CN206790783U - Copper-clad laminate for printed circuit - Google Patents
Copper-clad laminate for printed circuit Download PDFInfo
- Publication number
- CN206790783U CN206790783U CN201720470552.8U CN201720470552U CN206790783U CN 206790783 U CN206790783 U CN 206790783U CN 201720470552 U CN201720470552 U CN 201720470552U CN 206790783 U CN206790783 U CN 206790783U
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- CN
- China
- Prior art keywords
- copper foil
- foil layer
- adhesion coating
- epoxy glue
- glue adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a kind of copper-clad laminate for printed circuit, including metal substrate, upper copper foil layer and lower copper foil layer, there is the first epoxy glue adhesion coating between the metal substrate and upper copper foil layer, there is the second epoxy glue adhesion coating between the metal substrate and lower copper foil layer；The surface that the upper copper foil layer contacts with the first epoxy glue adhesion coating has the first lug boss, the surface that the lower copper foil layer contacts with the second epoxy glue adhesion coating has the second lug boss, between adjacent first lug boss at intervals of 2 ~ 4mm, between adjacent second lug boss at intervals of 2 ~ 4mm.The copper-clad laminate that the utility model is used for printed circuit had both improved the adhesive strength of copper foil layer and epoxy glue adhesion coating, avoids coming off in PCB following process and etching copper foil, is also beneficial to resistivity when reduction copper foil conduction.
Description
Technical field
A kind of copper clad laminate, the more particularly to copper-clad laminate for printed circuit are the utility model is related to, belongs to printing
Wiring board art.
Background technology
Printed substrate is the supplier of electronic component electrical connection, and the major advantage using wiring board is that integration is various
The set of electronic component and functional module, greatly reduce hand layouts and assembling mistake, improve electronic product assembling from
Dynamicization level and production efficiency.Wiring board is cut into certain size using insulation board as base material, thereon with multiple conductive patterns, and
Via hole is furnished with, realizes the interconnection between electronic component.
In the prior art because miniaturization of electronic products, the arranging density of device are stepped up, the radiating of heat is increasingly
Seriously, so as to influence the service life of electronic product, therefore, how on the premise of board area is not increased as far as possible, effectively
Heat dispersion is improved, turns into the direction of those of ordinary skill in the art's effort.
The content of the invention
The utility model purpose is to provide a kind of copper-clad laminate for printed circuit, and this is used for the copper foil of printed circuit
Laminate had both improved the adhesive strength of copper foil layer and epoxy glue adhesion coating, avoided the copper foil in PCB following process and etching
Come off, be also beneficial to reduce resistivity when copper foil conduction.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of copper foil for printed circuit is laminated
Plate, including metal substrate, upper copper foil layer and lower copper foil layer, have the first Wear Characteristics of Epoxy Adhesive between the metal substrate and upper copper foil layer
Layer, has the second epoxy glue adhesion coating between the metal substrate and lower copper foil layer；
The surface that the upper copper foil layer contacts with the first epoxy glue adhesion coating has the first lug boss, the lower copper foil layer and
The surface of diepoxy adhesive layer contact has the second lug boss.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in such scheme, between adjacent first lug boss at intervals of 2 ~ 4mm.
2. in such scheme, between adjacent second lug boss at intervals of 2 ~ 4mm.
3. in such scheme, the metal substrate is aluminium base, copper base or iron substrate.
Because above-mentioned technical proposal is used, the utility model has following advantages and effect compared with prior art：
The utility model is used for the copper-clad laminate of printed circuit, the table that copper foil layer contacts with the first epoxy glue adhesion coating thereon
Face has the first lug boss, and the surface that the lower copper foil layer contacts with the second epoxy glue adhesion coating has the second lug boss, both improved
The adhesive strength of copper foil layer and epoxy glue adhesion coating, coming off in PCB following process and etching copper foil is avoided, is also beneficial to
Reduce resistivity when copper foil conduction.
Brief description of the drawings
Accompanying drawing 1 is the copper-clad laminate structural representation that the utility model is used for printed circuit.
In the figures above：1st, metal substrate；2nd, upper copper foil layer；3rd, the first epoxy glue adhesion coating；5th, lower copper foil layer；6th, the second ring
Oxygen adhesive layer；7th, the first lug boss；8th, the second lug boss.
Embodiment
The utility model is further described with reference to embodiment：
Embodiment 1：A kind of copper-clad laminate for printed circuit, including metal substrate 1, upper copper foil layer 2 and lower copper foil
Layer 5, has the first epoxy glue adhesion coating 3, the metal substrate 1 and lower copper foil layer 5 between the metal substrate 1 and upper copper foil layer 2
Between there is the second epoxy glue adhesion coating 6；
The surface that the upper copper foil layer 2 contacts with the first epoxy glue adhesion coating 3 has the first lug boss 7, the lower copper foil layer 5
The surface contacted with the second epoxy glue adhesion coating 6 has the second lug boss 8.
Between adjacent first lug boss 7 at intervals of 2.4mm.
Between adjacent second lug boss 8 at intervals of 2.4mm.
Said metal substrates 1 are aluminium base.
Embodiment 2：A kind of copper-clad laminate for printed circuit, including metal substrate 1, upper copper foil layer 2 and lower copper foil
Layer 5, has the first epoxy glue adhesion coating 3, the metal substrate 1 and lower copper foil layer 5 between the metal substrate 1 and upper copper foil layer 2
Between there is the second epoxy glue adhesion coating 6；
The surface that the upper copper foil layer 2 contacts with the first epoxy glue adhesion coating 3 has the first lug boss 7, the lower copper foil layer 5
The surface contacted with the second epoxy glue adhesion coating 6 has the second lug boss 8.
Between adjacent first lug boss 7 at intervals of 3.6mm, between adjacent second lug boss 8 at intervals of
2.2mm。
Said metal substrates 1 are iron substrate.
During using above-mentioned copper-clad laminate for printed circuit, copper foil layer contacts with the first epoxy glue adhesion coating thereon table
Face has the first lug boss, and the surface that the lower copper foil layer contacts with the second epoxy glue adhesion coating has the second lug boss, both improved
The adhesive strength of copper foil layer and epoxy glue adhesion coating, coming off in PCB following process and etching copper foil is avoided, is also beneficial to
Reduce resistivity when copper foil conduction.
For above-described embodiment only to illustrate technical concepts and features of the present utility model, its object is to allow be familiar with technique
Personage can understand content of the present utility model and implement according to this, the scope of protection of the utility model can not be limited with this.
All equivalent change or modifications made according to the utility model Spirit Essence, should all cover the scope of protection of the utility model it
It is interior.
Claims (4)
- A kind of 1. copper-clad laminate for printed circuit, it is characterised in that：Including metal substrate（1）, upper copper foil layer（2）With under Copper foil layer（5）, the metal substrate（1）With upper copper foil layer（2）Between there is the first epoxy glue adhesion coating（3）, the metal substrate （1）With lower copper foil layer（5）Between there is the second epoxy glue adhesion coating（6）；The upper copper foil layer（2）With the first epoxy glue adhesion coating（3）The surface of contact has the first lug boss（7）, the lower copper foil Layer（5）With the second epoxy glue adhesion coating（6）The surface of contact has the second lug boss（8）.
- 2. the copper-clad laminate according to claim 1 for printed circuit, it is characterised in that：Adjacent described first is raised Portion（7）Between at intervals of 2 ~ 4mm.
- 3. the copper-clad laminate according to claim 1 for printed circuit, it is characterised in that：Adjacent described second is raised Portion（8）Between at intervals of 2 ~ 4mm.
- 4. the copper-clad laminate according to claim 1 for printed circuit, it is characterised in that：The metal substrate（1） For aluminium base, copper base or iron substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720470552.8U CN206790783U (en) | 2017-04-29 | 2017-04-29 | Copper-clad laminate for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720470552.8U CN206790783U (en) | 2017-04-29 | 2017-04-29 | Copper-clad laminate for printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206790783U true CN206790783U (en) | 2017-12-22 |
Family
ID=60709271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720470552.8U Active CN206790783U (en) | 2017-04-29 | 2017-04-29 | Copper-clad laminate for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206790783U (en) |
-
2017
- 2017-04-29 CN CN201720470552.8U patent/CN206790783U/en active Active
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| GR01 | Patent grant |