CN206790769U - High heat conduction type aluminium-based copper-clad laminate - Google Patents
High heat conduction type aluminium-based copper-clad laminate Download PDFInfo
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- CN206790769U CN206790769U CN201720468036.1U CN201720468036U CN206790769U CN 206790769 U CN206790769 U CN 206790769U CN 201720468036 U CN201720468036 U CN 201720468036U CN 206790769 U CN206790769 U CN 206790769U
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- aluminium base
- heat conduction
- high heat
- conduction type
- hole
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Abstract
The utility model discloses a kind of high heat conduction type aluminium-based copper-clad laminate, including aluminium base, copper foil layer and the epoxy glue adhesion coating between aluminium base and copper foil layer, several horizontal through hole are provided with the middle part of the aluminium base and along its in-plane, several this horizontal through hole are parallel and arranged at equal intervals, the adjacent horizontal through hole is at intervals of 10 ~ 30mm, the thickness ratio of the aluminium base, copper foil layer and epoxy glue adhesion coating（10000~30000）：（5~70）：（80~200）.The utility model high heat conduction type aluminium-based copper-clad laminate is advantageous to increase area of dissipation, be advantageous to quickly transmit the heat from copper foil layer device, so as to be advantageous to improve the service life of device, improve the reliability of product, secondly, towards the fan on PCB, the air-flow be advantageous in aluminium base quickly flows several horizontal through hole, so as to which more heats be taken out of.
Description
Technical field
A kind of copper clad laminate, more particularly to high heat conduction type aluminium-based copper-clad laminate are the utility model is related to, belongs to printing
Wiring board art.
Background technology
Printed substrate is the supplier of electronic component electrical connection, and the major advantage using wiring board is that integration is various
The set of electronic component and functional module, greatly reduce hand layouts and assembling mistake, improve electronic product assembling from
Dynamicization level and production efficiency.Wiring board is cut into certain size using insulation board as base material, thereon with multiple conductive patterns, and
Via hole is furnished with, realizes the interconnection between electronic component.
In the prior art because miniaturization of electronic products, the arranging density of device are stepped up, the radiating of heat is increasingly
Seriously, so as to influence the service life of electronic product, therefore, how on the premise of board area is not increased as far as possible, effectively
Heat dispersion is improved, turns into the direction of those of ordinary skill in the art's effort.
The content of the invention
The utility model purpose is to provide a kind of high heat conduction type aluminium-based copper-clad laminate, and the high heat conduction type aluminium base covers copper foil
Laminate is advantageous to increase area of dissipation, is advantageous to quickly transmit the heat from copper foil layer device, so as to be advantageous to improve
The service life of device, the reliability of product is improved, secondly, fan of several horizontal through hole direction on PCB, favorably
Quickly flowed in the air-flow in aluminium base, so as to which more heats be taken out of.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of aluminium-based copper foil coated pressure of high heat conduction type
Plate, including aluminium base, copper foil layer and the epoxy glue adhesion coating between aluminium base and copper foil layer, in the middle part of the aluminium base and
Several horizontal through hole are provided with along its in-plane, several this horizontal through hole are parallel and arranged at equal intervals.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, the adjacent horizontal through hole at intervals of 10 ~ 30mm.
2. in such scheme, the thickness of the aluminium base is 1.0 ~ 5.0 microns.
3. in such scheme, the thickness of the copper foil layer is 5 ~ 70 microns.
4. in such scheme, the thickness ratio of the aluminium base, copper foil layer and epoxy glue adhesion coating is（10000~30000）：（5
~70）：（80~200）.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model high heat conduction type aluminium-based copper-clad laminate, it is located in the middle part of the aluminium base and along its in-plane
Several horizontal through hole are provided with, several this horizontal through hole are parallel and arranged at equal intervals, are advantageous to increase area of dissipation, are advantageous to
Heat from copper foil layer device is quickly transmitted, so as to be advantageous to improve the service life of device, improves the reliable of product
Property, secondly, several horizontal through hole are towards the fan on PCB, and being advantageous to the air-flow in aluminium base quickly flows, so that will
More heats are taken out of.
