CN102983249A - Improved heat conduction light emitting diode (LED) substrate and processing technology thereof - Google Patents
Improved heat conduction light emitting diode (LED) substrate and processing technology thereof Download PDFInfo
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- CN102983249A CN102983249A CN2012104901455A CN201210490145A CN102983249A CN 102983249 A CN102983249 A CN 102983249A CN 2012104901455 A CN2012104901455 A CN 2012104901455A CN 201210490145 A CN201210490145 A CN 201210490145A CN 102983249 A CN102983249 A CN 102983249A
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Abstract
The invention relates to the technical field of substrates of light emitting diode (LED) lamps, in particular to an improved heat conduction LED substrate. The improved heat conduction LED substrate comprises a substrate body and a heat conduction block which is arranged on the substrate body, the substrate body is composed of a solder mask layer, an electricity conducting layer, an insulating layer and a metal base layer, an accommodating hole is arranged on the substrate body, and the heat conduction block is embedded in the accommodating hole. Merely one insulating layer is arranged, so that the structure of the substrate is simplified, and producing costs of the improved heat conduction LED substrate are lowered. A processing technology includes the steps that hot pressing is performed to obtain the substrate body, the accommodating hole is milled on the substrate body, a nickel layer is plated on the inner wall of the accommodating hole in an electroplating mode or a tin layer is sprayed on the inner wall of the accommodating hole in a spray coating mode, tin paste is coated at the bottom of the heat conduction block in a screen printing mode, the heat conduction block is embedded in the accommodating hole, and finally reflow soldering processing is performed. Accordingly, the structure is compact and firm, and the speed of heat conduction between the substrate body and the heat conduction block is greatly increased.
Description
Technical field
[0001] the present invention relates to the heat dissipation technology field of LED lamp, refer in particular to a kind of modified model thermally conductive LED substrate and processing technology thereof.
Background technology
Because at present increasing to the power requirement of LED lamp, and the volume of LED lamp is more and more less, the heat conductivility of existing base plate for packaging for the LED lamp oneself through not satisfying the needs of high-powered LED lamp, the inferior quality that causes high-powered LED lamp, greatly reduce the useful life of high-powered LED lamp, thereby hindered the development of high-powered LED lamp.
Prior art is to ask required capacity of heat transmission and the circuit function demand of carrying high-power components, need first with metal substrate, insulating barrier and circuit layer utilize the mode moulding of hot pressing, on the substrate of this two moulding, make circuit again, to form a high-power components bearing substrate, this bearing substrate comprises solder mask, conductive layer, the first insulating barrier, metal-based layer and the second insulating barrier, because the about 401W/M.K of conductive coefficient of copper, the conductive coefficient of aluminium is about 207W/M.K, and the conductive coefficient of insulating barrier is about 1-3W/M.K, therefore the heat conduction obstacle of LED substrate is insulating barrier, but aforesaid substrate vertical thermal conducting power is confined to its insulating barrier, and so that it uses power to be difficult to further raising.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of modified model thermally conductive LED substrate of high thermal conductivity.
The technical problem that the present invention also will solve provides a kind of technique more simply and the processing technology of Effective Raise modified model thermally conductive LED substrate heat conductivility.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme: a kind of modified model thermally conductive LED substrate, comprise substrate body and be arranged at heat-conducting block on the substrate body, described substrate body is comprised of solder mask, conductive layer, insulating barrier and metal-based layer, and this solder mask, conductive layer, insulating barrier and metal-based layer stack gradually from top to bottom; Described substrate body offers containing hole, and this containing hole extends to metal-based layer, and described heat-conducting block is embedded in the containing hole.
Wherein, be coated with between the bottom of the bottom surface of described heat-conducting block and containing hole tin cream is housed.
Wherein, be provided with nickel dam or tin layer between the inwall of the outer wall of described heat-conducting block and containing hole.
Wherein, described heat-conducting block is made by the red copper material.
Wherein, described conductive layer is the Copper Foil that is made of copper.
Wherein, described metal-based layer is made by copper coin, aluminium sheet or corrosion resistant plate.
Wherein, described insulating barrier is made by ceramics polymer.
Wherein, the thickness of described metal-based layer is greater than the thickness of solder mask, conductive layer and insulating barrier sum.
Wherein, the downside of described metal-based layer is provided with radiator, and this radiator and metal-based layer are one-body molded.
A kind of technique of processing modified model thermally conductive LED substrate comprises following processing step:
A, solder mask, conductive layer, insulating barrier and metal-based layer are stacked gradually hot pressing from top to bottom obtain substrate body;
B, adopt the mode of milling to mill out containing hole in substrate body, it is for subsequent use to make the heat-conducting block that adapts with the containing hole size;
C, the mode of electroplating in the inwall employing of containing hole plate nickel dam or adopt the mode of spraying to spray the tin layer;
D, adopt the mode of silk screen printing to be coated with the seal tin cream in the bottom of heat-conducting block, and heat-conducting block is embedded at obtains substrate base material in the containing hole;
E, Reflow Soldering processing is carried out in the junction between the inwall of the outer wall of heat-conducting block and containing hole process.
Further, in step e, when carrying out Reflow Soldering processing processing, the upper surface that heat-conducting block is pressed to heat-conducting block is concordant with the upper surface of conductive layer.
A kind of radiator with modified model thermally conductive LED substrate, this radiator and metal-based layer are structure as a whole.
Beneficial effect of the present invention is: the invention provides a kind of and contain an insulating barrier to improve the modified model thermally conductive LED substrate of LED substrate heat conductivility, only by solder mask, conductive layer, insulating barrier and metal-based layer form, simplified the structure of modified model thermally conductive LED substrate, reduced the production cost of modified model thermally conductive LED substrate, substrate body in the technical program directly is connected with heat-conducting block, strengthened the heat conductivility of substrate body, pearl is arranged on the heat-conducting block LED lamp, thereby the heat on the LED lamp pearl can be conducted to substrate body as soon as possible, by the radiator that is arranged on the substrate body heat is shed again, indirectly improved the radiating efficiency of LED lamp pearl, prolonged its useful life, practical.
The present invention also provides a kind of technique more simply and the processing technology of Effective Raise modified model thermally conductive LED substrate heat conductivility, the modified model thermally conductive LED substrate that the processing step of employing the technical program processes, not only structure is compacter firm, the sidewall of described containing hole is also more concordant, be convenient on the one hand greatly improve thermal conduction rate between substrate body and the heat-conducting block with plating nickel dam or adopting the mode of spraying to spray the tin layer; Also be convenient on the other hand described heat-conducting block is embedded in the containing hole, reduced difficulty of processing, improved the production efficiency of modified model thermally conductive LED substrate.
Description of drawings
Cross-sectional view when Fig. 1 is the hiding radiator of the present invention.
Fig. 2 is the structural representation of each step of technological process of processing technology of the present invention.
Fig. 3 is the cross-sectional view of the present invention when using.
Embodiment
For the ease of those skilled in the art's understanding, the present invention is further illustrated below in conjunction with embodiment and accompanying drawing, and the content that execution mode is mentioned not is limitation of the invention.
As shown in Figure 1 to Figure 3, a kind of modified model thermally conductive LED substrate, comprise substrate body 1 and be arranged at the heat-conducting block 2 of substrate body 1, described substrate body 1 is comprised of solder mask 3, conductive layer 4, insulating barrier 5 and metal-based layer 6, and this solder mask 3, conductive layer 4, insulating barrier 5 and metal-based layer 6 stack gradually from top to bottom; Described substrate body 1 offers containing hole 7, and this containing hole 7 extends to metal-based layer 6, and described heat-conducting block 2 is embedded in the containing hole 7.
Modified model thermally conductive LED substrate of the present invention is only by solder mask 3, conductive layer 4, insulating barrier 5 and metal-based layer 6 form, only contain an insulating barrier, simplified the structure of modified model thermally conductive LED substrate, reduced the production cost of modified model thermally conductive LED substrate, substrate body 1 in the technical program directly is connected with heat-conducting block 2, strengthened the heat conductivility of substrate body 1, LED lamp pearl is arranged on the heat-conducting block 2, thereby the heat on the LED lamp pearl can be conducted to substrate body 1 as soon as possible, by the radiator that is arranged on the substrate body 1 heat is shed again, indirectly improve the radiating efficiency of LED lamp pearl, prolonged its useful life, practical.
Be coated with between the bottom surface of the described heat-conducting block 2 of present embodiment and the bottom of containing hole 7 tin cream is housed, be provided with nickel dam or tin layer between the inwall of the outer wall of described heat-conducting block 2 and containing hole 7, so that improve the heat conductivility of junction between substrate body 1 and the heat-conducting block 2.
Concrete, described heat-conducting block 2 is made by the red copper material, the Copper Foil of described conductive layer 4 for being made of copper, described metal-based layer 6 is made by copper coin, aluminium sheet or corrosion resistant plate, adopt the higher material of conductive coefficient, can further accelerate thermal conduction rate, practicality is stronger.
The described insulating barrier 5 of present embodiment is made by ceramics polymer, not only has the good heat conductive performance, also have preferably insulation property, effectively avoid LED lamp pearl in use to produce short trouble, guarantee that modified model thermally conductive LED substrate has higher job stability.
The thickness of the described metal-based layer 6 of present embodiment is greater than the thickness of solder mask 3, conductive layer 4 and insulating barrier 5 sums, Effective Raise the bearing strength of substrate body 1.
See Fig. 3, the downside of described metal-based layer 6 is provided with radiator 8, this radiator 8 is one-body molded with metal-based layer 6, design has reduced the slit that is connected between substrate and the radiator 8 like this, can more convenient ground transferring heat, further improve heat conduction and heat radiation function between modified model thermally conductive LED substrate and the radiator 8, stabilized structure, practical.
