CN201204203Y - Radiating device for high-power LED - Google Patents

Radiating device for high-power LED Download PDF

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Publication number
CN201204203Y
CN201204203Y CNU200820031920XU CN200820031920U CN201204203Y CN 201204203 Y CN201204203 Y CN 201204203Y CN U200820031920X U CNU200820031920X U CN U200820031920XU CN 200820031920 U CN200820031920 U CN 200820031920U CN 201204203 Y CN201204203 Y CN 201204203Y
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CN
China
Prior art keywords
led
heat transfer
transfer block
heat
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU200820031920XU
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Chinese (zh)
Inventor
陈雷中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Led Trust Photoelectron Technology Ltd
Original Assignee
Wuxi Led Trust Photoelectron Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Led Trust Photoelectron Technology Ltd filed Critical Wuxi Led Trust Photoelectron Technology Ltd
Priority to CNU200820031920XU priority Critical patent/CN201204203Y/en
Application granted granted Critical
Publication of CN201204203Y publication Critical patent/CN201204203Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a cooling device of a lamp taking a high-power LED as the light source, which is characterized in that a high-power LED thermal device includes a high-power white light LED, a printed circuit board (PCB) on the back side of the LED and a heat radiator, wherein, a cooling module is provided between the PCB and the heat radiator of the LED. The cooling module includes a heat transfer block connected to the PCB of the LED, and a cooling block connected to the heat transfer block, wherein, the cooling block is made of semi-conducting material and the heat transfer block is made of aluminum alloy. An insulating compound is provided between the cooling block and the heat transfer block, one end of the heat radiator is provided with a fan. The high-power LED has a plurality of heat dissipation routes, which is inaccessible by the conventional LED cooling device, so that the junction temperature of the LED drops to 45 DEG C and the LED has a higher light emission rate and longer life.

Description

The heat abstractor of great power LED
Technical field
The technical field that the utility model relates to is to be the heat abstractor of the light fixture of light source with the great power LED.
Background technology
In recent years, large power white light LED (light-emitting diode) performance improves constantly, and its power also constantly increases, and develops the super high power white light LEDs of 20~100W.Since large power white light LED have the luminous power height (60~100Im/W), long characteristics of power consumptive province and life-span, develop the light fixture that various large power white light LEDs are light source, as high light flashlight, mine lamp and various indoor and outdoor illuminating lamp.
LED is the device that a kind of electric energy converts luminous energy to, in the transfer process only about 20% power conversion become luminous energy, about 80% power conversion to become heat energy.The heat of this conversion raises the junction temperature of LED, if do not take cooling measure, after then the junction temperature of LED surpassed 150 ℃, LED understood overheated and damages.In addition,,, be unlikely to damage, when junction temperature reaches 100 ℃, can reduce the light emission rate of LED, reduce brightness though the junction temperature of LED is lower than 150 ℃ if the heat abstractor radiating effect that adopts is poor, and the life-span that can reduce LED.So the design of its heat abstractor of light fixture that great power LED is made is crucial.
Traditional heat dissipating method is to add metal heat sink at the printed board PCB back side of welding great power LED, is a kind of natural cooling (passive cooled) mode, and this is only applicable to tens watts of LED light fixture heat radiations to nearly hectowatt.When adopting passive cooled on the LED light fixture more than 100 watts, the volume of its radiator is too big, and radiating effect is poor, therefore often on radiator, add a fan again,, strengthen the cooling of radiator with the air-flow that fan produces, reach the effect of improving heat radiation, this is a kind of active heat abstractor.
Summary of the invention
Technical problem to be solved in the utility model provide a kind of be applicable to great power LED as light source and the better cooling device of radiating effect.
The technical solution of the utility model is: a kind of high-power LED heat radiating device, comprise large power white light LED, the printed substrate PCB at LED back, radiator, and between the printed substrate PCB of described LED and radiator, be provided with the refrigeration module.
Described refrigeration module comprises that the printed substrate PCB of LED goes up the heat transfer block that connects, the refrigerating sheet that connects on the heat transfer block.The material of described refrigerating sheet is a semi-conducting material, and the material of described heat transfer block is an aluminium alloy.Can be provided with heat-insulating material between described heat transfer block and the refrigerating sheet, the other end of described radiator can be provided with fan.
Beneficial effect: between the printed substrate PCB of LED and radiator, the refrigeration module is set, the refrigeration module comprises that the printed substrate PCB of LED goes up the heat transfer block that connects, the refrigeration that connects on the heat transfer block. sheet, the another side of heat transfer block contacts with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, and the hot side of semiconductor chilling plate contacts with radiator, refrigerating sheet is made with semiconductor, utilize its surface decline (refrigeration) when energising, the effect of another surface temperature rising (heating) is dispelled the heat, cooling piece (adds certain voltage in energising, electric current) after, the maximum temperature difference of its hot side and huyashi-chuuka (cold chinese-style noodles) can reach 60 ℃, the heat radiation approach of great power LED is in huyashi-chuuka (cold chinese-style noodles) → hot side → radiator → surrounding air by shell → PCB → heat transfer block → cooling piece of tube core → LED of LED, the heat radiation approach is many, and this is that traditional LED heat abstractor is inaccessible.
If need lower junction temperature, a direct current brush-less fan can also be set on radiator, the heat that quickens fin sheds, and can make the huyashi-chuuka (cold chinese-style noodles) temperature of semiconductor chilling plate lower, can obtain lower LED junction temperature.The junction temperature of LED is dropped to about 45 ℃, make the light emission rate of LED higher, and the long life-span is arranged.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the radiator structure schematic diagram of being made up of two refrigeration modules of the present utility model.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing
Among Fig. 1, high-power LED heat radiating device comprises printed substrate PCB5, the radiator 1 at large power white light LED 6, LED back, is provided with the refrigeration module between the printed substrate PCB5 of LED and radiator 1.The refrigeration module comprises that the printed substrate PCB of LED goes up the heat transfer block 4 that connects, the refrigerating sheet 3 that connects on the heat transfer block, the face that refrigerating sheet 3 contacts with heat transfer block 4 is a huyashi-chuuka (cold chinese-style noodles) 8, the face that refrigerating sheet 3 contacts with radiator 1 is a hot side 9, the material of refrigerating sheet 3 is a semi-conducting material, the material of heat transfer block 4 is an aluminium alloy, has adiabatic expanded material 2 to fill between heat transfer block 4 and the refrigerating sheet 3, and the other end of radiator 1 is provided with fan 7.
During large power white light LED work, the heat of generation is mainly dispelled the heat by way of being: hot side 9 → radiator 1 → fan 7 → surrounding air of the huyashi-chuuka (cold chinese-style noodles) 8 → semiconductor chilling plate 3 of white light LEDs 6 → PCB5 → heat transfer block 4 → semiconductor chilling plate 3.
Heat transfer block 4 not only has heat transfer effect, and Homogeneouslly-radiating (make the junction temperature difference of the LED that PCB go up to distribute little).Adiabatic expanded material 2 makes the hot side 9 of semiconductor chilling plate with huyashi-chuuka (cold chinese-style noodles) 8 good thermal insulation be arranged, and improves refrigeration.Good refrigeration is to be based upon on the basis of radiator good heat radiating, so radiator needs enough volumes, and requires well thermal conductivity really.
For reducing thermal resistance, reaching the silicone grease that should be coated with the good heat conductive performance between cooling piece hot side and the radiator bottom surface between PCB and the heat transfer block.
If the quantity of large power white light LED is many, the PCB area is big, can adopt cold of a plurality of semiconductor refrigeratings and heat transfer block and heat-insulating material to make the radiator structure of refrigeration module 10, as shown in Figure 2.

Claims (6)

1, a kind of high-power LED heat radiating device comprises large power white light LED, the printed substrate PCB at LED back, radiator, it is characterized in that: be provided with the refrigeration module between the printed substrate PCB of described LED and radiator.
2, high-power LED heat radiating device according to claim 1 is characterized in that: described refrigeration module comprises that the printed substrate PCB of LED goes up the heat transfer block that connects, the refrigerating sheet that connects on the heat transfer block.
3, high-power LED heat radiating device according to claim 2 is characterized in that: be provided with heat-insulating material between described heat transfer block and the refrigerating sheet.
4, high-power LED heat radiating device according to claim 1 is characterized in that: the other end of described radiator is provided with fan.
5, high-power LED heat radiating device according to claim 2 is characterized in that: the material of described refrigerating sheet is a semi-conducting material.
6, high-power LED heat radiating device according to claim 2 is characterized in that: the material of described heat transfer block is an aluminium alloy.
CNU200820031920XU 2008-03-04 2008-03-04 Radiating device for high-power LED Expired - Fee Related CN201204203Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU200820031920XU CN201204203Y (en) 2008-03-04 2008-03-04 Radiating device for high-power LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU200820031920XU CN201204203Y (en) 2008-03-04 2008-03-04 Radiating device for high-power LED

Publications (1)

Publication Number Publication Date
CN201204203Y true CN201204203Y (en) 2009-03-04

Family

ID=40426518

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU200820031920XU Expired - Fee Related CN201204203Y (en) 2008-03-04 2008-03-04 Radiating device for high-power LED

Country Status (1)

Country Link
CN (1) CN201204203Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012040925A1 (en) * 2010-09-30 2012-04-05 李翔 Led street lamp using thermoelectric cooling device
CN103050610A (en) * 2012-02-01 2013-04-17 俞国宏 High photosynthetic efficiency white light LED (light-emitting diode) flip chip
CN103453364A (en) * 2013-08-27 2013-12-18 湖北爱商光电股份有限公司 Novel LED (Light-Emitting Diode) bay light and assembling method thereof
US8888328B2 (en) 2012-12-12 2014-11-18 Orbotech Ltd. Light engine
TWI496517B (en) * 2013-08-22 2015-08-11 Unimicron Technology Corp Wiring board structure
CN109185800A (en) * 2018-08-17 2019-01-11 郴州智上光电科技有限公司 A kind of graphene heat dissipation intelligent energy-saving street lamp

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012040925A1 (en) * 2010-09-30 2012-04-05 李翔 Led street lamp using thermoelectric cooling device
CN103050610A (en) * 2012-02-01 2013-04-17 俞国宏 High photosynthetic efficiency white light LED (light-emitting diode) flip chip
CN103050610B (en) * 2012-02-01 2014-10-22 俞国宏 High photosynthetic efficiency white light LED (light-emitting diode) flip chip
US8888328B2 (en) 2012-12-12 2014-11-18 Orbotech Ltd. Light engine
TWI496517B (en) * 2013-08-22 2015-08-11 Unimicron Technology Corp Wiring board structure
CN103453364A (en) * 2013-08-27 2013-12-18 湖北爱商光电股份有限公司 Novel LED (Light-Emitting Diode) bay light and assembling method thereof
CN109185800A (en) * 2018-08-17 2019-01-11 郴州智上光电科技有限公司 A kind of graphene heat dissipation intelligent energy-saving street lamp

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090304

Termination date: 20110304