WO2012040925A1 - Led street lamp using thermoelectric cooling device - Google Patents

Led street lamp using thermoelectric cooling device Download PDF

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Publication number
WO2012040925A1
WO2012040925A1 PCT/CN2010/077502 CN2010077502W WO2012040925A1 WO 2012040925 A1 WO2012040925 A1 WO 2012040925A1 CN 2010077502 W CN2010077502 W CN 2010077502W WO 2012040925 A1 WO2012040925 A1 WO 2012040925A1
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Prior art keywords
heat
street lamp
led
led street
semiconductor
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PCT/CN2010/077502
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French (fr)
Chinese (zh)
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邓树兴
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李翔
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Priority to PCT/CN2010/077502 priority Critical patent/WO2012040925A1/en
Publication of WO2012040925A1 publication Critical patent/WO2012040925A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/54Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10Outdoor lighting
    • F21W2131/103Outdoor lighting of streets or roads
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to an LED street lamp, in particular to an LED street lamp using a semiconductor refrigeration device.
  • LED has high luminous efficiency, long life, easy to intelligent management, energy saving and environmental protection. With the improvement of LED stability, high power performance and cost reduction, street lamps have been made and applied in urban roads and other lighting fields. .
  • the technical solution of the present invention is to provide an LED street lamp using a semiconductor refrigeration device, comprising a plurality of LED lighting tubes, an LED substrate, a metal heat collecting plate, and a metal fin type heat sink, wherein the LED The light-emitting tube is mounted on the LED substrate, and the metal heat collecting plate is closely attached to the LED substrate; a heat insulating material layer and a semiconductor refrigerator are mounted between the metal heat collecting plate and the metal fin heat sink, and the semiconductor refrigerator is The cooling surface is attached to the metal heat collecting plate, and the metal fin type heat sink is mounted above the heat generating surface of the semiconductor refrigerator.
  • the LED street lamp using the semiconductor refrigeration device has a heat insulating material layer and a semiconductor cooler mounted between the metal heat collecting plate and the metal fin heat sink, so that the LED light pipe is cooled and dissipated from the LED light pipe. Passive change to active and good effect, high reliability, simple installation, compact structure, light weight and long working life.
  • the technical problem to be solved by the present invention is to provide an LED street lamp using a semiconductor refrigeration device, which has good heat dissipation, simple installation, compact structure, light weight and long working life.
  • Another technical problem to be solved by the present invention is to provide an LED using a semiconductor refrigeration device.
  • the street lamp has good heat dissipation, simple installation, compact structure, light weight and long working life.
  • an LED street lamp using a semiconductor refrigeration device comprising a plurality of LED light-emitting tubes, an LED substrate, a metal heat collecting plate, and a metal fin-type heat sink, wherein the LED light-emitting tube is mounted on the LED substrate, the metal heat collecting plate and The LED substrate is closely attached; a heat insulating material layer and a semiconductor refrigerator are installed between the metal heat collecting plate and the metal fin heat sink, and the cooling surface of the semiconductor cooler is attached to the metal heat collecting plate, and the metal fin The chip heat sink is mounted above the heat generating surface of the semiconductor refrigerator.
  • an LED street lamp using a semiconductor refrigeration device comprising a plurality of LED light-emitting tubes, a heat-conductive ceramic-based circuit board, and a metal fin-type heat sink, wherein the LED light-emitting tubes are directly mounted on the heat-conductive ceramic-based circuit board;
  • a layer of heat insulating material and a semiconductor cooler are mounted between the ceramic-based circuit board and the metal fin-type heat sink, and the cooling surface of the semiconductor cooler is attached to the heat-conductive ceramic-based circuit board, and the metal fin-type heat sink is mounted on Above the heating surface of the semiconductor cooler.
  • the LED street lamp adopting the semiconductor refrigeration device has a heat insulating material layer and a semiconductor refrigerator mounted between the heat conductive ceramic base circuit board and the metal fin heat sink, so that the light emitting tube is cooled and dissipated from the light source. Passive change to active and good effect, high reliability, simple installation, compact structure, light weight and long working life.
