CN201599745U - LED lamp and substrate thereof - Google Patents
LED lamp and substrate thereof Download PDFInfo
- Publication number
- CN201599745U CN201599745U CN2010200031948U CN201020003194U CN201599745U CN 201599745 U CN201599745 U CN 201599745U CN 2010200031948 U CN2010200031948 U CN 2010200031948U CN 201020003194 U CN201020003194 U CN 201020003194U CN 201599745 U CN201599745 U CN 201599745U
- Authority
- CN
- China
- Prior art keywords
- heat
- copper
- conducting plate
- clad
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model provides an LED lamp and a substrate thereof. The substrate of the LED lamp comprises a heat conduction plate, a copper coating layer, an insulating layer and a solder mask layer, wherein the heat conduction plate is used for transmitting heat; the copper coating layer is used for manufacturing a circuit; the insulating layer is arranged between the surface of the heat conduction plate and the copper coating layer and is used for insulating the heat conduction plate and the copper coating layer; the solder mask layer is covered on the surface of the copper coating layer and is used for protecting the copper coating layer; and the substrate also comprises a filling groove that is positioned on the surface of the insulating layer under an LED base and is not covered by the copper coating layer and the solder mask layer. The LED lamp with the substrate also comprises a filling part, wherein the filling part is filled in the filling groove; and one end surface of the filling part is in contact with the bottom surface of the filling groove, and the other end surface thereof is in contact with the LED base. With the adoption of the lamp and the substrate, the energy generated by a PN junction can be directly transmitted to the heat conduction plate of the substrate by the LED base and the filling part, thereby avoiding the heat conduction blocking of the insulating layer between the LED base and the heat conduction plate in the prior art, improving the heat conduction capacity and enhancing the heat dissipation effect.
Description
Technical field
The utility model relates to lighting field, particularly a kind of LED light fixture and substrate thereof.
Background technology
(Light Emitting Diode LED) as solid state light emitter of new generation, has numerous advantages such as long, energy-efficient, environmental protection of life-span to light emitting diode, is widely applied in the lighting field.Along with development in science and technology, advanced technology constantly is applied in the semiconductor lighting, so that the light efficiency of LED constantly promotes, cost continues to descend.
The wafer that the core of LED is made up of P-type semiconductor and N-type semiconductor has a transition zone between P-type semiconductor and N-type semiconductor, be called PN junction.When the positive pole of power supply connects the P-type semiconductor of PN junction, the N-type semiconductor that negative pole connects PN junction, electric current flows to N-type semiconductor from P-type semiconductor, can discharge the form of unnecessary energy when injected electrons and hole-recombination with light, thereby electric energy directly is converted to luminous energy, but in compound, exist part non-radiative compound, non-radiative compound be that the form of electric energy with heat energy discharged.The light that sends after electronics and the hole-recombination be not all can be transmitted into the LED fluorescent tube outside, its can be absorbed and transform heat at PN junction and epoxy resin/silica gel inside.This heat is fatal, because can not fully dispel the heat, can be that the LED internal temperature is raise, and temperature is high more, the luminous efficiency of LED reduces, and temperature is high more, and the LED life-span is short more, serious situation can cause led chip to lose efficacy at once, so heat radiation is still great power LED and uses huge obstacle.
For the heat that LED is produced distributes, on the LED light fixture, make the device that is used to dispel the heat usually.Fig. 1 is the structural representation of existing LED light fixture, in conjunction with Fig. 1, the structure of LED light fixture is described, and is specific as follows:
Existing LED light fixture comprises LED, aluminium base and radiating part; LED is manufactured with the one side of circuit by being fixedly welded on aluminium base; The another side of aluminium base is fixed with the radiating part that is used to dispel the heat.
Wherein, radiating part comprises radiating fin 101 and heat-conducting layer 102; Aluminium base comprises aluminium sheet 103, insulating barrier 104, copper-clad 105 and solder mask 106; LED comprises pedestal 107, PN junction 108, first electrode 109, second electrode 110, connecting line 111 and light collecting part 112.
