CN207491319U - A kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate - Google Patents
A kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate Download PDFInfo
- Publication number
- CN207491319U CN207491319U CN201721366807.2U CN201721366807U CN207491319U CN 207491319 U CN207491319 U CN 207491319U CN 201721366807 U CN201721366807 U CN 201721366807U CN 207491319 U CN207491319 U CN 207491319U
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- China
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- veneer
- layer
- rigid insulation
- layer veneer
- outer layer
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Abstract
The utility model is related to a kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrates, and including an internal layer veneer, outer layer veneer is provided on the upside of internal layer veneer, and lower outer layer veneer is provided on the downside of internal layer veneer；The first rigid insulation layer is equipped between internal layer veneer and upper outer layer veneer, both sides are equipped with the first copper post protrusion to the first rigid insulation layer up and down, and adhesive layer on second is equipped between the first rigid insulation layer and internal layer veneer；The second rigid insulation layer is equipped between internal layer veneer and lower outer layer veneer, both sides are equipped with the second copper post protrusion to the second rigid insulation layer up and down, first time adhesive layer is equipped between second rigid insulation layer and internal layer veneer, second time adhesive layer is equipped between the second rigid insulation layer and lower outer layer veneer；An at least thermal vias is equipped between upper outer layer veneer, the first rigid insulation layer, internal layer veneer, the second rigid insulation layer and lower outer layer veneer, radiating piece is equipped in thermal vias.
Description
Technical field
The utility model belongs to field of circuit boards, and in particular to a kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate.
Background technology
With being constantly progressive for Electronic Design and manufacturing process, electronic product is also gradually to multifunction, densification
And the trend development of high transfer rate.It is since the rapid development of chip miniaturization, data transmission quantity increase again simultaneously
Working frequency of uniting is also higher and higher.
But with the influence of this market environment,
In consideration of it, propose a kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate.
Utility model content
The defects of to solve the prior art, the utility model provide a kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate, packet
An internal layer veneer is included, the upper outer layer veneer that a size, shape and internal layer veneer match is provided on the upside of internal layer veneer,
The lower outer layer veneer that a size, shape and internal layer veneer match is provided on the downside of internal layer veneer；
It is exhausted that the first hard that size, shape and internal layer veneer match is equipped between the internal layer veneer and upper outer layer veneer
Both sides are equipped with the first copper post protrusion up and down for edge layer, the first rigid insulation layer inner hollow, and the first rigid insulation layer, this first
Copper post protrusion upper end is connect with upper outer layer veneer, and lower end is connect with internal layer veneer, the first rigid insulation layer and upper outer layer list
Adhesive layer on first is equipped between plate, adhesive layer on second is equipped between the first rigid insulation layer and internal layer veneer；It is described
The second rigid insulation layer that size, shape and internal layer veneer match is equipped between internal layer veneer and lower outer layer veneer, this second
Rigid insulation layer inner hollow, and both sides are raised equipped with the second copper post up and down for the second rigid insulation layer, in the second copper post protrusion
End is connect with internal layer veneer, and lower end is connect with lower outer layer veneer, equipped with the between the second rigid insulation layer and internal layer veneer
Adhesive layer once is equipped with second time adhesive layer between the second rigid insulation layer and lower outer layer veneer；
The upper outer layer veneer, the first rigid insulation layer, internal layer veneer, the second rigid insulation layer and lower outer layer veneer it
Between be equipped with an at least thermal vias, which is through to the lower surface of lower outer layer veneer by the upper surface of upper outer layer veneer,
And radiating piece is equipped in thermal vias.
Further, first copper post is hollow structure, filled with heat dissipation in the hollow structure inside of the first copper post
Silica gel.
Further, second copper post is hollow structure, filled with heat dissipation in the hollow structure inside of the second copper post
Silica gel.
Further, the upper surface of the upper outer layer veneer has one layer of upper adhesive sheet, and adhesive sheet uper side surface covers on this
There is one layer of upper copper foil.
Further, the upper surface of the lower outer layer veneer has one layer of lower adhesive sheet, which covers
There is one layer of lower copper foil.
Further, the number of plies of the upper adhesive sheet is two layers, and the number of plies of the lower adhesive sheet is two layers.
Advantageous effect：The utility model good reliability, thermal conductivity are high, insulating properties is good, heat resistance is strong, and can effectively keep away
Exempt from its brittle break.
Description of the drawings
Attached drawing 1 is compound basic structure diagram in this implementation；
Attached drawing 2 is compound basic structure diagram in this implementation.
Specific embodiment
Embodiment：A kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate
Such as Fig. 1, including an internal layer veneer 1, a size, shape and internal layer veneer phase are provided in the upside of internal layer veneer 1
Matched upper outer layer veneer 2 is provided with the lower outer layer that a size, shape and internal layer veneer 1 match in 1 downside of internal layer veneer
Veneer 3.
Be equipped with that size, shape and internal layer veneer 1 match between the internal layer veneer 1 and upper outer layer veneer 2 first is hard
Matter insulating layer 4,4 inner hollow of the first rigid insulation layer, and the first rigid insulation layer are equipped with the first copper post protrusion in both sides about 4
40, first copper post protrusion, 40 upper ends are connect with upper outer layer veneer 2, and lower end is connect with internal layer veneer 1, first rigid insulation
Adhesive layer 6 on first is equipped between layer 4 and upper outer layer veneer 2, is equipped between the first rigid insulation layer 4 and internal layer veneer 1
Adhesive layer 7 on second.
