JP2009182327A - Led illuminating device, led light source module, and led support member - Google Patents

Led illuminating device, led light source module, and led support member Download PDF

Info

Publication number
JP2009182327A
JP2009182327A JP2009012664A JP2009012664A JP2009182327A JP 2009182327 A JP2009182327 A JP 2009182327A JP 2009012664 A JP2009012664 A JP 2009012664A JP 2009012664 A JP2009012664 A JP 2009012664A JP 2009182327 A JP2009182327 A JP 2009182327A
Authority
JP
Japan
Prior art keywords
metal
foam
layer
led
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009012664A
Other languages
Japanese (ja)
Inventor
Xue-Yong Liu
Hong-Xian Lou
学勇 劉
洪献 楼
Original Assignee
Ningbo Andy Optoelectronic Co Ltd
寧波安迪光電科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CNA2008100333273A priority Critical patent/CN101220934A/en
Application filed by Ningbo Andy Optoelectronic Co Ltd, 寧波安迪光電科技有限公司 filed Critical Ningbo Andy Optoelectronic Co Ltd
Publication of JP2009182327A publication Critical patent/JP2009182327A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

<P>PROBLEM TO BE SOLVED: To provide: an LED illuminating device having advantages such as light weight, low costs and an excellent heat radiation effect; an LED light source module; and an LED support member. <P>SOLUTION: The LED illuminating device includes a housing and the LED light source module. The LED light source module has a plurality of LEDs and the LED support member. The LEDs are installed on the LED support member, and the LED support member is provided with: a foam metal layer; and a metal support layer, at least part of which is used for supporting the plurality of the LEDs. The foam metal layer is made of foam metal having porous structures, and the metal support layer is formed on part of a surface of the foam metal layer, so that the metal support layer and the foam metal layer are connected to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、発光ダイオード(Light−Emitting Diode、LED)照明の技術領域に関し、特にLED照明装置、LED光源モジュール及びLED支持体に関する。   The present invention relates to the technical field of light-emitting diode (LED) illumination, and more particularly to an LED illumination device, an LED light source module, and an LED support.
近年、LEDの発展と進歩に伴い、LEDの性能インデックスが大幅に日増しに高まっている。現在の白色LEDの光取り出し効率(Light extraction efficiency)の殆どは、光束(Luminous Flux)が大幅に高まり、周知の白熱電球の光取り出し効率を得ることができ、或いは白熱電球の光取り出し効率を超えることができる。従って、LEDは照明の領域において広く応用されるようになってきた。LEDは、従来の太陽光発電電源を得る省エネ照明設備に比べ、長寿命、低発熱、耐衝撃性、低消費電力、高省エネなどの長所を有し、21世紀において蛍光灯や白熱電球に取って代わる第4世代の照明光源に誉められる。   In recent years, with the development and progress of LEDs, the performance index of LEDs has been greatly increased day by day. Most of the current light extraction efficiency of white LEDs can greatly increase the luminous flux and obtain the light extraction efficiency of well-known incandescent bulbs, or exceed the light extraction efficiency of incandescent bulbs be able to. Accordingly, LEDs have been widely applied in the area of illumination. LED has advantages such as long life, low heat generation, shock resistance, low power consumption, high energy saving, etc. compared to conventional energy-saving lighting equipment that uses photovoltaic power generation. It is commended for the fourth generation lighting source.
現在のLED照明設備は、規定の方式で多くのLEDをアルミ基板上に配置させ、LED光源モジュールを形成し、アルミ基板により放熱を行う。放熱のためにアルミ基板の厚みを増大させなければならなかった。しかし、LED光源モジュール全体の重量を不可避的に増大させ、使用上の不都合を高め、製造コストを不可避的に向上させる。特に大出力のLED照明設備に対して、この欠点は更に著しくなる。例えば、アルミ基板により放熱するパワーが約120ワットで、大出力のLED街灯の重量が約9キログラムである場合、その多くは放熱のためアルミ基板の厚み及び放熱フィンの大きさを増大させたことによる重量である。そのため、街灯の重量を大幅に増大させ、取り付けや分解上とても不便であり、しかも材料コストを増大させる。一方、非常に大きい放熱フィンは、特別に一体的に成形される必要があり、その成形上の要求が高いため製品収率が下がり、製造コストを実質的に向上させる。しかし、街灯全体の放熱効果は、理想値を得ることが困難であった。   