CN201851917U - High-power LED (Light Emitting Diode) lamp conducting heat by using average-temperature plate - Google Patents

High-power LED (Light Emitting Diode) lamp conducting heat by using average-temperature plate Download PDF

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Publication number
CN201851917U
CN201851917U CN2010205394469U CN201020539446U CN201851917U CN 201851917 U CN201851917 U CN 201851917U CN 2010205394469 U CN2010205394469 U CN 2010205394469U CN 201020539446 U CN201020539446 U CN 201020539446U CN 201851917 U CN201851917 U CN 201851917U
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CN
China
Prior art keywords
temperature
radiator
average
heat
temperature plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205394469U
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Chinese (zh)
Inventor
于正国
胡锡兵
李静静
杨佳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI LADER OPTOELECTRONICS TECHNOLOGY Co Ltd
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ANHUI LADER OPTOELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN2010205394469U priority Critical patent/CN201851917U/en
Application granted granted Critical
Publication of CN201851917U publication Critical patent/CN201851917U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a high-power LED (Light Emitting Diode) lamp conducting heat by using an average-temperature plate, which comprises an LED chip, a circuit board, a radiator and the average-temperature plate, wherein the LED chip is directly encapsulated on one end face of the average-temperature plate; and the radiator is connected with the other end face of the average-temperature plate. In the utility model, the chip is directly fixed and encapsulated on the surface of the average-temperature plate and the PN junction temperature of the chip is directly transferred from an epitaxial layer to the average-temperature plate, thereby greatly increasing the heat transfer speed, bringing the cooling efficiency of the radiator into full play, effectively reducing the junction temperature of the LED, improving the light emitting efficiency of the LED chip, prolonging the service life of the LED chip and enlarging the power range of the high-power LED lamp to hectowatt even kilowatt.

Description

Adopt the high-power LED lamp of temperature-uniforming plate heat conduction
Technical field
The utility model relates to a kind of high-power LED lamp that adopts temperature-uniforming plate heat conduction.
Background technology
The LED semiconductor light sources is compared with conventional light source, has significant advantages such as energy-saving and environmental protection, long service life and operating cost is low, but because quantity of heat production is big and can't in time shed, has seriously restricted its development speed.How in time, the huge heat that led light source produces that sheds quickly and efficiently is technical barrier and the huge challenge that present numerous insiders face.Conventional high-power LED light source is led chip to be encapsulated on copper base or the ceramic substrate form light source module, then this light source module is fitted on the various radiators, carry out heat exchange with air, what radiating efficiency was best at present is the heat-pipe radiator that utilizes the circle heat pipe to make, the capillary porosity duct that has metal sintering to form in the tube wall of this round heat pipe, heated liquid vaporization in the evaporation ends inside pipe wall pore, the heat band is liquefied to condensation end again, and be back to evaporation ends through capillary porosity duct, circulation so repeatedly, constantly with the heat band to the low end of temperature.This heat pipe efficient in the utilization of the heating module of low heat flow density is very high, and shortcoming is that heater element is little with circle heat pipe surface contact area, several heat pipes need be fixed on one usually and have on mounting platform heat sink, and its capacity of heat transmission is restricted.In order to overcome this shortcoming, flat hot pipe is made after this round heat pipe is flattened by the producer that has, and forms flat surface, to increase generating surface, improves heat transfer efficiency.The problem that this heat transport schemes exists is the bad control of the processing procedure of heat pipe own and is difficult to bear bigger heat flow density, cause the radiating efficiency of radiator to be not in full use, the heat that chip PN junction district produces can't in time conduct to the heat radiation terminal efficiently, particularly adopt the high-power LED chip of power in the above integrated optical source of 1W, make junction temperature too high, cause the LED luminous efficiency to descend, wearing out of speed-up chip makes its scope of application and service life be restricted.
Summary of the invention
The purpose of this utility model is at the deficiencies in the prior art part, a kind of high-power LED lamp that adopts temperature-uniforming plate heat conduction is provided, can improves chip, thereby effectively reduce the LED junction temperature to the heat transfer efficiency between the radiator, improve the luminous efficiency of led chip, prolong its service life.
For achieving the above object, the utility model has adopted following technical scheme: it comprises led chip, circuit board and radiator, it also comprises a temperature-uniforming plate, and described led chip directly is encapsulated on the end face of temperature-uniforming plate, and described radiator is connected with the temperature-uniforming plate other end.Temperature-uniforming plate also claims flat-plate heat pipe, is a kind of of heat pipe, with temperature-uniforming plate alternative package substrate, led chip is directly fixed and is encapsulated on the surface of temperature-uniforming plate, effectively reduce the thermal resistance of substrate, not only rate of heat transfer is greatly improved, and can give full play to the heat transfer efficiency of radiator.And this structure can give full play to the big advantage of temperature-uniforming plate heater element mounting plane, and the encapsulated LED number of chips is many on the temperature-uniforming plate end face.
Above-mentioned radiator can adopt heat-pipe radiator, and the evaporation ends of heat pipe is fixed on the temperature-uniforming plate other end of packaging LED chips not.Temperature-uniforming plate and heat-pipe radiator form two heat pipe structures, and the condensation end of temperature-uniforming plate links to each other with the evaporation ends of heat pipe, can transmit heat better, the efficient of performance radiator.
Above-mentioned temperature-uniforming plate radiator also can adopt the heronsbill radiator, and the axial end of heronsbill radiator is fixed on the temperature-uniforming plate other end of packaging LED chips not.
As shown from the above technical solution, the scheme that the utility model solves is not conceived to improve the radiating efficiency of radiator, but start with from improving chip to the heat transfer efficiency between the radiator, with temperature-uniforming plate alternative package substrate, led chip is directly fixed and is encapsulated on the surface of temperature-uniforming plate, effectively reduce the thermal resistance of substrate, not only rate of heat transfer is greatly improved, and can give full play to the heat transfer efficiency of radiator, make whole system can comparatively fast reach thermal balance, the LED junction temperature can be reduced to below 125 ℃, improve the luminous efficiency of led chip, prolong its service life, make the lamp power of utilizing high power LED integrated optical source manufacturing can be promoted to more than 100 watts.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is another example structure schematic diagram of the utility model;
Fig. 4 is the vertical view of Fig. 3.
The specific embodiment
As shown in Figure 1 and Figure 2, radiator adopts by heat pipe 4, radiating fin 5, the copper base is heat sink 6 heat-pipe radiators of forming, the evaporation ends of heat pipe 4 is fixed on the copper base heat sink 6, the condensation end of heat pipe 4 is connected with radiating fin 5, one end face of temperature-uniforming plate 3 is fixed on the heater element of heat-pipe radiator and installs on the end face, thereby form the radiator of two heat pipe structures, led chip 1 is encapsulated in by latticed form on the other end of temperature-uniforming plate 3, is electrically connected with circuit board 2 again.The shell of light fixture and driving electrical appliance part thereof do not draw in the drawings.
Radiating element of the present utility model also can adopt the heronsbill radiator, its structure as shown in Figure 3 and Figure 4, temperature-uniforming plate 3 is arranged in the axial top of heronsbill radiator 7, led chip 1 directly is encapsulated on the other end of temperature-uniforming plate 3, is electrically connected with circuit board 2 again.Lamp outer casing and driving electrical appliance part thereof do not draw in the drawings.

