CN207869487U - A kind of three sandwich circuit boards of warpage preventing - Google Patents
A kind of three sandwich circuit boards of warpage preventing Download PDFInfo
- Publication number
- CN207869487U CN207869487U CN201721859257.8U CN201721859257U CN207869487U CN 207869487 U CN207869487 U CN 207869487U CN 201721859257 U CN201721859257 U CN 201721859257U CN 207869487 U CN207869487 U CN 207869487U
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- Prior art keywords
- sandwich circuit
- circuit board
- sandwich
- warpage preventing
- copper
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Abstract
The utility model discloses a kind of three sandwich circuit boards of warpage preventing, including the first sandwich circuit board, the bottom of first sandwich circuit board is equipped with the second sandwich circuit board, second sandwich circuit board is closely connect by hot pressing with first sandwich circuit board, the bottom of second sandwich circuit board is equipped with third sandwich circuit board, and the third sandwich circuit board is closely connect also by hot pressing with second sandwich circuit board, the third sandwich circuit board is by upper layers of copper, incomplete insulating layer and lower layers of copper composition, the bottom of the third sandwich circuit board is equipped with feet, the feet is closely welded with the third sandwich circuit board, the top insertion of first sandwich circuit board is provided with IGBT field-effect tube and heat sink strip, and the surface of first sandwich circuit board is equipped with recess portion, so three sandwich circuit boards of this kind of warpage preventing have a wide range of applications.
Description
Technical field
The utility model is related to wiring board technology field, three sandwich circuit boards of specially a kind of warpage preventing.
Background technology
At present in the industry multi-layer board mainly based on even number multi-layer board, such as four, six, laminate, however still have part end
It brings out in product function, the cost the considerations of, by PCB design at odd number plate, such as three ply board.
The common mechanism of three ply board is copper foil, prepreg, core plate composition.Although such template is with being pair in this structure
Claim structure, but since in pressing, unilateral prepreg will produce contractility in cure stage, and the contractility of core layer
It is relatively small, so after three ply board pressing, it may appear that warpage issues, part demanding terminal three ply board depth of camber is less than hundred at present
/ zero the Seventh Five-Year Plan, two cannot be satisfied the requirement of angularity using normal production technology.
So how to design a kind of three sandwich circuit boards of warpage preventing, becoming us will currently solve the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of three sandwich circuit boards of warpage preventing, to solve to carry in above-mentioned background technology
The problem of going out.
To achieve the above object, the utility model provides the following technical solutions：A kind of three sandwich circuit boards of warpage preventing, including
First sandwich circuit board, first sandwich circuit board are layers of copper, and the bottom of first sandwich circuit board is equipped with the second sandwich circuit board, institute
The second sandwich circuit board to be stated closely to connect with first sandwich circuit board by hot pressing, second sandwich circuit board is prepreg,
The bottom of second sandwich circuit board is equipped with third sandwich circuit board, and the third sandwich circuit board is not fully cured core plate, and institute
Third sandwich circuit board is stated closely to connect with second sandwich circuit board also by hot pressing, the third sandwich circuit board by upper layers of copper,
The bottom of incomplete insulating layer and lower layers of copper composition, the third sandwich circuit board is equipped with feet, the feet and the third layer
Wiring board closely welds, and the feet is made of metal material, and the top insertion of first sandwich circuit board is provided with IGBT
The quantity of field-effect tube and heat sink strip, the IGBT field-effect tube and the heat sink strip is several, and first sandwich circuit board
Surface is equipped with recess portion.
Further, the third sandwich circuit board is thicker than second sandwich circuit board.
Further, the IGBT field-effect tube is used with effect pipe made of damper diode.
Further, the recess portion is in " cross " type.
Further, the surface of first sandwich circuit board is coated with one layer of green oil structure sheaf, and the green oil structure sheaf
It adopts and is made from an insulative material.