In the current LED lighting equipment, many LEDs are arranged on an aluminum substrate by a prescribed method, an LED light source module is formed, and heat is radiated by the aluminum substrate. The thickness of the aluminum substrate had to be increased for heat dissipation. However, the weight of the entire LED light source module is inevitably increased, the inconvenience in use is increased, and the manufacturing cost is inevitably improved. This disadvantage becomes even more serious especially for high-power LED lighting equipment. For example, when the power dissipated by the aluminum substrate is about 120 watts and the weight of the high-power LED street light is about 9 kilograms, many of them have increased the thickness of the aluminum substrate and the size of the radiation fins for heat dissipation It is the weight by. This greatly increases the weight of the streetlight, is very inconvenient in installation and disassembly, and increases the material cost. On the other hand, a very large heat dissipating fin needs to be specially formed integrally, and the demand for the formation is high, so that the product yield is lowered and the manufacturing cost is substantially improved. However, it was difficult to obtain an ideal value for the heat dissipation effect of the street lamp as a whole.
本発明の目的は、軽重量、低コスト、良好な放熱効果などの長所を有するLED照明装置、LED光源モジュール及びLED支持体を提供することを課題とする。   An object of the present invention is to provide an LED lighting device, an LED light source module, and an LED support having advantages such as light weight, low cost, and good heat dissipation effect.
上記目的を達成するために、本発明によれば、ハウジング及びLED光源モジュールを備えるLED照明装置であって、前記LED光源モジュールは、複数のLEDとLED支持体を有し、前記LEDは、前記LED支持体上に配置されて、前記LED支持体は、発泡金属層と少なくとも一部は前記複数のLEDを支持するために用いられる金属支持層を含み、前記発泡金属層は多孔質構造である発泡金属により形成され、前記金属支持層は前記発泡金属層の一部の表面上に形成され、前記金属支持層と前記発泡金属層とが互いに結合することを特徴とするLED照明装置が提供される。   In order to achieve the above object, according to the present invention, an LED lighting apparatus including a housing and an LED light source module, wherein the LED light source module includes a plurality of LEDs and an LED support, Located on an LED support, the LED support includes a foam metal layer and at least a portion of the metal support layer used to support the plurality of LEDs, the foam metal layer having a porous structure. An LED lighting device is provided, wherein the LED support device is formed of a foam metal, the metal support layer is formed on a part of a surface of the foam metal layer, and the metal support layer and the foam metal layer are bonded to each other. The
一つの好適な態様では、前記発泡金属は、発泡鉄、発泡銅、発泡アルミ、発泡鉄合金、発泡銅合金或いは発泡アルミ合金である。   In one preferred embodiment, the foam metal is foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, or foam aluminum alloy.
一つの好適な態様では、前記発泡金属のインチ当たり10〜50つの孔を有する。   In one preferred embodiment, the metal foam has 10 to 50 holes per inch.
一つの好適な態様では、中実の金属層である前記金属支持層の金属材料は前記発泡金属の金属材料と同様である。   In one preferred embodiment, the metal material of the metal support layer which is a solid metal layer is the same as the metal material of the foam metal.
一つの好適な態様では、前記LED照明装置は、冷却ファンをさらに含み、前記冷却ファンは、前記金属支持層を有する表面以外に前記発泡金属層の表面に或いは前記発泡金属層の中に形成されてチャンバにの中に配置される。   In one preferable aspect, the LED lighting device further includes a cooling fan, and the cooling fan is formed on the surface of the metal foam layer or in the metal foam layer other than the surface having the metal support layer. And placed in the chamber.
一つの好適な態様では、前記金属支持層を有する表面以外に前記発泡金属層の表面の少なくとも一部は封止される。   In one preferable aspect, at least a part of the surface of the metal foam layer is sealed in addition to the surface having the metal support layer.
また、本発明によれば、複数のLEDとLED支持体を備えるLED光源モジュールであって、前記LEDは、前記LED支持体上に配置されて、前記LED支持体は、発泡金属層と少なくとも一部は前記複数のLEDを支持するために用いられる金属支持層を含み、前記発泡金属層は多孔質構造である発泡金属により形成され、前記金属支持層は前記発泡金属層の一部の表面上に形成され、前記金属支持層と前記発泡金属層とが互いに結合することを特徴とするLED光源モジュールが提供される。   According to the present invention, there is also provided an LED light source module including a plurality of LEDs and an LED support, wherein the LED is disposed on the LED support, and the LED support is at least one of the foam metal layer and the LED support. The portion includes a metal support layer used to support the plurality of LEDs, the foam metal layer is formed of a foam metal having a porous structure, and the metal support layer is on a part of the surface of the foam metal layer. The LED light source module is provided in which the metal support layer and the foam metal layer are bonded to each other.
