CN202363517U - Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) - Google Patents
Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) Download PDFInfo
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- CN202363517U CN202363517U CN2011204900557U CN201120490055U CN202363517U CN 202363517 U CN202363517 U CN 202363517U CN 2011204900557 U CN2011204900557 U CN 2011204900557U CN 201120490055 U CN201120490055 U CN 201120490055U CN 202363517 U CN202363517 U CN 202363517U
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Abstract
The utility model discloses an aluminium base plate heat dissipation mechanism used for an LED (light-emitting diode). The aluminium base plate heat dissipation mechanism comprises a heat dissipation aluminium profile, an aluminium base plate, a heat conduction silica gel gasket or silicone grease arranged between the heat dissipation aluminium profile and the aluminium base plate, wherein the aluminium base plate is of a layer-shaped structure and is composed of an aluminium plate, an insulating layer and a copper-covered layer which are successively stacked; and the insulating layer is provided with a first through hole, a second through hole is arranged in a position on the copper-covered layer and corresponding to the first through hole, and the aluminium plate on the bottom of the first through hole is coated with a soldering tin metal layer. As the structure is adopted, the insulating layer is directly avoided by the heat dissipation process of an LED lamp; a heat dissipation path is as follows: a PN (Performance Number) node of an LED transits heat to transfer to a solder paste soldering layer from a base, enters the soldering tin metal layer, the aluminium plate, the heat conduction silica gel gasket and the heat dissipation aluminium profile in seuence, and finally carries out heat exchange with air; and the heat dissipation effect of each layer is equalizing, and the whole heat dissipation effect is good.
Description
Technical field
The utility model relates to a kind of aluminium base cooling mechanism, particularly a kind of aluminium base cooling mechanism that is used on the LED.
Background technology
(Light Emitting Diode LED) as solid state light emitter of new generation, has numerous advantages such as long, energy-efficient, environmental protection of life-span to light-emitting diode, is widely used.The radiating effect of the cooling mechanism of LED light fixture directly has influence on the luminous efficiency of LED light fixture, if can not efficiently radiates heat, the LED internal temperature is raise; Temperature is high more, and the luminous efficiency of LED is low more, and the life-span of LED is short more; Under the serious situation, can cause the LED wafer to lose efficacy at once.Present aluminium base cooling mechanism heat radiation process is following: the heat that the PN junction of LED sends from base be delivered to the tin cream weld layer again to copper-clad again to insulating barrier again to aluminium sheet again to the heat conductive silica gel pad again to the heat radiation aluminium section bar, last and air heat exchange, the base conductive coefficient is about 80W/mk; Tin cream weld layer conductive coefficient is greater than 60W/mk, and the conductive coefficient of copper-clad is about 400W/mk, and the conductive coefficient of aluminium sheet and aluminium section bar is about 200W/mk; The conductive coefficient of insulating barrier is about 1W/mk; Heat conductive silica gel pad/silicone grease is about 3W/mk, and the closer to LED, density of heat flow rate is high more; The heat conductive silica gel pad has the horizontal heat-conduction even temperature of aluminium sheet; Cause the density of heat flow rate of insulating barrier high more a lot, so in sum, can find out obviously that the heat radiation bottleneck is the insulating barrier of aluminium base than the density of heat flow rate of heat conductive silica gel pad.
Summary of the invention
In order to address the above problem, the utility model provides the aluminium base cooling mechanism of a kind of LED of being used for, is intended to promote the radiating effect of LED light fixture cooling mechanism.
The utility model solves the technical scheme that its technical problem adopted:
A kind of aluminium base cooling mechanism that is used for LED; Comprise heat radiation aluminium section bar, aluminium base and be arranged on heat conductive silica gel pad or the silicone grease between heat radiation aluminium section bar and the aluminium base; Said aluminium base is layer structure, is formed by stacking successively aluminium sheet, insulating barrier and copper-clad, it is characterized in that said insulating barrier is provided with first through hole; The copper-clad and the first through hole correspondence position are provided with second through hole, are coated with soldering tin metal layer on the aluminium sheet of first via bottoms.
Said copper-clad is provided with solder mask, and the position corresponding to second through hole on the solder mask is provided with third through-hole.
The beneficial effect of the utility model is: through adopting said structure; LED light fixture heat radiation process is directly avoided insulating barrier, and heat dissipation path is following, the heat that the PN junction of LED sends from base be delivered to the tin cream weld layer again to soldering tin metal layer again to aluminium sheet again to the heat conductive silica gel pad again to the heat radiation aluminium section bar; Last and air heat exchange; The radiating effect of each layer is balanced, and integral heat sink is effective, has broken in the existing aluminium base heat dissipation technology by the bad bottleneck that causes of insulating barrier radiating effect.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is the installation diagram of the utility model and LED.
Embodiment
With reference to Fig. 1; The utility model is the aluminium base cooling mechanism of a kind of LED of being used for, comprises heat radiation aluminium section bar 1, aluminium base 2 and is arranged on the heat conductive silica gel pad 3 between heat radiation aluminium section bar 1 and the aluminium base 2, and said aluminium base 2 is layer structure; Be formed by stacking successively aluminium sheet 21, insulating barrier 22 and copper-clad 23; Insulating barrier 22 is provided with first through hole, and the copper-clad 23 and the first through hole correspondence position are provided with second through hole, are coated with soldering tin metal layer 4 on the aluminium sheet of first via bottoms.LED is welded on the soldering tin metal layer 4 through base 61; Through adopting said structure; LED light fixture heat radiation process is directly avoided insulating barrier 22, and heat dissipation path is following: the heat that the PN junction 62 of LED sends from base 61 be delivered to the tin cream weld layer again to soldering tin metal layer 4 again to aluminium sheet 21 again to heat conductive silica gel pad 3 again to heat radiation aluminium section bar 1, last and air heat exchange; The radiating effect of each layer is balanced, and integral heat sink is effective.
Copper-clad 23 is provided with solder mask 24, and solder mask 24 is provided with third through-hole corresponding to the position of second through hole.
Soldering tin metal layer 4 can be made through following mode, heavy zinc on exposed aluminium sheet 21 at first, and nickel plating on the zinc face again, copper facing on nickel then, spray tin or turmeric on copper adopt the coating adhesion of above processing sequence processing strong, good heat conductivity at last.
The foregoing description is the preferred version of the utility model, and the utility model also can have other embodiments, and for example: soldering tin metal layer can be made through other technology, or the like.Those skilled in the art also can make equivalent variations or replacement under the prerequisite of the utility model spirit, modification that these are equal to or replacement all are included in the application's claim institute restricted portion.
Claims (2)
1. aluminium base cooling mechanism that is used for LED; Comprise heat radiation aluminium section bar (1), aluminium base (2) and be arranged on heat conductive silica gel pad (3) or the silicone grease between heat radiation aluminium section bar (1) and the aluminium base (2); Said aluminium base (2) is layer structure; Be formed by stacking successively aluminium sheet (21), insulating barrier (22) and copper-clad (23); It is characterized in that said insulating barrier (22) is provided with first through hole, copper-clad (23) is provided with second through hole with the first through hole correspondence position, is coated with soldering tin metal layer (4) on the aluminium sheet of first via bottoms.
2. a kind of aluminium base cooling mechanism that is used for LED according to claim 1 is characterized in that said copper-clad (23) is provided with solder mask (24), and the position that solder mask (24) is gone up corresponding to second through hole is provided with third through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204900557U CN202363517U (en) | 2011-12-01 | 2011-12-01 | Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204900557U CN202363517U (en) | 2011-12-01 | 2011-12-01 | Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) |
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| Publication Number | Publication Date |
|---|---|
| CN202363517U true CN202363517U (en) | 2012-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204900557U Expired - Fee Related CN202363517U (en) | 2011-12-01 | 2011-12-01 | Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) |
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| CN (1) | CN202363517U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983249A (en) * | 2012-11-27 | 2013-03-20 | 东莞勤上光电股份有限公司 | Improved heat conduction light emitting diode (LED) substrate and processing technology thereof |
| CN104501120A (en) * | 2014-11-25 | 2015-04-08 | 福建省辉尚光电科技有限公司 | Novel LED lamp heat-radiating structure |
| CN104534303A (en) * | 2014-11-26 | 2015-04-22 | 福建省辉尚光电科技有限公司 | Annular distributive type universal LED lamp structure |
| CN104676550A (en) * | 2013-12-02 | 2015-06-03 | 苏州承源光电科技有限公司 | LED (Light-Emitting Diode) heat-dissipating substrate |
| CN106449956A (en) * | 2016-12-05 | 2017-02-22 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | LED high thermal conductivity metal substrate and preparation technology thereof |
| CN106922081A (en) * | 2017-04-25 | 2017-07-04 | 安徽宏鑫电子科技有限公司 | A kind of single-clad board |
| CN107039568A (en) * | 2016-02-03 | 2017-08-11 | 苏州科医世凯半导体技术有限责任公司 | A kind of compound high heat conductive insulating metal substrate |
| CN107527988A (en) * | 2016-06-20 | 2017-12-29 | 苏州科医世凯半导体技术有限责任公司 | A kind of compound high heat conductive insulating metal substrate and encapsulation |
| CN108461616A (en) * | 2018-05-21 | 2018-08-28 | 杭州电子科技大学 | A kind of great power LED detaches the packaging method of radiator structure with thermoelectricity |
| CN108488644A (en) * | 2018-03-28 | 2018-09-04 | 杭州和顺建设有限公司 | A kind of high-efficient heat-dissipating LED lamp |
| CN108630799A (en) * | 2018-05-21 | 2018-10-09 | 杭州电子科技大学 | A kind of great power LED thermoelectricity separation radiator structure |
| CN109696792A (en) * | 2017-10-24 | 2019-04-30 | 中强光电股份有限公司 | Projector and Wavelength converter |
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2011
- 2011-12-01 CN CN2011204900557U patent/CN202363517U/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102983249B (en) * | 2012-11-27 | 2015-10-21 | 东莞勤上光电股份有限公司 | Modified model thermally conductive LED substrate and processing technology thereof |
| CN102983249A (en) * | 2012-11-27 | 2013-03-20 | 东莞勤上光电股份有限公司 | Improved heat conduction light emitting diode (LED) substrate and processing technology thereof |
| CN104676550A (en) * | 2013-12-02 | 2015-06-03 | 苏州承源光电科技有限公司 | LED (Light-Emitting Diode) heat-dissipating substrate |
| CN104501120A (en) * | 2014-11-25 | 2015-04-08 | 福建省辉尚光电科技有限公司 | Novel LED lamp heat-radiating structure |
| CN104534303A (en) * | 2014-11-26 | 2015-04-22 | 福建省辉尚光电科技有限公司 | Annular distributive type universal LED lamp structure |
| CN107039568A (en) * | 2016-02-03 | 2017-08-11 | 苏州科医世凯半导体技术有限责任公司 | A kind of compound high heat conductive insulating metal substrate |
| CN107527988A (en) * | 2016-06-20 | 2017-12-29 | 苏州科医世凯半导体技术有限责任公司 | A kind of compound high heat conductive insulating metal substrate and encapsulation |
| CN106449956A (en) * | 2016-12-05 | 2017-02-22 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | LED high thermal conductivity metal substrate and preparation technology thereof |
| CN106922081A (en) * | 2017-04-25 | 2017-07-04 | 安徽宏鑫电子科技有限公司 | A kind of single-clad board |
| CN109696792A (en) * | 2017-10-24 | 2019-04-30 | 中强光电股份有限公司 | Projector and Wavelength converter |
| CN108488644A (en) * | 2018-03-28 | 2018-09-04 | 杭州和顺建设有限公司 | A kind of high-efficient heat-dissipating LED lamp |
| CN108461616A (en) * | 2018-05-21 | 2018-08-28 | 杭州电子科技大学 | A kind of great power LED detaches the packaging method of radiator structure with thermoelectricity |
| CN108630799A (en) * | 2018-05-21 | 2018-10-09 | 杭州电子科技大学 | A kind of great power LED thermoelectricity separation radiator structure |
| CN108461616B (en) * | 2018-05-21 | 2020-08-07 | 杭州电子科技大学 | Packaging method of thermoelectric separation heat dissipation structure for high-power L ED |
| CN108630799B (en) * | 2018-05-21 | 2020-08-07 | 杭州电子科技大学 | Thermoelectric separation heat radiation structure for high-power L ED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 519125 Guangdong Province, Zhuhai city Doumen District Baijiao Industrial Park New Road No. 23 Patentee after: Guangdong all treasures Polytron Technologies Inc Address before: 519125 Guangdong city of Zhuhai province Doumen Baijiao Industrial Park Patentee before: Zhuhai Totking Electron Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120801 Termination date: 20201201 |
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| CF01 | Termination of patent right due to non-payment of annual fee |