Compared with prior art, the utility model has the beneficial effects that：Three sandwich circuit boards of this kind of warpage preventing pass through IGBT
The design of field-effect tube, using with effect pipe made of damper diode, unfailing performance is high, and manufacturing cost is low, quality and one
The advantages that cause property is high, and conduction impedance is controllable, by the design of recess portion, recess portion is in " cross " type, and processing in this way can
The surface area for increasing wiring board, ensures that more complex circuit and more component can complete in the circuit board, and ties
Structure is simple, easy to make, improves work efficiency, and reduces the production cost, and one is coated with by the surface of the first sandwich circuit board
Layer green oil structure sheaf, adopt and be made from an insulative material, completely cut off wiring board on electric current, prevent from getting an electric shock, and can protection circuit plate, prevent
Only in the handling process, the circuit on wiring board is caused to damage, and third sandwich circuit board is than second sandwich circuit board
Thickness can improve stability, in addition, by the design of heat sink strip, improve radiating efficiency, and when pressing, third layer line
Road plate shrinkage stress and the shrinkage stress of the second sandwich circuit board balance each other, and can prevent the warpage of wiring board.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the side structure schematic diagram of the utility model；
In figure：The first sandwich circuit boards of 1-；The second sandwich circuit boards of 2-；3- third sandwich circuit boards；4-IGBT field-effect tube；5- is padded
Foot；6- recess portions；7- heat sink strips；8- green oil structure sheafs；The upper layers of copper of 9-；The incomplete insulating layers of 10-；Layers of copper under 11-.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of three sandwich circuit boards of warpage preventing, including the
One sandwich circuit board 1, first sandwich circuit board 1 are layers of copper, and the bottom of first sandwich circuit board 1 is equipped with the second sandwich circuit board 2,
Second sandwich circuit board 2 is closely connect by hot pressing with first sandwich circuit board 1, and second sandwich circuit board 2 is half solid
Change piece, the bottom of second sandwich circuit board 2 is equipped with third sandwich circuit board 3, and the third sandwich circuit board 3 is not fully cured core
Plate, and the third sandwich circuit board 3 is closely connect also by hot pressing with second sandwich circuit board 2, the third sandwich circuit board 3
It is made of upper layers of copper 9, incomplete insulating layer 10 and lower layers of copper 11, the bottom of the third sandwich circuit board 3 is equipped with feet 5, described
Feet 5 is closely welded with the third sandwich circuit board 3, and the feet 5 is made of metal material, first sandwich circuit board 1
Top insertion be provided with IGBT field-effect tube 4 and heat sink strip 7, if the quantity of the IGBT field-effect tube 4 and the heat sink strip 7
It is dry, and the surface of first sandwich circuit board 1 is equipped with recess portion.
Further, the third sandwich circuit board 3 is thicker than second sandwich circuit board 2, can improve stability.
Further, for the IGBT field-effect tube 4 using with effect pipe made of damper diode, unfailing performance is high,
The advantages that manufacturing cost is low, and quality and consistency are high, and conduction impedance is controllable.
Further, the recess portion 6 is in " cross " type, can increase the surface area of wiring board, ensure more complex circuit
It can complete in the circuit board with more component, and simple in structure, it is easy to make, it improves work efficiency, reduces
Cost of manufacture.
Further, the surface of first sandwich circuit board 1 is coated with one layer of green oil structure sheaf 8, and the green oil structure
Layer 8 is adopted and is made from an insulative material, and is completely cut off the electric current on wiring board, is prevented from getting an electric shock, and can protection circuit plate, prevent from carrying
Cheng Zhong causes the circuit on wiring board to damage.
