CN205124122U - Copper -clad plate of low thermal resistance metal base - Google Patents
Copper -clad plate of low thermal resistance metal base Download PDFInfo
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- CN205124122U CN205124122U CN201520977901.6U CN201520977901U CN205124122U CN 205124122 U CN205124122 U CN 205124122U CN 201520977901 U CN201520977901 U CN 201520977901U CN 205124122 U CN205124122 U CN 205124122U
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- thermal resistance
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- clad plate
- heat
- low thermal
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Abstract
The utility model discloses a copper -clad plate of low thermal resistance metal base, including setting up in the metal sheet of bottom, the upper surface of this metal sheet is the rectangle describes the top of metal sheet is provided with electrically conductive copper foil layer the upper surface coating of copper foil layer has a heat conduction epoxy layer heat conduction epoxy layer upper surface coating has a welding membrane weld the epimembranal heating panel that has covered the louvre has been seted up on the heating panel. Through the epoxy layer that is provided with heat conduction for the copper -clad plate of metal base has good peel strength and heat resistance, can improve its effect of thermal conductivity, forms the metallization circuit layer that has heat conductivity and weldbility simultaneously on the metal substrate, and its heat dispersion is good, through being provided with the heating panel, and has seted up the louvre, and furthest hangs down and has reduced the thermal resistance, need not to use a large amount of low thermal resistance materials.
Description
Technical field
The utility model relates to circuit board technology field, particularly relates to a kind of low thermal resistance metal-based copper-clad plate.
Background technology
Along with the develop rapidly of electronics industry, the volume size of electronic product is more and more less, and power density is increasing, and solving heat dissipation problem is to one of electronics industry design huge challenge.Metal-based copper-clad plate is one of effective means solving heat dissipation problem beyond doubt.Metal-based copper-clad plate is a kind of copper-clad plate having good heat radiating function, and it is made up of the three-decker of uniqueness, is circuit layer, thermally conductive insulating layer and metal-based layer respectively.The operation principle of metal-based copper-clad plate is: power device surface mount is at circuit layer, and the heat that device produces is transmitted to metal-based layer by insulating barrier, is then diffused into module-external by metal substrate, realizes the heat radiation to device.
Above-mentioned existing metal-based copper-clad plate, because the thermal resistance of its heat conductive insulating adhesive linkage or title composite layer is comparatively large, generally all more than 0.5.Due to its metal substrate and heat conductive insulating adhesive linkage heat dispersion not ideal enough, simultaneously because of metallic substrate surfaces and radiating insulating adhesive linkage resin-bonded firm not, easy generation metal substrate is separated with heat conductive insulating adhesive linkage, proof voltage is lower, and the problem such as easily to puncture, thus have a strong impact on its durable service behaviour, especially when being used as LED illumination substrate and high power converter circuit substrate, because substrate is overheated, light decay can be caused to exhaust and even to burn out LED luminescent diode.
Therefore, a kind ofly can make that thermal conductivity is high, thermal resistance is little, durability is strong, the metal-based copper-clad plate of good stability urgently occurs.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of low thermal resistance metal-based copper-clad plate.
The utility model is achieved through the following technical solutions:
A kind of low thermal resistance metal-based copper-clad plate, comprise the metallic plate being arranged at bottom, the rectangular shape of upper surface of this metallic plate, the copper foil layer of conduction is provided with above described metallic plate, heat-conduction epoxy resin layer is coated with at the upper surface of described copper foil layer, be coated with welding film at described heat-conduction epoxy resin layer upper surface, described welding film covered heating panel, described heating panel offers louvre.
As optimal technical scheme of the present utility model, described metallic plate is aluminium sheet or copper coin.
As optimal technical scheme of the present utility model, described heating panel is that metal material is made, and described louvre is evenly arranged on described heating panel, and described louvre is circular.
As optimal technical scheme of the present utility model, the thickness of described heat-conduction epoxy resin layer is 60 μm-100 μm.
As optimal technical scheme of the present utility model, the thickness of described welding film is 60 μm-100 μm.