また、本発明によれば、複数のLEDを支持するために用いられるLED支持体であって、発泡金属層と少なくとも一部は前記複数のLEDを支持するために用いられる金属支持層を含み、前記発泡金属層は多孔質構造である発泡金属により形成され、前記金属支持層は前記発泡金属層の一部の表面上に形成され、前記金属支持層と前記発泡金属層とが互いに結合することを特徴とするLED支持体が提供される。   Further, according to the present invention, there is an LED support used for supporting a plurality of LEDs, the foam metal layer and at least a part including a metal support layer used for supporting the plurality of LEDs, The metal foam layer is formed of a metal foam having a porous structure, the metal support layer is formed on a part of the surface of the metal foam layer, and the metal support layer and the metal foam layer are bonded to each other. An LED support is provided.
本発明は、従来の技術に比べ、LED照明装置のLED支持体を改善し、LED支持体の発泡金属の表面上に金属支持層を形成し、LED光源が回路基板によって金属支持層上に固定される。そのため、LEDの熱は、金属支持層によって発泡金属層へ迅速に伝達され、発泡金属層が提供される立体メッシュ状構造により、空気と熱源との接触面積を増大させ、良好な放熱効果を得ることができる。なお、発泡金属によって、金属材料を節約し、LED照明装置全体の重量と製造コストを大幅に低減することができ、使用が便利となる。   The present invention improves the LED support of the LED lighting device compared with the prior art, forms a metal support layer on the surface of the foam metal of the LED support, and the LED light source is fixed on the metal support layer by the circuit board. Is done. Therefore, the heat of the LED is quickly transferred to the foam metal layer by the metal support layer, and the contact area between the air and the heat source is increased by the three-dimensional mesh structure provided with the foam metal layer, and a good heat dissipation effect is obtained. be able to. In addition, the metal material can be saved by the foam metal, and the weight and manufacturing cost of the entire LED lighting device can be greatly reduced, and the use is convenient.
本発明の第1実施例によるLED照明装置のLED光源モジュールを示す斜視図である。1 is a perspective view showing an LED light source module of an LED lighting device according to a first embodiment of the present invention. 本発明の第2実施例によるLED照明装置のLED光源モジュールを示す斜視図である。It is a perspective view which shows the LED light source module of the LED lighting apparatus by 2nd Example of this invention. 図2の他方の角度で示す斜視図である。It is a perspective view shown by the other angle of FIG. 本発明の第3実施例によるLED照明装置のLED光源モジュールを示す斜視図である。It is a perspective view which shows the LED light source module of the LED lighting apparatus by 3rd Example of this invention. 本発明の第4実施例によるLED照明装置のLED光源モジュールを示す斜視図である。It is a perspective view which shows the LED light source module of the LED lighting apparatus by 4th Example of this invention. 本発明の第5実施例によるLED照明装置のLED光源モジュールを示す斜視図である。It is a perspective view which shows the LED light source module of the LED lighting apparatus by 5th Example of this invention. 本発明のLED照明装置を示す略図である。1 is a schematic view showing an LED lighting device of the present invention.
図1及び図7を参照し、本発明の第1実施例によるLED照明装置9を示す略図である。図1及び図7に示すように、LED照明装置9は、ハウジング7及びLED光源モジュール8を備える。LED光源モジュール8は、LED光源1とLED支持体2を有し、LED光源1は、複数のLED(図示せず)及び高熱伝導性を有する材料(例えばアルミ)からなり、LEDを支持するために用いられる回路基板10を含む。LEDは、回路基板10上に配置され、複数のLEDライトバー(Light Bar、図に参照符号を付けず)を形成する。なお、光取り出し効率を向上させるために、それぞれのLEDは、実際の必要に応じてレンズ部材11を有することができる。LED支持体2は、発泡金属層21と金属支持層20を含み、少なくとも一部の金属支持層20はLEDを支持するために用いられる。この発泡金属層21は、多孔質構造である発泡金属により形成され、例えば発泡鉄、発泡銅、発泡アルミ、発泡鉄合金、発泡銅合金、発泡アルミ合金などであり、発泡金属のインチ当たり10〜50つの孔を有する。この実施の形態において、発泡金属層21は、発泡銅からなる。金属支持層20は、発泡金属層21の一部の表面上に形成され、金属材料からなる中実の金属層であり、中実の金属層の金属材料は、発泡金属の金属材料と同様であることができる。例えば、この実施の形態において、発泡金属層21は、発泡銅からなり、金属支持層20は、銅からなる中実の金属層である。金属支持層20と発泡金属層とが互いに結合し、金属支持層20と発泡金属層21とは、電解めっきによって互いに結合されることが好ましい。このLEDは、回路基板10によってLED支持体2上に固定される。この実施の形態において、このLEDは、回路基板10によって金属支持層20上に固定され、回路基板10が金属支持層20上にきつく固定されて大面積が接触する。また、熱伝導材料(例えば熱伝導性接着剤)は、回路基板10と金属支持層20の間に配置されてもよい。これによって、LED光源モジュール8を操作する場合は、LEDの熱は、回路基板10によって金属支持層20へ伝達され、金属支持層20によって発泡金属層21へ迅速に伝達される。この場合は、発泡金属層21が提供される立体メッシュ状構造により、空気と熱源との接触面積を増大させる。これにより放熱効果を改善することができる。なお、発泡金属からなる発泡金属層21によって、金属材料を節約し、LED照明装置9全体の重量と製造コストを大幅に低減することができ、使用が便利になる。   