The heat that aluminium sheet 103 in the aluminium base will be welded in the LED generation of aluminium base distributes; Insulating barrier 104 is made in a surface of aluminium sheet 103, is used to isolate aluminium sheet 103 and is made in the copper-clad 105 on insulating barrier 104 surfaces, prevents to be made in circuit on the copper-clad 105 and contacts with aluminium sheet 103 and cause short circuit; Can carry out etching to the copper-clad 105 that is made on the insulating barrier 104 according to circuit design, form the internal connection circuit of LED light fixture; Solder mask 106 is covered in the part surface of copper-clad 105, is used to protect the copper-clad 105 under it, to avoid in welding device process the destruction to the LED lamp circuit that is made in copper-clad 105; The surface of solder mask 106 unlapped copper-clads 105 can be in order to welding LED, so that LED is connected with related circuit on the copper-clad 105.
One surface of the pedestal 107 of LED contacts with copper-clad 105, and another surface is manufactured with PN junction 108, is used for the heat that PN junction 108 produces is conducted by copper-clad 105.The P-type semiconductor of PN junction 108 is connected with first electrode 109 by connecting line 111, N-type semiconductor is connected with second electrode 110 by connecting line 111, also but N-type semiconductor is connected with first electrode 109 by connecting line 111, and P-type semiconductor is connected with second electrode 110 by connecting line 111; PN junction 108 is used to convert electrical energy into luminous energy.Connecting line 111 can be gold thread for connecting the plain conductor of electrode and PN junction 108.One end of first electrode 109 and pedestal 107 are fixed by the insulation plastic cement, the other end is fixed in the copper-clad 105 that is not covered by solder mask 106, an end that is fixed in first electrode 109 of pedestal 107 can be connected with the P-type semiconductor or the N-type semiconductor of PN junction 108 by connecting line 111, is used to connect PN junction 108 and the circuit that is made on the copper-clad 105.One end of second electrode 110 and pedestal 107 are fixed by the insulation plastic cement, the other end is fixed in the copper-clad 105 that is not covered by solder mask 106, an end that is fixed in second electrode 110 of pedestal 107 can be connected with the N-type semiconductor or the P-type semiconductor of PN junction 108 by connecting line 111, is used to connect PN junction 108 and the circuit that is made on the copper-clad 105.Light collecting part 112 is coated on the part that part that PN junction 108, connecting line 111, first electrode 109 be connected with PN junction 108 and second electrode 110 are connected with PN junction 108, be used to protect PN junction 108 and connecting line 111 under it, increase the light emission rate of PN junction 108, have certain light-focusing function; Light collecting part 112 can adopt epoxy resin or silica gel.Cause the PN junction short circuit for fear of the contact between electrode and the pedestal, normally the copper-clad 105 that will contact with pedestal 107 is kept apart with the copper-clad 105 that contacts with electrode, so that an end and pedestal 107 threes that the contact copper-clad 105 electricity isolation mutually of an end of first electrode, 109 contact copper-clads 105, second electrode, 109 contact copper-clads 105.
The radiating fin 101 of radiating part comprises and is distributed in heat-conducting layer 102 surfaces that do not contact aluminium sheet 103, the multi-disc sheet metal that keeps at a certain distance away, and is used for that heat-conducting layer 102 is conducted the heat that and distributes by the multi-disc sheet metal; The multi-disc sheet metal has increased area of dissipation, when flow in the interval of air between the multi-disc sheet metal, can take away more heat, has preferable radiating effect.Heat-conducting layer 102 is used to fill radiating fin 101 and the space between aluminium sheet 103 surfaces of contact insulation layer 104 not, improves the capacity of heat transmission; Heat-conducting layer 102 can be silicone grease or thermal conductive silicon film.