Brief description of the drawings
Accompanying drawing 1 is the utility model high heat conduction type aluminium-based copper-clad laminate structural representation；
Accompanying drawing 2 is the A-A cross-sectional views of accompanying drawing 1.
In the figures above：1st, aluminium base；2nd, copper foil layer；3rd, epoxy glue adhesion coating；4th, horizontal through hole.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of high heat conduction type aluminium-based copper-clad laminate, including aluminium base 1, copper foil layer 2 and positioned at aluminium base 1
Epoxy glue adhesion coating 3 between copper foil layer 2, it is logical to be provided with several levels positioned at the middle part of aluminium base 1 and along its in-plane
Hole 4, several this horizontal through hole 4 are parallel and arranged at equal intervals.
The adjacent horizontal through hole 4 at intervals of 12mm；The thickness of above-mentioned aluminium base 1 is 2 microns.
The thickness of above-mentioned copper foil layer 2 is 60 microns.
The thickness ratio of above-mentioned aluminium base 1, copper foil layer 2 and epoxy glue adhesion coating 3 is 12000：30：100.
Embodiment 2：A kind of high heat conduction type aluminium-based copper-clad laminate, including aluminium base 1, copper foil layer 2 and positioned at aluminium base 1
Epoxy glue adhesion coating 3 between copper foil layer 2, it is logical to be provided with several levels positioned at the middle part of aluminium base 1 and along its in-plane
Hole 4, several this horizontal through hole 4 are parallel and arranged at equal intervals.
The adjacent horizontal through hole 4 at intervals of 20mm；The thickness of above-mentioned aluminium base 1 is 3.5 microns.
The thickness of above-mentioned copper foil layer 2 is 40 microns.
The thickness ratio of above-mentioned aluminium base 1, copper foil layer 2 and epoxy glue adhesion coating 3 is 20000：50：150.
During using above-mentioned high heat conduction type aluminium-based copper-clad laminate, it is located in the middle part of the aluminium base and along its in-plane
Several horizontal through hole are provided with, several this horizontal through hole are parallel and arranged at equal intervals, are advantageous to increase area of dissipation, are advantageous to
Heat from copper foil layer device is quickly transmitted, so as to be advantageous to improve the service life of device, improves the reliable of product
Property, secondly, several horizontal through hole are towards the fan on PCB, and being advantageous to the air-flow in aluminium base quickly flows, so that will
More heats are taken out of.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (5)
- A kind of 1. high heat conduction type aluminium-based copper-clad laminate, it is characterised in that：Including aluminium base（1）, copper foil layer（2）With positioned at aluminium Substrate（1）And copper foil layer（2）Between epoxy glue adhesion coating（3）, positioned at the aluminium base（1）Middle part and it is provided with along its in-plane Several horizontal through hole（4）, several this horizontal through hole（4）Parallel and arranged at equal intervals.
- 2. high heat conduction type aluminium-based copper-clad laminate according to claim 1, it is characterised in that：Adjacent is described horizontal logical Hole（4）At intervals of 10 ~ 30mm.
- 3. high heat conduction type aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The aluminium base（1）'s Thickness is 1.0 ~ 5.0mm.
- 4. high heat conduction type aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The copper foil layer（2）'s Thickness is 5 ~ 70 microns.
- 5. high heat conduction type aluminium-based copper-clad laminate according to claim 1, it is characterised in that：The aluminium base（1）, copper Layers of foil（2）With epoxy glue adhesion coating（3）Thickness ratio be（10000~30000）：（5~70）：（80~200）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720468036.1U CN206790769U (en) | 2017-04-29 | 2017-04-29 | High heat conduction type aluminium-based copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720468036.1U CN206790769U (en) | 2017-04-29 | 2017-04-29 | High heat conduction type aluminium-based copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206790769U true CN206790769U (en) | 2017-12-22 |
Family
ID=60709827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720468036.1U Active CN206790769U (en) | 2017-04-29 | 2017-04-29 | High heat conduction type aluminium-based copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206790769U (en) |
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2017
- 2017-04-29 CN CN201720468036.1U patent/CN206790769U/en active Active
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