Referring to FIGS. 1 and 7, it is a schematic diagram illustrating an LED lighting device 9 according to a first embodiment of the present invention. As shown in FIGS. 1 and 7, the LED lighting device 9 includes a housing 7 and an LED light source module 8. The LED light source module 8 includes an LED light source 1 and an LED support 2, and the LED light source 1 is composed of a plurality of LEDs (not shown) and a material having high thermal conductivity (for example, aluminum) to support the LEDs. The circuit board 10 used for the above is included. The LEDs are arranged on the circuit board 10 and form a plurality of LED light bars (Light Bar, not labeled with a reference numeral in the figure). In addition, in order to improve light extraction efficiency, each LED can have the lens member 11 as needed. The LED support 2 includes a foam metal layer 21 and a metal support layer 20, and at least a part of the metal support layer 20 is used to support the LED. The foam metal layer 21 is formed of a foam metal having a porous structure, such as foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, foam aluminum alloy, and the like. It has 50 holes. In this embodiment, the foam metal layer 21 is made of foam copper. The metal support layer 20 is formed on a part of the surface of the foam metal layer 21 and is a solid metal layer made of a metal material. The metal material of the solid metal layer is the same as the metal material of the foam metal. Can be. For example, in this embodiment, the foam metal layer 21 is made of foamed copper, and the metal support layer 20 is a solid metal layer made of copper. The metal support layer 20 and the foam metal layer are preferably bonded to each other, and the metal support layer 20 and the foam metal layer 21 are preferably bonded to each other by electrolytic plating. This LED is fixed on the LED support 2 by the circuit board 10. In this embodiment, the LED is fixed on the metal support layer 20 by the circuit board 10, and the circuit board 10 is fixed firmly on the metal support layer 20 so that a large area contacts. Further, a heat conductive material (for example, a heat conductive adhesive) may be disposed between the circuit board 10 and the metal support layer 20. Thereby, when operating the LED light source module 8, the heat of the LED is transferred to the metal support layer 20 by the circuit board 10 and quickly transferred to the foam metal layer 21 by the metal support layer 20. In this case, the contact area between the air and the heat source is increased by the three-dimensional mesh structure in which the foam metal layer 21 is provided. Thereby, the heat dissipation effect can be improved. In addition, the metal material can be saved by the foam metal layer 21 made of the foam metal, and the weight and manufacturing cost of the LED lighting device 9 as a whole can be greatly reduced, which makes the use convenient.
図2及び図3を参照し、本発明の第2実施例によるLED照明装置を示す略図であり、この第2実施例は、第1実施例を類似する。図2及び図3に示すように、第2実施例のLED照明装置は、第1実施例と異なるLED光源モジュール8’を備える。第2実施例において、LED光源モジュール8’のLED支持体2は、さらに冷却ファン23を含む。この冷却ファン23は、金属支持層20を有する表面以外に発泡金属層21の表面に配置される。図2及び図3に示すように、冷却ファン23は、金属支持層20に向かい合う他方の一側の表面に配置される。   Referring to FIGS. 2 and 3, there is a schematic diagram illustrating an LED lighting apparatus according to a second embodiment of the present invention, which is similar to the first embodiment. As shown in FIGS. 2 and 3, the LED illumination device of the second embodiment includes an LED light source module 8 'different from the first embodiment. In the second embodiment, the LED support 2 of the LED light source module 8 ′ further includes a cooling fan 23. The cooling fan 23 is disposed on the surface of the foam metal layer 21 in addition to the surface having the metal support layer 20. As shown in FIGS. 2 and 3, the cooling fan 23 is disposed on the surface of the other side facing the metal support layer 20.
本発明の第2実施例において、LED照明装置を操作する場合は、冷却ファン23が運転し、且つ多孔質構造である発泡金属からなる発泡金属層21が立体メッシュ状構造と多孔質とを有しているため、そのため、発泡金属層21の中の空気の流量を増大させ、LEDの熱を迅速に伝達し、放熱効果を改善することができる。   In the second embodiment of the present invention, when operating the LED lighting device, the cooling fan 23 is operated, and the foam metal layer 21 made of foam metal having a porous structure has a three-dimensional mesh structure and a porous structure. For this reason, the flow rate of air in the foam metal layer 21 can be increased, the heat of the LED can be quickly transmitted, and the heat dissipation effect can be improved.
