M339772 八、新型說明： 【新型所屬之技術領域】 本創作係有關一種應用在發光二極體的導熱基板，旨 在提供一種有效提升整體發光二極體導埶效 發光二 極體導熱基板。 μ 【先前技術】M339772 VIII. New Description: [New Technology Field] This creation is about a heat-conducting substrate applied to a light-emitting diode, aiming to provide a light-emitting diode with a light-emitting diode that effectively enhances the overall light-emitting diode. μ [prior art]
一=第一圖一種傳統發光二極體基板的結構剖視圖所 示售有的發光二極體基板係在一印刷電路板的頂部 建構有一發光二極體晶片20,此發光二極體晶片20並且 與印刷，路板1〇電性連接，使構成—種可穩固承載發光 一極體晶片20的基板結構；然而，傳統的發光二極體基 板未建構有任何的散熱機制，因此散熱效率較差。 此=致於，坊間即出現有一種在印刷電路板上設有一沖 孔ί、谷置發光二極體晶片，另外在印刷電路板黏設一同時 /、發光二極體晶片導觸的鋁基板，使構成一種能夠利用鋁 基板產生散熱作用的發光二極體散熱基板。但由於上述發 $—極體散熱基板的印刷電路板與鋁基板之間會形成樹 月曰層[如酚醛樹脂]，有時為了絕緣還會增加一層玻璃纖維 布，不但/且礙發光二極體的熱傳導，在長時間高溫導熱不 佳的，態下，容易衍生發光二極體亮度不足，以及發光二 極體辱命減短等課題。 ^本國公告第200714838號「發光二極體散熱機構設 計」專利文獻則係揭露在印刷電路板與鋁基板間介入 5 M339772 熱擴散板，該熱擴散板上沖壓出或拗折出多個呈梯形凸出 的導熱塊，其中一導熱塊更穿過印刷電路板穿孔而與發光 二極體晶片底面導觸；此雖可達良好散熱效果，但熱擴散 板的體積太大，占用過多空間，再加上鋁基板又有多片延 伸加長的分歧狀鰭片，使得整個發光二極體散熱基板過 大，不容易設置在發光裝置的有限空間範圍内。 再者，本國第M276326號「具有高散熱效率之LED 散熱結構」新型專利文獻則揭露散熱基座的上層為銅箔 層、中層為絕緣層、下層為銅金屬層，該散熱基座上並設 有一安裝發光二極體晶片的凹槽，在發光二極體晶片的底 面具有銅金屬面，其與凹槽上的銅金屬層以錫層焊接接 觸，使得發光二極體的熱量經由銅金屬面、錫層、銅金屬 層而散發出去。該案由於散熱基座的下層為銅金屬層，而 凹槽上的銅金屬層是焊接在銅金屬層上，又發光二極體晶 片底面也需鍍上銅金屬面，建構與組裝麻煩，製造成本大 大提高，使得羞品無競爭優勢。 【新型内容】 有鑑於此，本創作之主要目的旨在提供一種體積小、 加工容易、製造成本低廉，以及能夠有效提升發光二極體 導熱效率的發光二極體導熱基板結構。 為達上揭目的，本創作之導熱基板係包括至少一印刷 電路板、一與印刷電路板相嵌設的導熱體、及至少一設於 導熱體外表面並且與印刷電路板電性連接的發光二極體 M339772 組件所構成；其中，印 加工成本，更可以有效 以及縮減整體導熱基板 提升整體發光二極體之導 的體積。 熱體嵌設，俾可以大幅 略板係具有一貫穿的穿孔供導 ^ JCL· 33^ ^ ^ ” 低材料 【實施方式】 可參閱本案 圖式及實施例之詳細說明A first embodiment of a conventional light-emitting diode substrate is shown in a cross-sectional view of the printed light-emitting diode substrate. A light-emitting diode chip 20 is formed on the top of a printed circuit board, and the light-emitting diode wafer 20 is The circuit board is electrically connected to the printed circuit board to form a substrate structure capable of stably supporting the light-emitting one-pole wafer 20; however, the conventional light-emitting diode substrate is not constructed with any heat-dissipating mechanism, and thus the heat-dissipating efficiency is poor. Therefore, there is a kind of aluminum substrate on the printed circuit board which is provided with a punching hole, a valley-mounted LED chip, and a printed circuit board with a simultaneous/light-emitting diode wafer. A light-emitting diode heat-dissipating substrate capable of generating a heat-dissipating effect by using an aluminum substrate is formed. However, since the above-mentioned printed circuit board of the heat-dissipating substrate and the aluminum substrate form a layer of a tree-like layer (such as a phenolic resin), sometimes a layer of glass fiber cloth is added for the insulation, and not only the light-emitting diode The heat conduction of the body is prone to derivation of insufficient brightness of the light-emitting diode and short-sightedness of the light-emitting diode in the case of poor heat conduction for a long period of time. ^ National Publication No. 200714838 "Design of Light-Emitting Diode Heat Dissipation Mechanism" discloses that a 5 M339772 heat diffusion plate is interposed between a printed circuit board and an aluminum substrate, and the heat diffusion plate is stamped or folded into a plurality of trapezoids. a protruding heat conducting block, wherein a heat conducting block is further perforated through the printed circuit board to be in contact with the bottom surface of the light emitting diode chip; although this can achieve good heat dissipation effect, the heat diffusion plate is too large in size and takes up too much space. In addition, the aluminum substrate has a plurality of elongated fins extending and lengthening, so that the entire light-emitting diode heat-dissipating substrate is too large and is not easily disposed in a limited space of the light-emitting device. Furthermore, the new patent document No. M276326 "LED heat dissipation structure with high heat dissipation efficiency" discloses that the upper layer of the heat dissipation base is a copper foil layer, the middle layer is an insulation layer, and the lower layer is a copper metal layer, and the heat dissipation base is arranged on the same. There is a recess for mounting the LED chip, and a copper metal surface is formed on the bottom surface of the LED substrate, and the copper metal layer on the groove is soldered to the tin layer, so that the heat of the LED is via the copper metal surface. The tin layer and the copper metal layer are emitted. In this case, the lower layer of the heat dissipation base is a copper metal layer, and the copper metal layer on the groove is soldered on the copper metal layer, and the bottom surface of the light emitting diode wafer is also plated with a copper metal surface, which is troublesome in construction and assembly. The cost is greatly improved, making the shyness have no competitive advantage. [New content] In view of this, the main purpose of this creation is to provide a light-emitting diode thermal conductive substrate structure which is small in size, easy to process, low in manufacturing cost, and capable of effectively improving the heat conduction efficiency of the light-emitting diode. In order to achieve the above, the thermally conductive substrate of the present invention comprises at least one printed circuit board, a heat conductor embedded in the printed circuit board, and at least one light emitting light disposed on the outer surface of the heat conductive body and electrically connected to the printed circuit board. The assembly of the polar body M339772; wherein the printing processing cost is more effective and reduces the volume of the overall thermal conductive substrate to promote the guide of the overall light-emitting diode. The hot body is embedded, and the crucible can have a large perforation for guiding. ^ JCL· 33^ ^ ^ ” Low material [Embodiment] Refer to the present drawings and detailed description of the embodiment.
本創作之特點， 而獲得清楚地瞭解 如第二圖至第四圖所 之第一實施例，係包括有本創作發光二極體導熱基板 熱體30及至少一發光_故至少一印刷電路板10、一導 印刷電路板1〇係:;體;件2;其中： 則係植入印刷電路板1〇ζ~：貝穿的穿孔11;其導熱體30 10相嵌設；至於，發光二^孔11纟中而與印刷電路板 外表面並讀印刷電路=件2狀在導減30的 ^ 2, ϋ電性連接（例如焊接），並可 如第一圖所不，再進行後續封襄製成成品。 上述導熱體30係可以由銅塊、石墨棒、銘塊或寶石 等所構成，而本實施例係以銅塊為例，並且如第五圖所示 之第二實施例，導熱體30在其相對應於印刷電路板1〇 設有發光二極體組件2的另側設有一相對凸出印刷電略 板10的散熱部40 ;於實施時，散熱部40係可以第五_ 所示與導熱體30 —體成型或是連接成型，或是如第六_ 之第三實施例所示，該散熱部4〇另為一設在印刷電路才反 10板面的鋁質散熱板41 ,並且與導熱體30導觸，抑或是 7 M339772 如第七圖之第四實施例所示，該散熱部4〇由一設在印刷 電路板10板面並且與導熱體3〇相欲設的銘質散熱板41 •所構成。 、 、 當然，其散熱部40亦可以如第八圖之第五實施例所 示，由一散熱鰭片42及連接於散熱鰭片42與導熱體30 -之間的導熱管43所構成；以及可以如第九圖之第六實施 •例所示，進一步在散熱部40處尾端（圖式中的散熱鰭片 42處）設有風扇5〇將熱氣散出，以增加發光二極體組件2 籲的散熱效率。 上述各實施例當中的印刷電路板1〇係可以為紙基 材、複合基材、玻璃纖維基材、金屬基材、陶瓷基材或熱 塑性基材等，並在至少其中一侧的板面上依序設有絕緣層 13、線路層12以及絕緣層13，使構成供與發光二極體組 件2電性連接的接點之外，當其印刷電路板1〇的基材係 為金屬材質（如鋁基板）時，亦可如第十圖之第七實施例 所示’在印刷電路板10的穿孔11周圍另外設有一絕緣層 _ 13以構成絕緣效果，而且其導熱體30更可以如第十一圖 之第八貫施例所示，伸出印刷電路板1〇的線路層丨2及絕 緣層13以增加發光二極體組件2的導熱效率。 ，者，其印刷電路板1〇可以如上述各實施例當中， 為單層板形式，亦可以如第十二圖之第九實施例所示， ▲在其中一側的板面上設有線路層12及絕緣層13,使構成 供與發光二極體組件2電性連接的接點，以及在其另側板 面設有供與其他裝置電性連接的線路層12及絕緣層13, M339772 成為一雙層板形式；當然也可以於印刷電路板1〇上設有 多層線路層12及絕緣層13，為一多層板形式者。 值得一提的是，在上述各實施例當中，發光二極體組 件2係了以由如第一圖至第十二圖戶斤示的發光二極體晶 片20所構成之外，亦、可以如第十三圖之第十實施例及十 四圖之第十—實施例所示，由已完成封裝的發光二極體所 構成，至於，第十四圖當中的印刷電路板1〇則係在豆兩 側的板面上皆設有線路層12及絕緣層13，使構成供與發 光，極體組件2電性連接的接點；並且，在如第二圖至第 十二圖所示之各實施例當中，發光二極體組件2係為直接 的设置於導熱體3Q上，可直接導熱，或者亦可如第十三 圖及十四®所示，於發光二極體組件2與導熱體30間具 有絕、=層13仍可透過間接導熱作用將熱源散出。 、’vT、上所述，本創作提供-較佳可行之發光二極體導熱 ϋ構，歧法提呈新型專利之申請；本創作之技術内 ^ t揭如上’然、而熟悉本項技術之人士仍可 本創作之揭示而作各種不雜本案創作精神之替 一、夕飾。因此，本創作之保護範圍應不限於實施例所揭 =而應包括各種不背離本創作之替換及修飾，並為以 下之申請專利範圍所涵蓋。 【圖式簡單說明】 ^圖係為j 專統發光二極體基板之結構剖視圖。 第二圖係為本創作第—實_之外觀立體圖。 9The first embodiment of the present invention includes a light-emitting diode thermal substrate 30 and at least one illumination, so that at least one printed circuit board is obtained. 10, a printed circuit board 1 :: body; 2; wherein: is embedded in the printed circuit board 1 〇ζ ~: through the perforation 11; its thermal conductor 30 10 is embedded; as for the light two ^ Hole 11纟 and the printed circuit board outer surface and read the printed circuit = piece 2 in the lead reduction of 2, 2 electrically connected (such as welding), and can be followed by the first picture, and then follow-up襄 made into finished products. The heat conductor 30 may be made of a copper block, a graphite rod, an ingot or a gemstone, etc., and the embodiment is a copper block, and as in the second embodiment shown in the fifth figure, the heat conductor 30 is Corresponding to the printed circuit board 1 , the other side of the LED assembly 2 is provided with a heat dissipating portion 40 opposite to the printed printing board 10; in implementation, the heat dissipating portion 40 can be shown as the fifth _ The body 30 is integrally formed or joined, or as shown in the third embodiment of the sixth embodiment, the heat dissipating portion 4 is another aluminum heat dissipating plate 41 disposed on the counter surface of the printed circuit, and The heat conductor 30 is in contact with the light, or is it 7 M339772. As shown in the fourth embodiment of the seventh figure, the heat dissipating portion 4 is heat-dissipated by a surface provided on the surface of the printed circuit board 10 and connected to the heat conductor 3 Board 41 • is composed. The heat dissipating portion 40 can also be formed by a heat dissipating fin 42 and a heat conducting tube 43 connected between the heat dissipating fin 42 and the heat conducting body 30 - as shown in the fifth embodiment of the eighth embodiment; As shown in the sixth embodiment of the ninth embodiment, a fan 5 is further disposed at the tail end of the heat dissipating portion 40 (at the heat dissipating fin 42 in the drawing) to dissipate hot air to increase the light emitting diode assembly. 