have minimum diameter or the width of 1mm.
Module can comprise installation device on the first substrate further, such as, uses conducting resinl, ink or band.Device can comprise semiconductor element.Device can comprise microcontroller.
Second substrate can support one or more capacitor type touch switch, and such as, the finger tip size for touch pad (such as has 0.2mm
2to 2mm
2between area) touch electrode and/or the form of touch electrode array.Therefore, microcontroller and other devices directly can be installed or are installed via other substrates one or more, and to form the printed matter (as placard or greeting card) of enhancing, user provides input by touching to it.
Circuit board assemblies can comprise a part (as front cover) for printed matter or printed matter.Printed matter can be greeting card, placard, book, the packing of product, point of sale exhibit an advertisement, map or pamphlet.
Water base electrically conductive ink or glue can have the application viscosity between 90 to 300 centipoises (cP).The electrically conductive ink of ultraviolet light polymerization or glue can have the application viscosity of about 250 to 600cP.Solvent-borne type conduction band ink or glue can have the application viscosity between 100 to 500cP.
Water base or solvent-borne type conduction band ink can have the solid of 15% to 80% volume and/or the solid constituent up to 95% weight.In fact the electrically conductive ink of ultraviolet light polymerization can be considered to the solid constituent of 100% volume or weight.
Electrically conductive ink or glue, the such as first and/or second contact pad and/or grafting material, can have the thickness of at least 1 μm or at least 2 μm.Electrically conductive ink or glue can have the thickness of at least 5 μm or at least 10 μm.Electrically conductive ink or glue can have the thickness being not more than 100 μm or being not more than 50 μm.Electrically conductive ink or glue can have the thickness being not more than 20 μm or being not more than 10 μm.Dry electrically conductive ink, such as, be coated with by flexographic printing, can have the thickness between 1 and 10 μm.
According to a second aspect of the invention, provide a kind of method manufacturing circuit board assemblies, the method comprises: provide module, this module comprise there are the first and second contrary surfaces first substrate, first substrate first surface on the first conductive region and in the first conductive region or near the first conductive region and between the first and second surfaces through the hole of first substrate; There is provided circuit board, this circuit board comprises the second conductive region had on the contrary second substrate on the first and second surfaces and the first surface of second substrate.The method can be included on the second conductive region and/or near the second conductive region adds a certain amount of liquid electrically conductive ink or conducting resinl.The second surface that the method can be included in first substrate adds electrically conductive ink or conducting resinl near described hole.The method comprises and puts together the first and second substrates to form conductive path between the first and second conductive regions.The amount of liquid electrically conductive ink is abundant to form conductive path.
According to a third aspect of the present invention, provide a kind of method manufacturing circuit board assemblies, the method comprises: provide module, this module comprise there are the first and second contrary surfaces first substrate, first substrate first surface on the first conductive region and in the first conductive region or near the first conductive region and between the first and second surfaces through the hole of first substrate; And circuit board is provided, this circuit board comprises the second conductive region had on the second substrate on contrary first and second surfaces and the first surface of second substrate.The method is included in hole provides electrically conductive ink or conducting resinl, and is put together by the first and second substrates.There is provided electrically conductive ink or conducting resinl can carry out before or after being put together by the first and second substrates.There is provided electrically conductive ink to comprise module is immersed in electrically conductive ink or conducting resinl.
There is provided through first substrate hole can on the first surface the first conductive region being provided in first substrate before carry out.
The method can comprise curing conductive ink or conducting resinl, such as, by making electrically conductive ink or conducting resinl drying.
According to a forth aspect of the invention, provide a kind of circuit board assemblies, comprise: circuit board, comprise there are the first and second contrary surfaces substrate, be arranged on conductive region on the first surface of first substrate and in conductive region or near conductive region and between the first and second surfaces through the hole of substrate; Comprise the device of contact pad; And the electrically conductive ink be arranged in hole and between device and substrate or conducting resinl.Device is installed in circuit board, and is arranged hole is positioned at above contact pad or near contact pad, and electrically conductive ink or conducting resinl provide electrical connection between contact pad and conductive region.
This contributes to device, as semiconductor element or module, joins on substrate.
Substrate can be flexible.Substrate can comprise paper, card, hardboard or other similar fiber-based materials.Substrate can comprise plastics.Such as, substrate can comprise PET, PP or PEN.Flexible base, board can comprise laminated sheet, such as, comprise and cover or be clipped in fiber-based material between two layers of plastic by one deck plastics.
Contact pad can be bond pad.Device can comprise multiple contact pad, such as 20 or more, and substrate can provide corresponding conductive region, such as contact pad or strip conductor.
Conductive region can comprise electrically conductive ink, conducting resinl or conductive foil.
Substrate can support one or more capacitor type touch switch, and such as, the finger tip size for touch pad (such as has 0.2mm
2to 2mm
2between area) touch electrode and/or the form of touch electrode array.Therefore, microcontroller and other devices directly can be installed or be installed to form the printed matter (as placard or greeting card) strengthened via other substrates one or more, and user provides input by touching to it.
Accompanying drawing explanation
Fig. 1 is the simplification stereogram of a part for circuit board assemblies;
Fig. 2 is the sectional view of circuit board assemblies shown in Fig. 1;
Fig. 3 illustrates the first method module being installed on flexible PCB;
Fig. 4 illustrates the second method module being installed on flexible PCB; And
Fig. 5 a and 5b illustrates third method module being installed on flexible PCB.
Embodiment
Fig. 1 illustrates a part for flexible circuit board assembly 1.
Also with reference to Fig. 1 a and 2, circuit board assemblies 1 comprises module 2 and circuit board 3.Circuit board 3 comprises the flexible base, board 4 with surface 5, and surface 5 supports one group of contact pad 6 (being also referred to as in this article " conductive region ").Substrate 4 is formed by insulating material, as card, paper or plastics.Substrate 4 can take the form of a card or paper.Substrate 4 can be laminated sheet.In this example, two contact pads 6 are merely illustrated.But, many contact pads 6 can be provided, such as 20 or more.
Contact pad 6 comprises electrically conductive ink, as silver base conductive ink, and can be formed directly on circuit board substrate 4.Contact pad 6 can be connected to the pad of the separation of one group of strip conductor (not shown).But contact pad 6 can be provided by the section of strip conductor or end.In some instances, contact pad 6 can be provided by the metal forming be such as formed directly on circuit board substrate 4.Contact pad 6 can have the size (as width and/or length) of at least 100 μm.Such as, contact pad 6 has the width between 1mm and 10mm.
Module 2 comprises: flexible base, board 7, such as, have a card or the plastics of first surface 8 and second surface 9; Be supported on the device 10 on the first surface 8 of substrate 7 and one group of contact pad 11 (herein also referred to as " conductive region ").Module 2 can comprise the protective cover 12 covering above-mentioned device.Contact pad 11 comprises electrically conductive ink, as silver base conductive ink, and can be formed directly on module substrate 7.In some instances, contact pad 11 can be provided by metal forming.Contact pad 11 can have the size (such as width and/or length) of at least 100 μm.Such as, contact pad 11 has the width between 1mm and 10mm.
Device 10 comprises one group of terminal 13, as bond pad.Usually, terminal 13 has the size of about 100 μm.But terminal 13 can be larger.In this illustration, simple two-terminal device 10 is shown.But device 10 can have multiple terminal, such as 20 terminals or more.Terminal 13 is electrically connected to contact pad 11.Such as, each terminal 13 and corresponding contact pad 11 are overlapping wholly or in part and with conducting resinl, ink or bring attachment (not shown).
The method of suitable module and this module of manufacture, has description in the GB2472047A being merged in this paper by reference.But these modules and operation are changed by going out hole 14 in a substrate before or after formation contact pad 11.
Module 2, on circuit board 3, makes module substrate 7 between device 10 and circuit board substrate 4.
Each contact pad 11 comprises one or more hole 14, and module substrate 7 is passed in hole 14 between surface 8 and surface 9.Each hole 14 is filled with electrically conductive ink or glue 15, and electrically conductive ink or glue 15 arrive the space of (even may extend into) module contact pad 11 also between packing module 2 and circuit board 3, to reach corresponding circuit board contacts pad 6.Electrically conductive ink 15 can comprise non-conductive adhesive, as polyvinyl acetate (PVA), silicone or epoxy resin, to increase bonding force.
The second surface 9 (or " bottom side ") of module substrate 7 can be formed another group contact pad (not shown).This may be used for increasing contact area, and therefore reduces contact resistance.
Electrically conductive ink or glue 15 can be introduced in circuit board assemblies 1 with one of several diverse ways.
With reference to Fig. 1, Fig. 1 a, Fig. 2 and Fig. 3, the liquid electrically conductive ink that can flow or glue 15 ' can be dripped before module 2 and circuit board 3 being put together, use blade (or " scraper plate ") be coated with or be printed on circuit board contacts pad 6 by such as flexographic printing, ink jet printing, lithographic printing, silk screen printing or intaglio printing.Once electrically conductive ink or glue 15 ' have been dripped, are coated with or have been printed onto on circuit board contacts pad 6, then module 2 has been aligned with circuit board 3 and has started to contact.
