CN203586162U - LED (Light-Emitting Diode) heat-dissipating substrate - Google Patents
LED (Light-Emitting Diode) heat-dissipating substrate Download PDFInfo
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- CN203586162U CN203586162U CN201320775850.XU CN201320775850U CN203586162U CN 203586162 U CN203586162 U CN 203586162U CN 201320775850 U CN201320775850 U CN 201320775850U CN 203586162 U CN203586162 U CN 203586162U
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- heat
- led
- radiating substrate
- aluminium base
- substrate
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Abstract
The utility model discloses an LED (Light-Emitting Diode) heat-dissipating substrate, and relates to the field of electrical appliances. The LED heat-dissipating substrate comprises an aluminum substrate, wherein the aluminum substrate is provided with a groove; heat-conducting silicone grease fills the groove; the bottom of the aluminum substrate is provided with a temperature controller; the temperature controller is connected with a radiator; the aluminum substrate is provided with an insulating layer; the insulating layer is provided with a circuit layer; the circuit layer is provided with a waterproof layer. The LED heat-dissipating substrate has the characteristics that heat can be dissipated stably, the service life of an LED is prolonged, electric leakage and electric shock accidents of the LED heat-dissipating substrate can be prevented, and liquid such as water can be prevented from splashing onto the heat-dissipating substrate and causing short-circuit accidents.
Description
Technical field
The utility model relates to appliance field, is specifically related to a kind of LED heat-radiating substrate.
Background technology
LED is a kind of PN junction electronic device, there is optics, electricity and thermal characteristic, early stage LED operating current is very low, dispel the heat less demanding, therefore seldom consider its heat dissipation problem, along with the raising of LED luminous efficiency and the increase of operating current, now heat dissipation problem becomes one of LED application very stubborn problem, many products about LED heat radiation have been emerged in large numbers in the market, the file that is 201310016535.3 as application number discloses LED heat-radiating substrate, comprise heat-conducting substrate, in described heat-conducting substrate, at least embed and have a high heat conduction ring, the upper and lower surface of described high heat conduction ring maintains an equal level with the upper and lower surface of heat-conducting substrate respectively, the upper and lower surface of described high heat conduction ring center heat-conducting substrate is corresponding with the lower surface that is preset in the LED chip on heat-conducting substrate, structural manufacturing process is simple, easy to make and can obviously promote the radiating efficiency of heat-conducting substrate, but this LED heat-radiating substrate can not solve, how to make heat-radiating substrate can stablize heat radiation, extend the service life of LED, how to prevent that LED heat-radiating substrate from leaking electricity, electric shock accidents, how the liquid such as anti-sealing splashes on heat-radiating substrate plate, the problem of the accident that is short-circuited.
Utility model content
The purpose of this utility model is to provide a kind of LED heat-radiating substrate, to solve the above-mentioned multinomial defect causing in prior art.
A kind of LED heat-radiating substrate, comprise aluminium base, described aluminium base is provided with groove, in described groove, be provided with heat-conducting silicone grease, described aluminium base bottom is provided with temperature controller, and described temperature controller is connected with radiator, described aluminium base is provided with insulating barrier, described insulating barrier is provided with circuit layer, and described circuit layer is provided with watertight composition, and the thickness of described watertight composition is 0.11mm-0.17mm.
Preferably, described aluminium base bottom is connected with spring.
Preferably, described insulating barrier is ceramic material.
Preferably, the thickness of described aluminium base is 2mm-3mm.
Preferably, described radiator is aerofoil fan.
The utility model has the advantage of: in groove, be provided with heat-conducting silicone grease, heat-conducting silicone grease is solid conductive heat agent, affected by environment less, therefore heat conductivility is stable, can extend the service life of LED, the temperature controller of aluminium base bottom is connected with radiator, temperature controller can be by controlling the power of radiator, control the temperature of heat-radiating substrate, reliability is strong, aluminium base is provided with insulating barrier, can prevent that LED heat-radiating substrate from leaking electricity, electric shock accidents, circuit layer is provided with watertight composition, can anti-sealing etc. liquid splash on heat-radiating substrate plate, accident is short-circuited, aluminium base bottom is connected with spring, can prevent that heat-radiating substrate from being damaged by pressure, radiator is aerofoil fan, volume is little, lightweight.
Accompanying drawing explanation
Fig. 1 is the front view of a kind of LED heat-radiating substrate described in the utility model.
Fig. 2 is the side view of a kind of LED heat-radiating substrate described in the utility model.
Wherein: 1-watertight composition, 2-circuit layer, 3-insulating barrier, 4-aluminium base, 5-groove, 6-heat-conducting silicone grease, 7-spring, 8-temperature controller, 9-radiator.