2 The heat dissipation efficiency of the call. The printed circuit board 1 in each of the above embodiments may be a paper substrate, a composite substrate, a glass fiber substrate, a metal substrate, a ceramic substrate or a thermoplastic substrate, and the like, and on at least one of the plates The insulating layer 13, the wiring layer 12, and the insulating layer 13 are sequentially provided so as to constitute a metal material (the substrate of the printed circuit board 1) is formed in addition to the contact which is electrically connected to the light-emitting diode assembly 2. For example, in the case of the aluminum substrate, as shown in the seventh embodiment of the tenth embodiment, an insulating layer _ 13 is additionally provided around the through hole 11 of the printed circuit board 10 to constitute an insulating effect, and the heat conductor 30 is more like the first As shown in the eighth embodiment of the eleventh figure, the wiring layer 2 and the insulating layer 13 of the printed circuit board 1 are extended to increase the heat transfer efficiency of the light emitting diode assembly 2. The printed circuit board 1 can be in the form of a single layer as in the above embodiments, or as shown in the ninth embodiment of the twelfth figure, ▲ the circuit is provided on one of the sides of the board. The layer 12 and the insulating layer 13 form a contact for electrically connecting the LED assembly 2, and a wiring layer 12 and an insulating layer 13 for electrically connecting to other devices on the other side surface thereof, and the M339772 becomes A double-layer board form; of course, a plurality of circuit layers 12 and an insulating layer 13 may be provided on the printed circuit board 1A, which is a multi-layer board form. It is to be noted that, in the above embodiments, the LED assembly 2 is formed by the LED chip 20 as shown in the first to twelfth drawings. As shown in the tenth embodiment of the thirteenth embodiment and the tenth embodiment of the fourteenth embodiment, the packaged light emitting diode is formed. As for the printed circuit board of the fourteenth figure, A circuit layer 12 and an insulating layer 13 are disposed on the sides of the beans to form a contact for electrically connecting the polar body assembly 2; and, as shown in the second to twelfth figures In each of the embodiments, the LED assembly 2 is directly disposed on the thermal conductor 3Q and can be directly thermally conductive, or can be disposed in the LED assembly 2 as shown in FIG. 13 and FIG. Between the heat conductors 30 and the layer 13 can still dissipate the heat source through indirect heat conduction. , 'vT, above, this creation provides - a better feasible light-emitting diode thermal conduction structure, the application of a new type of patent is proposed by law; the technology of this creation is as follows, and is familiar with this technology. The person can still make a variety of the creative spirit of this case, and the eve decoration. Therefore, the scope of protection of this creation should not be limited to the examples disclosed, but should include various substitutions and modifications that do not depart from the present invention and are covered by the scope of the patent application below. [Simple description of the figure] ^ The figure is a structural sectional view of the j-specific light-emitting diode substrate. The second picture is a perspective view of the appearance of the first creation of the creation. 9