図4を参照し、本発明の第3実施例によるLED照明装置を示す略図であり、この第3実施例は、第2実施例を類似する。図4に示すように、第3実施例のLED照明装置は、第2実施例と異なるLED光源モジュール8”を備える。第3実施例において、LED光源モジュール8”は、さらに冷却ファン23を含む。この冷却ファン23は、金属支持層20を有する表面に隣接する発泡金属層21の側面に配置される。第3実施例のLED照明装置の作動原理は、上述の第2実施例とほぼ同じであり、類似する点については述べない。   Referring to FIG. 4, there is a schematic diagram illustrating an LED lighting device according to a third embodiment of the present invention, which is similar to the second embodiment. As shown in FIG. 4, the LED lighting device of the third embodiment includes an LED light source module 8 ″ different from the second embodiment. In the third embodiment, the LED light source module 8 ″ further includes a cooling fan 23. . The cooling fan 23 is disposed on the side surface of the foam metal layer 21 adjacent to the surface having the metal support layer 20. The operation principle of the LED lighting device of the third embodiment is almost the same as that of the second embodiment described above, and the similar points will not be described.
図5を参照し、本発明の第4実施例によるLED照明装置を示す略図であり、この第4実施例は、第1実施例を類似する。図5に示すように、第4実施例のLED照明装置は、第1実施例と異なるLED光源モジュール8’”を備える。第4実施例において、LED光源モジュール8’”の一つの側面は、断熱板25によって封止される。断熱板25は、熱源の実質的な位置と冷却ファン23の位置に応じてLED光源モジュール8’”の側面を封止し、さらに優れた放熱効果を持ち、熱源が局所領域中へ集中することを防ぐことができる。LED光源モジュール8’”の封止される側面は、熱源の実質的な位置により決定される。例えば、LED光源モジュール8’”の熱源に隣接する側面は開放状態に保たれ、LED光源モジュール8’”のその他の側面を封止することができる。これによって、冷却ファン23を操作する場合は、僅かに熱源に位置する側面に空気が通り、熱源が局所領域中に集中することを防ぐことができる。   Referring to FIG. 5, there is a schematic diagram illustrating an LED lighting apparatus according to a fourth embodiment of the present invention, which is similar to the first embodiment. As shown in FIG. 5, the LED lighting device of the fourth embodiment includes an LED light source module 8 ′ ″ different from the first embodiment. In the fourth embodiment, one side surface of the LED light source module 8 ′ ″ is Sealed by a heat insulating plate 25. The heat insulating plate 25 seals the side surface of the LED light source module 8 ′ ″ according to the substantial position of the heat source and the position of the cooling fan 23, has a further excellent heat dissipation effect, and concentrates the heat source in the local region. The sealed side surface of the LED light source module 8 ′ ″ is determined by the substantial position of the heat source. For example, the side surface adjacent to the heat source of the LED light source module 8 ′ ″ can be kept open, and the other side surface of the LED light source module 8 ′ ″ can be sealed. As a result, when operating the cooling fan 23, it is possible to prevent air from passing through the side surface located slightly in the heat source and concentrating the heat source in the local region.
図6を参照し、本発明の第5実施例によるLED照明装置を示す略図であり、この第5実施例は、第1実施例を類似する。図6に示すように、第5実施例のLED照明装置は、第1実施例と異なるLED光源モジュール8””を備える。第5実施例において、LED光源モジュール8”は、さらに冷却ファン23を含む。この冷却ファン23は、発泡金属層21の中に形成されてチャンバ(図示せず)にの中に配置される。第5実施例のLED照明装置の作動原理は、上述の第2実施例とほぼ同じであり、類似する点については述べない。   Referring to FIG. 6, it is a schematic diagram illustrating an LED lighting device according to a fifth embodiment of the present invention, which is similar to the first embodiment. As shown in FIG. 6, the LED lighting device of the fifth embodiment includes an LED light source module 8 ″ ″ that is different from the first embodiment. In the fifth embodiment, the LED light source module 8 ″ further includes a cooling fan 23. The cooling fan 23 is formed in the foam metal layer 21 and disposed in a chamber (not shown). The operating principle of the LED lighting apparatus of the fifth embodiment is almost the same as that of the second embodiment described above, and the similar points will not be described.
以上、複数の実施例を開示したが、これは本発明を限定するためのものではなく、当業者であれば、本発明の技術的思想および範囲を逸脱することなく、各種の変更および修正を行うことができるので、本発明の権利範囲は特許請求の範囲に基づく。   Although a plurality of embodiments have been disclosed above, this is not intended to limit the present invention, and various changes and modifications can be made by those skilled in the art without departing from the technical idea and scope of the present invention. The scope of rights of the present invention is based on the claims.
1 LED光源
2 LED支持体
7 ハウジング
8、8’、8”、8’”、8”” LED光源モジュール
9 LED照明装置
10 回路基板
11 レンズ部材
20 金属支持層
21 発泡金属層
23 冷却ファン
25 断熱板
DESCRIPTION OF SYMBOLS 1 LED light source 2 LED support body 7 Housing 8, 8 ', 8 ", 8'", 8 "" LED light source module 9 LED lighting apparatus 10 Circuit board 11 Lens member 20 Metal support layer 21 Foam metal layer 23 Cooling fan 25 Thermal insulation Board