When electrically conductive ink or glue 15 ' touch the bottom side 9 of module 2, it is attracted between module 2 and circuit board 3 or extrudes and in access aperture 14, in certain embodiments, ink or glue 15 ' attracted in hole by capillarity.In certain embodiments, electrically conductive ink or glue 15 ' can be stuffed in hole 14.The amount of electrically conductive ink or glue 15 ' and viscosity are selected, and arrive module contact pad 11 to make enough electrically conductive inks 15 '.
Additionally or alternatively, electrically conductive ink or glue 15 ' can be dripped, are coated with or are printed near circuit board contacts pad 6, such as, in several millimeters of circuit board contacts pad 6.In this case, electrically conductive ink or glue 15 ' can be attracted or be directed on circuit board contacts pad 6 to side, and upwards in access aperture 14.This can bring the larger degree of freedom when applying conductive ink or glue 15 '.
One or more slit (not shown) and/or barrier (not shown) can be provided in circuit board substrate 4, to control the less desirable flowing of ink or glue 15 ' and to prevent short circuit described in GB2453765A.
Electrically conductive ink or glue 15 ' are such as by making it dry or be cured by using infrared or ultra-violet radiation.
(solidification) electrically conductive ink or glue 15 provide the conductive path between circuit board contacts pad 6 and module contact pad 11.Electrically conductive ink or glue 15 also can mechanical engagement module 2 and circuit boards 3.But, extra adhesive (it can be nonconducting) can be provided.
With reference to Fig. 1, Fig. 1 a, Fig. 2 and Fig. 4, the liquid conductive ink that can flow or glue 15 ' can be dripped, and be coated with or be printed onto on module contact pad 6 before or after module 2 and circuit substrate 3 being put together.
Electrically conductive ink or glue 15 ' are attracted or guide in access aperture 14.If module 2 and circuit board 3 have contacted or enough close to making the gap between module 2 and circuit board 3 be bridged, then electrically conductive ink or glue 15 ' can continue to attracted to and/or be diffused on contact pad 6.
If module 2 and circuit board 3 are enough not close, then the film of electrically conductive ink or glue 15 ' or meniscus can remain on the bottom side of module 2, until module 2 and circuit board 3 enough close, in the case, electrically conductive ink or glue 15 ' are attracted or are directed on contact pad 6.
Described in GB2453765A, one or more slit (not shown) may be provided in circuit board substrate 4, such as, between contact pad 5, to control to flow and to prevent less desirable short circuit.
Two methods of applying conductive ink or glue 15 ' relate to drips, is coated with or printing conductive inks 15 ' in the specified point or region of module 2 and/or circuit board 3.This can contribute to the use amount and the position thereof that control ink.But, the additive method of applying conductive ink or glue 15 ' can be used.
With reference to Fig. 1, Fig. 1 a, Fig. 2, Fig. 5 a, module 2 is dipped in the pond 16 of liquid electrically conductive ink or glue.Once module 2 is removed, liquid electrically conductive ink or glue 15 ' can be coalescent in hole 14, and unnecessary ink can pour off from the remainder of module 2.
With reference to Fig. 1, Fig. 1 a, Fig. 2, Fig. 5 b, module 2 is aligned with circuit board 3 and contacts, so electrically conductive ink or glue 15 ' are attracted between module 2 and circuit board 3.
If needed, suitable anti-ink layer or anti-glue-line can be formed in module 2 and/or circuit board 3, to help locating conductive ink or glue 15 '.
Be promoted by the viscosity of adjustment ink or glue and/or surface energy by capillary flowing or VISCOUS FLOW.Together with the diameter in hole, ink or the glue with suitable flow behavior can be found by normal experiment.
Module 2 and circuit board assemblies 1 can be assembled in substantially the same manner, such as, use continuous chip technique or other Large Copacity technique, and it can use printing and/or dyeing and printing process (as described in GB2472047A) to perform.Flexographic printing process can be used.Pick-and-place robot can be used.
Module 2 can be assembled at the production line of same workshop even identical with circuit board assemblies 1 (comprising module 2).This can contribute to manufacturing circuit board assemblies 1 simply.
In addition, the material of same or similar type can be used for the first and second substrates, thus can contribute to reducing mechanical stress.
Should be appreciated that and can make many changes to embodiment mentioned above.
Electrically conductive ink is without the need to for contact pad and/or track.Such as, can use demetallised film, wherein the layer of metal (as aluminium) of covered with plastic film (as PET) is by sheltering and being partly removed (i.e. de-metallization) to leave electrode and track with after etching.
Hole may be provided in circuit board, and the device of such as semiconductor element or module (atresia) can be mounted on circuit boards.Electrically conductive ink or glue are to be provided in circuit board with the same or similar mode of aforementioned manner.
First and/or second substrate without the need to being flat.Substrate can be formed (or " by molding "), such as embossed and/or shaping.Therefore, device can take the form of three-dimensional (i.e. on-plane surface) object, as computer mouse.Substrate can be formed by shapable paper or card, as Billerud FibreForm (RTM).
First and/or second substrate can have different contour shapes.Such as, substrate without the need to having straight edge, but can have curved edge.First and/or second substrate can comprise slit, slit, hole (relatively little compared with the size of substrate) and/or mouth (relatively large compared with the size of substrate).
Claims (22)
1. a circuit board assemblies, comprising:
Module, comprise there are the first and second surfaces first substrate, be arranged on the first conductive region on the described first surface of described first substrate and in described first conductive region or near described first conductive region and between described first and second surfaces through the hole of described first substrate;
Circuit board, comprises the second substrate with the first and second surfaces, the second conductive region be arranged on the described first surface table of described second substrate; With
Be arranged on the electrically conductive ink in described hole and between first and second substrate described or conducting resinl;
Wherein said module is installed in described circuit board, and be arranged and described hole is positioned at above described second conductive region or near described second conductive region, and described electrically conductive ink or conducting resinl provide electrical connection between the first and second conductive regions.
2. circuit board assemblies according to claim 1, comprising:
Be arranged on multiple first conductive regions on the described first surface of described first substrate;
Be arranged on multiple second conductive regions on the described first surface of described second substrate;
Through multiple holes of described first substrate in described first conductive region or near described first conductive region and between described first and second surfaces, some making in described first conductive region have corresponding hole;
Be arranged on the electrically conductive ink in hole described at least some and between first and second substrate described or conducting resinl,
Wherein there is the second conductive region that described at least some of electrically conductive ink, hole is positioned at above the second corresponding conductive region or vicinity is corresponding, and described electrically conductive ink or conducting resinl provide electrical connection between the first and second conductive regions.
3. the circuit board assemblies according to aforementioned arbitrary claim, wherein said first conductive region comprises electrically conductive ink.
4. the circuit board assemblies according to aforementioned arbitrary claim, wherein said second conductive region comprises electrically conductive ink.
5. the circuit board assemblies according to aforementioned arbitrary claim, wherein said first substrate is flexible.
6. the circuit board assemblies according to aforementioned arbitrary claim, wherein said first substrate comprises paper, card, hardboard and/or plastics.
7. the circuit board assemblies according to aforementioned arbitrary claim, wherein said second substrate is flexible.
8. the circuit board assemblies according to aforementioned arbitrary claim, wherein said second substrate comprises paper, card, hardboard and/or plastics.
9. the circuit board assemblies according to aforementioned arbitrary claim, wherein said hole has the Breadth Maximum of 1mm.
10. the circuit board assemblies according to aforementioned arbitrary claim, comprises further: be installed on the device on described first substrate.
11. circuit board assemblies according to claim 10, described device comprises semiconductor element.
12. circuit board assemblies according to claim 10 or 11, wherein said device comprises microcontroller.
13. circuit board assemblies according to aforementioned arbitrary claim, wherein said circuit board assemblies comprises the printed matter of supporting printing mark or a part for printed matter.
14. 1 kinds of methods, comprising:
There is provided module, this module comprises the first conductive region on the described first surface of the first substrate with the first and second surfaces, described first substrate and in described first conductive region or near described first conductive region and between described first and second surfaces, passes the hole of described first substrate;
There is provided circuit board, this circuit board comprises the second conductive region on the described first surface of second substrate and the described second substrate with the first and second surfaces;
On described second conductive region and/or near described second conductive region, add a certain amount of liquid electrically conductive ink or conducting resinl and/or near described hole, add electrically conductive ink on the described second surface of described first substrate; And
Described first and second substrates are put together, to form conductive path between described first and second conductive regions,
The amount of wherein said liquid electrically conductive ink or conducting resinl is abundant to form described conductive path.
15. 1 kinds of methods, comprising:
There is provided module, this module comprises the first conductive region on the described first surface of the first substrate with the first and second surfaces, described first substrate and in described first conductive region or near described first conductive region and between described first and second surfaces, passes the hole of described first substrate;
There is provided circuit board, this circuit board comprises the second conductive region on the described first surface of the second substrate with the first and second surfaces, described second substrate;
Electrically conductive ink or conducting resinl are provided in the hole; And
Described first and second substrates are put together.
