CN203896582U - High-efficiency heat radiation type PCB - Google Patents

High-efficiency heat radiation type PCB Download PDF

Info

Publication number
CN203896582U
CN203896582U CN201420279158.2U CN201420279158U CN203896582U CN 203896582 U CN203896582 U CN 203896582U CN 201420279158 U CN201420279158 U CN 201420279158U CN 203896582 U CN203896582 U CN 203896582U
Authority
CN
China
Prior art keywords
substrate
layer
wiring layer
top layer
arranges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420279158.2U
Other languages
Chinese (zh)
Inventor
梁智果
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Ding Feng electronic Polytron Technologies Inc
Original Assignee
JIANGXI DINGFENG ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGXI DINGFENG ELECTRONIC TECHNOLOGY Co Ltd filed Critical JIANGXI DINGFENG ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201420279158.2U priority Critical patent/CN203896582U/en
Application granted granted Critical
Publication of CN203896582U publication Critical patent/CN203896582U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a high-efficiency heat radiation type PCB. The high-efficiency heat radiation type PCB comprises surface layer substrates, intermediate wiring layer substrates, a substrate, a heat conduction insulation glue layer and a dust cover, a plurality of intermediate wiring layer substrates are arranged between the surface layer substrates, one side of each intermediate wiring layer substrate is provided with a power supply layer, the other side is provided with a ground wire layer, two ends of the surface layer substrates and the intermediate wiring layer substrates are provided with positioning holes, the outside of the surface layer substrate is bonded with the substrate, the heat conduction insulation glue layer is arranged between the substrate and the surface layer substrate, the substrate is provided with an opening window, the opening window is provided with components, the outside of the components is provided with the dust cover, and the outer ends of the surface layer substrates and the intermediate wiring layer substrates are provided with fixing bound edges. According to the high-efficiency heat radiation type PCB, in the wiring of a multilayer plate, the power supply layer and the ground wire layer are reasonably arranged to form power supply grids and grounding grids, a power supply and a ground wire are tightly adjacent to each other so that good capacitance coupling can be realized, the inductance can be better controlled, and EMI can be finally controlled.

