CN205364691U - Good copper -clad plate of heat dissipation function - Google Patents
Good copper -clad plate of heat dissipation function Download PDFInfo
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- CN205364691U CN205364691U CN201620189795.XU CN201620189795U CN205364691U CN 205364691 U CN205364691 U CN 205364691U CN 201620189795 U CN201620189795 U CN 201620189795U CN 205364691 U CN205364691 U CN 205364691U
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- conductive insulating
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- thermally conductive
- heat
- insulating layer
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Abstract
The utility model discloses a good copper -clad plate of heat dissipation function, include metal basic unit, locate the heat -conduction insulation layer of metal basic unit upper surface, locate the circuit layer of heat -conduction insulation layer upper surface, metal basic unit, heat -conduction insulation layer, circuit layer are connected with the mode that bonds each other. The utility model discloses the thermal diffusivity is strong for electronic component's heat dissipation, under the ambient temperature who makes electronic component maintains a lower environment, guaranteed electronic component's performance, prolonged electronic component's life, the practicality is strong.
Description
Technical field
This utility model relates to copper-clad plate technical field, particularly relates to the copper-clad plate that a kind of heat sinking function is good.
Background technology
Along with developing rapidly of electronics industry, the volume size of electronic product is more and more less, and power is increasing, and heat is the biggest threat of LED and other silicon series products, and solving heat dissipation problem is a huge challenge to electronics industry design.Copper-clad plate is to be made reinforcing material by wood pulp paper or glass-fiber-fabric etc., leaching is with resin, single or double is coated with Copper Foil, a kind of product through hot pressing, it it is the basic material of electronics industry, it is mainly used in processing and manufacturing printed circuit board (PCB), is widely used in the electronic products such as television set, radio, computer, computer, mobile communication.The heat sinking function improving copper-clad plate is one of effective means solving heat dissipation problem.
Utility model content
The purpose of this utility model is to solve the shortcoming existed in prior art, and the copper-clad plate that a kind of heat sinking function of proposing is good.
To achieve these goals, this utility model adopts the technical scheme that
The copper-clad plate that a kind of heat sinking function is good, including metal-based layer, is located at the thermally conductive insulating layer of metal-based layer upper surface, is located at the circuit layer of thermally conductive insulating layer upper surface, and described metal-based layer, thermally conductive insulating layer, circuit layer connect each other in the way of bonding.
Preferably, being provided with the high heat conductive insulating glue of film like between described metal-based layer and thermally conductive insulating layer, thermally conductive insulating layer and circuit layer, described metal-based layer and thermally conductive insulating layer, thermally conductive insulating layer and circuit layer are by described high heat conductive insulating glue laminating.
Preferably, described metal-based layer adopts the aluminium base that heat conductivity is good.
Preferably, described thermally conductive insulating layer is made up of the ceramic dielectric filled polymer of high heat conduction, high insulation.
Preferably, described circuit layer adopts electrolytic copper foil.
nullThis utility model compared with prior art has advantageous effect in that: in this utility model，By circuit layer、Thermally conductive insulating layer and metal-based layer three-decker composition，Circuit layer adopts electrolytic copper foil，For realizing assembling and the connection of device，Thermally conductive insulating layer is by high heat conduction、The ceramic dielectric filled polymer of high insulation is made，Metal-based layer adopts the aluminium base that heat conductivity is good，Laminating is connect each other by high heat conductive insulating is gluing，The heat that circuit layer produces is conducted to thermally conductive insulating layer by high heat conductive insulating glue，Heat is conducted to aluminium base by high heat conductive insulating glue by thermally conductive insulating layer，Aluminium base has higher heat-sinking capability，Thus improving the radiating efficiency of copper-clad plate，Thermal diffusivity is strong，Accelerate the heat radiation of electronic component，The ambient temperature making electronic component maintains under a relatively low environment，Ensure that the performance of electronic component，Extend the service life of electronic component，Practical.
Accompanying drawing explanation
Fig. 1 is the structural representation of the copper-clad plate that a kind of heat sinking function that the utility model proposes is good.
In figure: 1 metal-based layer, 2 thermally conductive insulating layer, 3 circuit layers, 4 high heat conductive insulating glue.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments.
