CN206575660U - A kind of printed wiring board for improving radiating effect - Google Patents
A kind of printed wiring board for improving radiating effect Download PDFInfo
- Publication number
- CN206575660U CN206575660U CN201720138309.6U CN201720138309U CN206575660U CN 206575660 U CN206575660 U CN 206575660U CN 201720138309 U CN201720138309 U CN 201720138309U CN 206575660 U CN206575660 U CN 206575660U
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- CN
- China
- Prior art keywords
- electrolytic copper
- copper foil
- insulating barrier
- printed wiring
- radiating effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a kind of printed wiring board for improving radiating effect, including electroplate and electrolytic copper foil, the lower surface of the electroplate is installed with buffer board, pressing plate is additionally provided with the lower surface of buffer board, the lower surface of the pressing plate is also installed with electrolytic copper foil, the inner surface of the electrolytic copper foil is also installed with outer layer prepreg, the inner surface of the outer layer prepreg is also inlaid with internal layer prepreg, the electrolytic copper foil lower surface is also installed with insulating barrier, and it is installed with metal substrate in the lower surface of insulating barrier, the outer surface of the metal substrate is additionally provided with thermal interfacial material, the outer surface of the thermal interfacial material is also installed with heat sink, the heat derives for being produced whole device using metallic conductor, and disturbed using insulating barrier isolation external circuitry, so that placement-and-routing's effect of component is more preferable, extend the service life of circuit board.
Description
Technical field
The utility model is related to printed wiring board technical field, specially a kind of printed wiring for improving radiating effect
Plate.
Background technology
Printed substrate just tends to multiple stratification, path of perforating, distribution fine and closely wovenization, and this is with regard to the hot swollen of corresponding requirements copper-clad plate
Swollen coefficients comparison is small, and relative dielectric constant is low (2.5~4.0), and mouldability is excellent, and hair is difficult under high temperature, high humidity and high voltage
Raw insulation ag(e)ing (copper migration), current circuit board printing sets the number of plies relatively more, although with layered device, but majority is electric
The design or single layer designs of road plate, the spacing of pin are smaller, moreover, during the use of circuit board, in current loop
Heat can be produced so that whole device radiating is slow, the ratio of component's feet aging at high temperature under high pressure is very fast so that equipment
Service life it is shorter, and the wasting of resources is than more serious.
Utility model content
For problem above, the utility model provides a kind of printed wiring board for improving radiating effect, in cathode copper
Paper tinsel is internally provided with heat sink, the heat derives for being produced whole device using metallic conductor, and is completely cut off using insulating barrier
External circuitry is disturbed so that placement-and-routing's effect of component more preferably, will also be connected to circuit board using inside and outside layer prepreg
The heat that internal device pin is produced disperses away, the temperature in reduction circuit board so that the service life extension of circuit board,
The problem of effectively can solving in background technology.
To achieve the above object, the utility model provides following technical scheme：A kind of track for improving radiating effect
Road plate, including electroplate and electrolytic copper foil, the lower surface of the electroplate are installed with buffer board, in the lower surface of buffer board
Pressing plate is additionally provided with, the lower surface of the pressing plate is also installed with electrolytic copper foil, and the inner surface of the electrolytic copper foil is also fixed
Outer layer prepreg is installed, the inner surface of the outer layer prepreg is also inlaid with internal layer prepreg, the electrolytic copper foil
Lower surface is also installed with insulating barrier, and is installed with metal substrate in the lower surface of insulating barrier, the metal substrate
Outer surface is additionally provided with thermal interfacial material, and the outer surface of the thermal interfacial material is also installed with heat sink.
As a kind of preferred technical scheme of the utility model, the front of the insulating barrier is also installed with solder layer,
Copper hole is additionally provided with the upper surface of solder layer.
As a kind of preferred technical scheme of the utility model, the surrounding of the electroplate is also installed with multiple thermal conductivities
Pcb board, and multiple thermal conductivity pcb boards are symmetrically distributed on the surface of electroplate.
As a kind of preferred technical scheme of the utility model, the quantity of the electrolytic copper foil is four, and four electrolysis
Copper foil is respectively and fixedly installed to the two ends of insulating barrier outer wall.
Compared with prior art, the beneficial effects of the utility model are：This can improve the printed wiring board of radiating effect,
Electrolytic copper foil is internally provided with heat sink, the heat derives that are produced whole device using metallic conductor, and uses insulation
Layer isolation external circuitry interference so that placement-and-routing's effect of component more preferably, will be also connected to using inside and outside layer prepreg
The heat that device pin inside circuit board is produced disperses away, the temperature in reduction circuit board so that the use longevity of circuit board
Life extension.
Brief description of the drawings
Fig. 1 is the utility model structural representation；
Fig. 2 is the utility model electrolytic copper foil cross-sectional view.
In figure：1- electroplates；2- thermal conductivity pcb boards；3- buffer boards；4- pressing plates；5- electrolytic copper foils；6- outer layer prepregs；
7- internal layer prepregs；8- insulating barriers；9- metal substrates；10- thermal interfacial materials；11- heat sinks；12- solder layers；13- copper hole.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Embodiment：
Fig. 1 and Fig. 2 are referred to, the utility model provides a kind of technical scheme：A kind of track for improving radiating effect
Road plate, including electroplate 1 and electrolytic copper foil 5, the lower surface of the electroplate 1 are installed with buffer board 3, the four of electroplate 1
Week is also installed with multiple thermal conductivity pcb boards 2, and multiple thermal conductivity pcb boards 2 are symmetrically distributed on the surface of electroplate 1, slow
The lower surface of punching 3 is additionally provided with pressing plate 4, reduces the vibration force in component welding process using buffer board 3, improves circuit
The service life on printed line road, and the layout of circuit is also planned using pressing plate 4 so that the wiring of whole device is compacter, described
The lower surface of pressing plate 4 is also installed with electrolytic copper foil 5, and the quantity of electrolytic copper foil 5 is four, and four electrolytic copper foils 5 are distinguished
The two ends of the outer wall of insulating barrier 8 are fixedly mounted on, the inner surface of the electrolytic copper foil 5 is also installed with outer layer prepreg 6, institute
The inner surface for stating outer layer prepreg 6 is also inlaid with internal layer prepreg 7, and the lower surface of electrolytic copper foil 5 is also installed with
Insulating barrier 8, the front of insulating barrier 8 is also installed with solder layer 12, and copper hole 13 is additionally provided with the upper surface of solder layer 12, and
Metal substrate 9 is installed with the lower surface of insulating barrier 8, the outer surface of the metal substrate 9 is additionally provided with thermal interfacial material
10, the outer surface of the thermal interfacial material 10 is also installed with heat sink 11, is reduced using heat sink 11 inside wiring board
Temperature so that temperature extends the service life of component than relatively low.
Operation principle of the present utility model：This can improve the printed wiring board of radiating effect, be set in the inside of electrolytic copper foil 5
Heat sink 11 is equipped with, the heat derives for being produced whole device using metallic conductor, and completely cut off external circuitry using insulating barrier 8
Interference so that placement-and-routing's effect of component more preferably, will be also connected to inside circuit board using inside and outside layer prepreg 7
The heat that device pin is produced disperses away, the temperature in reduction circuit board so that the service life extension of circuit board.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Any modifications, equivalent substitutions and improvements made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (4)
1. a kind of printed wiring board for improving radiating effect, it is characterised in that：Including electroplate (1) and electrolytic copper foil (5), institute
The lower surface for stating electroplate (1) is installed with buffer board (3), and pressing plate (4), institute are additionally provided with the lower surface of buffer board (3)
The lower surface for stating pressing plate (4) is also installed with electrolytic copper foil (5), and the inner surface of the electrolytic copper foil (5) is also installed with
Outer layer prepreg (6), the inner surface of the outer layer prepreg (6) is also inlaid with internal layer prepreg (7), the cathode copper
Paper tinsel (5) lower surface is also installed with insulating barrier (8), and is installed with metal substrate (9) in the lower surface of insulating barrier (8),
The outer surface of the metal substrate (9) is additionally provided with thermal interfacial material (10), and the outer surface of the thermal interfacial material (10) is also solid
Dingan County is equipped with heat sink (11).
2. a kind of printed wiring board for improving radiating effect according to claim 1, it is characterised in that：The insulating barrier
(8) front is also installed with solder layer (12), and copper hole (13) is additionally provided with the upper surface of solder layer (12).
3. a kind of printed wiring board for improving radiating effect according to claim 1, it is characterised in that：The electroplate
(1) surrounding is also installed with multiple thermal conductivity pcb boards (2), and multiple thermal conductivity pcb boards (2) are symmetrically distributed in electroplate (1)
Surface on.
4. a kind of printed wiring board for improving radiating effect according to claim 1, it is characterised in that：The cathode copper
The quantity of paper tinsel (5) is four, and four electrolytic copper foils (5) are respectively and fixedly installed to the two ends of insulating barrier (8) outer wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720138309.6U CN206575660U (en) | 2017-02-16 | 2017-02-16 | A kind of printed wiring board for improving radiating effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720138309.6U CN206575660U (en) | 2017-02-16 | 2017-02-16 | A kind of printed wiring board for improving radiating effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206575660U true CN206575660U (en) | 2017-10-20 |
Family
ID=60058936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720138309.6U Active CN206575660U (en) | 2017-02-16 | 2017-02-16 | A kind of printed wiring board for improving radiating effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206575660U (en) |
-
2017
- 2017-02-16 CN CN201720138309.6U patent/CN206575660U/en active Active
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