CN203748107U - Double-layer wiring high-heat-conducting flexible printed circuit board - Google Patents
Double-layer wiring high-heat-conducting flexible printed circuit board Download PDFInfo
- Publication number
- CN203748107U CN203748107U CN201420131395.4U CN201420131395U CN203748107U CN 203748107 U CN203748107 U CN 203748107U CN 201420131395 U CN201420131395 U CN 201420131395U CN 203748107 U CN203748107 U CN 203748107U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- double
- printed circuit
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 12
- 230000002787 reinforcement Effects 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 239000002356 single layer Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Abstract
The utility model discloses a double-layer wiring high-heat-conducting flexible printed circuit board. Original single-layer wiring is upgraded into double-layer wiring via technical means, and double-layer circuit connection is realized via conduction holes so that wiring number of electronic components and parts of a single circuit board can be capacity-expended, and functions of the circuit board are enhanced. Meanwhile, one heat-conducting glue layer is additionally arranged between double-layer lines, and is also additionally arranged between the lines and a metal reinforcing layer so that great heat conduction design is realized, heat-radiating effect of a conventional printed circuit board is greatly improved, electric energy utilization rate of the circuit board is enhanced, and the service life of the product is also increased.
Description
Technical field
The utility model relates to printed circuit board technology field, particularly relates to the high thermal conductivity flexible printed circuit board of a kind of two-layer wiring.
Background technology
Printed circuit board is widely used in all kinds of electric equipments, is the substrate that all kinds of electronic devices and components are electrically connected; Individual layer cabling printed circuit board is the simplest flexible board of structure, is followed successively by from top to bottom: substrate, solid, Copper Foil, solid, diaphragm.Along with the raising of scientific and technical development and application demand, the wiring density of wiring board is more and more higher, and original individual layer cabling printed circuit board can not have been contained all requirements of application terminal to heat-conducting substrate.Traditional printed circuit board in actual use in addition, due to the heat-blocking action of substrate and solid, the heat that in copper foil layer circuit, electronic devices and components produce is difficult for being distributed, its thermal conductivity is only 0.3-0.4W/mk, reduce the utilization rate of electrical of power component, as the LED extensively utilizing at present, in the time adopting traditional flexible circuit board, input power 20% changes into light, all the other 80% be converted into heat energy.Be difficult for the damage that distribute heat may cause electronic devices and components or printed circuit board simultaneously, and then affect the useful life of electronic product.
Summary of the invention
The problem that the utility model mainly solves is to provide a kind of two-layer wiring high thermal conductivity aluminum matrix printed circuit board, on the product of the high heat conduction of original individual layer, carry out technological improvement, original individual layer circuit increase is become to double-deck circuit, and will complete double-sided circuit connection, and the adhesion layer of double-deck circuit own also will be realized heat conductive design.The utility model design is as follows:
The high thermal conductivity flexible printed circuit board of two-layer wiring is followed successively by from top to bottom: the 1st layer is protective layer; The 2nd layer is copper foil layer; The 3rd layer is heat conduction glue-line; The 4th layer is copper foil layer; The 5th layer is heat conduction glue-line; The 6th layer is metal reinforcement substrate layer.Wherein, between the 2nd, the 3rd, the 4th layer, to realize double-deck connection moulding by making via.
The high thermal conductivity flexible circuit board of two-layer wiring the utility model proposes, owing to having increased one deck copper foil circuit layer, has been equivalent to increase the wiring area of electronic devices and components, and the wiring quantity that these can the single circuit board electronic devices and components of dilatation, has strengthened circuit board function.Simultaneously due in the middle of double-deck circuit, circuit with all increased one deck heat conduction glue-line with metal reinforcement layer centre, realize good heat conductive design, greatly improve the radiating effect of traditional printed circuit board, when having improved circuit board utilization rate of electrical, also increased the useful life of product.
Brief description of the drawings
Fig. 1 is the folded structure schematic diagram of the utility model.