Operation principle：First sandwich circuit board 1 is layers of copper, and the bottom of the first sandwich circuit board 1 is equipped with the second sandwich circuit board 2, the
Two sandwich circuit boards 2 are closely connect by hot pressing with the first sandwich circuit board 1, and the second sandwich circuit board 2 is prepreg, the second sandwich circuit
The bottom of plate 2 is equipped with third sandwich circuit board 3, and third sandwich circuit board 3 is not fully cured core plate, and third sandwich circuit board 3 also leads to
It crosses hot pressing closely to connect with the second sandwich circuit board 2, third sandwich circuit board 3 is by upper layers of copper 9, incomplete insulating layer 10 and lower layers of copper 11
Composition when hot pressing third sandwich circuit board 3, is pressed using low temperature and short time, and temperature is less than 180 degrees Celsius, pressing time 20-
30 minutes so that third sandwich circuit board 3 is in not fully cured state, the solidification of the second sandwich circuit board 2 and third sandwich circuit board 3
Spend closer, the effect for improving warpage issues is more notable, and when pressing, 3 shrinkage stress of third sandwich circuit board and second
The shrinkage stress of sandwich circuit board 2 balances each other, and the warpage of wiring board, the top insertion of the first sandwich circuit board 1 can be prevented to be provided with
The quantity of IGBT field-effect tube 4 and heat sink strip 7, IGBT field-effect tube 4 and heat sink strip 7 is several, and unfailing performance is high, and conduction impedance
Controllably, radiating efficiency is improved, and the surface of the first sandwich circuit board 1 is equipped with recess portion 6, increases the surface area of wiring board.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of three sandwich circuit boards of warpage preventing, including the first sandwich circuit board（1）, it is characterised in that：First sandwich circuit board
（1）For layers of copper, first sandwich circuit board（1）Bottom be equipped with the second sandwich circuit board（2）, second sandwich circuit board（2）It is logical
Cross hot pressing and first sandwich circuit board（1）Close connection, second sandwich circuit board（2）For prepreg, the second layer
Wiring board（2）Bottom be equipped with third sandwich circuit board（3）, the third sandwich circuit board（3）For not fully cured core plate, and it is described
Third sandwich circuit board（3）Also by hot pressing and second sandwich circuit board（2）Close connection, the third sandwich circuit board（3）By
Upper layers of copper（9）, incomplete insulating layer（10）With lower layers of copper（11）Composition, the third sandwich circuit board（3）Bottom be equipped with feet
（5）, the feet（5）With the third sandwich circuit board（3）Close welding, the feet（5）It is made of metal material, it is described
First sandwich circuit board（1）Top insertion be provided with IGBT field-effect tube（4）And heat sink strip（7）, the IGBT field-effect tube（4）
With the heat sink strip（7）Quantity it is several, and first sandwich circuit board（1）Surface be equipped with recess portion.
2. a kind of three sandwich circuit boards of warpage preventing according to claim 1, it is characterised in that：The third sandwich circuit board
（3）Than second sandwich circuit board（2）It is thick.
3. a kind of three sandwich circuit boards of warpage preventing according to claim 1, it is characterised in that：The IGBT field-effect tube
（4）Using with effect pipe made of damper diode.
4. a kind of three sandwich circuit boards of warpage preventing according to claim 1, it is characterised in that：The recess portion（6）In " ten
Word " type.
5. a kind of three sandwich circuit boards of warpage preventing according to claim 1, it is characterised in that：First sandwich circuit board
（1）Surface be coated with one layer of green oil structure sheaf（8）, and the green oil structure sheaf（8）It adopts and is made from an insulative material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721859257.8U CN207869487U (en) | 2017-12-27 | 2017-12-27 | A kind of three sandwich circuit boards of warpage preventing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721859257.8U CN207869487U (en) | 2017-12-27 | 2017-12-27 | A kind of three sandwich circuit boards of warpage preventing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207869487U true CN207869487U (en) | 2018-09-14 |
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ID=63466782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721859257.8U Active CN207869487U (en) | 2017-12-27 | 2017-12-27 | A kind of three sandwich circuit boards of warpage preventing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207869487U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747659A (en) * | 2021-10-09 | 2021-12-03 | 深圳市安博利电路有限公司 | Anti-warping structure of circuit board |
-
2017
- 2017-12-27 CN CN201721859257.8U patent/CN207869487U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747659A (en) * | 2021-10-09 | 2021-12-03 | 深圳市安博利电路有限公司 | Anti-warping structure of circuit board |
| CN113747659B (en) * | 2021-10-09 | 2023-02-03 | 深圳市安博利电路有限公司 | Anti-warping structure of circuit board |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343600 No. 281, Jingjiu Avenue, Jinggangshan National Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |