JP3133586U - LED lamp heat dissipation structure - Google Patents

Abstract

Provided is a heat dissipation structure for an LED lamp.
The present invention is a kind of heat dissipation structure for an LED lamp, and particularly refers to a heat dissipation structure applicable to higher performance LEDs. It includes a circuit board, LEDs provided on the circuit board, and a heat conduction plate provided below the circuit board, and a lamp base is provided outside. The outside of the lamp pedestal has a large number of heat radiating fins. The main feature thereof is that an insulating heat exchange film is coupled to the circuit board, and the lamp pedestal and the heat radiating fin can be covered with the same insulating heat exchange film. Utilizing its high thermal conductivity and high heat dissipation, it is possible to effectively lower the temperature when using LEDs and extend the service life.
[Selection] Figure 3

Description

  The present invention is a kind of LED lamp heat dissipation structure, which can directly cover the circuit board of the LED using an insulating heat exchange membrane, and effectively and quickly extracts and eliminates the heat energy generated when the LED emits light. LED can be protected because it can.

  Since LED lamps consume less energy when emitting light, they replace the traditional tongue-stan bulbs of many products and are widely applied. The application range includes, for example, decorative lamps, advertising signs, traffic signals, and the like. LED lamps can emit light with a small amount of electricity, but they can also emit high temperatures. Therefore, it can be used only for low-power products at present, but it cannot be applied to high-performance LED lamps. For example, a well-known 4 watt LED lamp emits light for more than an hour, and then the temperature of the lamp base rises to 70 ° C to 80 ° C. In general, above 90 ° C, LEDs can be easily damaged or their service life can be significantly shortened. Therefore, the well-known one can make only this output performance.

  As for the analysis on the method of lowering the temperature when using a well-known LED lamp, as shown in FIGS. 1 and 2, the structure diagram of the circuit board (1), the LED (2) provided on it, and the circuit board (1) A heat conduction plate (3) provided below is included. The entire structure is housed in the lamp pedestal (4), and a large number of radiating fins (41) are installed on the outside of the lamp pedestal (4). The heat conduction plate (3) absorbs the heat generated when the LED (2) emits light and transmits it to the lamp pedestal (4) and heat radiation fin (41) in a contact and conduction manner to achieve the purpose of heat dissipation. To do. In general, the conventional heat conducting plate (3), lamp base (4) and heat radiating fin (41) are made of copper or aluminum material to improve the heat radiating effect, but this effect is not desirable.

  The present invention provides an LED lamp with a kind of excellent heat dissipation structure, directly covers the circuit board using a kind of insulating heat exchange membrane, and extends to the surface of the lamp pedestal and the radiation fin. The effect of lowering the temperature by radiating heat quickly is achieved.

  As shown in FIGS. 3 and 4, the present invention includes a circuit board (1), an LED (2), a heat conduction plate (3), a lamp base (4) and a heat radiating fin (41) of a general LED lamp. Yes. The main feature is that the circuit board (1) is covered with the insulating exchange membrane (5), the outside is extended to the lamp base (4), and the entire heat radiation fin (41) can be covered. The insulation exchange membrane (5) is formed by dissolving nanocarbon in liquid glass, is an insulator, and has high thermal conductivity and high heat dissipation.

The invention of claim 1 is a circuit board for coupling an LED, a heat conduction plate is provided below the circuit board, the entire structure is housed in a lamp pedestal, and a large number of radiating fins are installed outside the lamp pedestal. The plate is directly covered with an insulating heat exchange membrane, which is constructed by dissolving nanocarbon in a suitable medium, extending to the structure of the lamp pedestal, or extending to cover the entire radiating fin. However, the heat energy generated when the LED emits light accelerates the discharge to the outside, and the temperature can be lowered effectively.
The invention of claim 2 covers the insulating heat exchange membrane directly on the circuit board and extends to the external heat radiation fin, where the circuit board is a motherboard or CPU inside the computer, or a board that is likely to generate high heat. It is a kind of heat dissipation structure characterized by the above.

  The present invention is a kind of LED lamp heat dissipation structure, and particularly refers to a heat dissipation structure applicable to higher performance LEDs. It includes a circuit board, LEDs provided on the circuit board, and a heat conduction plate provided below the circuit board, and a lamp base is provided outside. The outside of the lamp pedestal has a large number of heat radiating fins. The main feature thereof is that an insulating heat exchange film is coupled to the circuit board, and the lamp pedestal and the heat radiating fin can be covered with the same insulating heat exchange film. Utilizing its high thermal conductivity and high heat dissipation, it is possible to effectively lower the temperature when using LEDs and extend the service life.

  Since the heat exchange membrane (5) assembled in the present invention is a non-conductor, it can directly cover the circuit board (1) and the external connection side of the conductive wire that electrically connects the LED light-emitting chip Because it can be in direct contact with the LED, the energy generated during LED emission can be extracted more efficiently. In actual tests, when the heat exchange membrane (5) extends to the position of the lamp base (4), the temperature of the LED lamp drops to 60 ° C, and the heat exchange membrane (5) covers the entire heat dissipation fin (41). When extended to do so, the temperature drops to 50 ° C. Therefore, it can be seen that the present invention has a better heat dissipation effect than the conventional one. Based on this, the manufacture of high-power LED lamps is provided, the better lighting effect is obtained, and the LED light-emitting lamps are not damaged.

  In summary, the present invention meets the requirements of the utility model. However, the above contents are only examples that the present invention applies to LED lamps, and applications and modifications made based on this concept , All shall be included in the scope of the utility model registration request. For example, as shown in FIGS. 5 and 6, the present invention uses an insulating heat exchange membrane (5) to generate extremely high heat, directly covers the CPU (6), and the original motherboard is connected. It can also be extended to the radiating fin (61). By doing so, the operating temperature can be lowered efficiently when the motherboard of any type of computer runs at high speed, preventing computer shutdown and damage.

It is a three-dimensional view of a known LED lamp. FIG. 2 is a cross-sectional plan view of FIG. 1. It is a three-dimensional view of the present invention. FIG. 4 is a cross-sectional plan view of FIG. 3. It is a three-dimensional view of a known CPU structure. It is a three-dimensional view in which the present invention is applied to a CPU of a computer.

Explanation of symbols

(1) Circuit board (2) LED
(3) Heat conduction plate (4) Lamp base (5) Insulating heat exchange membrane (6) CPU
(41) Radiation fin (61) Radiation fin

Claims (2)

  Including a circuit board for coupling the LED, a heat conduction plate is provided below the circuit board, the entire structure is housed in the lamp pedestal, and a large number of radiating fins are installed outside the lamp pedestal. It is to cover directly with an insulating heat exchange membrane, and this membrane is constructed by dissolving nanocarbon in a suitable medium, extending to the structure of the lamp pedestal, or extending to cover the entire heat dissipation fin. A kind of LED lamp heat dissipation structure, characterized in that the thermal energy generated when the LED emits light can accelerate the discharge to the outside and effectively lower the temperature.   Cover the insulating heat exchange membrane directly on the circuit board and extend it to the external radiating fins, where the circuit board is like a motherboard or CPU inside the computer, or a board that easily generates high heat A kind of heat dissipation structure.

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