Fig. 2 is the heat dissipation path schematic diagram of existing LED light fixture.In conjunction with Fig. 2, the heat dissipation path of existing LED light fixture is described, specific as follows:
The PN junction 108 of high-power LED lamp is when converting electrical energy into luminous energy, also can produce a large amount of heats, wherein the small part heat is dispersed in the air by light collecting part 112 in luminous, most of heat is by conducting to the aluminium sheet 103 that contacts with insulating barrier 104 with PN junction 108 substrate contacted 107, the copper-clad 105 that contacts with pedestal 107, the insulating barrier 104 that contacts with copper-clad 105, by aluminium sheet 103 heat conducted; If the aluminium sheet of high-power LED lamp also has radiating part 103 times, then aluminium sheet 103 can further conduct to heat on the multi-disc sheet metal of radiating fin 101 by heat-conducting layer 102, by the multi-disc sheet metal heat is distributed.Usually the thermal conductivity factor of metal is bigger, has preferable heat-conducting effect, such as: the thermal conductivity factor of copper is about 400 watts every meter and whenever opens (W/mk), and the thermal conductivity factor of iron is about 80W/mk, and the thermal conductivity factor of aluminium is about 200W/mk; The heat-conducting system of insulating materials is generally less than 1W/mk; Therefore, in the existing high-power LED lamp, the insulating barrier of making on the aluminium base 104 has hindered the conduction of heat, makes that the radiating effect of existing high-power LED lamp is not good, has reduced the efficient of LED, has shortened the life-span of LED.
The utility model content
In view of this, the purpose of this utility model is to provide a kind of substrate of LED light fixture, and this substrate can improve capacity of heat transmission, strengthens radiating effect.
The purpose of this utility model is to provide a kind of LED light fixture, and this light fixture can improve capacity of heat transmission, strengthens radiating effect.
For achieving the above object, the technical solution of the utility model specifically is achieved in that
A kind of substrate of LED light fixture, this substrate comprises:
Heat-conducting plate in order to the conduction heat;
And, be used to make the copper-clad of circuit;
And, be arranged between heat-conducting plate surface and copper-clad, be used to isolate the insulating barrier of heat-conducting plate and copper-clad;
And, be covered in the solder mask of copper-clad surface in order to the protection copper-clad;
The described surface of insulating layer that is positioned at LED pedestal below is provided with not by the filling slot of copper-clad and solder mask covering, and described filling slot bottom surface contacts described heat-conducting plate.
In the aforesaid substrate, the area of section that described filling slot is parallel to described surface of insulating layer is parallel to the area of described surface of insulating layer less than the LED pedestal, described filling slot perpendicular to the degree of depth of described surface of insulating layer direction greater than thickness of insulating layer and less than heat-conducting plate and thickness of insulating layer sum.
In the aforesaid substrate, described heat-conducting plate is copper or aluminium.
A kind of LED light fixture comprises: the substrate that is provided with the LED of pedestal and is used to install LED,
One surface of the pedestal of described LED is provided with PN junction;
Described substrate comprise in order to the conduction heat heat-conducting plate, be used to make circuit copper-clad, be arranged at be used to isolate the insulating barrier of heat-conducting plate and copper-clad between heat-conducting plate surface and copper-clad and be covered in the copper-clad surface in order to the protection copper-clad solder mask;
The described surface of insulating layer that is positioned at LED pedestal below is provided with not by the filling slot of copper-clad and solder mask covering, and described filling slot bottom surface contacts described heat-conducting plate;
This light fixture also comprises: be filled in the filling slot of described heat-conducting plate and an end face contacts the filling part of other end, described filling slot bottom surface contact LED pedestal.
In the above-mentioned light fixture, the area of section that described filling slot is parallel to described surface of insulating layer is parallel to the area of described surface of insulating layer less than the LED pedestal, described filling slot perpendicular to the degree of depth of described insulating barrier direction greater than the thickness of insulating barrier and less than heat-conducting plate and thickness of insulating layer sum.
Preferably, this light fixture further comprises the radiating part that is used to increase area of dissipation,
Described radiating part is fixed in the surface that described heat-conducting plate is not provided with insulating barrier.
In the above-mentioned light fixture, described radiating part comprises: be used to increase the radiating fin of area of dissipation and be used for the heat of heat-conducting plate is conducted to the radiating fin heat-conducting layer;
Described heat-conducting layer is filled in radiating fin and described heat-conducting plate slit between surface of insulating layer is not set;
Described radiating fin comprises and is distributed in the not multi-disc sheet metal on the heat-conducting layer surface of thermal contact conductance plate to have one between described adjacent two metal sheets at interval.
In the above-mentioned light fixture, described heat-conducting plate is a copper coin, and described radiating fin is a copper, and then described filling part is a tin cream, and described heat-conducting layer is a tin.
In the above-mentioned light fixture, described heat-conducting plate is an aluminium sheet, the coat of metal that then described filling part comprises the thermal contact conductance plate with fill filling slot and contact the tin cream of LED pedestal, described heat-conducting layer comprises the coat of metal of thermal contact conductance plate and fills the tin cream in slit between the coat of metal and radiating fin.
Preferably, described radiating fin is an aluminium, and then described heat-conducting layer further comprises the coat of metal that contacts radiating fin.
As seen from the above technical solutions, the utility model provides the substrate of a kind of LED light fixture and LED light fixture, and the substrate of LED light fixture comprises: in order to the heat-conducting plate of conduction heat; And, be used to make the copper-clad of circuit; And, be arranged between heat-conducting plate surface and copper-clad, be used to isolate the insulating barrier of heat-conducting plate and copper-clad; And, be covered in the solder mask of copper-clad surface in order to the protection copper-clad; The described surface of insulating layer that is positioned at LED pedestal below is provided with not by the filling slot of copper-clad and solder mask covering, and described filling slot bottom surface contacts described heat-conducting plate.The LED light fixture comprises: the substrate that is provided with the LED of pedestal and is used to install LED, and a surface of the pedestal of described LED is provided with PN junction; Described substrate comprise in order to the conduction heat heat-conducting plate, be used to make circuit copper-clad, be arranged at be used to isolate the insulating barrier of heat-conducting plate and copper-clad between heat-conducting plate surface and copper-clad and be covered in the copper-clad surface in order to the protection copper-clad solder mask; The described surface of insulating layer that is positioned at LED pedestal below is provided with not by the filling slot of copper-clad and solder mask covering, and the bottom surface of described filling slot contacts described heat-conducting plate; This light fixture also comprises: be filled in the filling slot of described heat-conducting plate and the filling part of end face contact other end, filling slot bottom surface contact LED pedestal.Adopt the substrate of LED light fixture of the present utility model and LED light fixture, the insulating barrier of this substrate is provided with filling slot, and filling slot bottom surface thermal contact conductance plate, have in the LED light fixture of aforesaid substrate, the filling part that is filled in the filling slot directly is connected the LED pedestal with heat-conducting plate, and the stopping of the heat of having avoided insulating barrier that the LED pedestal is conducted is so that the heat that PN junction produces can be directly conducted to heat-conducting plate, improve capacity of heat transmission, strengthened radiating effect.
Description of drawings
Fig. 1 is the structural representation of existing LED light fixture.
Fig. 2 is the schematic diagram of existing LED light fixture heat dissipation path.
Fig. 3 is the structural representation of the substrate of the utility model LED light fixture.
Fig. 4 is the structural representation of the utility model LED light fixture.
The specific embodiment
For make the purpose of this utility model, technical scheme, and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the utility model is further described.
The utility model provides the substrate of a kind of LED light fixture and LED light fixture, the insulating barrier of the substrate of this LED light fixture is provided with filling slot, the bottom surface thermal contact conductance plate of filling slot and not covered by copper-clad and solder mask, have in the LED light fixture of aforesaid substrate, the filling part that is filled in the filling slot directly is connected the LED pedestal with heat-conducting plate, avoided stopping of heat that insulating barrier passes to out the LED pedestal,, improved capacity of heat transmission so that the heat that PN junction produces can be directly conducted to heat-conducting plate; Have in the LED light fixture of radiating part, the heat-conducting layer of radiating part and substrate contacts is no longer selected lower silicone grease of thermal conductivity factor or thermal conductive silicon film for use, and selected the higher metal of thermal conductivity factor for use, and improved the capacity of heat transmission between substrate and radiating part, strengthened radiating effect.
Fig. 3 is the structural representation of the substrate of the utility model LED light fixture.In conjunction with Fig. 3, the structure of the substrate of the utility model LED light fixture is described, specific as follows;
The substrate of the utility model LED light fixture comprises: heat-conducting plate 203, insulating barrier 204, copper-clad 205 and solder mask 206.
Heat-conducting plate 203 is used for the heat of the PN junction generation of LED is conducted; Heat-conducting plate 203 can be selected the higher material of thermal conductivity factor for use, and such as the higher metal of thermal conductivity factor, thermal conductive ceramic etc., the thermal conductivity factor of copper is 400 watts every meter and whenever opens (W/mk), and the thermal conductivity factor of iron is 80W/mk, and the thermal conductivity factor of aluminium is 200W/mk.The heat-conducting plate 203 of present embodiment can be the higher metal of thermal conductivity factor, such as: copper or aluminium.