Description

A kind of high-efficient heat-dissipating pcb board
Technical field
The utility model relates to field of electronic devices, is specially a kind of high-efficient heat-dissipating pcb board.
Background technology
Pcb board claims again printed circuit board (PCB), is the supplier of electronic devices and components electrical connection, its development history of existing more than 100 year, can be divided into single sided board, double sided board and multi-layer sheet according to the circuit number of plies.Nearly all electronic product all comprises pcb board, along with the integrated level of pcb board is more and more higher, components and parts on pcb board are arranged also more and more intensive, power consumption is increasing, area of dissipation deficiency, pcb board components and parts are overheated usually causes component aging, inefficacy, the lost of life, thereby whole aircraft reliability is declined.
Utility model content
The technical problem that the utility model solves is to provide a kind of high-efficient heat-dissipating pcb board, to solve the problem proposing in above-mentioned background technology.
The technical problem that the utility model solves realizes by the following technical solutions: a kind of high-efficient heat-dissipating pcb board, comprise: top layer substrate, middle wiring layer substrate, substrate, heat conductive insulating glue-line, dust cover, between the substrate of described top layer, be provided with some middle wiring layer substrates, middle wiring layer substrate one side is provided with bus plane, opposite side is provided with ground plane, top layer substrate, middle wiring layer substrate two ends are provided with location hole, substrate outside, top layer is bonded with substrate, between substrate and top layer substrate, be provided with heat conductive insulating glue-line, on substrate, arrange and window, the place of windowing carries components and parts, components and parts outside is provided with dust cover, top layer substrate, middle wiring layer substrate outer end is provided with fixing bound edge, in the middle of described, wiring layer substrate comprises: first substrate, second substrate, the 3rd substrate, described first substrate, second substrate, the one side of the 3rd substrate arranges routing layer, the described first to the 3rd substrate is closely pressing successively, wherein, first substrate does not arrange the one side of routing layer and the one side pressing of second substrate, the one side that described first substrate arranges routing layer arranges the first solder mask, the 3rd substrate does not arrange the one side of routing layer and the another side pressing of second substrate, the one side that described the 3rd substrate arranges routing layer arranges the second solder mask, spray tin layer or gilding layer are all set on described the first solder mask, the second solder mask, the first antioxidation coating, the second antioxidation coating are also set on described spray tin layer or gilding layer, on described the first antioxidation coating, the second antioxidation coating, silk-screen layer is all set.
In the middle of described, wiring layer substrate thickness is 10-30mm.
Substrate outside, described top layer is connected in heat abstractor.
Described fixing bound edge surrounding offers fixing hole.
Compared with prior art, the beneficial effects of the utility model are: multi-layer PCB board described in the utility model comprises top layer substrate and the middle wiring layer substrate for carrying components and parts, in the middle of described, in wiring layer substrate, at least comprise one deck ground plane and one deck bus plane, the adjacent setting of described ground plane and bus plane also arranges in pairs, in multiple-plate wiring, bus plane and ground plane reasonably cloth become power grid and earth grid, VDD-to-VSS line is tight adjacently can realize good capacitive coupling, can also control better inductance, finally control EMI well.If in the time that bus plane is horizontal wiring, ground plane preferred vertical wiring.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is board structure schematic diagram of the present utility model.
In figure: 1, top layer substrate, 2, middle wiring layer substrate, 21, bus plane, 22, ground plane, 3, components and parts, 4, substrate, 41, window, 5, heat conductive insulating glue-line, 6, location hole, 7, dust cover, 8, fixing bound edge, 111, first substrate, 112, second substrate, 113, the 3rd substrate, 114, the first solder mask, 115, the second solder mask, 116, the first antioxidation coating, 117, the second antioxidation coating.
Embodiment
In order to make of the present utility modelly to realize technological means, creation characteristic, reach object and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
As Fig. 1, shown in Fig. 2, a kind of high-efficient heat-dissipating pcb board, comprise: top layer substrate 1, middle wiring layer substrate 2, substrate 4, heat conductive insulating glue-line 5, dust cover 7, between described top layer substrate 1, be provided with some middle wiring layer substrates 2, middle wiring layer substrate 2 one sides are provided with bus plane 21, opposite side is provided with ground plane 22, top layer substrate 1, middle wiring layer substrate 2 two ends are provided with location hole 6, substrate 1 outside in top layer is bonded with substrate 4, between substrate 4 and top layer substrate 1, be provided with heat conductive insulating glue-line 5, on substrate 4, arrange and window 41, 41 places of windowing carry components and parts 3, components and parts 3 outsides are provided with dust cover 7, top layer substrate 1, middle wiring layer substrate 2 outer ends are provided with fixing bound edge 8, in the middle of described, wiring layer substrate 2 comprises: first substrate 111, second substrate 112, the 3rd substrate 113, described first substrate 111, second substrate 112, the one side of the 3rd substrate 113 arranges routing layer, the described first to the 3rd substrate is closely pressing successively, wherein, first substrate 111 does not arrange the one side of routing layer and the one side pressing of second substrate 112, the one side that described first substrate 111 arranges routing layer arranges the first solder mask 114, the 3rd substrate 113 does not arrange the one side of routing layer and the another side pressing of second substrate 112, the one side that described the 3rd substrate 113 arranges routing layer arranges the second solder mask 115, spray tin layer or gilding layer are all set on described the first solder mask 114, the second solder mask 115, the first antioxidation coating 116, the second antioxidation coating 117 are also set on described spray tin layer or gilding layer, on described the first antioxidation coating 116, the second antioxidation coating 117, silk-screen layer are all set.
In the middle of described, wiring layer substrate 2 thickness are 10-30mm.
Substrate 1 outside, described top layer is connected in heat abstractor.
Described fixing bound edge 8 surroundings offer fixing hole.
Multi-layer PCB board described in the utility model comprises top layer substrate 1 and the middle wiring layer substrate 2 for carrying components and parts 3, in the middle of described, in wiring layer substrate 2, at least comprise one deck ground plane 22 and one deck bus plane 21, the setting adjacent with bus plane 21 of described ground plane 22 also arranges in pairs, in multiple-plate wiring, bus plane 21 and ground plane 22 reasonably cloth become power grid and earth grid, bus plane 21 and ground plane 22 are tight adjacently can realize good capacitive coupling, can also control better inductance, finally control EMI well.If in the time that bus plane is horizontal wiring, ground plane preferred vertical wiring.
In addition, substrate 1 outside, described top layer is also bonded with layer of copper substrate 4, the thickness of described copper base 4 is 100 μ m~120 μ m, the radiating effect of copper base 4 is all got well doubly a lot than aluminium base and iron substrate, current capacity is very large, can improve product power density and reliability, extend the useful life of product, be applicable to the heat radiation that high-frequency circuit and high low temperature change regional and accurate communication equipment greatly, copper base 4 thickness are thicker, not only can ensure efficient radiating effect, can also obtain better mechanical durability.
In the utility model, because PCB is in the process of gold-plated, turmeric, because gold layer is very thin, gold layer is too thin, in crystallization process, is not just very fine and close, leaves many micropores, and these micropores just become later corrosion initial point.Cause its bottom corrosion, to the eye, just there is oxidation stain in gold, antioxidation coating is mainly by antioxidant, scaling powder is effectively combined into anti-oxidation working solution, anti-oxidation working solution is penetrated in the gap on metal ion surface, very thin, then the anti-oxidation working solution on wash clean PCB surface, dry surperficial moisture, anti-oxidation liquid forms the uniform diaphragm of one deck between metal ion space, can effectively completely cut off the oxygen of occurring in nature, thereby effectively prevent burning variable color, advantage is that anti-oxidization time is lasting, cost is low, bright in color, to electric conductivity, welding performance, upper tin performance does not all affect.
More than show and described general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.Claimed scope of the present utility model is defined by appending claims and equivalent thereof.

Claims (4)

1. a high-efficient heat-dissipating pcb board, comprise: top layer substrate, middle wiring layer substrate, substrate, heat conductive insulating glue-line, dust cover, it is characterized in that: between the substrate of described top layer, be provided with some middle wiring layer substrates, middle wiring layer substrate one side is provided with bus plane, opposite side is provided with ground plane, top layer substrate, middle wiring layer substrate two ends are provided with location hole, substrate outside, top layer is bonded with substrate, between substrate and top layer substrate, be provided with heat conductive insulating glue-line, on substrate, arrange and window, the place of windowing carries components and parts, components and parts outside is provided with dust cover, top layer substrate, middle wiring layer substrate outer end is provided with fixing bound edge, in the middle of described, wiring layer substrate comprises: first substrate, second substrate, the 3rd substrate, described first substrate, second substrate, the one side of the 3rd substrate arranges routing layer, the described first to the 3rd substrate is closely pressing successively, wherein, first substrate does not arrange the one side of routing layer and the one side pressing of second substrate, the one side that described first substrate arranges routing layer arranges the first solder mask, the 3rd substrate does not arrange the one side of routing layer and the another side pressing of second substrate, the one side that described the 3rd substrate arranges routing layer arranges the second solder mask, spray tin layer or gilding layer are all set on described the first solder mask, the second solder mask, the first antioxidation coating, the second antioxidation coating are also set on described spray tin layer or gilding layer, on described the first antioxidation coating, the second antioxidation coating, silk-screen layer is all set.
2. a kind of high-efficient heat-dissipating pcb board according to claim 1, is characterized in that: in the middle of described, wiring layer substrate thickness is 10-30mm.
3. a kind of high-efficient heat-dissipating pcb board according to claim 1, is characterized in that: substrate outside in described top layer is connected in heat abstractor.
4. a kind of high-efficient heat-dissipating pcb board according to claim 1, is characterized in that: described fixing bound edge surrounding offers fixing hole.
CN201420279158.2U 2014-05-29 2014-05-29 High-efficiency heat radiation type PCB Expired - Fee Related CN203896582U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420279158.2U CN203896582U (en) 2014-05-29 2014-05-29 High-efficiency heat radiation type PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420279158.2U CN203896582U (en) 2014-05-29 2014-05-29 High-efficiency heat radiation type PCB