  • Figure 1 is a schematic cross-sectional view showing an embodiment of an LED street lamp using a semiconductor refrigeration device of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing another embodiment of an LED street lamp using a semiconductor refrigeration device of the present invention.
  • Figure 3 is a block diagram of the electrical principle of the embodiment of Figures 1 and 2.
  • the LED street lamp includes a plurality of LED light-emitting tubes 1, an LED substrate 2, a metal heat collecting plate 3, and a metal fin type.
  • the heat sink 7, the outer casing 8 and the transparent plastic plate 9, the LED light-emitting tube 1 is mounted on the LED substrate 2, the metal heat collecting plate 3 and the LED substrate 2 are closely attached, the metal heat collecting plate 3 and the metal fin-type heat sink 7 is the radiator inside the LED street light.
  • An asbestos thermal insulation layer 4 and a semiconductor refrigerator 6 are installed between the metal heat collecting plate 3 and the metal fin type heat sink 7.
  • the hot plate 3 is closely attached, and the metal fin type heat sink 7 is mounted above the heat generating surface of the semiconductor refrigerator 6.
  • the asbestos insulation layer 4 does not cause heat exchange between the cooling surface of the semiconductor refrigerator 6 and the heat generating surface, and the asbestos insulation layer 4 may be another layer of heat insulating material.
  • the LED substrate 2, the metal heat collecting plate 3, the asbestos insulating layer 4, the semiconductor cooler 6 and the metal finned heat sink 7 are connected as a substrate by two or more phenolic plastic connecting columns 5, the phenolic plastic
  • the connecting post 5 can also be a plastic connecting post with a small heat transfer coefficient.
  • the phenolic plastic connecting post 5 can also prevent heat conduction between the cooling surface of the semiconductor cooler 6 and the heat generating surface.
  • the base body is connected to the LED street lamp metal casing 8 as a whole by a plurality of metal screws, and a transparent plastic plate 9 is further mounted on the LED street lamp metal casing 8 to form an LED street lamp using a semiconductor refrigeration device.
  • FIG. 2 another preferred embodiment of the LED street lamp using the semiconductor refrigeration device of the present invention is different from the embodiment shown in FIG. 1 in that the LED lighting tube 1 of the embodiment shown in FIG. On the LED substrate 2, the metal heat collecting plate 3 is closely attached to the LED substrate 2, and the LED light-emitting tube 1 of the embodiment shown in FIG. 2 is directly mounted on the heat-conductive ceramic-based circuit board 10, and the metal heat collecting plate 3 is not required. .
  • the LED light-emitting tube 1 of the LED street lamp is directly mounted on the heat-conductive ceramic-based circuit board 10, the heat-conductive ceramic-based circuit board 10 is closely attached to the cooling surface of the semiconductor refrigerator 6, and the metal fin-type heat sink 7 is mounted on Above the heat generating surface of the semiconductor refrigerator 6, the metal fin type heat sink 7 is a heat sink inside the LED street lamp.
  • a power supply circuit 11 is disposed in the lamp body of the LED street lamp using the semiconductor refrigeration device, and the device directly connected to the power supply circuit 11 has an LED driver 12 and a DC power supply 14 of the semiconductor refrigerator 6, which are respectively connected.
  • the power circuit 10 is connected to the power supply grid through the "L" and "N" wires to ensure efficient operation of the LED street lamps.
  • the plurality of LED lighting tubes 1 are cooled and thermally conducted by the cooling surface of the semiconductor cooler 6 via the LED substrate 2 and the metal heat collecting plate 3 or the thermally conductive ceramic-based circuit board 10, and the semiconductor cooler 6 is cooled.
  • the heat-generating surface is subjected to natural convection and radiation heat dissipation through the metal fin-type heat sink 7 and the LED street lamp metal casing 8 and the outer space of the LED street lamp, thereby realizing the active heat dissipation of the LED light-emitting tube 1.
  • the LED street lamp using the semiconductor refrigeration device is provided with an asbestos insulation layer 4 and a semiconductor refrigerator 6 so that the illumination tube 1 has good cooling and heat dissipation effects, high operational reliability, simple overall installation, compact structure, light weight, and work. Long life, making LED street lighting more practical, reliable, convenient and popular.
  • the heat dissipation method used in the LED street lamp using the semiconductor refrigeration device of the present invention is also applicable to other high power LED facilities.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An LED street lamp using a thermoelectric cooling device includes a plurality of LEDs (1), an LED substrate (2), a metal heat-collecting plate (3), and a metal heat-dissipating device with fins (7). The LEDs (1) are mounted on the LED substrate (2), and the heat-collecting plate (3) tightly contacts the LED substrate (2). A thermal insulation material layer (4) and a thermoelectric cooler (6) are mounted between the heat-collecting plate (3) and the heat-dissipating device (7). The cooling surface of the thermoelectric cooler (6) contacts the heat-collecting plate (3), and the heat-dissipating device (7) is mounted above the heating surface of the thermoelectric cooler (6). The LEDs (1) of the LED street lamp can also be directly mounted on a ceramic circuit board (10), and the thermal insulation material layer (4) and the thermoelectric cooler (6) are mounted between the ceramic circuit board (10) and the heat-dissipating device (7).

Description

采用半导体致冷装置的LED路灯  LED street light using semiconductor refrigeration device 技术领域Technical field
本发明涉及一种LED路灯,尤其涉及一种采用半导体致冷装置的LED路灯。 The invention relates to an LED street lamp, in particular to an LED street lamp using a semiconductor refrigeration device.
背景技术Background technique
LED具有发光效率高,寿命长,易于智能化管理,节能环保等特点,随着LED稳定性,大功率等性能的提升和成本的不断降低,目前已制成路灯,应用在城市道路等照明领域。 LED has high luminous efficiency, long life, easy to intelligent management, energy saving and environmental protection. With the improvement of LED stability, high power performance and cost reduction, street lamps have been made and applied in urban roads and other lighting fields. .
为解决上述技术问题,本发明的技术方案是:提供一种采用半导体致冷装置的LED路灯,包括多个LED发光管、LED基板、金属集热平板、金属鳍片式散热器,所述LED发光管安装于LED基板上,金属集热平板与LED基板紧密相贴;所述金属集热平板与金属鳍片式散热器之间安装有绝热材料层及半导体致冷器,半导体致冷器的致冷面与金属集热平板相贴,金属鳍片式散热器则安装在半导体致冷器的发热面的上方。In order to solve the above technical problem, the technical solution of the present invention is to provide an LED street lamp using a semiconductor refrigeration device, comprising a plurality of LED lighting tubes, an LED substrate, a metal heat collecting plate, and a metal fin type heat sink, wherein the LED The light-emitting tube is mounted on the LED substrate, and the metal heat collecting plate is closely attached to the LED substrate; a heat insulating material layer and a semiconductor refrigerator are mounted between the metal heat collecting plate and the metal fin heat sink, and the semiconductor refrigerator is The cooling surface is attached to the metal heat collecting plate, and the metal fin type heat sink is mounted above the heat generating surface of the semiconductor refrigerator.
与现有技术相比较,上述采用半导体致冷装置的LED路灯通过在金属集热平板与金属鳍片式散热器之间安装有绝热材料层及半导体致冷器,使得LED发光管降温和散热从被动式改变为主动式且效果良好,工作可靠性高,整体安装简便,结构紧凑,重量轻,工作寿命长。Compared with the prior art, the LED street lamp using the semiconductor refrigeration device has a heat insulating material layer and a semiconductor cooler mounted between the metal heat collecting plate and the metal fin heat sink, so that the LED light pipe is cooled and dissipated from the LED light pipe. Passive change to active and good effect, high reliability, simple installation, compact structure, light weight and long working life.
技术问题technical problem
本发明所要解决的技术问题在于提供一种采用半导体致冷装置的LED路灯,其散热好,安装简便,结构紧凑,重量轻,工作寿命长。The technical problem to be solved by the present invention is to provide an LED street lamp using a semiconductor refrigeration device, which has good heat dissipation, simple installation, compact structure, light weight and long working life.