The specific embodiment
For technological means, creation characteristic that the utility model is realized, reach object and effect is easy to understand, below in conjunction with the specific embodiment, be further elaborated the utility model.
As depicted in figs. 1 and 2, a kind of LED heat-radiating substrate, comprise aluminium base 4, described aluminium base 4 is provided with groove 5, in described groove 5, be provided with heat-conducting silicone grease 6, heat-conducting silicone grease is solid conductive heat agent, affected by environment less, therefore heat conductivility is stable, can extend the service life of LED, described aluminium base 4 bottoms are provided with temperature controller 8, described temperature controller 8 is connected with radiator 9, temperature controller can be by controlling the power of radiator, control the temperature of heat-radiating substrate, reliability is strong, described aluminium base 4 is provided with insulating barrier 3, can prevent that LED heat-radiating substrate from leaking electricity, electric shock accidents, described insulating barrier 3 is provided with circuit layer 2, described circuit layer 2 is provided with watertight composition 1, can anti-sealing etc. liquid splash on heat-radiating substrate plate, accident is short-circuited, the thickness of described watertight composition 1 is 0.11mm-0.17mm.
It should be noted that described insulating barrier 3 is ceramic material, described aluminium base 4 bottoms are connected with spring 7, can prevent that heat-radiating substrate from being damaged by pressure.
In the present embodiment, the thickness of described aluminium base 4 is 2mm-3mm, and described radiator 9 is aerofoil fan, and volume is little, lightweight.
Based on above-mentioned, this LED heat-radiating substrate, has and can stablize heat radiation, extends the service life of LED, can prevent that LED heat-radiating substrate from leaking electricity, electric shock accidents, can anti-sealing etc. liquid splash on heat-radiating substrate plate, the feature of the accident that is short-circuited.
As known by the technical knowledge, the utility model can be realized by other the embodiment that does not depart from its Spirit Essence or essential feature, therefore, above-mentioned disclosed embodiment, with regard to each side, all just illustrating, is not only, and all changes within the scope of the utility model or within being equal to scope of the present utility model are all included in the utility model.
Claims (5)
1. a LED heat-radiating substrate, comprise aluminium base, described aluminium base is provided with groove, it is characterized in that: in described groove, be provided with heat-conducting silicone grease, described aluminium base bottom is provided with temperature controller, and described temperature controller is connected with radiator, described aluminium base is provided with insulating barrier, described insulating barrier is provided with circuit layer, and described circuit layer is provided with watertight composition, and the thickness of described watertight composition is 0.11mm-0.17mm.
2. a kind of LED heat-radiating substrate according to claim 1, is characterized in that: described aluminium base bottom is connected with spring.
3. a kind of LED heat-radiating substrate according to claim 1, is characterized in that: described insulating barrier is ceramic material.
4. a kind of LED heat-radiating substrate according to claim 1, is characterized in that: the thickness of described aluminium base is 2mm-3mm.
5. a kind of LED heat-radiating substrate according to claim 1, is characterized in that: described radiator is aerofoil fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320775850.XU CN203586162U (en) | 2013-12-02 | 2013-12-02 | LED (Light-Emitting Diode) heat-dissipating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320775850.XU CN203586162U (en) | 2013-12-02 | 2013-12-02 | LED (Light-Emitting Diode) heat-dissipating substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203586162U true CN203586162U (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320775850.XU Expired - Fee Related CN203586162U (en) | 2013-12-02 | 2013-12-02 | LED (Light-Emitting Diode) heat-dissipating substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN203586162U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104676550A (en) * | 2013-12-02 | 2015-06-03 | 苏州承源光电科技有限公司 | LED (Light-Emitting Diode) heat-dissipating substrate |
| CN110032025A (en) * | 2018-01-11 | 2019-07-19 | 舜宇光学（浙江）研究院有限公司 | Structured light projector and its methods and applications |
-
2013
- 2013-12-02 CN CN201320775850.XU patent/CN203586162U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104676550A (en) * | 2013-12-02 | 2015-06-03 | 苏州承源光电科技有限公司 | LED (Light-Emitting Diode) heat-dissipating substrate |
| CN110032025A (en) * | 2018-01-11 | 2019-07-19 | 舜宇光学（浙江）研究院有限公司 | Structured light projector and its methods and applications |
| CN110032025B (en) * | 2018-01-11 | 2021-10-26 | 舜宇光学（浙江）研究院有限公司 | Structured light projector, method and use thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140507 Termination date: 20141202 |
|
| EXPY | Termination of patent right or utility model |