16. methods according to claim 15, wherein provide described electrically conductive ink or glue to carry out after being put together by described first and second substrates.
17. methods according to claim 15 or 16, wherein provide described electrically conductive ink or conducting resinl to carry out before being put together by described first and second substrates.
18. methods according to claim 17, wherein provide described electrically conductive ink or glue to comprise: described module to be immersed in described electrically conductive ink or conducting resinl.
19. according to claim 14 to the circuit board assemblies according to any one of 18, wherein provide the described hole through described first substrate on the described first surface described first conductive region being provided in described first substrate before carry out.
20., according to claim 14 to the circuit board assemblies according to any one of 19, comprise further: solidify described electrically conductive ink or conducting resinl.
21. methods according to claim 20, wherein solidify described electrically conductive ink and comprise and make described electrically conductive ink or conducting resinl dry.
22. 1 kinds of circuit board assemblies, comprising:
Circuit board, comprise there are the first and second contrary surfaces first substrate, be arranged on conductive region on the described first surface of described first substrate and in described conductive region or near described conductive region and between described first and second surfaces through the hole of described first substrate;
Device, comprises contact pad; With
Be arranged on the electrically conductive ink in described hole and between described device and described substrate and conducting resinl;
Wherein said device is installed in described circuit board, and is arranged described hole is positioned at above described contact pad or near described contact pad, and described electrically conductive ink or conducting resinl provide electrical connection between contact pad and conductive region.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1203727.1A GB2499850B (en) | 2012-03-02 | 2012-03-02 | Circuit board assembly |
| GB1203727.1 | 2012-03-02 | ||
| PCT/GB2013/050502 WO2013128197A1 (en) | 2012-03-02 | 2013-02-28 | Circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104272883A true CN104272883A (en) | 2015-01-07 |
Family
ID=46003039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380023103.3A Pending CN104272883A (en) | 2012-03-02 | 2013-02-28 | Circuit board assembly |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2820926A1 (en) |
| CN (1) | CN104272883A (en) |
| GB (1) | GB2499850B (en) |
| WO (1) | WO2013128197A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993537A (en) * | 2017-12-21 | 2018-05-04 | 美科科技（北京）有限公司 | Teaching aid and tutoring system |
| CN109743837A (en) * | 2019-03-15 | 2019-05-10 | 北京印刷学院 | Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof |
| CN111567150A (en) * | 2017-11-10 | 2020-08-21 | 雷神公司 | Helical antenna and related manufacturing techniques |
| CN112038054A (en) * | 2019-06-04 | 2020-12-04 | 台达电子工业股份有限公司 | Voltage regulation module |
| CN114141162A (en) * | 2021-12-07 | 2022-03-04 | 惠州华星光电显示有限公司 | Display screen splicing method and spliced display screen |
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- 2013-02-28 EP EP13714320.2A patent/EP2820926A1/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111567150A (en) * | 2017-11-10 | 2020-08-21 | 雷神公司 | Helical antenna and related manufacturing techniques |
| CN107993537A (en) * | 2017-12-21 | 2018-05-04 | 美科科技（北京）有限公司 | Teaching aid and tutoring system |
| CN109743837A (en) * | 2019-03-15 | 2019-05-10 | 北京印刷学院 | Glass substrate bimetallic chromatography LED light source circuit plate and preparation method thereof |
| CN112038054A (en) * | 2019-06-04 | 2020-12-04 | 台达电子工业股份有限公司 | Voltage regulation module |
| US11134571B2 (en) | 2019-06-04 | 2021-09-28 | Delta Electronics, Inc. | Voltage regulator module |
| US11160167B2 (en) | 2019-06-04 | 2021-10-26 | Delta Electronics, Inc. | Voltage regulator module and voltage regulation device with same |
| CN112038054B (en) * | 2019-06-04 | 2022-04-01 | 台达电子工业股份有限公司 | Voltage regulation module |
| US11395409B2 (en) | 2019-06-04 | 2022-07-19 | Delta Electronics, Inc | Voltage regulator module |
| CN114141162A (en) * | 2021-12-07 | 2022-03-04 | 惠州华星光电显示有限公司 | Display screen splicing method and spliced display screen |
| CN114141162B (en) * | 2021-12-07 | 2024-03-15 | 惠州华星光电显示有限公司 | Display screen splicing method and spliced display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013128197A1 (en) | 2013-09-06 |
| GB2499850A (en) | 2013-09-04 |
| GB2499850B (en) | 2014-07-09 |
| EP2820926A1 (en) | 2015-01-07 |
| GB201203727D0 (en) | 2012-04-18 |
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Application publication date: 20150107 |