CN203757671U - Heat-conducting waterproof silicone pad - Google Patents
Heat-conducting waterproof silicone pad Download PDFInfo
- Publication number
- CN203757671U CN203757671U CN201420167260.3U CN201420167260U CN203757671U CN 203757671 U CN203757671 U CN 203757671U CN 201420167260 U CN201420167260 U CN 201420167260U CN 203757671 U CN203757671 U CN 203757671U
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- Prior art keywords
- heat
- silicone pad
- metal
- pad
- graphite flake
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- Expired - Fee Related
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Abstract
The utility model discloses a heat-conducting waterproof silicone pad, which comprises a graphite sheet, metal covered edges, a silicone ring, an aluminum substrate, a silicone pad and a metal braid layer, wherein the graphite sheet is arranged in the aluminum substrate, and is connected with a lamp holder through a circuit board, a lamp body is arranged in the lamp holder, the silicone ring is arranged on the outer side of the lamp holder, the silicone pad is arranged on the lower end of the graphite sheet, the metal braid layer is embedded in the silicone pad, a cooling copper plate is arranged on the lower side of the silicone pad, a cooling pin is arranged on the bottom end of the cooling copper plate, the metal covered edges are arranged on the two sides of the cooling copper plate, and are of C-type metal structures, and a lampshade is arranged on the upper ends of the metal covered edges, and is of an arc-shaped transparent structure. The heat-conducting waterproof silicone pad can greatly prolong service life of the silicone pad by arranging the metal braid layer in silicone, improves high heat transfer efficiency by arranging the metal covered edges on the outer side of the silicone pad, and guarantees service life of the silicone pad at the same time.
Description
Technical field
The utility model relates to silica gel technical field, is specially a kind of heat conduction water-proof silica-gel pad.
Background technology
The same with other light source, semiconductor light emitting diode (LED) also can produce heat during operation, and how much it depends on whole luminous efficiency.Power up outside under energy, the radiation recombination generation electroluminescent in electronics and hole, near the light radiating PN junction also needs just can arrive at the external world through the semiconductor medium of chip itself and encapsulation medium.Comprehensive electric current injection efficiency, radioluminescence quantum efficiency, chip exterior light take out efficiency etc., and finally probably only having the input electric energy conversion of 30-40% is luminous energy, and the energy of all the other 60-70% mainly transforms heat energy with the form of the lattice vibration of non-radiative compound generation.
In general, whether the work of LED lamp is stable, quality quality, and most important with lamp body heat radiation itself, the heat radiation of the high-brightness LED lamp on market, usually adopts natural heat dissipation, and effect is unsatisfactory.The LED light fixture that LED light source is made, is comprised of LED, radiator structure, driver, lens, and therefore heat radiation is also a part and parcel, if LED can not finely dispel the heat, its life-span also can be influenced.
At present, the heat dissipating method of LED mainly contains aluminium radiating fin, with aluminium radiating fin, as the part of shell, increases area of dissipation; Heat-conducting plastic shell, is used LED insulating radiation plastics substitution of Al alloy to make radiator; Surface emissivity radiating treatment, smears heat loss through radiation paint, and heat is taken away to lamp housing surface with radiation mode; Air fluid mechanics, utilizes lamp housing profile, produces convection current air; Fan, inner with long-service life high-efficiency fan reinforcement heat radiation at lamp housing; Heat pipe, leads shell radiating fin by heat by LED chip; Liquid ball bubble, is filled into the higher transparency liquid of thermal conductivity in lamp body ball bubble; Utilize lamp holder, as screw socket, have the lamp holder heat radiation of larger metal surface; These methods are each has something to recommend him, can both solve some problems, but have limitation.
Utility model content
The technical problem that the utility model solves is to provide a kind of heat conduction water-proof silica-gel pad, to solve the problem proposing in above-mentioned background technology.
The technical problem that the utility model solves realizes by the following technical solutions: a kind of heat conduction water-proof silica-gel pad, comprise: graphite flake, metal hemming edge, silica gel ring, aluminium base, silicagel pad, wire sheathing, in described aluminium base, be provided with graphite flake, graphite flake connects lamp socket by circuit board, in lamp socket, be provided with lamp body, lamp socket outside is provided with silica gel ring, graphite flake lower end is provided with silicagel pad, silicagel pad is embedded with wire sheathing, silicagel pad downside is provided with heat radiation copper coin, heat radiation copper coin bottom is provided with radiating fin, graphite flake, aluminium base, heat radiation copper coin both sides are provided with metal hemming edge, metal hemming edge is C type metal structure, metal hemming edge upper end is provided with lampshade, lampshade is arc transparent configuration.
Described graphite flake comprises electrographite sheet and natural graphite flakes, and electrographite sheet and natural graphite flakes are arranged alternately.
Described radiating fin becomes matrix form to distribute in heat radiation copper coin bottom.
Compared with prior art, the beneficial effects of the utility model are: the utility model by arranging wire sheathing in silica gel, can greatly improve silicagel pad service life, in silicagel pad outside, be provided with simultaneously and when metal hemming edge improves heat conduction efficiency, ensure silicagel pad service life.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1, lamp body; 2, lamp socket; 3, graphite flake; 4, metal hemming edge; 5, silica gel ring; 6, circuit board; 7, aluminium base; 8, silicagel pad; 9, wire sheathing; 10, heat radiation copper coin; 11, radiating fin; 12, lampshade.