With reference to Fig. 1, the copper-clad plate that a kind of heat sinking function is good, including metal-based layer 1, is located at the thermally conductive insulating layer 2 of metal-based layer 1 upper surface, being located at the circuit layer 3 of thermally conductive insulating layer 2 upper surface, metal-based layer 1, thermally conductive insulating layer 2, circuit layer 3 connect each other in the way of bonding.
The high heat conductive insulating glue 4 of film like it is provided with between metal-based layer 1 and thermally conductive insulating layer 2, thermally conductive insulating layer 2 and circuit layer 3, metal-based layer 1 is fitted by high heat conductive insulating glue 4 with circuit layer 3 with thermally conductive insulating layer 2, thermally conductive insulating layer 2, metal-based layer 1 adopts the aluminium base that heat conductivity is good, thermally conductive insulating layer 2 is made up of the ceramic dielectric filled polymer of high heat conduction, high insulation, and circuit layer 3 adopts electrolytic copper foil.
By circuit layer 3, thermally conductive insulating layer 2 and metal-based layer 1 three-decker composition, circuit layer 3 adopts electrolytic copper foil, for realizing assembling and the connection of device, thermally conductive insulating layer 2 is by high heat conduction, the ceramic dielectric filled polymer of high insulation is made, metal-based layer 1 adopts the aluminium base that heat conductivity is good, each other by the bonding laminating of high heat conductive insulating glue 4, the heat that circuit layer 3 produces is conducted to thermally conductive insulating layer 2 by high heat conductive insulating glue 4, heat is conducted to aluminium base by high heat conductive insulating glue 4 by thermally conductive insulating layer 2, aluminium base has higher heat-sinking capability, thus improving the radiating efficiency of copper-clad plate, accelerate the heat radiation of electronic component, the ambient temperature making electronic component maintains under a relatively low environment, ensure that the performance of electronic component, extend the service life of electronic component, practical.
The above; it is only this utility model preferably detailed description of the invention; but protection domain of the present utility model is not limited thereto; any those familiar with the art is in the technical scope that this utility model discloses; conceive according to the technical solution of the utility model and utility model thereof and be equal to replacement or change, all should be encompassed within protection domain of the present utility model.
Claims (5)
1. the copper-clad plate that a heat sinking function is good, it is characterized in that, including metal-based layer, be located at the thermally conductive insulating layer of metal-based layer upper surface, being located at the circuit layer of thermally conductive insulating layer upper surface, described metal-based layer, thermally conductive insulating layer, circuit layer connect each other in the way of bonding.
2. the copper-clad plate that a kind of heat sinking function according to claim 1 is good, it is characterized in that, being provided with the high heat conductive insulating glue of film like between described metal-based layer and thermally conductive insulating layer, thermally conductive insulating layer and circuit layer, described metal-based layer and thermally conductive insulating layer, thermally conductive insulating layer and circuit layer are by described high heat conductive insulating glue laminating.
3. the copper-clad plate that a kind of heat sinking function according to claim 1 is good, it is characterised in that described metal-based layer adopts the aluminium base that heat conductivity is good.
4. the copper-clad plate that a kind of heat sinking function according to claim 1 is good, it is characterised in that described thermally conductive insulating layer is made up of the ceramic dielectric filled polymer of high heat conduction, high insulation.
5. the copper-clad plate that a kind of heat sinking function according to claim 1 is good, it is characterised in that described circuit layer adopts electrolytic copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620189795.XU CN205364691U (en) | 2016-03-11 | 2016-03-11 | Good copper -clad plate of heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620189795.XU CN205364691U (en) | 2016-03-11 | 2016-03-11 | Good copper -clad plate of heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205364691U true CN205364691U (en) | 2016-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620189795.XU Active CN205364691U (en) | 2016-03-11 | 2016-03-11 | Good copper -clad plate of heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205364691U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
| US20220201835A1 (en) * | 2020-12-22 | 2022-06-23 | Wanjiong Lin | Circuit Board and a Driving Power Supply with the Circuit Board Thereof |
-
2016
- 2016-03-11 CN CN201620189795.XU patent/CN205364691U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
| US20220201835A1 (en) * | 2020-12-22 | 2022-06-23 | Wanjiong Lin | Circuit Board and a Driving Power Supply with the Circuit Board Thereof |
| US11778723B2 (en) * | 2020-12-22 | 2023-10-03 | Self Electronics Co., Ltd. | Circuit board and a driving power supply with the circuit board thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |