CN206790771U - One side copper foil baseplate structure - Google Patents
One side copper foil baseplate structure Download PDFInfo
- Publication number
- CN206790771U CN206790771U CN201720470553.2U CN201720470553U CN206790771U CN 206790771 U CN206790771 U CN 206790771U CN 201720470553 U CN201720470553 U CN 201720470553U CN 206790771 U CN206790771 U CN 206790771U
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- China
- Prior art keywords
- copper foil
- metal substrate
- adhesion coating
- glue adhesion
- epoxy glue
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Abstract
The utility model discloses a kind of one side copper foil baseplate structure, including metal substrate, copper foil layer and the epoxy glue adhesion coating between metal substrate and copper foil layer, there is a glass fabric in the epoxy glue adhesion coating, the metal substrate surface opposite with epoxy glue adhesion coating is provided with several sawtooth grooves be arrangeding in parallel；The inner surface that glass fabric in the epoxy glue adhesion coating contacts close to epoxy resin layer with metal substrate.The utility model one side copper foil baseplate structure both adds area of dissipation, meanwhile, towards the fan on PCB, the air-flow be advantageous in metal substrate quickly flows sawtooth grooves during use, so as to which more heats be taken out of.
Description
Technical field
A kind of copper clad laminate, more particularly to one side copper foil baseplate structure are the utility model is related to, belongs to printed substrate neck
Domain.
Background technology
Printed substrate is the supplier of electronic component electrical connection, and the major advantage using wiring board is that integration is various
The set of electronic component and functional module, greatly reduce hand layouts and assembling mistake, improve electronic product assembling from
Dynamicization level and production efficiency.Wiring board is cut into certain size using insulation board as base material, thereon with multiple conductive patterns, and
Via hole is furnished with, realizes the interconnection between electronic component.
In the prior art because miniaturization of electronic products, the arranging density of device are stepped up, the radiating of heat is increasingly
Seriously, so as to influence the service life of electronic product, therefore, how on the premise of board area is not increased as far as possible, effectively
Heat dispersion is improved, turns into the direction of those of ordinary skill in the art's effort.
The content of the invention
The utility model purpose is to provide a kind of one side copper foil baseplate structure, and the one side copper foil baseplate structure is advantageous to increase
Area of dissipation, be advantageous to quickly transmit the heat from copper foil layer device, so as to be advantageous to improve the service life of device, carry
The high reliability of product, secondly, several horizontal through hole are advantageous to the gas in metal substrate towards the fan on PCB
The quick flowing of stream, so as to which more heats be taken out of.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of one side copper foil baseplate structure, including gold
Belong to substrate, copper foil layer and the epoxy glue adhesion coating between metal substrate and copper foil layer, there is a glass in the epoxy glue adhesion coating
Glass fiber cloth, the metal substrate surface opposite with epoxy glue adhesion coating are provided with several sawtooth grooves be arrangeding in parallel.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the glass fabric in the epoxy glue adhesion coating connects close to epoxy resin layer and metal substrate
Tactile inner surface.
2. in such scheme, the adjacent sawtooth grooves at intervals of 1 ~ 3cm.
3. in such scheme, the thickness of the metal substrate is 0.3 ~ 3.0 micron.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model one side copper foil baseplate structure, its epoxy glue adhesion coating is interior to have a glass fabric, the Metal Substrate
The plate surface opposite with epoxy glue adhesion coating is provided with several sawtooth grooves be arrangeding in parallel, both adds area of dissipation, meanwhile, make
Towards the fan on PCB, the air-flow be advantageous in metal substrate quickly flows used time sawtooth grooves, so that will more heat
Amount is taken out of；Secondly, there is a glass fabric in its epoxy glue adhesion coating between metal substrate and copper foil layer, both causes production
Product have pliability, also improve folding resistance；Again, the glass fabric in its epoxy glue adhesion coating is close to epoxy resin layer and gold
Belong to the inner surface of substrate contact, not only improve the bulk strength for improving wiring board, be also beneficial to improve technique epoxy resin
The adhesive strength of layer and copper foil layer.
Brief description of the drawings
Accompanying drawing 1 is the utility model one side copper foil baseplate structure structural representation.
