TWM445127U - LED heat dissipation structure - Google Patents

Description

LED heat dissipation structure

This creation is related to LEDs, especially an LED heat dissipation structure.

As shown in the first figure, the basic structure of a conventional LED lamp comprises a substrate 1 which is usually a printed circuit board. The substrate is provided with a circuit 2, and the LED 3 is disposed on the substrate 1 and the substrate. The circuit 2 is turned on to form a commonly used LED lamp structure. Heat dissipation in this structure has always been a big problem, because LED 3 generates heat when it is illuminated, but printed circuit board 1 is made of plastic material, so it is not a good heat conduction material, and the heat generated by LED cannot be fast and effective. Spread out.

As shown in the second figure, the basic structure of another conventional LED lamp comprises a substrate 1 which is made of an aluminum alloy and is generally referred to as an aluminum substrate. The substrate 1 is provided with an insulating layer 4, A circuit 2 is disposed on the insulating layer 4, and the LED 3 is disposed on the insulating layer 4 and communicates with the circuit 2. Although such a structure replaces a conventional printed circuit board with an aluminum substrate having a high thermal conductivity to obtain a better heat dissipation effect, since aluminum is electrically conductive, an additional one must be added between the aluminum substrate 1 and the circuit 2. The insulating layer 4 can make the circuit 2 operate normally. The insulating layer 4 is generally formed of a material that is not electrically conductive or thermally conductive, so that the heat conduction is also blocked when the insulating effect is achieved, so that the aluminum substrate does not contribute much to the conduction of the LED heat.

In view of the above shortcomings, the main purpose of this creation is to provide an LED heat dissipation structure that can quickly and effectively conduct heat and heat.

In order to achieve the above object, the LED heat dissipation structure provided by the present invention comprises: a substrate having a circuit and at least one through hole, the through hole penetrating the top bottom surface of the substrate, wherein the through hole is provided with a heat conducting column on the substrate And at least one thermal conductive sheet is disposed, and one end of the thermal conductive sheet is connected to the heat conducting column. At least one LED is disposed on the substrate and is in communication with a circuit on the substrate, and a heat generated by the bottom surface of the LED on the heat conducting sheet to cause the LED to emit light can be conducted outward from the heat conductive sheet.

The substrate is an aluminum substrate, and the heat conducting column can be integrally formed with the aluminum substrate.

One side of the substrate is provided with a metal plate, and the heat conducting column is integrally formed with the metal plate.

The plurality of LEDs on the substrate are respectively connected to a heat conducting sheet, and the heat conducting sheets share a perforation and a heat conducting column.

In order to explain the features and functions of the present invention in detail, the following embodiments are described below with reference to the drawings.

As shown in the third and fourth figures, the LED heat dissipation structure of the present invention comprises: a substrate 10, which may be a printed circuit board or an aluminum substrate, which in this embodiment is a printed circuit board. The substrate is provided with a circuit 11 and at least one through hole 12 extending through the top surface of the substrate 10. A heat conducting column 13 is disposed in the through hole 12, and the heat conducting column may be a rivet, a copper column or an iron column. At least one heat conducting sheet 14 is disposed on the substrate 10, and one end of the heat conducting sheet 14 is connected to the heat conducting column 13. The heat conductive sheet 14 is made of a metal material and may be a copper sheet or an iron sheet. The heat conductive sheet 14 may be formed together when the printed circuit board is made. The heat conducting column 13 The connection to the heat conductive sheet 14 may be adhesion, welding or riveting.

At least one LED 20 is disposed on the substrate 10 and communicates with the circuit 11 on the substrate. The bottom surface of the LED 20 is disposed on the heat conducting sheet 14 to cause the heat generated by the LED to be conducted out from the heat conducting sheet 14. .

A metal plate 30 is made of a metal material having good heat conductivity such as copper or iron. The metal plate 30 is disposed under the substrate 10, and the heat transfer column 13 is connected to the metal plate 30. The heat conducting column 13 and the metal plate 30 may be connected by bonding, welding or riveting. The heat conducting column 13 can also be directly stamped and formed from the metal plate 30.

According to the structure of the first embodiment of the present invention, since the bottom of the LED is directly attached to the heat conductive sheet 14, when the LED emits heat, the heat conductive sheet 14 attached to the bottom surface of the LED can conduct the heat generated by the LED, and The heat conducting sheet 14 is connected to the heat conducting column 13, and the heat conducting column 13 is connected to the metal plate 30, and the heat generated by the LED is transmitted to the metal plate through a heat conduction effect to achieve a fast and effective heat dissipation effect, and the substrate is The position of the perforation and the heat conducting column is preferably close to the position where the LED is disposed, so that the heat conducting column can exert the best effect.

As shown in the fifth figure, the second embodiment of the LED heat dissipation structure of the present invention comprises: a substrate 10, which may be a printed circuit board or an aluminum substrate, which is an aluminum substrate in this embodiment. An insulating layer 15 is disposed on the substrate 10, and the circuit 11 is provided with an electric circuit 11. The substrate 10 is provided with at least one through hole 12 penetrating through the top bottom surface of the substrate 10. The substrate 10 is provided with at least one heat conducting sheet 14, and the heat conducting sheet 14 may be a metal sheet such as a copper sheet. a guide is arranged in the through hole 12 The heat column 13 is connected to one end of the heat conducting sheet 14 , and the other end of the heat conducting column 13 is connected to the substrate 10 . The heat conducting column 13 and the heat conducting sheet 14 can be connected by bonding, welding or riveting.

At least one LED 20 is disposed on the substrate 10 and communicates with the circuit 11 on the substrate 10. The heat generated by the bottom surface of the LED on the heat conducting sheet 14 to cause the LED to emit light can be conducted out from the heat conducting sheet 14. .

According to the structure of the second embodiment of the present invention, since the substrate is made of an aluminum alloy, that is, the aluminum substrate which is currently used, the substrate itself can be a metal plate which is excellent in heat dissipation and heat dissipation. When the LED 20 emits heat to generate heat, the thermal energy can bypass the barrier of the insulating layer 15, and is conducted by the heat conducting sheet 14 to the heat conducting column 13 and then conducted to the aluminum substrate 10 by the heat conducting column 13 to achieve a fast and effective heat dissipation effect.

It should be further noted that in the second embodiment of the present invention, the heat conducting column 13 can be integrally formed with the aluminum substrate 10. Regardless of the structure of the first embodiment or the second embodiment, if a plurality of LEDs are provided on the substrate, the LEDs can conduct heat generated by the LEDs to the heat conducting column by the arrangement of the plurality of heat conducting sheets. As for the number of perforations and heat-conducting columns, the number can be set according to actual needs. For example, two LEDs share a perforation with a heat-conducting column or three LEDs share a perforation and a heat-conducting column, etc., and the LEDs surround the Perforation and the heat pole setting

1‧‧‧Substrate

2‧‧‧ Circuitry

3‧‧‧LED

4‧‧‧Insulation

10‧‧‧Substrate

11‧‧‧ Circuitry

12‧‧‧Perforation

13‧‧‧ Thermal column

14‧‧‧ Thermal sheet

20‧‧‧LED

30‧‧‧Metal plates

The first figure is a schematic view of a conventional LED lamp; the second figure is a schematic view of another conventional LED lamp; the third figure is a schematic cross-sectional view of the first embodiment of the creation; The top view is a schematic view of the second embodiment of the present invention.

10‧‧‧Substrate

11‧‧‧ Circuitry

12‧‧‧Perforation

13‧‧‧ Thermal column

14‧‧‧ Thermal sheet

20‧‧‧LED

30‧‧‧Metal plates

Claims (10)

An LED heat dissipation structure includes: a substrate having a circuit and at least one through hole, the through hole penetrating through a top surface of the substrate, wherein the through hole is provided with a heat conducting column, and the substrate is provided with at least one heat conducting piece, One end of the heat conducting sheet is connected to the heat conducting column; at least one LED is disposed on the substrate and communicates with the circuit on the substrate, and the bottom surface of the LED is disposed on the heat conducting sheet to enable heat generated by the LED to be illuminated by the heat conducting sheet Conducted out. According to the LED heat dissipation structure of claim 1, wherein one side of the substrate is provided with a metal plate, and the heat conducting column is connected to the metal plate. The LED heat dissipation structure according to claim 1, wherein the substrate is a printed circuit board. The LED heat dissipation structure according to claim 1, wherein the heat conductive sheet is a copper sheet. According to the LED heat dissipation structure of claim 2, wherein the heat conducting column is integrally formed with the metal plate. According to the LED heat dissipation structure of claim 2, wherein the heat conducting column is riveted to the metal plate by a rivet. An LED heat dissipation structure comprises: a substrate; an insulating layer disposed on the substrate; the insulating layer is provided with a circuit, the substrate is provided with at least one through hole, the through hole penetrating through a top surface of the substrate, and the substrate is provided with At least one heat conducting sheet, the heat conducting column is connected to one end of the heat conducting sheet, and the other end of the heat conducting column is connected to the substrate; at least one LED is disposed on the substrate and is connected to the circuit on the substrate , The heat generated by the bottom surface of the LED on the heat conducting sheet to cause the LED to emit light can be conducted out from the heat conducting sheet. The LED heat dissipation structure according to Item 7 of the patent application, wherein the heat conduction column is integrally formed with the substrate. The LED heat dissipation structure according to Item 8 of the patent application, wherein the substrate is an aluminum substrate. According to the LED heat dissipation structure of claim 7, wherein the heat conducting column is riveted to the aluminum substrate by a rivet.