Insulating barrier 204 is arranged at heat-conducting plate 203 surfaces, is used to isolate heat-conducting plate 203 and is arranged at the copper-clad 205 on insulating barrier 204 surfaces, prevents to be made in circuit on the copper-clad 205 and contacts with heat-conducting plate 203 and cause short circuit.The insulating barrier 204 not surface of thermal contact conductance plate 203 is provided with not by the filling slot 2031 of the bottom surface thermal contact conductance plate 203 of copper-clad 205 and solder mask 206 coverings, and its heat that pedestal of LED is produced is directly conducted to heat-conducting plate 203.Filling slot 2031 is parallel to the area of the area on insulating barrier 204 surfaces less than the LED pedestal, its perpendicular to the degree of depth of insulating barrier 204 surface direction greater than insulating barrier 204 thickness and less than the thickness sum of heat-conducting plate 203 with insulating barrier 204, just the bottom surface thermal contact conductance plate 203 of filling slot 2031.Such as: the thickness of heat-conducting plate 203 is 1.0mm, 1.2mm, 1.6mm, 2.0mm etc., the thickness of insulating barrier 204 is about 0.1mm, and the degree of depth of filling slot 2031 is as long as just can guarantee to remove fully insulating barrier 204 between LED pedestal and heat-conducting plate 203 greater than 0.5mm.
Copper-clad 205 is arranged at the surface of insulating barrier 204 and away from the filling slot 2031 of insulating barrier 204.Can carry out etching to the copper-clad 205 that is arranged on the insulating barrier 204 according to circuit design, form the internal connection circuit of LED light fixture.Solder mask 206 is covered in the part surface of copper-clad 205, is used to protect the copper-clad 205 under it, to avoid in welding device process being made in the damage of circuit of copper-clad 205; LED is welded in not on the copper-clad 205 that is covered by solder mask 206.
Fig. 4 is the structural representation of the utility model LED light fixture.Now in conjunction with Fig. 4, the structure of the utility model LED light fixture is described, specific as follows:
The utility model LED light fixture comprises LED, substrate and filling part 207, and wherein, LED is identical with existing LED structure, is provided with pedestal 107; Substrate has structure shown in Figure 3, no longer the structure of LED and substrate is given unnecessary details at this.
Be not provided with the filling slot 2031 of LED pedestal 107 surfaces on heat-conducting plate 203 of PN junction 108; The pedestal 107 of LED and 203 of the heat-conducting plates of substrate have a filling part 207, it is filled in the filling slot 2031 on insulating barrier 204 surfaces and the pedestal 107 of an end face thermal contact conductance plate 203 other ends contact LED, and the heat that produces in order to the PN junction 108 that will be provided with on the pedestal 107 is directly conducted to the heat-conducting plate 203 of substrate.Filling part 207 is the higher welding material of thermal conductivity factor, such as: thermal conductivity factor is greater than the tin cream of 60W/mk; Since filling slot 2031 perpendicular to the degree of depth on insulating barrier 204 surfaces greater than the thickness of insulating barrier 204 and less than insulating barrier 204 and heat-conducting plate 203 thickness sums, and the thickness of copper-clad 205 is less, therefore, the pedestal 107 of LED and the close together of the filling slot 2031 on insulating barrier 204 surfaces, in order to prevent that the tin cream that overflows filling slot 2031 from contacting the short circuit that causes pedestal 107 and electrode with copper-clad 205, the area of section that filling slot 2031 is parallel to insulating barrier 204 surfaces is parallel to the area of insulating barrier 204 less than LED pedestal 107, preferably, the copper-clad 205 that is connected with electrode is away from filling slot 2031.
In order to improve the radiating effect of LED light fixture, LED light fixture of the present utility model can further comprise the radiating part that is installed in the substrate surface that is not equiped with LED; Radiating part comprises the heat-conducting layer 208 that is used to increase the radiating fin 209 of area of dissipation and is used for the heat of heat-conducting plate 203 is conducted to radiating fin 209; Heat-conducting layer 208 is filled in radiating fin 209 and heat-conducting plate 203 slit between the surface of insulating barrier 204 is not set.The structure of radiating fin 209 is same as the prior art, does not repeat them here, and radiating fin 209 can be the higher metal of thermal conductivity factor in the present embodiment, such as copper or aluminium.Because the thermal conductivity factor of silicone grease or thermal conductive silicon film is less than 5W/mk, heat-conducting effect is not good, and the heat-conducting layer 208 of the utility model LED light fixture can be metal, such as: heat-conducting layer 208 can be tin cream, and perhaps heat-conducting layer 208 comprises the coat of metal and tin cream; The coat of metal is copper, nickel, gold or silver-colored; Because golden or silver-colored cost is higher, does not adopt gold or silver usually, can select different metals according to the material of heat-conducting plate 203 and radiating fin 209.
Because the bonding force of aluminium and tin is relatively poor, tin can't directly adhere to the surface of aluminium, need make layer of metal coating on the surface of aluminium usually, sprays tin at coating surface again and handles, and described coating can be copper, nickel, gold or silver-colored.Therefore, if the heat-conducting plate 203 of substrate is a copper, then filling part 207 is a tin cream, can directly fill tin cream in filling slot 2031, so that pedestal 107 directly is connected with copper coin by tin cream; If the heat-conducting plate 203 of substrate is an aluminium, then filling part 207 comprises the coat of metal and the tin cream of filling filling slot 2031 and contacting with LED pedestal 107 of thermal contact conductance plate 203, utilize plating or chemical plating to make the coats of metal on filling slot 2031 surfaces of aluminium sheet, on the coat of metal, spray tin and handle, fill tin creams in the filling slot 2031 that utilizes the steel mesh tin scraping to make afterwards to be manufactured with the coat of metal; The coat of metal is copper, nickel, gold or silver-colored.If heat-conducting plate 203 and radiating fin 209 all are copper, then heat-conducting layer 208 can be tin, if one of them of heat-conducting plate 203 and radiating fin 209 is aluminium, then heat-conducting layer 208 comprises the coat of metal that contacts with aluminium and the tin that contacts other metal, and the coat of metal can be copper, nickel, gold or silver-colored.
The substrate surface of LED light fixture of the present utility model has filling slot 2031, be made in the heat that the PN junction 108 of the LED of substrate produces and be directly conducted to heat-conducting plate 203 by LED pedestal 107, filling part 207, need not through insulating barrier 204, avoided in the prior art insulating barrier to heat conducting obstruction, improve capacity of heat transmission, strengthened radiating effect; Heat-conducting layer 208 with LED light fixture of radiating part adopts the higher metal of the coefficients of heat conduction, has avoided existing silicone grease or the thermal conductive silicon film obstruction to the heat that conducts to radiating part, has improved capacity of heat transmission, has strengthened radiating effect.
In sum, be preferred embodiment of the present utility model more than, be not to be used for limiting protection domain of the present utility model.All within spirit of the present utility model and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection domain of the present utility model.
Claims (10)
1. the substrate of a LED light fixture, this substrate comprises:
Heat-conducting plate in order to the conduction heat;
And, be used to make the copper-clad of circuit;
And, be arranged between heat-conducting plate surface and copper-clad, be used to isolate the insulating barrier of heat-conducting plate and copper-clad;
And, be covered in the solder mask of copper-clad surface in order to the protection copper-clad;
It is characterized in that,
The described surface of insulating layer that is positioned at LED pedestal below is provided with not by the filling slot of copper-clad and solder mask covering, and described filling slot bottom surface contacts described heat-conducting plate.
2. substrate according to claim 1, it is characterized in that, the area of section that described filling slot is parallel to described surface of insulating layer is parallel to the area of described surface of insulating layer less than the LED pedestal, described filling slot perpendicular to the degree of depth of described surface of insulating layer direction greater than thickness of insulating layer and less than heat-conducting plate and thickness of insulating layer sum.
3. substrate according to claim 1 and 2 is characterized in that, described heat-conducting plate is copper or aluminium.