Claims (3)

1. adopt the high-power LED lamp of temperature-uniforming plate heat conduction, comprise led chip (1), circuit board (2) and radiator, it is characterized in that: it also comprises a temperature-uniforming plate (3), described led chip (1) directly is encapsulated on the end face of temperature-uniforming plate (3), and described radiator is connected with temperature-uniforming plate (3) other end.
2. the high-power LED lamp of employing temperature-uniforming plate according to claim 1 heat conduction is characterized in that: described radiator is a heat-pipe radiator, and the evaporation ends of heat pipe (4) is fixed on not on the temperature-uniforming plate of packaging LED chips (3) other end.
3. the high-power LED lamp of employing temperature-uniforming plate according to claim 1 heat conduction is characterized in that: described radiator is heronsbill radiator (7), and the axial end of heronsbill radiator (7) is fixed on not on the temperature-uniforming plate of packaging LED chips (3) other end.
CN2010205394469U 2010-09-19 2010-09-19 High-power LED (Light Emitting Diode) lamp conducting heat by using average-temperature plate Expired - Fee Related CN201851917U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205394469U CN201851917U (en) 2010-09-19 2010-09-19 High-power LED (Light Emitting Diode) lamp conducting heat by using average-temperature plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205394469U CN201851917U (en) 2010-09-19 2010-09-19 High-power LED (Light Emitting Diode) lamp conducting heat by using average-temperature plate

Publications (1)

Publication Number Publication Date
CN201851917U true CN201851917U (en) 2011-06-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205394469U Expired - Fee Related CN201851917U (en) 2010-09-19 2010-09-19 High-power LED (Light Emitting Diode) lamp conducting heat by using average-temperature plate

Country Status (1)

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CN (1) CN201851917U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102613146A (en) * 2012-04-17 2012-08-01 海南鑫镁科技有限公司 High-power light-emitting diode (LED) energy-saving fish gathering lamp
CN106016207A (en) * 2016-05-27 2016-10-12 河南中云创光电科技股份有限公司 High-power LED lamp and machining method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102613146A (en) * 2012-04-17 2012-08-01 海南鑫镁科技有限公司 High-power light-emitting diode (LED) energy-saving fish gathering lamp
CN106016207A (en) * 2016-05-27 2016-10-12 河南中云创光电科技股份有限公司 High-power LED lamp and machining method thereof
CN106016207B (en) * 2016-05-27 2019-02-01 浙江三森科技股份有限公司 High-power LED lamp and its processing method

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110601

Termination date: 20130919