CN205124122U - Copper -clad plate of low thermal resistance metal base - Google Patents
Copper -clad plate of low thermal resistance metal base Download PDFInfo
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- CN205124122U CN205124122U CN201520977901.6U CN201520977901U CN205124122U CN 205124122 U CN205124122 U CN 205124122U CN 201520977901 U CN201520977901 U CN 201520977901U CN 205124122 U CN205124122 U CN 205124122U
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- thermal resistance
- metal
- heat dissipation
- low thermal
- copper
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 title claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 9
- 239000010949 copper Substances 0.000 title claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000004411 aluminium Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 29
- 239000000758 substrate Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 23
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
本实用新型公开了一种低热阻金属基覆铜板，包括设置于底部的金属板，该金属板的上表面呈矩形状，在所述金属板的上方设置有导电的铜箔层，在所述铜箔层的上表面涂布有导热环氧树脂层，在所述导热环氧树脂层上表面涂布有焊接膜，在所述焊接膜上压覆有散热板，在所述散热板上开设有散热孔。通过设置有导热的环氧树脂层，使得金属基覆铜板具有良好的剥离强度和耐热性，能够提高其导热效果，同时在金属基板上形成具有导热性和可焊性的金属化电路层，其散热性能好，通过设置有散热板，并开设有散热孔，最大限度低减少了热阻，无需使用大量低热阻材料。
The utility model discloses a metal-based copper-clad laminate with low thermal resistance, which comprises a metal plate arranged at the bottom, the upper surface of the metal plate is rectangular, and a conductive copper foil layer is arranged above the metal plate. The upper surface of the copper foil layer is coated with a thermally conductive epoxy resin layer, and a welding film is coated on the upper surface of the thermally conductive epoxy resin layer, and a heat dissipation plate is pressed on the welding film, and a There are cooling holes. By providing a thermally conductive epoxy resin layer, the metal-based copper clad laminate has good peel strength and heat resistance, which can improve its thermal conductivity, and at the same time form a metallized circuit layer with thermal conductivity and solderability on the metal substrate. Its heat dissipation performance is good. By setting up a heat dissipation plate and opening a heat dissipation hole, the thermal resistance is minimized, and there is no need to use a large number of low thermal resistance materials.
Description
技术领域technical field
本实用新型涉及电路板技术领域，尤其涉及一种低热阻金属基覆铜板。The utility model relates to the technical field of circuit boards, in particular to a metal-based copper-clad board with low thermal resistance.
背景技术Background technique
随着电子工业的飞速发展，电子产品的体积尺寸越来越小，功率密度越来越大，解决散热问题是对电子工业设计的一个巨大的挑战。金属基覆铜板无疑是解决散热问题的有效手段之一。金属基覆铜板是一种有良好散热功能的覆铜板，它由独特的三层结构所组成，分别是电路层、导热绝缘层和金属基层。金属基覆铜板的工作原理是：功率器件表面贴装在电路层，器件所产生的热量通过绝缘层传导到金属基层，然后由金属基板扩散到模块外部，实现对器件的散热。With the rapid development of the electronics industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher. Solving the problem of heat dissipation is a huge challenge for the design of the electronics industry. Metal-based copper clad laminate is undoubtedly one of the effective means to solve the problem of heat dissipation. Metal-based copper clad laminate is a copper clad laminate with good heat dissipation function. It is composed of a unique three-layer structure, which are circuit layer, thermal insulation layer and metal base layer. The working principle of the metal-based copper-clad laminate is: the surface of the power device is mounted on the circuit layer, and the heat generated by the device is conducted to the metal base layer through the insulating layer, and then diffused from the metal substrate to the outside of the module to realize heat dissipation of the device.