4. LED light fixture comprises: the substrate that is provided with the LED of pedestal and is used to install LED,
One surface of the pedestal of described LED is provided with PN junction;
Described substrate comprise in order to the conduction heat heat-conducting plate, be used to make circuit copper-clad, be arranged at be used to isolate the insulating barrier of heat-conducting plate and copper-clad between heat-conducting plate surface and copper-clad and be covered in the copper-clad surface in order to the protection copper-clad solder mask;
It is characterized in that,
The described surface of insulating layer that is positioned at LED pedestal below is provided with not by the filling slot of copper-clad and solder mask covering, and described filling slot bottom surface contacts described heat-conducting plate;
Be filled in the filling slot of described heat-conducting plate and an end face contacts the filling part of other end, described filling slot bottom surface contact LED pedestal.
5. light fixture according to claim 4, it is characterized in that, the area of section that described filling slot is parallel to described surface of insulating layer is parallel to the area of described surface of insulating layer less than the LED pedestal, described filling slot perpendicular to the degree of depth of described insulating barrier direction greater than the thickness of insulating barrier and less than heat-conducting plate and thickness of insulating layer sum.
6. light fixture according to claim 5 is characterized in that this light fixture further comprises the radiating part that is used to increase area of dissipation,
Described radiating part is fixed in the surface that described heat-conducting plate is not provided with insulating barrier.
7. light fixture according to claim 6 is characterized in that, described radiating part comprises: be used to increase the radiating fin of area of dissipation and be used for the heat of heat-conducting plate is conducted to the radiating fin heat-conducting layer;
Described heat-conducting layer is filled in radiating fin and described heat-conducting plate slit between surface of insulating layer is not set;
Described radiating fin comprises and is distributed in the not multi-disc sheet metal on the heat-conducting layer surface of thermal contact conductance plate to have one between described adjacent two metal sheets at interval.
8. light fixture according to claim 7 is characterized in that,
Described heat-conducting plate is a copper coin, and described radiating fin is a copper, and then described filling part is a tin cream, and described heat-conducting layer is a tin.
9. light fixture according to claim 7 is characterized in that,
Described heat-conducting plate is an aluminium sheet, the coat of metal that then described filling part comprises the thermal contact conductance plate with fill filling slot and contact the tin cream of LED pedestal, described heat-conducting layer comprises the coat of metal of thermal contact conductance plate and fills the tin cream in slit between the coat of metal and radiating fin.
10. light fixture according to claim 9 is characterized in that,
Described radiating fin is an aluminium, and then described heat-conducting layer further comprises the coat of metal that contacts radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200031948U CN201599745U (en) | 2010-01-20 | 2010-01-20 | LED lamp and substrate thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200031948U CN201599745U (en) | 2010-01-20 | 2010-01-20 | LED lamp and substrate thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201599745U true CN201599745U (en) | 2010-10-06 |
Family
ID=42810799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200031948U Expired - Lifetime CN201599745U (en) | 2010-01-20 | 2010-01-20 | LED lamp and substrate thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201599745U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102330901A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Light source module |
| CN102519027A (en) * | 2011-11-21 | 2012-06-27 | 王振辉 | Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof |
| CN102679187A (en) * | 2011-03-07 | 2012-09-19 | 秦彪 | LED (light-emitting diode) optical module for lighting, and LED chip |
| CN102983249A (en) * | 2012-11-27 | 2013-03-20 | 东莞勤上光电股份有限公司 | Improved heat conduction light emitting diode (LED) substrate and processing technology thereof |
| CN102997088A (en) * | 2011-09-09 | 2013-03-27 | 东芝照明技术株式会社 | Luminaire |
| CN103672810A (en) * | 2013-12-04 | 2014-03-26 | 浙江欧珑电气有限公司 | LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator |
-
2010
- 2010-01-20 CN CN2010200031948U patent/CN201599745U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102679187A (en) * | 2011-03-07 | 2012-09-19 | 秦彪 | LED (light-emitting diode) optical module for lighting, and LED chip |
| CN102679187B (en) * | 2011-03-07 | 2016-06-01 | 秦彪 | For the LED light module illuminated and LED chip |
| CN102330901A (en) * | 2011-07-22 | 2012-01-25 | 东莞市万丰纳米材料有限公司 | Light source module |
| CN102997088A (en) * | 2011-09-09 | 2013-03-27 | 东芝照明技术株式会社 | Luminaire |
| CN102997088B (en) * | 2011-09-09 | 2014-12-03 | 东芝照明技术株式会社 | Luminaire |
| CN102519027A (en) * | 2011-11-21 | 2012-06-27 | 王振辉 | Radiation enhanced LED (light-emitting diode) circuit board and manufacturing method and application thereof |
| CN102983249A (en) * | 2012-11-27 | 2013-03-20 | 东莞勤上光电股份有限公司 | Improved heat conduction light emitting diode (LED) substrate and processing technology thereof |
| CN102983249B (en) * | 2012-11-27 | 2015-10-21 | 东莞勤上光电股份有限公司 | Modified model thermally conductive LED substrate and processing technology thereof |
| CN103672810A (en) * | 2013-12-04 | 2014-03-26 | 浙江欧珑电气有限公司 | LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201599745U (en) | LED lamp and substrate thereof | |
| CN102109116B (en) | Led light module and led chip | |
| CN202363517U (en) | Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) | |
| WO2009094829A1 (en) | A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly | |
| CN203481273U (en) | LED light source module based on AlSiC composite substrate | |
| CN102769076A (en) | Package carrier and method for manufacturing the same | |
| CN101645478A (en) | Light emitting diode (LED) radiating structure | |
| CN204062952U (en) | A kind of radiator structure of LED lamp | |
| CN105444461B (en) | A kind of thermoelectric cooler | |
| US20130010481A1 (en) | LED Lampwick, LED Chip, and Method for Manufacturing LED Chip | |
| CN201766098U (en) | Zero thermal resistance structure of high-power LED (light-emitting diode) and radiator and LED lamp | |
| WO2015032256A1 (en) | Floating heat sink support with copper sheets and led package assembly for led flip chip package | |
| TW201608678A (en) | Chip package module and package substrate | |
| CN102842671B (en) | LED (Light Emitting Diode) heat dissipation structure and machining method thereof | |
| CN103247742B (en) | A kind of LED heat radiation substrate and manufacture method thereof | |
| CN102255236A (en) | Circuit packaging structure of high-power semiconductor laser and method for preparing circuit packaging structure | |
| CN104501013A (en) | Led lamp | |
| CN211606913U (en) | Easy radiating circuit board | |
| CN103234181A (en) | High heat conduction light-emitting diode (LED) welding method | |
| CN201985161U (en) | Stack-type thermal module | |
| CN203734133U (en) | Serially-connected multi-tube semiconductor laser | |
| CN103887396A (en) | A light-emitting assembly in which an LED chip is directly welded to the surface of a copper heat sink and a preparation method thereof | |
| CN202065723U (en) | LED (light-emitting diode) lamp | |
| CN203323067U (en) | High-power LED heat dissipation structure | |
| CN201732809U (en) | Encapsulating structure of LED lighting source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN DIANMING TECH. CO., LTD. Free format text: FORMER OWNER: SHENZHEN TONGZHOU ELECTRONIC CO., LTD. Effective date: 20110330 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518057 CAIJIANG TECHNOLOGY BUILDING, NORTH AREA OF HIGH-TECH. PARK, NANSHAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518057 FACTORY BUILDING 1, INSIDE OF YARD OF FLOUR COMPANY, THE FIFTH INDUSTRIAL ZONE, KEYUAN ROAD, NANSHAN DISTRICT, SHENZHEN CITY |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110330 Address after: 518057 Shenzhen city Nanshan District Keyuan Road Fifth Industrial Zone flour company courtyard 1 factories Patentee after: SHENZHEN DIANMING SCI & TECH CO., LTD. Address before: 518057 Nanshan District hi tech park, Guangdong, North District Rainbow science and Technology Building Patentee before: Shenzhen Tongzhou Electronic Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 518101 D building, 1-5 floor, zone seventy-one, Xin'an street, Baoan District, Guangdong, Shenzhen Patentee after: SHENZHEN DIANMING TECHNOLOGY CO., LTD. Address before: 518057 Shenzhen city Nanshan District Keyuan Road Fifth Industrial Zone flour company courtyard 1 factories Patentee before: SHENZHEN DIANMING SCI & TECH CO., LTD. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20101006 |
|
| CX01 | Expiry of patent term |