本发明所要解决的另一技术问题在于提供一种采用半导体致冷装置的 LED 路灯,其散热好,安装简便,结构紧凑,重量轻,工作寿命长。  Another technical problem to be solved by the present invention is to provide an LED using a semiconductor refrigeration device. The street lamp has good heat dissipation, simple installation, compact structure, light weight and long working life.
技术解决方案Technical solution
提供一种采用半导体致冷装置的LED路灯,包括多个LED发光管、LED基板、金属集热平板、金属鳍片式散热器,所述LED发光管安装于LED基板上,金属集热平板与LED基板紧密相贴;所述金属集热平板与金属鳍片式散热器之间安装有绝热材料层及半导体致冷器,半导体致冷器的致冷面与金属集热平板相贴,金属鳍片式散热器则安装在半导体致冷器的发热面的上方。Providing an LED street lamp using a semiconductor refrigeration device, comprising a plurality of LED light-emitting tubes, an LED substrate, a metal heat collecting plate, and a metal fin-type heat sink, wherein the LED light-emitting tube is mounted on the LED substrate, the metal heat collecting plate and The LED substrate is closely attached; a heat insulating material layer and a semiconductor refrigerator are installed between the metal heat collecting plate and the metal fin heat sink, and the cooling surface of the semiconductor cooler is attached to the metal heat collecting plate, and the metal fin The chip heat sink is mounted above the heat generating surface of the semiconductor refrigerator.
提供一种采用半导体致冷装置的LED路灯,包括多个LED发光管、导热陶瓷基电路板、金属鳍片式散热器,所述LED发光管直接装于导热陶瓷基电路板上;所述导热陶瓷基电路板与金属鳍片式散热器之间安装有绝热材料层及半导体致冷器,半导体致冷器的致冷面与导热陶瓷基电路板相贴,金属鳍片式散热器则安装在半导体致冷器的发热面的上方。Providing an LED street lamp using a semiconductor refrigeration device, comprising a plurality of LED light-emitting tubes, a heat-conductive ceramic-based circuit board, and a metal fin-type heat sink, wherein the LED light-emitting tubes are directly mounted on the heat-conductive ceramic-based circuit board; A layer of heat insulating material and a semiconductor cooler are mounted between the ceramic-based circuit board and the metal fin-type heat sink, and the cooling surface of the semiconductor cooler is attached to the heat-conductive ceramic-based circuit board, and the metal fin-type heat sink is mounted on Above the heating surface of the semiconductor cooler.
有益效果Beneficial effect
与现有技术相比较,上述采用半导体致冷装置的LED路灯通过在导热陶瓷基电路板与金属鳍片式散热器之间安装有绝热材料层及半导体致冷器,使得发光管降温和散热从被动式改变为主动式且效果良好,工作可靠性高,整体安装简便,结构紧凑,重量轻,工作寿命长。 Compared with the prior art, the LED street lamp adopting the semiconductor refrigeration device has a heat insulating material layer and a semiconductor refrigerator mounted between the heat conductive ceramic base circuit board and the metal fin heat sink, so that the light emitting tube is cooled and dissipated from the light source. Passive change to active and good effect, high reliability, simple installation, compact structure, light weight and long working life.
附图说明DRAWINGS
图1是本发明采用半导体致冷装置的LED路灯的一种实施例的截面示意图。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view showing an embodiment of an LED street lamp using a semiconductor refrigeration device of the present invention.
图2是本发明采用半导体致冷装置的LED路灯的另一种实施例的截面示意图。2 is a schematic cross-sectional view showing another embodiment of an LED street lamp using a semiconductor refrigeration device of the present invention.
图3是图1和图2所示实施例的电原理方框图。Figure 3 is a block diagram of the electrical principle of the embodiment of Figures 1 and 2.
本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION
为了使本发明所要解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
请参阅图1,是本发明采用半导体致冷装置的LED路灯的一种较佳实施例,所述LED路灯包括多个LED发光管1、LED基板2、金属集热平板3、金属鳍片式散热器7、外壳8及透明塑料板9,所述LED发光管1安装于LED基板2上,金属集热平板3与LED基板2紧密相贴,金属集热平板3及金属鳍片式散热器7为LED路灯内部的散热器。1 is a preferred embodiment of an LED street lamp using a semiconductor refrigeration device according to the present invention. The LED street lamp includes a plurality of LED light-emitting tubes 1, an LED substrate 2, a metal heat collecting plate 3, and a metal fin type. The heat sink 7, the outer casing 8 and the transparent plastic plate 9, the LED light-emitting tube 1 is mounted on the LED substrate 2, the metal heat collecting plate 3 and the LED substrate 2 are closely attached, the metal heat collecting plate 3 and the metal fin-type heat sink 7 is the radiator inside the LED street light.
所述金属集热平板3与金属鳍片式散热器7之间安装有石棉隔热层4及半导体致冷器6,安装时半导体致冷器6的致冷面涂敷导热硅胶后与金属集热平板3紧密相贴,金属鳍片式散热器7则安装在半导体致冷器6的发热面的上方。An asbestos thermal insulation layer 4 and a semiconductor refrigerator 6 are installed between the metal heat collecting plate 3 and the metal fin type heat sink 7. When the cooling surface of the semiconductor refrigerator 6 is coated with a thermal conductive silica gel and a metal set The hot plate 3 is closely attached, and the metal fin type heat sink 7 is mounted above the heat generating surface of the semiconductor refrigerator 6.
所述石棉隔热层4使得半导体致冷器6的致冷面与发热面不产生热交换,石棉隔热层4也可以为其他的绝热材料层。The asbestos insulation layer 4 does not cause heat exchange between the cooling surface of the semiconductor refrigerator 6 and the heat generating surface, and the asbestos insulation layer 4 may be another layer of heat insulating material.
所述LED基板2、金属集热平板3、石棉隔热层4、半导体致冷器6及金属鳍片式散热器7通过两个或多个酚醛塑料连接柱5连接为基体,所述酚醛塑料连接柱5也可为其他传热系数较小的塑料连接柱,酚醛塑料连接柱5也可使得半导体致冷器6的致冷面与发热面之间不导热。所述基体通过多个金属螺丝与LED路灯金属外壳8连接为一个整体,在LED路灯金属外壳8上还装有透明塑料板9,共同组成采用半导体致冷装置的LED路灯。The LED substrate 2, the metal heat collecting plate 3, the asbestos insulating layer 4, the semiconductor cooler 6 and the metal finned heat sink 7 are connected as a substrate by two or more phenolic plastic connecting columns 5, the phenolic plastic The connecting post 5 can also be a plastic connecting post with a small heat transfer coefficient. The phenolic plastic connecting post 5 can also prevent heat conduction between the cooling surface of the semiconductor cooler 6 and the heat generating surface. The base body is connected to the LED street lamp metal casing 8 as a whole by a plurality of metal screws, and a transparent plastic plate 9 is further mounted on the LED street lamp metal casing 8 to form an LED street lamp using a semiconductor refrigeration device.
请参阅图2,是本发明采用半导体致冷装置的LED路灯的另一种较佳实施例,其与图1所示的实施例的区别在于:图1所示实施例的LED发光管1安装于LED基板2上,通过金属集热平板3与LED基板2紧密相贴,而图2所示实施例的LED发光管1直接装于导热陶瓷基电路板10上,而且无需金属集热平板3。Referring to FIG. 2, another preferred embodiment of the LED street lamp using the semiconductor refrigeration device of the present invention is different from the embodiment shown in FIG. 1 in that the LED lighting tube 1 of the embodiment shown in FIG. On the LED substrate 2, the metal heat collecting plate 3 is closely attached to the LED substrate 2, and the LED light-emitting tube 1 of the embodiment shown in FIG. 2 is directly mounted on the heat-conductive ceramic-based circuit board 10, and the metal heat collecting plate 3 is not required. .
所述LED路灯的LED发光管1直接装于导热陶瓷基电路板10上,导热陶瓷基电路板10与半导体致冷器6的致冷面紧密相贴,金属鳍片式散热器7则安装在半导体致冷器6的发热面的上方,金属鳍片式散热器7为LED路灯内部的散热器。The LED light-emitting tube 1 of the LED street lamp is directly mounted on the heat-conductive ceramic-based circuit board 10, the heat-conductive ceramic-based circuit board 10 is closely attached to the cooling surface of the semiconductor refrigerator 6, and the metal fin-type heat sink 7 is mounted on Above the heat generating surface of the semiconductor refrigerator 6, the metal fin type heat sink 7 is a heat sink inside the LED street lamp.
请参阅图3,在采用半导体致冷装置的LED路灯的灯体内装置有电源电路11,与电源电路11直接相连的装置有LED驱动器12和半导体致冷器6的直流供电电源14,它们分别连接LED发光管群13和半导体致冷器6的电源接头15,其中半导体致冷器6所消耗的电能约占LED发光管群13总功率的20%左右,与目前的LED路灯风扇散热系统所消耗的电能相当。电源电路10通过“L”和“N”导线与供电电网连接,从而保证LED路灯有效工作。Referring to FIG. 3, a power supply circuit 11 is disposed in the lamp body of the LED street lamp using the semiconductor refrigeration device, and the device directly connected to the power supply circuit 11 has an LED driver 12 and a DC power supply 14 of the semiconductor refrigerator 6, which are respectively connected. The LED lighting tube group 13 and the power supply connector 15 of the semiconductor refrigerator 6 wherein the semiconductor refrigerator 6 consumes about 20% of the total power of the LED lighting tube group 13 and is consumed by the current LED street lamp fan cooling system. The power is quite equal. The power circuit 10 is connected to the power supply grid through the "L" and "N" wires to ensure efficient operation of the LED street lamps.
当LED路灯通电后,多个LED发光管1经过LED基板2和金属集热平板3或导热陶瓷基电路板10由半导体致冷器6的致冷面进行降温和热传导,而半导体致冷器6的发热面则通过金属鳍片式散热器7和LED路灯金属外壳8与LED路灯的外空间进行自然对流和辐射散热,从而实现LED发光管1主动式散热。After the LED street lamp is energized, the plurality of LED lighting tubes 1 are cooled and thermally conducted by the cooling surface of the semiconductor cooler 6 via the LED substrate 2 and the metal heat collecting plate 3 or the thermally conductive ceramic-based circuit board 10, and the semiconductor cooler 6 is cooled. The heat-generating surface is subjected to natural convection and radiation heat dissipation through the metal fin-type heat sink 7 and the LED street lamp metal casing 8 and the outer space of the LED street lamp, thereby realizing the active heat dissipation of the LED light-emitting tube 1.
上述采用半导体致冷装置的LED路灯安装有石棉隔热层4及半导体致冷器6,使得发光管1降温和散热效果良好,工作可靠性高,且整体安装简便,结构紧凑,重量轻,工作寿命长,从而使得LED路灯照明更具实用性,可靠性,便利性和普及性。The LED street lamp using the semiconductor refrigeration device is provided with an asbestos insulation layer 4 and a semiconductor refrigerator 6 so that the illumination tube 1 has good cooling and heat dissipation effects, high operational reliability, simple overall installation, compact structure, light weight, and work. Long life, making LED street lighting more practical, reliable, convenient and popular.
本发明采用半导体致冷装置的LED路灯使用的散热方式也适用于其他大功率LED设施。The heat dissipation method used in the LED street lamp using the semiconductor refrigeration device of the present invention is also applicable to other high power LED facilities.
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。 The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.
