CN205364691U - Good copper -clad plate of heat dissipation function - Google Patents

Abstract

The utility model discloses a copper-clad laminate with good heat dissipation function, which comprises a metal base layer, a heat-conducting insulating layer arranged on the upper surface of the metal base layer, a circuit layer arranged on the upper surface of the heat-conducting insulating layer, the metal base layer, the heat-conducting insulating layer, and the circuit layer The layers are adhesively connected to each other. The utility model has strong heat dissipation, accelerates the heat dissipation of the electronic components, maintains the ambient temperature of the electronic components at a lower environment, ensures the performance of the electronic components, prolongs the service life of the electronic components, and has strong practicability.

Description

A copper clad laminate with good heat dissipation function

technical field

The utility model relates to the technical field of copper clad laminates, in particular to a copper clad laminate with good heat dissipation function.

Background technique

With the rapid development of the electronics industry, the size of electronic products is getting smaller and larger, and the power is getting higher and higher. Heat is the biggest threat to LEDs and other silicon products. Solving the problem of heat dissipation is a huge challenge for the design of the electronics industry. Copper clad laminate is a product made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and hot pressed. It is the basic material of the electronics industry and is mainly used for Processing and manufacturing printed circuit boards (PCBs), which are widely used in electronic products such as televisions, radios, computers, computers, and mobile communications. Improving the heat dissipation function of the copper clad laminate is one of the effective means to solve the heat dissipation problem.

Utility model content

The purpose of the utility model is to solve the shortcomings in the prior art, and propose a copper clad laminate with good heat dissipation function.

In order to achieve the above object, the utility model adopts the following technical solutions:

A copper-clad laminate with good heat dissipation function, comprising a metal base layer, a thermally conductive insulating layer disposed on the upper surface of the metal base layer, and a circuit layer disposed on the upper surface of the thermally conductive insulating layer, the metal base layer, the thermally conductive insulating layer, and the circuit layer are mutually connected by connected by bonding.

Preferably, a film-like high thermal conductivity insulating glue is provided between the metal base layer and the thermally conductive insulating layer, the thermally conductive insulating layer and the circuit layer, and the metal base layer and the thermally conductive insulating layer, the thermally conductive insulating layer and the circuit layer pass through the high thermally conductive insulating layer. Insulating glue fit.

Preferably, the metal base layer is an aluminum substrate with good thermal conductivity.

Preferably, the thermally conductive insulating layer is made of high thermally conductive, high insulating ceramic dielectric filled polymer.

Preferably, the circuit layer uses electrolytic copper foil.

Compared with the prior art, the utility model has the beneficial effect that: in the utility model, it is composed of a circuit layer, a heat-conducting insulating layer and a metal base layer. The circuit layer uses electrolytic copper foil to realize the assembly and connection of devices. , the thermally conductive insulation layer is made of high thermal conductivity and high insulation ceramic medium filled polymer, the metal base layer is made of aluminum substrate with good thermal conductivity, and is bonded and bonded to each other by high thermal conductivity insulating adhesive, the heat generated by the circuit layer passes through the high The thermally conductive insulating glue conducts to the thermally conductive insulating layer, and the thermally conductive insulating layer conducts heat to the aluminum substrate through the high thermally conductive insulating glue. The aluminum substrate has a high heat dissipation capacity, thereby improving the heat dissipation efficiency of the copper clad laminate, and the heat dissipation is strong, which speeds up the electronic components. Heat dissipation keeps the ambient temperature of the electronic components at a lower environment, ensures the performance of the electronic components, prolongs the service life of the electronic components, and has strong practicability.

Description of drawings

FIG. 1 is a structural schematic diagram of a copper clad laminate with good heat dissipation function proposed by the present invention.

In the figure: 1 metal base layer, 2 heat conduction insulation layer, 3 circuit layer, 4 high heat conduction insulation glue.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example.

Referring to Fig. 1 , a copper clad laminate with good heat dissipation function includes a metal base layer 1, a thermally conductive insulating layer 2 disposed on the upper surface of the metal base layer 1, a circuit layer 3 disposed on the upper surface of the thermally conductive insulating layer 2, a metal base layer 1, and a thermally conductive insulating layer. Layer 2 and circuit layer 3 are connected to each other by adhesive.

A film-like high thermal conductivity insulating glue 4 is provided between the metal base layer 1 and the thermally conductive insulating layer 2, the thermally conductive insulating layer 2 and the circuit layer 3, and the metal base layer 1 and the thermally conductive insulating layer 2, the thermally conductive insulating layer 2 and the circuit layer 3 pass the high thermal conductivity The insulating glue 4 is pasted together, the metal base layer 1 is made of an aluminum substrate with good thermal conductivity, the thermally conductive insulating layer 2 is made of high thermal conductivity and high insulation ceramic medium filled polymer, and the circuit layer 3 is made of electrolytic copper foil.

It consists of a three-layer structure of circuit layer 3, thermal insulation layer 2 and metal base layer 1. The circuit layer 3 is made of electrolytic copper foil for the assembly and connection of devices. The thermal insulation layer 2 is filled with high thermal conductivity and high insulation ceramic medium Made of polymer, the metal base layer 1 is made of an aluminum substrate with good thermal conductivity, and is bonded to each other by a high thermal conductivity insulating glue 4. The heat generated by the circuit layer 3 is transferred to the thermal conductivity insulating layer 2 through the high thermal conductivity insulation glue 4, and the heat conduction The insulating layer 2 conducts heat to the aluminum substrate through the high thermal conductivity insulating glue 4. The aluminum substrate has a high heat dissipation capacity, thereby improving the heat dissipation efficiency of the copper clad laminate, accelerating the heat dissipation of the electronic components, and maintaining the ambient temperature of the electronic components at a relatively low temperature. Under the environment of low temperature, the performance of electronic components is guaranteed, the service life of electronic components is prolonged, and the practicability is strong.

The above is only a preferred embodiment of the utility model, but the scope of protection of the utility model is not limited thereto. The equivalent replacement or change of the new technical solution and the concept of the utility model shall be covered by the protection scope of the utility model.

Claims (5)

1. A copper clad laminate with good heat dissipation, characterized in that it comprises a metal base layer, a thermally conductive insulating layer arranged on the upper surface of the metal base layer, a circuit layer arranged on the upper surface of the thermally conductive insulating layer, the metal base layer, the thermally conductive insulating layer, The circuit layers are connected to each other by adhesive. 2. A copper-clad laminate with good heat dissipation according to claim 1, characterized in that a film-like high thermal-conductive insulating glue is provided between the metal base layer and the thermally conductive insulating layer, and between the thermally conductive insulating layer and the circuit layer. The metal base layer and the heat-conducting insulating layer, and the heat-conducting insulating layer and the circuit layer are laminated through the high heat-conducting insulating glue. 3 . The copper clad laminate with good heat dissipation function according to claim 1 , wherein the metal base layer is an aluminum substrate with good thermal conductivity. 4 . 4 . The copper clad laminate with good heat dissipation function according to claim 1 , wherein the thermally conductive insulating layer is made of high thermally conductive, high insulating ceramic dielectric filled polymer. 5 . The copper clad laminate with good heat dissipation function according to claim 1 , wherein the circuit layer is made of electrolytic copper foil. 6 .