上述已有的金属基覆铜板，由于其导热绝缘粘接层或称复合材料层的热阻较大，一般均在0.5以上。由于其金属基板与导热绝缘粘接层散热性能不够理想，同时因金属基板表面与散热绝缘粘接层树脂结合不够牢固，易产生金属基板与导热绝缘粘接层分离，耐电压较低，而易击穿等问题，从而严重影响其耐久工作性能，尤其是当用作LED照明基板和高功率变频器电路基板时，由于基板过热，会造成光衰竭甚至烧坏LED发光两极管。In the above-mentioned existing metal-based copper-clad laminates, due to the relatively large thermal resistance of the heat-conducting and insulating adhesive layer or the composite material layer, it is generally above 0.5. Due to the unsatisfactory heat dissipation performance of the metal substrate and the heat-conducting and insulating adhesive layer, and because the bonding between the surface of the metal substrate and the resin of the heat-dissipating and insulating adhesive layer is not strong enough, it is easy to separate the metal substrate from the heat-conducting and insulating adhesive layer, the withstand voltage is low, and it is easy to Breakdown and other problems will seriously affect its durable performance, especially when it is used as an LED lighting substrate and a high-power inverter circuit substrate, due to overheating of the substrate, it will cause light failure or even burn out the LED light-emitting diode.
因此，一种能够使得导热率高、热阻小、耐久性强、稳定性好的金属基覆铜板亟待出现。Therefore, a metal-based copper-clad laminate that can achieve high thermal conductivity, low thermal resistance, strong durability, and good stability is urgently needed.
实用新型内容Utility model content
本实用新型的目的是为了克服现有技术的不足，提供了一种低热阻金属基覆铜板。The purpose of the utility model is to provide a metal-based copper-clad laminate with low thermal resistance in order to overcome the deficiencies of the prior art.
本实用新型是通过以下技术方案实现：The utility model is realized through the following technical solutions:
一种低热阻金属基覆铜板，包括设置于底部的金属板，该金属板的上表面呈矩形状，在所述金属板的上方设置有导电的铜箔层，在所述铜箔层的上表面涂布有导热环氧树脂层，在所述导热环氧树脂层上表面涂布有焊接膜，在所述焊接膜上压覆有散热板，在所述散热板上开设有散热孔。A metal-based copper-clad laminate with low thermal resistance, comprising a metal plate arranged at the bottom, the upper surface of the metal plate is rectangular, and a conductive copper foil layer is arranged above the metal plate, and on the copper foil layer The surface is coated with a heat-conducting epoxy resin layer, and a welding film is coated on the surface of the heat-conducting epoxy resin layer. A heat dissipation plate is pressed on the welding film, and a heat dissipation hole is opened on the heat dissipation plate.
作为本实用新型的优选技术方案，所述金属板为铝板或铜板。As a preferred technical solution of the utility model, the metal plate is an aluminum plate or a copper plate.
作为本实用新型的优选技术方案，所述散热板为金属材料制成，且所述散热孔均匀布置在所述散热板上，所述散热孔为圆形。As a preferred technical solution of the present invention, the heat dissipation plate is made of metal material, and the heat dissipation holes are evenly arranged on the heat dissipation plate, and the heat dissipation holes are circular.
作为本实用新型的优选技术方案，所述导热环氧树脂层的厚度为60μm-100μm。As a preferred technical solution of the present utility model, the thickness of the thermally conductive epoxy resin layer is 60 μm-100 μm.
作为本实用新型的优选技术方案，所述焊接膜的厚度为60μm-100μm。As a preferred technical solution of the present invention, the thickness of the welding film is 60 μm-100 μm.
与现有的技术相比，本实用新型的有益效果是：本实用新型通过设置有导热的环氧树脂层，使得金属基覆铜板具有良好的剥离强度和耐热性，能够提高其导热效果，同时在金属基板上形成具有导热性和可焊性的金属化电路层，其散热性能好，通过设置有散热板，并开设有散热孔，最大限度低减少了热阻，无需使用大量低热阻材料。Compared with the existing technology, the beneficial effect of the utility model is: the utility model is equipped with a heat-conducting epoxy resin layer, so that the metal-based copper-clad laminate has good peel strength and heat resistance, and can improve its thermal conductivity. At the same time, a metallized circuit layer with thermal conductivity and solderability is formed on the metal substrate, and its heat dissipation performance is good. By setting a heat dissipation plate and opening a heat dissipation hole, the thermal resistance is minimized, and there is no need to use a large number of low thermal resistance materials. .
附图说明Description of drawings
图1为本实用新型的结构示意图。Fig. 1 is the structural representation of the utility model.
具体实施方式detailed description
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.
请参阅图1，图1为本实用新型的结构示意图。Please refer to Fig. 1, Fig. 1 is the structural representation of the utility model.
所述一种低热阻金属基覆铜板，包括设置于底部的金属板1，该金属板1的上表面呈矩形状，在所述金属板1的上方设置有导电的铜箔层2，在所述铜箔层2的上表面涂布有导热环氧树脂层3，在所述导热环氧树脂层3上表面涂布有焊接膜4，在所述焊接膜4上压覆有散热板5，在所述散热板5上开设有散热孔6。The metal-based copper-clad laminate with low thermal resistance includes a metal plate 1 arranged at the bottom, the upper surface of the metal plate 1 is rectangular, and a conductive copper foil layer 2 is arranged above the metal plate 1. The upper surface of the copper foil layer 2 is coated with a thermally conductive epoxy resin layer 3, the upper surface of the thermally conductive epoxy resin layer 3 is coated with a soldering film 4, and a heat dissipation plate 5 is pressed on the soldering film 4, A heat dissipation hole 6 is opened on the heat dissipation plate 5 .
所述金属板1为铝板或铜板，所述散热板5为金属材料制成，且所述散热孔6均匀布置在所述散热板5上，所述散热孔6为圆形。The metal plate 1 is an aluminum plate or a copper plate, the heat dissipation plate 5 is made of metal material, and the heat dissipation holes 6 are evenly arranged on the heat dissipation plate 5, and the heat dissipation holes 6 are circular.
所述导热环氧树脂层3的厚度为为100μm-150μm，所述导热环氧树脂层3的厚度为60μm-100μm，所述焊接膜4的厚度为60μm-100μm。The thickness of the thermally conductive epoxy resin layer 3 is 100 μm-150 μm, the thickness of the thermally conductive epoxy resin layer 3 is 60 μm-100 μm, and the thickness of the welding film 4 is 60 μm-100 μm.
通过设置有导热的环氧树脂层，使得金属基覆铜板具有良好的剥离强度和耐热性，能够提高其导热效果，同时在金属基板上形成具有导热性和可焊性的金属化电路层，其散热性能好，通过设置有散热板，并开设有散热孔，最大限度低减少了热阻，无需使用大量低热阻材料。By providing a thermally conductive epoxy resin layer, the metal-based copper clad laminate has good peel strength and heat resistance, which can improve its thermal conductivity, and at the same time form a metallized circuit layer with thermal conductivity and solderability on the metal substrate. Its heat dissipation performance is good. By setting up a heat dissipation plate and opening a heat dissipation hole, the thermal resistance is minimized, and there is no need to use a large amount of low thermal resistance materials.
以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977901.6U CN205124122U (en) | 2015-11-30 | 2015-11-30 | Copper -clad plate of low thermal resistance metal base |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520977901.6U CN205124122U (en) | 2015-11-30 | 2015-11-30 | Copper -clad plate of low thermal resistance metal base |
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| CN205124122U true CN205124122U (en) | 2016-03-30 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430870A (en) * | 2015-11-30 | 2016-03-23 | 惠州市博宇科技有限公司 | Metal-based copper-clad plate with low thermal resistance |
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
-
2015
- 2015-11-30 CN CN201520977901.6U patent/CN205124122U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430870A (en) * | 2015-11-30 | 2016-03-23 | 惠州市博宇科技有限公司 | Metal-based copper-clad plate with low thermal resistance |
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
| CN106255313B (en) * | 2016-08-30 | 2018-10-02 | 无锡市同步电子制造有限公司 | A kind of preparation of circuit board heat dissipation cold plate and adhering method |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160330 |