The specific embodiment
In order to make of the present utility modelly to realize technological means, creation characteristic, reach object and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
As shown in Figure 1, a kind of heat conduction water-proof silica-gel pad, comprise: graphite flake 3, metal hemming edge 4, silica gel ring 5, aluminium base 7, silicagel pad 8, wire sheathing 9, in described aluminium base 7, be provided with graphite flake 3, graphite flake 3 connects lamp socket 2 by circuit board 6, in lamp socket 2, be provided with lamp body 1, lamp socket 2 outsides are provided with silica gel ring 5, graphite flake 3 lower ends are provided with silicagel pad 8, silicagel pad 8 is embedded with wire sheathing 9, silicagel pad 8 downsides are provided with heat radiation copper coin 10, heat radiation copper coin 10 bottoms are provided with radiating fin 11, graphite flake 3, aluminium base 7, heat radiation copper coin 10 both sides are provided with metal hemming edge 4, metal hemming edge 4 is C type metal structure, metal hemming edge 4 upper ends are provided with lampshade 12, lampshade 12 is arc transparent configuration.
Described graphite flake 3 comprises electrographite sheet and natural graphite flakes, and electrographite sheet and natural graphite flakes are arranged alternately.
Described radiating fin 11 becomes matrix form to distribute in heat radiation copper coin 10 bottoms.
Between aluminium base and heat-dissipating aluminium plate, be coated with paving one deck silica gel, at the another side installing insulating circuit board of aluminium base, in insulating circuit board appearance, be coated with again paving one deck silica gel; On aluminium base and insulating circuit board, dig hole, will in hole, fill graphite and make graphite directly touch the silica gel between aluminium base and heat-dissipating aluminium plate; Then the centre of the bottom surface of the lamp socket of lamp body is directly contacted with graphite, the outer shroud position of the bottom surface of lamp socket is connected with insulating circuit board, and the silica gel that the side of lamp socket is layered on insulating circuit board appearance by painting surrounds; Make the silica gel heat abstractor of the utility model LED fluorescent tube.
During use, the heat major part on lamp socket is conducted to the silica gel between aluminium base and heat-dissipating aluminium plate rapidly by the graphite of bottom surface, then is conducted to heat-dissipating aluminium plate and distributed rapidly by silica gel; Meanwhile, separately some is distributed rapidly by the silica gel of lamp socket side; Utilizing like this graphite and silica gel easily to pass thermal property distributes the heat of lamp body generation rapidly by graphite and silica gel, greatly improved radiating efficiency, reduced the temperature of lamp body, silica gel be coated be layered on lamp body surrounding and under, can also play moistureproof and dustproof effect, extend the Acceptable life of whole lamp body.
More than show and described basic principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and description, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.Claimed scope of the present utility model is defined by appending claims and equivalent thereof.
Claims (3)
1. a heat conduction water-proof silica-gel pad, comprise: graphite flake, metal hemming edge, silica gel ring, aluminium base, silicagel pad, wire sheathing, it is characterized in that: in described aluminium base, be provided with graphite flake, graphite flake connects lamp socket by circuit board, in lamp socket, be provided with lamp body, lamp socket outside is provided with silica gel ring, graphite flake lower end is provided with silicagel pad, silicagel pad is embedded with wire sheathing, silicagel pad downside is provided with heat radiation copper coin, heat radiation copper coin bottom is provided with radiating fin, graphite flake, aluminium base, heat radiation copper coin both sides are provided with metal hemming edge, metal hemming edge is C type metal structure, metal hemming edge upper end is provided with lampshade, lampshade is arc transparent configuration.
2. a kind of heat conduction water-proof silica-gel pad according to claim 1, is characterized in that: described graphite flake comprises electrographite sheet and natural graphite flakes, and electrographite sheet and natural graphite flakes are arranged alternately.
3. a kind of heat conduction water-proof silica-gel pad according to claim 1, is characterized in that: described radiating fin becomes matrix form to distribute in heat radiation copper coin bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420167260.3U CN203757671U (en) | 2014-04-09 | 2014-04-09 | Heat-conducting waterproof silicone pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420167260.3U CN203757671U (en) | 2014-04-09 | 2014-04-09 | Heat-conducting waterproof silicone pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203757671U true CN203757671U (en) | 2014-08-06 |
Family
ID=51252939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420167260.3U Expired - Fee Related CN203757671U (en) | 2014-04-09 | 2014-04-09 | Heat-conducting waterproof silicone pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203757671U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770187A (en) * | 2018-06-13 | 2018-11-06 | 无锡飞述科技有限公司 | A kind of novel PCB circuit board |
-
2014
- 2014-04-09 CN CN201420167260.3U patent/CN203757671U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770187A (en) * | 2018-06-13 | 2018-11-06 | 无锡飞述科技有限公司 | A kind of novel PCB circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140806 Termination date: 20150409 |
|
| EXPY | Termination of patent right or utility model |