Publications (1)

Publication Number Publication Date
CN203896582U true CN203896582U (en) 2014-10-22

Family

ID=51722928

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420279158.2U Expired - Fee Related CN203896582U (en) 2014-05-29 2014-05-29 High-efficiency heat radiation type PCB

Country Status (1)

Country Link
CN (1) CN203896582U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107484329A (en) * 2017-09-19 2017-12-15 滁州博杰科技有限公司 A kind of electronic component built-in substrate
CN107851621A (en) * 2015-07-20 2018-03-27 3M创新有限公司 Radiator structure and forming method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107851621A (en) * 2015-07-20 2018-03-27 3M创新有限公司 Radiator structure and forming method thereof
CN107484329A (en) * 2017-09-19 2017-12-15 滁州博杰科技有限公司 A kind of electronic component built-in substrate

Similar Documents

Publication Publication Date Title
CN203457035U (en) Module power supply
CN203748105U (en) Double-face circuit board
CN203896582U (en) High-efficiency heat radiation type PCB
CN204497951U (en) A kind of small power module power source
CN203482489U (en) Multilayer printed circuit board (PCB)
CN202178915U (en) Blind hole double-face heat conducting circuit board
CN203775526U (en) Pcb capacitor module
CN203942694U (en) A kind of anticorrosion pcb board
CN103415153A (en) Steel disc ground production method of FPC silver paste pouring hole
CN203574941U (en) Electronic energy-saving circuit board
CN206365156U (en) A kind of printed circuit board (PCB) for being easy to surface mount elements wiring
CN205051965U (en) Compound heat conduction circuit board
CN204721709U (en) A kind of double-sided ceramic circuit board
CN203912334U (en) Collapsible-type double-layer printed circuit board
CN203631462U (en) Patch type resettable fuse structure
CN204733462U (en) A kind of circuit board based on ceramic material
CN203912335U (en) Printed circuit board
KR102279152B1 (en) Interposer for wiring and electric module having the same
CN203896583U (en) New dustproof PCB
CN205755031U (en) A kind of high-efficient heat-dissipating pcb board
CN209170722U (en) A kind of pcb board that safety and reliability is high
CN204291566U (en) The pressing circuit board of a kind of aluminium base and two-sided FR4 plate
CN203057687U (en) Anti-oxidation PCB
CN203872425U (en) Printed circuit board
CN202475938U (en) Printed circuit board with palladium coating

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: High-efficiency heat radiation type PCB

Effective date of registration: 20151009

Granted publication date: 20141022

Pledgee: Jiangxi science and technology Company Limited by Guarantee

Pledgor: JIANGXI DINGFENG ELECTRONIC TECHNOLOGY CO., LTD.

Registration number: 2015360000001

PLDC Enforcement, change and cancellation of contracts on pledge of patent right or utility model
CP03 Change of name, title or address

Address after: 336000, Yichun City, Jiangxi province high security industrial park, the north end of long avenue

Patentee after: Jiangxi Ding Feng electronic Polytron Technologies Inc

Address before: 330000, Yichun City, Jiangxi province high security industrial park, the north end of long avenue

Patentee before: JIANGXI DINGFENG ELECTRONIC TECHNOLOGY CO., LTD.

CP03 Change of name, title or address
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141022

Termination date: 20180529

CF01 Termination of patent right due to non-payment of annual fee