In the figures above：1st, metal substrate；2nd, copper foil layer；3rd, epoxy glue adhesion coating；4th, glass fabric；5th, sawtooth grooves.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of one side copper foil baseplate structure, including metal substrate 1, copper foil layer 2 and positioned at metal substrate 1 and copper
Epoxy glue adhesion coating 3 between layers of foil 2, the epoxy glue adhesion coating 3 is interior to have a glass fabric 4, the metal substrate 1 and epoxy
The opposite surface of adhesive layer 3 is provided with several sawtooth grooves 5 be arrangeding in parallel.
The inner side table that glass fabric 4 in above-mentioned epoxy glue adhesion coating 3 contacts close to epoxy resin layer 3 with metal substrate 1
Face.
The adjacent sawtooth grooves 5 at intervals of 2cm.
The thickness of said metal substrates 1 is 0.6 micron.
Embodiment 2：A kind of one side copper foil baseplate structure, including metal substrate 1, copper foil layer 2 and positioned at metal substrate 1 and copper
Epoxy glue adhesion coating 3 between layers of foil 2, the epoxy glue adhesion coating 3 is interior to have a glass fabric 4, the metal substrate 1 and epoxy
The opposite surface of adhesive layer 3 is provided with several sawtooth grooves 5 be arrangeding in parallel.
The inner side table that glass fabric 4 in above-mentioned epoxy glue adhesion coating 3 contacts close to epoxy resin layer 3 with metal substrate 1
Face.
The adjacent sawtooth grooves 5 at intervals of 1.6cm.
The thickness of said metal substrates 1 is 2.2 microns.
During using above-mentioned one side copper foil baseplate structure, there is a glass fabric, the Metal Substrate in its epoxy glue adhesion coating
The plate surface opposite with epoxy glue adhesion coating is provided with several sawtooth grooves be arrangeding in parallel, both adds area of dissipation, meanwhile, make
Towards the fan on PCB, the air-flow be advantageous in metal substrate quickly flows used time sawtooth grooves, so that will more heat
Amount is taken out of；Secondly, there is a glass fabric in its epoxy glue adhesion coating between metal substrate and copper foil layer, both causes production
Product have pliability, also improve folding resistance；Again, the glass fabric in its epoxy glue adhesion coating is close to epoxy resin layer and gold
Belong to the inner surface of substrate contact, not only improve the bulk strength for improving wiring board, be also beneficial to improve technique epoxy resin
The adhesive strength of layer and copper foil layer.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (4)
- A kind of 1. one side copper foil baseplate structure, it is characterised in that：Including metal substrate（1）, copper foil layer（2）With positioned at metal substrate （1）And copper foil layer（2）Between epoxy glue adhesion coating（3）, the epoxy glue adhesion coating（3）Inside there is a glass fabric（4）, it is described Metal substrate（1）With epoxy glue adhesion coating（3）Opposite surface is provided with several sawtooth grooves be arrangeding in parallel（5）.
- 2. one side copper foil baseplate structure according to claim 1, it is characterised in that：The epoxy glue adhesion coating（3）Interior glass Glass fiber cloth（4）Close to epoxy resin layer（3）With metal substrate（1）The inner surface of contact.
- 3. the one side copper foil baseplate structure according to claims 1 or 2, it is characterised in that：The adjacent sawtooth grooves （5）At intervals of 1 ~ 3cm.
- 4. the one side copper foil baseplate structure according to claims 1 or 2, it is characterised in that：The metal substrate（1）Thickness Spend for 0.3 ~ 3.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720470553.2U CN206790771U (en) | 2017-04-29 | 2017-04-29 | One side copper foil baseplate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720470553.2U CN206790771U (en) | 2017-04-29 | 2017-04-29 | One side copper foil baseplate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206790771U true CN206790771U (en) | 2017-12-22 |
Family
ID=60710288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720470553.2U Active CN206790771U (en) | 2017-04-29 | 2017-04-29 | One side copper foil baseplate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206790771U (en) |
-
2017
- 2017-04-29 CN CN201720470553.2U patent/CN206790771U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |