CN103234181A - High heat conduction light-emitting diode (LED) welding method - Google Patents
High heat conduction light-emitting diode (LED) welding method Download PDFInfo
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- CN103234181A CN103234181A CN2013101273069A CN201310127306A CN103234181A CN 103234181 A CN103234181 A CN 103234181A CN 2013101273069 A CN2013101273069 A CN 2013101273069A CN 201310127306 A CN201310127306 A CN 201310127306A CN 103234181 A CN103234181 A CN 103234181A
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Abstract
The invention discloses a high heat conduction light-emitting diode (LED) welding method. The high heat conduction LED welding method includes the following steps: an LED electrode is welded onto a circuit board through high temperature soldering tin; and an LED radiating pole plate is directly welded onto a radiating device through low temperature soldering tin. The LED electrode is welded onto the circuit board through the high temperature soldering tin, the LED radiating pole plate is welded onto the radiating device through the low temperature soldering tin, and the LED radiating pole plate is directly contacted with the radiating device so as to enable an LED to have good heat conduction and radiating effects.
Description
Technical field
The present invention relates to lighting field, particularly relate to a kind of high thermally conductive LED welding method.
Background technology
At LED(Light Emitting Diode, light emitting diode) during illumination used, except the conversion efficiency of electricity with light, heat conduction and heat radiation were the most critical technology, can directly have influence on light extraction efficiency and the life-span of LED.The great power LED welding method of using always all is earlier LED to be welded on aluminium base or the copper base, and then aluminium base or copper base is installed on the radiator at present.Yet the welding method of this routine is subjected to the thermal conductivity factor restriction of substrate insulating layer, and good heat conduction and radiating effect can not be arranged.
Summary of the invention
Based on this, a kind of high thermally conductive LED welding method is provided, make LED have heat conduction preferably and radiating effect.
A kind of high thermally conductive LED welding method comprises the steps: with high temperature scolding tin the electrode of LED to be welded on the circuit board; With low temperature scolding tin the heat radiation pole plate of LED directly is welded on the heat abstractor.
Therein among embodiment, brush dystectic scolding tin respectively on the cathode conductive film of circuit board and cathode conductive film, the negative electrode of the LED cathode conductive film with circuit board is welded mutually, the anode electrode of LED welds mutually with the cathode conductive film of circuit board.
Therein among embodiment, the window by circuit board brushes low-melting scolding tin at the heat radiation pole plate of LED, and the heat radiation pole plate of LED welds with heat abstractor mutually by the window of circuit board.
Among embodiment, described heat abstractor is the radiator with heat sinking function therein, and radiator comprises heat-dissipating cylinder and fin.
Among embodiment, described heat abstractor is copper coin or the aluminium sheet with heat sinking function therein.
Among embodiment, before to the aluminium sheet welding, do nickel coating earlier therein.
Therein among embodiment, described heat abstractor is heat-conducting piece and the radiating piece with heat sinking function that is connected with described heat-conducting piece, with low temperature scolding tin the heat radiation pole plate of LED directly is welded on the heat-conducting piece, is connected to radiating piece.
Among embodiment, described heat-conducting piece is the inner heat-conducting copper pipe that is filled with low-boiling point gas therein, and radiating piece comprises heat-dissipating cylinder and fin.
Among embodiment, the material of described heat abstractor is high conductivity material therein.
Among embodiment, described circuit board is flexible PCB or slim circuit board therein.
Above-mentioned high thermally conductive LED welding method, weld the electrode of LED on circuit board with high temperature scolding tin, the heat radiation pole plate that meets LED with the eutectic welding soldering is on heat abstractor, and the heat radiation pole plate of LED directly contacts with heat abstractor, makes LED have heat conduction preferably and radiating effect.
Description of drawings
Fig. 1 is the schematic diagram of the LED assembly of the high thermally conductive LED welding method formation of present embodiment.
The specific embodiment
Please join Fig. 1, the heat abstractor (not shown) that LED assembly 100 comprises circuit board 110, is welded on the LED120 on the circuit board 110 and welds mutually with LED120.The cathode conductive film 114 that circuit board 110 is provided with cathode conductive film 112 and is oppositely arranged with cathode conductive film 112, circuit board 110 offers window 116 between cathode conductive film 112 and cathode conductive film 114.LED120 be provided with negative electrode 122, and the anode electrode 124 that is oppositely arranged of negative electrode 122 and be located in negative electrode 122 and anode electrode 124 between heat radiation pole plate 126.
The negative electrode 112 of circuit board 110 welds mutually with the negative electrode 122 of LED120, and the anode electrode 114 of circuit board 110 welds mutually with the anode electrode 124 of LED120, and the heat radiation pole plate 126 of LED120 welds mutually by window 116 and heat abstractor.
Heat abstractor can be radiator, also can be aluminium sheet or copper coin, also can be heat-conducting piece and the radiating piece that is connected with heat-conducting piece.In the preferred mode, radiator comprises heat-dissipating cylinder and fin, and radiating piece also comprises heat-dissipating cylinder and fin, and heat-conducting piece is the inner heat-conducting copper pipe that is filled with low-boiling point gas, circuit board is flexible PCB and slim circuit board, and wherein slim circuit board is the ultra-thin circuit board of thinner thickness.The material of heat abstractor is high conductivity material.
Present embodiment discloses a kind of high thermally conductive LED welding method forming above-mentioned LED assembly, the comprising the steps: of this high thermally conductive LED welding method
Step 1 is welded on the electrode of LED on the circuit board with high temperature scolding tin.
Brush dystectic scolding tin respectively on the cathode conductive film of circuit board and cathode conductive film, the negative electrode of the LED cathode conductive film with circuit board is welded mutually, the anode electrode of LED welds mutually with the cathode conductive film of circuit board.Circuit board is flexible PCB or slim circuit board.
Step 2 directly is welded on the heat radiation pole plate of LED on the heat abstractor with low temperature scolding tin.
Window by circuit board brushes low-melting scolding tin at the heat radiation pole plate of LED, and the heat radiation pole plate of LED welds with heat abstractor mutually by the window of circuit board.
Here said high temperature scolding tin is dystectic scolding tin, and low temperature scolding tin is low-melting scolding tin, and the welding temperature of high temperature scolding tin is higher than the welding temperature of low temperature scolding tin.
Heat abstractor is the radiator with heat sinking function, and perhaps heat abstractor is copper coin or the aluminium sheet with heat sinking function, and perhaps heat abstractor is that heat-conducting piece reaches the radiating piece with heat sinking function that is connected with heat-conducting piece.Preferably, radiator comprises heat-dissipating cylinder and fin; Heat-conducting piece is the inner heat-conducting copper pipe that is filled with low-boiling point gas, and radiating piece comprises heat-dissipating cylinder and fin.
Thus, step 2 is: with low temperature scolding tin the heat radiation pole plate of LED directly is welded on the radiator.
Perhaps with low temperature scolding tin the heat radiation pole plate of LED directly is welded on copper coin or the aluminium sheet, wherein before to the aluminium sheet welding, does nickel coating earlier.
Or with low temperature scolding tin the heat radiation pole plate of LED directly is welded on the heat-conducting copper pipe, be connected to radiating piece.
The material of heat abstractor is high conductivity material.
The high thermally conductive LED welding method of using present embodiment to disclose, weld the electrode of LED on circuit board with high temperature scolding tin, the heat radiation pole plate that meets LED with the eutectic welding soldering is on heat abstractor, and the heat radiation pole plate of LED directly contacts with heat abstractor, makes LED have heat conduction preferably and radiating effect.And, earlier with the electrode of the higher high temperature scolding tin welding LED of temperature, connect the heat sink electrodes of LED again with the relatively low eutectic welding soldering of temperature, so can not influence the welding quality of LED electrode and circuit board, thereby guarantee the safety of LED.
The LED aluminium base of using always or the thermal conductivity factor of copper base are about 3W/m.k at present, and the tin cream weld layer thermal conductivity factor 64W/m.k that the high thermally conductive LED welding method that present embodiment adopts forms, exceed existing 20 times of coefficients of heat conduction of conventional welding method, this shows that the LED assembly of the high thermally conductive LED welding method formation of adopting the present embodiment announcement has heat conduction preferably and radiating effect.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. one kind high thermally conductive LED welding method is characterized in that, comprises the steps:
With high temperature scolding tin the electrode of LED is welded on the circuit board;
With low temperature scolding tin the heat radiation pole plate of LED directly is welded on the heat abstractor.
2. high thermally conductive LED welding method according to claim 1, it is characterized in that, on the cathode conductive film of circuit board and cathode conductive film, brush dystectic scolding tin respectively, the negative electrode of the LED cathode conductive film with circuit board is welded mutually, and the anode electrode of LED welds mutually with the cathode conductive film of circuit board.
3. high thermally conductive LED welding method according to claim 2 is characterized in that, the window by circuit board brushes low-melting scolding tin at the heat radiation pole plate of LED, and the heat radiation pole plate of LED welds with heat abstractor mutually by the window of circuit board.
4. according to each described high thermally conductive LED welding method in the claim 1 to 3, it is characterized in that described heat abstractor is the radiator with heat sinking function, radiator comprises heat-dissipating cylinder and fin.
5. according to each described high thermally conductive LED welding method in the claim 1 to 3, it is characterized in that described heat abstractor is copper coin or the aluminium sheet with heat sinking function.
6. high thermally conductive LED welding method according to claim 5 is characterized in that, does nickel coating earlier before to the aluminium sheet welding.
7. according to each described high thermally conductive LED welding method in the claim 1 to 3, it is characterized in that, described heat abstractor is that heat-conducting piece reaches the radiating piece with heat sinking function that is connected with described heat-conducting piece, with low temperature scolding tin the heat radiation pole plate of LED directly is welded on the heat-conducting piece, is connected to radiating piece.
8. high thermally conductive LED welding method according to claim 7 is characterized in that, described heat-conducting piece is the inner heat-conducting copper pipe that is filled with low-boiling point gas, and radiating piece comprises heat-dissipating cylinder and fin.
9. according to each described high thermally conductive LED welding method in the claim 1 to 3, it is characterized in that the material of described heat abstractor is high conductivity material.
10. according to each described high thermally conductive LED welding method in the claim 1 to 3, it is characterized in that described circuit board is flexible PCB or slim circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101273069A CN103234181A (en) | 2013-04-12 | 2013-04-12 | High heat conduction light-emitting diode (LED) welding method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013101273069A CN103234181A (en) | 2013-04-12 | 2013-04-12 | High heat conduction light-emitting diode (LED) welding method |
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| CN103234181A true CN103234181A (en) | 2013-08-07 |
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| CN2013101273069A Pending CN103234181A (en) | 2013-04-12 | 2013-04-12 | High heat conduction light-emitting diode (LED) welding method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103775991A (en) * | 2014-01-28 | 2014-05-07 | 陈旭 | Glass heat pipe LED circuit board applicable to laser welding |
| WO2014166113A1 (en) * | 2013-04-12 | 2014-10-16 | 深圳市银盾科技开发有限公司 | Highly heat-conductive led welding method |
| CN110831269A (en) * | 2019-11-26 | 2020-02-21 | 深圳市德润明宇科技有限公司 | Method for forming heating element and heating element |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102129820A (en) * | 2010-01-20 | 2011-07-20 | 纬创资通股份有限公司 | Light-emitting diode device and display |
-
2013
- 2013-04-12 CN CN2013101273069A patent/CN103234181A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102129820A (en) * | 2010-01-20 | 2011-07-20 | 纬创资通股份有限公司 | Light-emitting diode device and display |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014166113A1 (en) * | 2013-04-12 | 2014-10-16 | 深圳市银盾科技开发有限公司 | Highly heat-conductive led welding method |
| CN103775991A (en) * | 2014-01-28 | 2014-05-07 | 陈旭 | Glass heat pipe LED circuit board applicable to laser welding |
| CN110831269A (en) * | 2019-11-26 | 2020-02-21 | 深圳市德润明宇科技有限公司 | Method for forming heating element and heating element |
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Application publication date: 20130807 |
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