Claims (20)

  1. ハウジング及びLED光源モジュールを備えるLED照明装置であって、前記LED光源モジュールは、複数のLEDとLED支持体を有し、前記複数のLEDは、前記LED支持体上に配置されて、前記LED支持体は、発泡金属層と少なくとも一部は前記複数のLEDを支持するために用いられる金属支持層を含み、前記発泡金属層は多孔質構造である発泡金属により形成され、前記金属支持層は前記発泡金属層の一部の表面上に形成され、前記金属支持層と前記発泡金属層とが互いに結合することを特徴とするLED照明装置。   An LED lighting apparatus including a housing and an LED light source module, wherein the LED light source module includes a plurality of LEDs and an LED support, and the plurality of LEDs are disposed on the LED support, and the LED support The body includes a foam metal layer and at least a portion of a metal support layer used to support the plurality of LEDs, the foam metal layer being formed of a foam metal having a porous structure, the metal support layer being An LED lighting device, wherein the LED lighting device is formed on a part of a surface of a foam metal layer, and the metal support layer and the foam metal layer are bonded to each other.
  2. 前記発泡金属は、発泡鉄、発泡銅、発泡アルミ、発泡鉄合金、発泡銅合金或いは発泡アルミ合金であることを特徴とする請求項1に記載のLED照明装置。   2. The LED lighting device according to claim 1, wherein the foam metal is foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, or foam aluminum alloy.
  3. 前記発泡金属のインチ当たり10〜50つの孔を有することを特徴とする請求項1又は2に記載のLED照明装置。   The LED lighting device according to claim 1, wherein the LED lighting device has 10 to 50 holes per inch of the foam metal.
  4. 中実の金属層である前記金属支持層の金属材料は前記発泡金属の金属材料と同様であることを特徴とする請求項1に記載のLED照明装置。   The LED lighting device according to claim 1, wherein a metal material of the metal support layer that is a solid metal layer is the same as the metal material of the foam metal.
  5. 冷却ファンをさらに含み、前記冷却ファンは、前記金属支持層を有する表面以外に前記発泡金属層の表面に或いは前記発泡金属層の中に形成される収容空間の中に配置されることを特徴とする請求項1に記載のLED照明装置。   The cooling fan further includes a cooling fan, and the cooling fan is disposed on the surface of the metal foam layer or in a housing space formed in the metal foam layer in addition to the surface having the metal support layer. The LED lighting device according to claim 1.
  6. 前記金属支持層を有する表面以外に前記発泡金属層の表面の少なくとも一部は封止されることを特徴とする請求項5に記載のLED照明装置。   The LED lighting device according to claim 5, wherein at least a part of the surface of the metal foam layer is sealed in addition to the surface having the metal support layer.
  7. 前記金属支持層と前記発泡金属層とは、電解めっきによって互いに結合することを特徴とする請求項1に記載のLED照明装置。   The LED lighting device according to claim 1, wherein the metal support layer and the foam metal layer are bonded to each other by electrolytic plating.
  8. 複数のLEDとLED支持体を備えるLED光源モジュールであって、前記LEDは、前記LED支持体上に配置されて、前記LED支持体は、発泡金属層と少なくとも一部は前記複数のLEDを支持するために用いられる金属支持層を含み、前記発泡金属層は多孔質構造である発泡金属により形成され、前記金属支持層は前記発泡金属層の一部の表面上に形成され、前記金属支持層と前記発泡金属層とが互いに結合することを特徴とするLED光源モジュール。   An LED light source module comprising a plurality of LEDs and an LED support, wherein the LED is disposed on the LED support, and the LED support supports the plurality of LEDs at least partially with a metal foam layer. A metal support layer used to make the foam metal layer is formed of a foam metal having a porous structure, the metal support layer is formed on a part of the surface of the foam metal layer, the metal support layer And the metal foam layer are bonded to each other.
  9. 前記発泡金属は、発泡鉄、発泡銅、発泡アルミ、発泡鉄合金、発泡銅合金或いは発泡アルミ合金であることを特徴とする請求項8に記載のLED光源モジュール。   The LED light source module according to claim 8, wherein the foam metal is foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, or foam aluminum alloy.
