CN207505217U - A kind of novel Enhanced circuit plate - Google Patents
A kind of novel Enhanced circuit plate Download PDFInfo
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- CN207505217U CN207505217U CN201721569475.8U CN201721569475U CN207505217U CN 207505217 U CN207505217 U CN 207505217U CN 201721569475 U CN201721569475 U CN 201721569475U CN 207505217 U CN207505217 U CN 207505217U
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- copper foil
- circuit plate
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Abstract
The utility model discloses a kind of novel Enhanced circuit plate, including enhancement layer, substrate, circuit layer, copper foil layer, protective layer, reinforcing rib, strengthen pad, conducting resinl, insulating layer and through-hole, the substrate that multiple top surfaces are equipped with circuit layer bonds composition basal body structure successively, and multiple reinforcing ribs being evenly spaced on are equipped in each substrate, the bottom surface of described matrix structure is bonded with enhancement layer, the top surface of basal body structure is equipped with copper foil layer, the copper foil layer top surface is equipped with the protective layer made of PE protective films, compared with prior art, the beneficial effects of the utility model are：This kind of novel Enhanced circuit plate, by adding enhancement layer and copper foil layer, improve the intensity of circuit board entirety, product qualification rate is high, and service life is long, while using conducting resinl as articulamentum, conducting resinl has the characteristics that environmentally friendly, nontoxic, and reinforcement pad is provided in through-hole periphery, reinforcing rib is equipped in substrate, improves the intensity of circuit board.
Description
Technical field
The utility model is related to the utility model category electric circuit electronics technical technical field, specially a kind of novel Enhanced circuit
Plate.
Background technology
The title of circuit board has：Ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, printing（Copper lithographic technique）
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, batch production and optimization electrical appliance layout lifting for permanent circuit
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and English name is（Printed Circuit Board）
PCB、（Flexible Printed Circuit board）FPC wiring boards [1]（FPC wiring boards are also known as flexible circuit board flexibility
Circuit board is that have height reliability, excellent flexible printing electricity to be a kind of made of base material using polyimides or polyester film
Road plate.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good！）And Rigid Flex（Reechas, Soft
and hard combination plate）The birth and development of-FPC and PCB has expedited the emergence of Rigid Flex this new product.
Therefore, Rigid Flex is exactly flexible circuit board and rigid wiring board, by processes such as pressings, is combined by related process requirement
Together, the wiring board with FPC characteristics and PCB characteristics of formation.
Existing circuit board is inadequate in intensity, and due to being made of plating mode, danger can be generated in electroplating process
The noxious material of evil health or even the pollution of environment is further resulted in, therefore very not environmentally, in addition the side of electroplated conductive layer
Formula, cost it is of high cost.
Utility model content
The purpose of this utility model is to provide a kind of novel Enhanced circuit plate, to solve to carry in above-mentioned background technology
The problem of going out.
To achieve the above object, the utility model provides following technical solution：A kind of novel Enhanced circuit plate, including adding
Strong layer, substrate, circuit layer, copper foil layer, protective layer, reinforcing rib, reinforcement pad, conducting resinl, insulating layer and through-hole, multiple top surfaces are set
The substrate for having circuit layer bonds composition basal body structure successively, and in each substrate equipped with multiple being evenly spaced on plus
Strengthening tendons, the bottom surface of described matrix structure are bonded with enhancement layer, and the top surface of basal body structure is equipped with copper foil layer, and the copper foil layer top surface is set
There is the protective layer made of PE protective films.
Further, insulating layer is equipped between the copper foil layer and basal body structure.
Further, the reinforcing rib is crossed in substrate.
Further, the substrate and enhancement layer are made of polyimides.
Further, a vertical perforative through-hole is equipped in Enhanced circuit plate, corresponding diameter is bonded in the through-hole
Reinforcement pad, it is described to strengthen the full conducting resinl of filling in pad.
Compared with prior art, the beneficial effects of the utility model are：This kind of novel Enhanced circuit plate, by adding
Strong layer and copper foil layer improve the intensity of circuit board entirety, and product qualification rate is high, and service life is long, while is made using conducting resinl
For articulamentum, conducting resinl has the characteristics that environmental protection, nontoxic, and reinforcement pad is provided in through-hole periphery, be equipped in substrate plus
Strengthening tendons improve the intensity of circuit board.
Description of the drawings
Fig. 1 is the utility model of the whole structure diagram；
In figure：1st, enhancement layer, 2, substrate, 3, circuit layer, 4, copper foil layer, 5, protective layer, 6, reinforcing rib, 7, strengthen pad, 8,
Conducting resinl, 9, insulating layer, 10, through-hole.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
Referring to Fig. 1, the utility model provides a kind of technical solution：A kind of novel Enhanced circuit plate, including enhancement layer
1st, substrate 2, circuit layer 3, copper foil layer 4, protective layer 5, reinforcing rib 6, reinforcement pad 7, conducting resinl 8, insulating layer 9 and through-hole 10 are more
The substrate 2 that a top surface is equipped with circuit layer 3 bonds composition basal body structure successively, and is equipped in each substrate 2 multiple uniform
The reinforcing rib 6 being spaced apart, the bottom surface of described matrix structure are bonded with enhancement layer 1, and the top surface of basal body structure is equipped with copper foil layer 4,
4 top surface of copper foil layer is equipped with the protective layer 5 made of PE protective films.Insulation is equipped between the copper foil layer 4 and basal body structure
Layer.The reinforcing rib 6 is crossed in substrate 2, not only the normal use of substrate 2 is not impacted, and intensity higher.The base
Plate 2 and enhancement layer 1 are made of polyimides, further increase the intensity of circuit board entirety.It is equipped in Enhanced circuit plate
One vertical perforative through-hole 10 is bonded with the reinforcement pad 7 of corresponding diameter in the through-hole 10, in the reinforcement pad 7 filling completely lead
Electric glue 8, conducting resinl 8 have the characteristics that environmental protection, nontoxic, and financial cost is low.
Compared with prior art, the beneficial effects of the utility model are：This kind of novel Enhanced circuit plate, by adding
Strong layer and copper foil layer improve the intensity of circuit board entirety, and product qualification rate is high, and service life is long, while is made using conducting resinl
For articulamentum, conducting resinl has the characteristics that environmental protection, nontoxic, and reinforcement pad is provided in through-hole periphery, be equipped in substrate plus
Strengthening tendons improve the intensity of circuit board.
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art is come
Say, can still modify to the technical solution recorded in foregoing embodiments or to which part technical characteristic into
Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all
It is included within the scope of protection of this utility model.
Claims (5)
1. a kind of novel Enhanced circuit plate, it is characterised in that:Including enhancement layer（1）, substrate（2）, circuit layer（3）, copper foil layer
（4）, protective layer（5）, reinforcing rib（6）, strengthen pad（7）, conducting resinl（8）, insulating layer（9）And through-hole（10）, multiple top surfaces are set
There is circuit layer（3）The substrate（2）Bonding forms basal body structure, and each substrate successively（2）It is interior be equipped with it is multiple uniformly between
Every the reinforcing rib of distribution（6）, the bottom surface of described matrix structure is bonded with enhancement layer（1）, the top surface of basal body structure is equipped with copper foil layer
（4）, the copper foil layer（4）Top surface is equipped with the protective layer made of PE protective films（5）.
2. a kind of novel Enhanced circuit plate according to claim 1, it is characterised in that：The copper foil layer（4）With matrix
Insulating layer is equipped between structure.
3. a kind of novel Enhanced circuit plate according to claim 1, it is characterised in that：The reinforcing rib（6）Cross in
Substrate（2）It is interior.
4. a kind of novel Enhanced circuit plate according to claim 1, it is characterised in that：The substrate（2）And enhancement layer
（1）It is made of polyimides.
5. a kind of novel Enhanced circuit plate according to claim 1, it is characterised in that：One is equipped in Enhanced circuit plate
Vertical perforative through-hole（10）, the through-hole（10）Inside it is bonded with the reinforcement pad of corresponding diameter（7）, it is described to strengthen pad（7）Inside fill out
Full of conducting resinl（8）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721569475.8U CN207505217U (en) | 2017-11-21 | 2017-11-21 | A kind of novel Enhanced circuit plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721569475.8U CN207505217U (en) | 2017-11-21 | 2017-11-21 | A kind of novel Enhanced circuit plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207505217U true CN207505217U (en) | 2018-06-15 |
Family
ID=62505440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721569475.8U Active CN207505217U (en) | 2017-11-21 | 2017-11-21 | A kind of novel Enhanced circuit plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207505217U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113038695A (en) * | 2021-03-02 | 2021-06-25 | 广德新三联电子有限公司 | Carbon paste through hole circuit board and preparation method thereof |
-
2017
- 2017-11-21 CN CN201721569475.8U patent/CN207505217U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113038695A (en) * | 2021-03-02 | 2021-06-25 | 广德新三联电子有限公司 | Carbon paste through hole circuit board and preparation method thereof |
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