本发明的实施方式Embodiments of the invention
工业实用性Industrial applicability
序列表自由内容Sequence table free content

Claims (12)

  1. 一种采用半导体致冷装置的LED路灯,包括多个LED发光管、LED基板、金属集热平板、金属鳍片式散热器,所述LED发光管安装于LED基板上,金属集热平板与LED基板紧密相贴;其特征在于:所述金属集热平板与金属鳍片式散热器之间安装有绝热材料层及半导体致冷器,半导体致冷器的致冷面与金属集热平板相贴,金属鳍片式散热器安装在半导体致冷器的发热面的上方。 An LED street lamp adopting a semiconductor refrigeration device, comprising a plurality of LED light-emitting tubes, an LED substrate, a metal heat collecting plate and a metal fin-type heat sink, wherein the LED light-emitting tube is mounted on the LED substrate, the metal heat collecting plate and the LED The substrate is closely attached; the surface of the metal heat collecting plate and the metal fin heat sink is mounted with a heat insulating material layer and a semiconductor refrigerator, and the cooling surface of the semiconductor cooler is attached to the metal heat collecting plate. The metal fin heat sink is mounted above the heat generating surface of the semiconductor refrigerator.
  2. 如权利要求1所述的采用半导体致冷装置的LED路灯,其特征在于:所述绝热材料层为石棉隔热层。The LED street lamp using a semiconductor refrigeration device according to claim 1, wherein the heat insulating material layer is an asbestos heat insulating layer.
  3. 如权利要求2所述的采用半导体致冷装置的LED路灯,其特征在于:所述半导体致冷器的致冷面涂敷导热硅胶后与金属集热平板相贴,半导体致冷器的发热面涂敷导热硅胶后与金属鳍片式散热器相贴。The LED street lamp using the semiconductor refrigeration device according to claim 2, wherein the cooling surface of the semiconductor refrigerator is coated with a thermal conductive silica gel and adhered to a metal heat collecting plate, and the heat generating surface of the semiconductor refrigerator After coating the thermal silica gel, it is attached to the metal fin heat sink.
  4. 如权利要求3所述的采用半导体致冷装置的LED路灯,其特征在于:所述LED基板、金属集热平板、石棉隔热层、半导体致冷器及金属鳍片式散热器通过传热系数小的塑料连接柱连接为基体。The LED street lamp using the semiconductor refrigeration device according to claim 3, wherein the LED substrate, the metal heat collecting plate, the asbestos heat insulating layer, the semiconductor cooler, and the metal fin type heat sink pass heat transfer coefficient Small plastic connecting posts are connected to the base.
  5. 如权利要求4所述的采用半导体致冷装置的LED路灯,其特征在于:所述塑料连接柱为酚醛塑料连接柱。The LED street lamp using the semiconductor refrigeration device according to claim 4, wherein the plastic connecting column is a phenolic plastic connecting column.
  6. 如权利要求5所述的采用半导体致冷装置的LED路灯,其特征在于:所述LED路灯还包括外壳,所述基体与外壳连接在一起。The LED street lamp using a semiconductor refrigeration device according to claim 5, wherein said LED street lamp further comprises a casing, said substrate being coupled to said casing.
  7. 一种采用半导体致冷装置的LED路灯,包括多个LED发光管、导热陶瓷基电路板、金属鳍片式散热器,所述LED发光管直接装于导热陶瓷基电路板上;其特征在于:所述导热陶瓷基电路板与金属鳍片式散热器之间安装有绝热材料层及半导体致冷器,半导体致冷器的致冷面与导热陶瓷基电路板相贴,金属鳍片式散热器则安装在半导体致冷器的发热面的上方。An LED street lamp adopting a semiconductor refrigeration device, comprising a plurality of LED light-emitting tubes, a heat-conductive ceramic-based circuit board, and a metal fin-type heat sink, wherein the LED light-emitting tubes are directly mounted on the heat-conductive ceramic-based circuit board; A heat insulating material layer and a semiconductor refrigerator are mounted between the heat conductive ceramic base circuit board and the metal fin type heat sink, and the cooling surface of the semiconductor cooler is attached to the heat conductive ceramic base circuit board, and the metal fin type heat sink is attached It is mounted above the heat generating surface of the semiconductor refrigerator.
  8. 如权利要求7所述的采用半导体致冷装置的LED路灯,其特征在于:所述绝热材料层为石棉隔热层。The LED street lamp using a semiconductor refrigeration device according to claim 7, wherein the heat insulating material layer is an asbestos heat insulating layer.
  9. 如权利要求8所述的采用半导体致冷装置的LED路灯,其特征在于:所述半导体致冷器的致冷面涂敷导热硅胶后与导热陶瓷基电路板相贴。The LED street lamp using the semiconductor refrigeration device according to claim 8, wherein the cooling surface of the semiconductor cooler is coated with a thermal conductive silica gel and then attached to the thermally conductive ceramic-based circuit board.
  10. 如权利要求9所述的采用半导体致冷装置的LED路灯,其特征在于:所述LED基板、导热陶瓷基电路板、石棉隔热层、半导体致冷器及金属鳍片式散热器通过传热系数小的塑料连接柱连接为基体。The LED street lamp using the semiconductor refrigeration device according to claim 9, wherein the LED substrate, the thermally conductive ceramic-based circuit board, the asbestos insulation layer, the semiconductor cooler, and the metal fin-type heat sink pass heat transfer A plastic connecting post with a small coefficient is connected to the base.
  11. 如权利要求10所述的采用半导体致冷装置的LED路灯,其特征在于:所述塑料连接柱为酚醛塑料连接柱。 The LED street lamp using the semiconductor refrigeration device according to claim 10, wherein the plastic connecting column is a phenolic plastic connecting column.
  12. 如权利要求11所述的采用半导体致冷装置的LED路灯,其特征在于:所述LED路灯还包括外壳,所述基体与外壳连接在一起。The LED street lamp using a semiconductor refrigeration device according to claim 11, wherein said LED street lamp further comprises a casing, and said base body is coupled to said casing.
PCT/CN2010/077502 2010-09-30 2010-09-30 Led street lamp using thermoelectric cooling device WO2012040925A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103867974A (en) * 2014-03-04 2014-06-18 宁波帕克电子有限公司 LED (Light Emitting Diode) streetlamp
EP3015764A4 (en) * 2013-06-25 2016-06-29 Zhiming Chen Low-light-failure high-power led road lamp and manufacturing method therefor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101315176A (en) * 2007-06-01 2008-12-03 富士迈半导体精密工业(上海)有限公司 Light source module group with better cooling efficiency
CN201204203Y (en) * 2008-03-04 2009-03-04 无锡爱迪信光电科技有限公司 Radiating device for high-power LED
CN101477981A (en) * 2008-01-03 2009-07-08 富士迈半导体精密工业(上海)有限公司 Light source module and manufacturing process thereof
CN201293238Y (en) * 2008-08-04 2009-08-19 周叔棣 Outdoor lighting equipment with active heat radiating device and outdoor lighting system thereof
CN101625086A (en) * 2009-08-04 2010-01-13 徐加同 High-power led energy-saving lamp
CN101761903A (en) * 2010-01-08 2010-06-30 李镭 Cooling structure for LED lamp

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101315176A (en) * 2007-06-01 2008-12-03 富士迈半导体精密工业(上海)有限公司 Light source module group with better cooling efficiency
CN101477981A (en) * 2008-01-03 2009-07-08 富士迈半导体精密工业(上海)有限公司 Light source module and manufacturing process thereof
CN201204203Y (en) * 2008-03-04 2009-03-04 无锡爱迪信光电科技有限公司 Radiating device for high-power LED
CN201293238Y (en) * 2008-08-04 2009-08-19 周叔棣 Outdoor lighting equipment with active heat radiating device and outdoor lighting system thereof
CN101625086A (en) * 2009-08-04 2010-01-13 徐加同 High-power led energy-saving lamp
CN101761903A (en) * 2010-01-08 2010-06-30 李镭 Cooling structure for LED lamp

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3015764A4 (en) * 2013-06-25 2016-06-29 Zhiming Chen Low-light-failure high-power led road lamp and manufacturing method therefor
AU2014301911B2 (en) * 2013-06-25 2017-10-12 Zhiming Chen Low light failure, high-power led street lamp and method for manufacturing the same
US9989238B2 (en) 2013-06-25 2018-06-05 Zhiming Chen Low light failure, high power led street lamp and method for manufacturing the same
CN103867974A (en) * 2014-03-04 2014-06-18 宁波帕克电子有限公司 LED (Light Emitting Diode) streetlamp

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