  10. 前記発泡金属のインチ当たり10〜50つの孔を有することを特徴とする請求項8又は9に記載のLED光源モジュール。   The LED light source module according to claim 8, wherein the LED light source module has 10 to 50 holes per inch of the foam metal.
  11. 中実の金属層であるる前記金属支持層の金属材料は前記発泡金属の金属材料と同様であることを特徴とする請求項8に記載のLED光源モジュール。   9. The LED light source module according to claim 8, wherein the metal material of the metal support layer which is a solid metal layer is the same as the metal material of the foam metal.
  12. 冷却ファンをさらに含み、前記冷却ファンは、前記金属支持層を有する表面以外に前記発泡金属層の表面に或いは前記発泡金属層の中に形成される収容空間の中に配置されることを特徴とする請求項8に記載のLED光源モジュール。   The cooling fan further includes a cooling fan, and the cooling fan is disposed on the surface of the metal foam layer or in a housing space formed in the metal foam layer in addition to the surface having the metal support layer. The LED light source module according to claim 8.
  13. 前記金属支持層を有する表面以外に前記発泡金属層の表面の少なくとも一部は封止されることを特徴とする請求項12に記載のLED光源モジュール。   The LED light source module according to claim 12, wherein at least part of the surface of the metal foam layer is sealed in addition to the surface having the metal support layer.
  14. 前記金属支持層と前記発泡金属層とは、電解めっきによって互いに結合することを特徴とする請求項8に記載のLED光源モジュール。   The LED light source module according to claim 8, wherein the metal support layer and the foam metal layer are bonded to each other by electrolytic plating.
  15. 複数のLEDを支持するために用いられるLED支持体であって、発泡金属層と少なくとも一部は前記複数のLEDを支持するために用いられる金属支持層を含み、前記発泡金属層は多孔質構造である発泡金属により形成され、前記金属支持層は前記発泡金属層の一部の表面上に形成され、前記金属支持層と前記発泡金属層とが互いに結合することを特徴とするLED支持体。   An LED support used to support a plurality of LEDs, the foam metal layer and at least a portion including a metal support layer used to support the plurality of LEDs, the foam metal layer having a porous structure An LED support, wherein the metal support layer is formed on a part of the surface of the foam metal layer, and the metal support layer and the foam metal layer are bonded to each other.
  16. 前記金属支持層と前記発泡金属層とは、電解めっきによって互いに結合することを特徴とする請求項15に記載のLED支持体。   The LED support according to claim 15, wherein the metal support layer and the foam metal layer are bonded to each other by electrolytic plating.
  17. 前記発泡金属のインチ当たり10〜50つの孔を有することを特徴とする請求項15又は16に記載のLED支持体。   The LED support according to claim 15 or 16, wherein the LED support has 10 to 50 holes per inch of the foam metal.
  18. 中実の金属層である前記金属支持層の金属材料は前記発泡金属の金属材料と同様であることを特徴とする請求項15に記載のLED支持体。   16. The LED support according to claim 15, wherein the metal material of the metal support layer which is a solid metal layer is the same as the metal material of the foam metal.
  19. 冷却ファンをさらに含み、前記冷却ファンは、前記金属支持層を有する表面以外に前記発泡金属層の表面に或いは前記発泡金属層の中に形成されの中に配置されることを特徴とする請求項15に記載のLED支持体。   The cooling fan further comprising a cooling fan, wherein the cooling fan is disposed on or in the surface of the metal foam layer other than the surface having the metal support layer. 15. The LED support according to 15.
  20. 前記金属支持層を有する表面以外に前記発泡金属層の表面の少なくとも一部は封止されることを特徴とする請求項16に記載のLED支持体。
    The LED support according to claim 16, wherein at least a part of the surface of the foam metal layer other than the surface having the metal support layer is sealed.
JP2009012664A 2008-01-31 2009-01-23 Led illuminating device, led light source module, and led support member Pending JP2009182327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2008100333273A CN101220934A (en) 2008-01-31 2008-01-31 LED illumination device

Publications (1)

Publication Number Publication Date
JP2009182327A true JP2009182327A (en) 2009-08-13

Family

ID=39630932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009012664A Pending JP2009182327A (en) 2008-01-31 2009-01-23 Led illuminating device, led light source module, and led support member

Country Status (4)

Country Link
EP (1) EP2085681A2 (en)
JP (1) JP2009182327A (en)
KR (1) KR20090084689A (en)
CN (1) CN101220934A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100285A (en) * 2009-11-05 2011-05-19 Canon Inc Usb host device, control method, and program
CN103727506A (en) * 2013-12-13 2014-04-16 青岛威力电子科技有限公司 Efficient heat-dissipation method of LED light source carrier
CN104315486A (en) * 2013-04-20 2015-01-28 大连三维传热技术有限公司 Foam metal wick hot plate heat radiator of SiO2 nano working fluid
CN105177339A (en) * 2015-10-26 2015-12-23 三峡大学 Foam aluminum with three-dimensional (3D) space ordered pore structure and preparation method thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2961894B1 (en) * 2010-06-24 2013-09-13 Valeo Vision Heat exchange device, in particular for a motor vehicle
FR2965042B1 (en) * 2010-09-22 2014-11-21 Valeo Vision HEAT EXCHANGE DEVICE, IN PARTICULAR FOR A MOTOR VEHICLE
CN102661504A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power light-emitting diode (LED) down lamp provided with metal radiating device
CN102661505A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (light-emitting diode) flat plate lamp provided with metal heat abstractor
FR3031569B1 (en) * 2015-01-12 2018-11-16 Xyzed IMPROVED COOLING DIODE LIGHTING MODULE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006135502A1 (en) * 2005-06-10 2006-12-21 Cree, Inc. High power solid-state lamp
JP2007527619A (en) * 2003-07-17 2007-09-27 エンフィス リミテッド Cooling method and apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007527619A (en) * 2003-07-17 2007-09-27 エンフィス リミテッド Cooling method and apparatus
WO2006135502A1 (en) * 2005-06-10 2006-12-21 Cree, Inc. High power solid-state lamp

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011100285A (en) * 2009-11-05 2011-05-19 Canon Inc Usb host device, control method, and program
CN104315486A (en) * 2013-04-20 2015-01-28 大连三维传热技术有限公司 Foam metal wick hot plate heat radiator of SiO2 nano working fluid
CN103727506A (en) * 2013-12-13 2014-04-16 青岛威力电子科技有限公司 Efficient heat-dissipation method of LED light source carrier
CN105177339A (en) * 2015-10-26 2015-12-23 三峡大学 Foam aluminum with three-dimensional (3D) space ordered pore structure and preparation method thereof

Also Published As

Publication number Publication date
EP2085681A2 (en) 2009-08-05
CN101220934A (en) 2008-07-16
KR20090084689A (en) 2009-08-05

Similar Documents

Publication Publication Date Title
JP5304198B2 (en) lighting equipment
JP5101578B2 (en) Light emitting diode lighting device
CN101625079B (en) Hollow liquid-cooling LED lamp
US7635205B2 (en) LED lamp with heat dissipation device
CN105972535B (en) A kind of LED automobile head lamp
US8398260B2 (en) Heat-dissipation structure of LED lamp
US10168041B2 (en) Light fixture
US20110038154A1 (en) System and methods for lighting and heat dissipation
US20090040760A1 (en) Illumination device having unidirectional heat-dissipating route
KR20080002564U (en) Lamp with light emitting diode module
JP2011228254A (en) Lamp assembly
US20090237937A1 (en) Led illuminating device and light engine thereof
KR20130079617A (en) Process for manufacturing heat sink structure for high-power led
US20090268463A1 (en) Led lamp with heat sink
US7926979B2 (en) Illumination device
CN101435566A (en) LED light fitting
RU2418345C1 (en) Light-emitting diode lamp
US20110075431A1 (en) Heat dissipation structure for LED lamp
CN101220916A (en) LED road lamp light source module group
CN201259193Y (en) Heat radiator of high power LED street lamp
JP2011228253A (en) Lamp assembly
WO2007044472A3 (en) Led with light transmissive heat sink
US20080149305A1 (en) Heat Sink Structure for High Power LED Lamp
JP3160924U (en) Ceramic radiator with conductive circuit
KR20130079618A (en) Process for manufacturing heat sink structure for high-power led

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111206

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120515