CN202634887U - Large power LED circuit board structure - Google Patents
Large power LED circuit board structure Download PDFInfo
- Publication number
- CN202634887U CN202634887U CN 201220207238 CN201220207238U CN202634887U CN 202634887 U CN202634887 U CN 202634887U CN 201220207238 CN201220207238 CN 201220207238 CN 201220207238 U CN201220207238 U CN 201220207238U CN 202634887 U CN202634887 U CN 202634887U
- Authority
- CN
- China
- Prior art keywords
- led
- led chip
- heat
- pcb board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a large power LED circuit board structure. A PCB panel forms a printed circuit through a traditional etching technology, a hole location corresponding to a LED chip bottom area is reserved at the corresponding position to the LED chip welded through PCB plate, the hole location is filled and leveled up with a high thermal conductivity material to form a heat conduction layer, the bottom of LED is directly and tightly connected to a heat radiation metal plate through the heat conduction layer, the heat generated by the LED chip can be timely introduced, so that the luminous efficiency and the usage life of the LED can be enhanced.
Description
Technical field
The utility model belongs to the LED lighting technical field, relates generally to a kind of structure of great power LED circuit plate.
Background technology
At present, the making of common led circuit plate all is on copper base or aluminium base, to cover the resistant to elevated temperatures insulating barrier of one deck, printed circuit on insulating barrier again.During use, led chip is welded on the metallic circuit; Like this, across a layer insulating, and the thermal resistance of insulating barrier is very big between led chip and the metal substrate; Heat conductivility is very poor; Its insulation property are also relatively poor, so the heat energy that led chip is produced is difficult to conduct; Make the knot surface temperature of LED high, thereby directly influence luminous efficiency and the useful life of LED.
Summary of the invention
The purpose of the utility model is to provide a kind of new construction of great power LED circuit plate, and simply structure realizes addressing the above problem.
The pcb board face forms printed circuit through traditional etching technics; And reserve and position, the corresponding hole of led chip bottom area at the correspondence position of pcb board welding led chip; This Kong Weiyong high-thermal conductive metal material is filled and led up like silver, copper, aluminium etc. and form to be filled heat-conducting layer, make it with pcb board be one.Like this, in use, the bottom of LED can form heat dissipation channel through this heat-conducting layer and heat dissipation metal piece and closely contact with heating panel, and the heat that led chip is produced can access timely derivation.Compare with metallic circuit, the utility model has the advantages that, not only improved the radiating effect of LED, reduced the knot surface temperature of led chip, thereby improved light efficiency and the useful life of LED.The worry of also having got rid of the existing Insulation Problems of metallic circuit simultaneously, and make simply, cost is low.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Wherein:
1---led chip,
2---pcb board,
3---fill heat-conducting layer,
4---the heat dissipation metal piece.
Embodiment
Please with reference to Fig. 1; The plate face of pcb board 2 forms printed circuit through traditional lithographic method; And reserve and position, the corresponding hole of led chip 1 bottom area at the correspondence position of pcb board 2 welding led chips 1; This Kong Weiyong Heat Conduction Material is filled and led up to form like silver, copper, aluminium etc. and is filled heat-conducting layer 3, makes it to be one with pcb board 2.During use, led chip 1 is welded on the pcb board 2 and is connected with circuit, between led chip 1 bottom and filling heat-conducting layer 3, is coated with one deck heat-conducting silicone grease; Then, be fixed on pcb board 2 usefulness screws on the heat dissipation metal piece 4, between filling heat-conducting layer 3 and heat dissipation metal piece 4, be coated with one deck heat-conducting silicone grease or fill up a conducting strip.
Claims (1)
1. great power LED circuit plate structure; It is characterized in that: the pcb board face forms printed circuit through traditional etching technics; And reserve and position, the corresponding hole of led chip bottom area at the correspondence position of pcb board welding led chip; This Kong Weiyong high-thermal conductive metal material is filled and led up, make it with pcb board be an integral body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220207238 CN202634887U (en) | 2012-05-10 | 2012-05-10 | Large power LED circuit board structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220207238 CN202634887U (en) | 2012-05-10 | 2012-05-10 | Large power LED circuit board structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202634887U true CN202634887U (en) | 2012-12-26 |
Family
ID=47388019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201220207238 Expired - Fee Related CN202634887U (en) | 2012-05-10 | 2012-05-10 | Large power LED circuit board structure |
Country Status (1)
Country | Link |
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CN (1) | CN202634887U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111263506A (en) * | 2018-11-30 | 2020-06-09 | 浙江宇视科技有限公司 | Circuit board and electronic equipment |
-
2012
- 2012-05-10 CN CN 201220207238 patent/CN202634887U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111263506A (en) * | 2018-11-30 | 2020-06-09 | 浙江宇视科技有限公司 | Circuit board and electronic equipment |
CN111263506B (en) * | 2018-11-30 | 2021-06-01 | 浙江宇视科技有限公司 | Circuit board and electronic equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20130510 |