Numeral and the represented corresponding construction title of letter in figure:
1. protective layer, 2. copper foil layer, 3. heat conduction glue-line, 4. copper foil layer, 5. heat conduction glue-line, 6. metal enhancement layer.
Embodiment
For design, creation characteristic that the present invention is realized, reach object and effect is easy to understand, further set forth the utility model below in conjunction with legend.
As shown in Figure 1, a kind of two-layer wiring flexible circuit board, comprising: protective layer 1, copper foil layer 2, heat conduction glue-line 3, copper foil layer 4, heat conduction glue-line 5, metal reinforcement layer 6.
First in the middle of copper foil layer 2 and copper foil layer 4, add one deck heat conduction glue-line 3 pressing formation double-sided copper-clad substrate.Then need on double-sided copper-clad substrate, process via according to circuit, and via is metallized, finally complete double-deck circuit and make.It is fine copper that Copper Foil is selected material.
Protective layer 1 is by forming at above-mentioned double-sided copper-clad substrate surface printing one deck anti-solder ink.
Metal enhancement layer 6, double-sided copper-clad substrate, heat conduction glue-line 5 are bonded to one through press (pressing soon or pressure transmission) equipment.
More than show and described general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. the high thermal conductivity flexible printed circuit board of two-layer wiring, is characterized in that, comprising:
The high thermal conductivity flexible printed circuit board of two-layer wiring is followed successively by from top to bottom: the 1st layer is protective layer; The 2nd layer is copper foil layer; The 3rd layer is heat conduction glue-line; The 4th layer is copper foil layer; The 5th layer is heat conduction glue-line; The 6th layer is metal reinforcement substrate.
2. according to the high thermal conductivity flexible printed circuit board of a kind of two-layer wiring claimed in claim 1, it is characterized in that: newly-increased one deck copper foil circuit, and two-layer copper foil circuit is realized odt circuit connection by processing via.
3. according to the high thermal conductivity flexible printed circuit board of a kind of two-layer wiring claimed in claim 1, it is characterized in that: newly-increased one deck heat conduction glue-line in the middle of double-deck copper foil circuit, realize heat conductive design between circuit.
4. according to the high thermal conductivity flexible printed circuit board of a kind of two-layer wiring claimed in claim 1, it is characterized in that: newly-increased one deck heat conduction glue-line in the middle of circuit and metal reinforcement substrate, realize the heat conductive design of circuit to metal reinforcement substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420131395.4U CN203748107U (en) | 2014-03-24 | 2014-03-24 | Double-layer wiring high-heat-conducting flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420131395.4U CN203748107U (en) | 2014-03-24 | 2014-03-24 | Double-layer wiring high-heat-conducting flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203748107U true CN203748107U (en) | 2014-07-30 |
Family
ID=51347853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420131395.4U Expired - Lifetime CN203748107U (en) | 2014-03-24 | 2014-03-24 | Double-layer wiring high-heat-conducting flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203748107U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391384A (en) * | 2018-05-02 | 2018-08-10 | 深圳光韵达激光应用技术有限公司 | A kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process |
-
2014
- 2014-03-24 CN CN201420131395.4U patent/CN203748107U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108391384A (en) * | 2018-05-02 | 2018-08-10 | 深圳光韵达激光应用技术有限公司 | A kind of high-thermal conductive metal reinforcing flexible circuit board manufacturing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI WLCP ELECTRICAL SCIENCE + TECHNOLOGY CO., Free format text: FORMER NAME: SHANGHAI WLCP ELECTRICAL SCIENCE + TECHNOLOGY LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 201700 Shanghai city Qingpu New Road No. 1168 Patentee after: SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co.,Ltd. Address before: 201700 Shanghai city Qingpu New Road No. 1168 Patentee before: SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210422 Address after: 314009 room 316, building 1, 70 Yubei street, Yuxin Town, Jiaxing City, Zhejiang Province Patentee after: Jiaxing Wenliang Electronic Technology Co.,Ltd. Address before: 201700 Shanghai city Qingpu New Road No. 1168 Patentee before: SHANGHAI WLCP ELECTRICAL & TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140730 |