Compared with prior art, the beneficial effects of the utility model are: the utility model is by being provided with the epoxy resin layer of heat conduction, metal-based copper-clad plate is made to have good peel strength and thermal endurance, its heat-conducting effect can be improved, form the metallization circuit layer with thermal conductivity and solderability on metallic substrates, its perfect heat-dissipating simultaneously, by being provided with heating panel, and offer louvre, lowly to greatest extent decrease thermal resistance, without the need to using a large amount of low thermal resistance material.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is structural representation of the present utility model.
Described a kind of low thermal resistance metal-based copper-clad plate, comprise the metallic plate 1 being arranged at bottom, the rectangular shape of upper surface of this metallic plate 1, the copper foil layer 2 of conduction is provided with above described metallic plate 1, heat-conduction epoxy resin layer 3 is coated with at the upper surface of described copper foil layer 2, be coated with welding film 4 at described heat-conduction epoxy resin layer 3 upper surface, described welding film 4 covered heating panel 5, described heating panel 5 offers louvre 6.
Described metallic plate 1 is aluminium sheet or copper coin, and described heating panel 5 is made for metal material, and described louvre 6 is evenly arranged on described heating panel 5, and described louvre 6 is circular.
The thickness of described heat-conduction epoxy resin layer 3 is for being 100 μm-150 μm, and the thickness of described heat-conduction epoxy resin layer 3 is 60 μm-100 μm, and the thickness of described welding film 4 is 60 μm-100 μm.
By being provided with the epoxy resin layer of heat conduction, metal-based copper-clad plate is made to have good peel strength and thermal endurance, its heat-conducting effect can be improved, form the metallization circuit layer with thermal conductivity and solderability on metallic substrates simultaneously, its perfect heat-dissipating, by being provided with heating panel, and offers louvre, lowly to greatest extent decrease thermal resistance, without the need to using a large amount of low thermal resistance material.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (5)
1. a low thermal resistance metal-based copper-clad plate, comprise the metallic plate (1) being arranged at bottom, the rectangular shape of upper surface of this metallic plate (1), the copper foil layer (2) of conduction is provided with in the top of described metallic plate (1), it is characterized in that: be coated with heat-conduction epoxy resin layer (3) at the upper surface of described copper foil layer (2), welding film (4) is coated with at described heat-conduction epoxy resin layer (3) upper surface, described welding film (4) covers heating panel (5), described heating panel (5) has offered louvre (6).
2. a kind of low thermal resistance metal-based copper-clad plate according to claim 1, is characterized in that: described metallic plate (1) is aluminium sheet or copper coin.
3. a kind of low thermal resistance metal-based copper-clad plate according to claim 1, it is characterized in that: described heating panel (5) is made for metal material, and described louvre (6) is evenly arranged on described heating panel (5), described louvre (6) is circular.
4. a kind of low thermal resistance metal-based copper-clad plate according to claim 1, is characterized in that: the thickness of described heat-conduction epoxy resin layer (3) is 60 μm-100 μm.
5. a kind of low thermal resistance metal-based copper-clad plate according to claim 1, is characterized in that: the thickness of described welding film (4) is 60 μm-100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977901.6U CN205124122U (en) | 2015-11-30 | 2015-11-30 | Copper -clad plate of low thermal resistance metal base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977901.6U CN205124122U (en) | 2015-11-30 | 2015-11-30 | Copper -clad plate of low thermal resistance metal base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205124122U true CN205124122U (en) | 2016-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520977901.6U Active CN205124122U (en) | 2015-11-30 | 2015-11-30 | Copper -clad plate of low thermal resistance metal base |
Country Status (1)
| Country | Link |
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| CN (1) | CN205124122U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430870A (en) * | 2015-11-30 | 2016-03-23 | 惠州市博宇科技有限公司 | Metal-based copper-clad plate with low thermal resistance |
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
-
2015
- 2015-11-30 CN CN201520977901.6U patent/CN205124122U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430870A (en) * | 2015-11-30 | 2016-03-23 | 惠州市博宇科技有限公司 | Metal-based copper-clad plate with low thermal resistance |
| CN106255313A (en) * | 2016-08-30 | 2016-12-21 | 无锡市同步电子制造有限公司 | The preparation of a kind of circuit board heat dissipation cold plate and adhering method |
| CN106255313B (en) * | 2016-08-30 | 2018-10-02 | 无锡市同步电子制造有限公司 | A kind of preparation of circuit board heat dissipation cold plate and adhering method |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |