CN202475938U - Printed circuit board with palladium coating - Google Patents

Printed circuit board with palladium coating Download PDF

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Publication number
CN202475938U
CN202475938U CN2012201042281U CN201220104228U CN202475938U CN 202475938 U CN202475938 U CN 202475938U CN 2012201042281 U CN2012201042281 U CN 2012201042281U CN 201220104228 U CN201220104228 U CN 201220104228U CN 202475938 U CN202475938 U CN 202475938U
Authority
CN
China
Prior art keywords
palladium coating
circuit board
printed circuit
part layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012201042281U
Other languages
Chinese (zh)
Inventor
吴道新
肖忠良
许国军
刘迎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changsha University of Science and Technology
Original Assignee
Changsha University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changsha University of Science and Technology filed Critical Changsha University of Science and Technology
Priority to CN2012201042281U priority Critical patent/CN202475938U/en
Application granted granted Critical
Publication of CN202475938U publication Critical patent/CN202475938U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a printed circuit board with a palladium coating. The printed circuit board comprises a part layer, a power supply layer and a base material, wherein the part layer, the power supply layer and the base material are sequentially ranked from top to bottom; the part layer and the power supply layer are provided with conducting holes which are conducted mutually; the surfaces of the part layer and the power supply layer are both coated with the palladium coating, and the thickness of the palladium coating is 0.5-1.5 mu m. According to the utility model, the surfaces of the part layer and the power supply layer are both coated with the palladium coating, and the corrosion-resistant property, the welding material joint property and the lead welding property of the base metal material are improved greatly.

Description

A kind of printed circuit board (PCB) with palladium coating
Technical field
The utility model relates to a kind of circuit board, is specifically related to a kind of printed circuit board (PCB) with palladium coating.
Background technology
Printed circuit board is to be base material with the insulation board; Be cut into certain size, have conductive pattern and cloth porose (like component hole, fastener hole, plated-through hole etc.) on it at least; Be used for replacing installing the chassis of electronic devices and components in the past, and realize interconnecting between the electronic devices and components.Because this plate is to adopt electron printing to make, so be called as " printing " circuit board.It is the important electron parts, is the supporter of electronic devices and components.
But present printed circuit board (PCB) non-oxidizability is poor, and simultaneously, corrosion resistance, solder bonds property, wire bonds property are all not ideal enough, therefore awaits further improving.
The utility model content
The technical problem that the utility model solved is to provide a kind of printed circuit board (PCB) with palladium coating, and it has good corrosion resistance, thereby solves the problem in the above-mentioned background technology.
The technical problem that the utility model solved adopts following technical scheme to realize:
A kind of printed circuit board (PCB) with palladium coating; Comprise part layer, bus plane and base material; Said part layer, base material and bus plane are arranged from top to down in regular turn; Part layer and bus plane are provided with the via of mutual conduction, it is characterized in that, the surface of said part layer and bus plane is coated with the palladium coating.
As a kind of improvement, the thickness of said palladium coating is 0.5~1.5 μ m.
In the utility model, said part layer is a kind of signal lead layer, is used for disposing the Copper Foil lead that couples operating assembly on the printed circuit board (PCB), and said base material is a dielectric layer, is used for keeping the insulating properties between part layer and the bus plane; Bus plane is large-area Copper Foil conductive plate.
Owing to adopted above structure, the utlity model has following beneficial effect:
The printed circuit board (PCB) that the utility model provides; Be coated with the palladium coating on the surface of part layer and bus plane; The palladium coating has superior antioxygenic property, stable performance in hot and humid atmosphere, has therefore improved corrosion resistance, solder bonds property, the wire bonds property of base metal material greatly.
The printed circuit board (PCB) with palladium coating that the utility model provides, the thickness of palladium coating are 0.5~1.5 μ m, and the palladium coating is not prone to the crack under this thickness in coating procedure.
Description of drawings
Fig. 1 is the utility model structural representation;
Among the figure: 1. part layer, 2. bus plane, 3. base material, 4. via, 5. palladium coating.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand understanding with effect, below in conjunction with concrete diagram, further set forth the utility model.
Referring to Fig. 1; A kind of printed circuit board (PCB) with palladium coating; Comprise part layer 1, bus plane 2 and base material 3, said part layer 1, base material 3 and bus plane 2 are arranged from top to down in regular turn, and part layer 1 and bus plane 2 are provided with the via 4 of mutual conduction; It is characterized in that the surface of said part layer 1 and bus plane 2 is coated with palladium coating 5.
In the present embodiment, the thickness of said palladium coating 5 is 1.3 μ m, and the palladium coating 5 under this thickness is not prone to the crack, is beneficial to the corrosion resistance, solder bonds property, the wire bonds property that improve the base metal material.
In the utility model, said part layer 1 is a kind of signal lead layer, is used for disposing the Copper Foil lead that couples operating assembly on the printed circuit board (PCB), and said base material 3 is a dielectric layer, is used for keeping the insulating properties between part layer 1 and the bus plane 2; Bus plane 2 is large-area Copper Foil conductive plate.
More than show and described basic principle of the utility model and the advantage of principal character and the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The principle of describing in the foregoing description and the specification that the utility model just is described; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection range to be defined by appending claims and equivalent thereof.

Claims (2)

1. printed circuit board (PCB) with palladium coating; Comprise part layer, bus plane and base material; Said part layer, base material and bus plane are arranged from top to down in regular turn; Part layer and bus plane are provided with the via of mutual conduction, it is characterized in that: the surface of said part layer and bus plane is coated with the palladium coating.
2. a kind of printed circuit board (PCB) with palladium coating according to claim 1 is characterized in that: the thickness of said palladium coating is 0.5~1.5 μ m.
CN2012201042281U 2012-03-20 2012-03-20 Printed circuit board with palladium coating Expired - Fee Related CN202475938U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012201042281U CN202475938U (en) 2012-03-20 2012-03-20 Printed circuit board with palladium coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012201042281U CN202475938U (en) 2012-03-20 2012-03-20 Printed circuit board with palladium coating

Publications (1)

Publication Number Publication Date
CN202475938U true CN202475938U (en) 2012-10-03

Family

ID=46924057

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012201042281U Expired - Fee Related CN202475938U (en) 2012-03-20 2012-03-20 Printed circuit board with palladium coating

Country Status (1)

Country Link
CN (1) CN202475938U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121003

Termination date: 20140320