The second hard that size, shape and internal layer veneer match is equipped between the internal layer veneer 1 and lower outer layer veneer 3
Insulating layer 5,5 inner hollow of the second rigid insulation layer, and the second rigid insulation layer are equipped with the second copper post protrusion in both sides about 5
50, second copper post protrusion, 50 upper ends are connect with internal layer veneer 1, and lower end is connect with lower outer layer veneer 3, second rigid insulation
First time adhesive layer 8 is equipped between layer 5 and internal layer veneer 1, is equipped between the second rigid insulation layer 5 and lower outer layer veneer 3
Second time adhesive layer 9.
The upper outer layer veneer 2, the first rigid insulation layer 4, internal layer veneer 1, the second rigid insulation layer 5 and lower outer layer list
An at least thermal vias is equipped between plate 3, which is through to by the upper surface of upper outer layer veneer under lower outer layer veneer
Surface, and radiating piece 10 is equipped in thermal vias.
Wherein, first copper post 40 is hollow structure, filled with heat dissipation in the hollow structure inside of the first copper post 40
Silica gel.Second copper post 50 is hollow structure, and thermal grease is filled in the hollow structure inside of the second copper post 50.
Referring to attached drawing 2, the upper surface of the upper outer layer veneer 2 has one layer of upper adhesive sheet 20,20 upside of adhesive sheet on this
Surface is covered with one layer of upper copper foil 21.The upper surface of the lower outer layer veneer 3 has one layer of lower adhesive sheet 30, under the lower adhesive sheet 30
Side surface is covered with one layer of lower copper foil 31.Specifically, the number of plies of the upper adhesive sheet 20 is two layers, the number of plies of the lower adhesive sheet 30
It is two layers.
The utility model is described in detail above, it is described above, only the preferred embodiment of the utility model and
, it is when the utility model practical range cannot be limited, i.e., all to make equivalent changes and modifications according to the application range, it all should still belong to this
In utility model covering scope.
Claims (6)
1. including an internal layer veneer, one is provided on the upside of internal layer veneer for a kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate
The upper outer layer veneer that size, shape and internal layer veneer match, is provided with a size, shape and internal layer on the downside of internal layer veneer
The lower outer layer veneer that veneer matches；
It is characterized in that：That size, shape and internal layer veneer match is equipped between the internal layer veneer and upper outer layer veneer
Both sides are convex equipped with the first copper post up and down for one rigid insulation layer, the first rigid insulation layer inner hollow, and the first rigid insulation layer
Rise, which connect with upper outer layer veneer, and lower end is connect with internal layer veneer, the first rigid insulation layer and
Adhesive layer on first is equipped between upper outer layer veneer, is equipped on second and bonds between the first rigid insulation layer and internal layer veneer
Layer；The second rigid insulation layer that size, shape and internal layer veneer match is equipped between the internal layer veneer and lower outer layer veneer,
The second rigid insulation layer inner hollow, and both sides are equipped with the second copper post protrusion, second copper post to the second rigid insulation layer up and down
Raised upper end is connect with internal layer veneer, and lower end is connect with lower outer layer veneer, between the second rigid insulation layer and internal layer veneer
Equipped with first time adhesive layer, second time adhesive layer is equipped between the second rigid insulation layer and lower outer layer veneer；
It is set between the upper outer layer veneer, the first rigid insulation layer, internal layer veneer, the second rigid insulation layer and lower outer layer veneer
There is an at least thermal vias, which is through to the lower surface of lower outer layer veneer by the upper surface of upper outer layer veneer, and is dissipated
Radiating piece is equipped in heat through-hole.
2. polytetrafluoroethylene (PTFE) microwave-medium composite substrate according to claim 1, it is characterised in that：First copper post is
Hollow structure is filled with thermal grease in the hollow structure inside of the first copper post.
3. polytetrafluoroethylene (PTFE) microwave-medium composite substrate according to claim 2, it is characterised in that：Second copper post is
Hollow structure is filled with thermal grease in the hollow structure inside of the second copper post.
4. polytetrafluoroethylene (PTFE) microwave-medium composite substrate according to claim 3, it is characterised in that：The upper outer layer veneer
Upper surface there is one layer of upper adhesive sheet, adhesive sheet uper side surface is covered with one layer of upper copper foil on this.
5. the polytetrafluoroethylene (PTFE) microwave-medium composite substrate according to claim 1 or 4, it is characterised in that：The lower outer layer
The upper surface of veneer has one layer of lower adhesive sheet, which is covered with one layer of lower copper foil.
6. polytetrafluoroethylene (PTFE) microwave-medium composite substrate according to claim 5, it is characterised in that：The upper adhesive sheet
The number of plies is two layers, and the number of plies of the lower adhesive sheet is two layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721366807.2U CN207491319U (en) | 2017-10-20 | 2017-10-20 | A kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721366807.2U CN207491319U (en) | 2017-10-20 | 2017-10-20 | A kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207491319U true CN207491319U (en) | 2018-06-12 |
Family
ID=62481020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721366807.2U Expired - Fee Related CN207491319U (en) | 2017-10-20 | 2017-10-20 | A kind of polytetrafluoroethylene (PTFE) microwave-medium composite substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207491319U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117156661A (en) * | 2023-10-30 | 2023-12-01 | 四川龙裕天凌电子科技有限公司 | High-frequency microwave printed circuit board and processing and manufacturing method thereof |
-
2017
- 2017-10-20 CN CN201721366807.2U patent/CN207491319U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117156661A (en) * | 2023-10-30 | 2023-12-01 | 四川龙裕天凌电子科技有限公司 | High-frequency microwave printed circuit board and processing and manufacturing method thereof |
| CN117156661B (en) * | 2023-10-30 | 2024-02-02 | 四川龙裕天凌电子科技有限公司 | High-frequency microwave printed circuit board and processing and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180612 Termination date: 20181020 |