A kind of processing technology of processing modified model thermally conductive LED substrate comprises following processing step:
A, solder mask 3, conductive layer 4, insulating barrier 5 and metal-based layer 6 are stacked gradually hot pressing from top to bottom obtain substrate body 1;
B, adopt the mode of milling to mill out containing hole 7 in substrate body 1, it is for subsequent use to make the heat-conducting block 2 that adapts with containing hole 7 sizes;
C, the mode of electroplating in the inwall employing of containing hole 7 plate nickel dam or adopt the mode of spraying to spray the tin layer;
D, adopt the mode of silk screen printing to be coated with the seal tin cream in the bottom of heat-conducting block 2, and heat-conducting block 2 is embedded at obtains substrate base material in the containing hole 7;
E, Reflow Soldering processing is carried out in the junction between the inwall of the outer wall of heat-conducting block 2 and containing hole 7 process.
The modified model thermally conductive LED substrate that adopts this processing step to process, not only structure is compacter firm, the sidewall of described containing hole 7 is also more concordant, is convenient on the one hand greatly improve thermal conduction rate between substrate body 1 and the heat-conducting block 2 with plating nickel dam or adopting the mode of spraying to spray the tin layer; Also be convenient on the other hand described heat-conducting block 2 is embedded in the containing hole 7, reduced difficulty of processing, improved the production efficiency of modified model thermally conductive LED substrate.
Preferably, in step e, when carrying out Reflow Soldering processing processing, the upper surface that heat-conducting block 2 is pressed to heat-conducting block 2 is concordant with the upper surface of conductive layer 4, be convenient to the installation of LED lamp pearl base and fixing, and make LED lamp pearl base keep good contacting with conductive layer 4, and improve the stability of LED lamp pearl, further improve the whole crudy of LED light fixture.What need supplementary notes is, equipment can adopt below substrate body 1 die was set in afternoon this, above heat-conducting block 2 punch was set, and utilizes the mutual extruding of punch and die to realize that the pressing of heat-conducting block 2 processes, and crudy is higher.
Above-described embodiment is the better implementation of the present invention, and in addition, the present invention can also realize that any apparent replacement is all within protection scope of the present invention without departing from the inventive concept of the premise by alternate manner.
Claims (9)
1. modified model thermally conductive LED substrate, comprise substrate body (1) and be arranged at the heat-conducting block (2) of substrate body (1), it is characterized in that: described substrate body (1) is comprised of solder mask (3), conductive layer (4), insulating barrier (5) and metal-based layer (6), and this solder mask (3), conductive layer (4), insulating barrier (5) and metal-based layer (6) stack gradually from top to bottom; Described substrate body (1) offers containing hole (7), and this containing hole (7) extends to metal-based layer (6), and described heat-conducting block (2) is embedded in the containing hole (7).
2. modified model thermally conductive LED substrate according to claim 1 is characterized in that: be provided with nickel dam or tin layer between the inwall of the outer wall of described heat-conducting block (2) and containing hole (7).
3. modified model thermally conductive LED substrate according to claim 1, it is characterized in that: described heat-conducting block (2) is made by the red copper material.
4. modified model thermally conductive LED substrate according to claim 1, it is characterized in that: described metal-based layer (6) is made by copper coin, aluminium sheet or corrosion resistant plate.
5. modified model thermally conductive LED substrate according to claim 1, it is characterized in that: described insulating barrier (5) is made by ceramics polymer.
6. modified model thermally conductive LED substrate according to claim 1, it is characterized in that: the thickness of described metal-based layer (6) is greater than the thickness of solder mask (3), conductive layer (4) and insulating barrier (5) sum.
7. modified model thermally conductive LED substrate according to claim 1, it is characterized in that: the downside of described metal-based layer (6) is provided with radiator (8), and this radiator (8) is one-body molded with metal-based layer (6).
8. processing technology of processing modified model thermally conductive LED substrate is characterized in that comprising following processing step:
A, solder mask (3), conductive layer (4), insulating barrier (5) and metal-based layer (6) are stacked gradually hot pressing from top to bottom obtain substrate body (1);
B, adopt the mode of milling to mill out containing hole (7) in substrate body (1), it is for subsequent use to make the heat-conducting block (2) that adapts with containing hole (7) size;
C, the mode of electroplating in the inwall employing of containing hole (7) plate nickel dam or adopt the mode of spraying to spray the tin layer;
D, adopt the mode of silk screen printing to be coated with the seal tin cream in the bottom of heat-conducting block (2), and heat-conducting block (2) is embedded at obtains substrate base material in the containing hole (7);
E, Reflow Soldering processing is carried out in the junction between the inwall of the outer wall of heat-conducting block (2) and containing hole (7) process.
9. the technique of processing modified model thermally conductive LED substrate according to claim 8 is characterized in that: in step e, when carrying out Reflow Soldering processing and processing, the upper surface that heat-conducting block (2) is pressed to heat-conducting block (2) is concordant with the upper surface of conductive layer (4).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210490145.5A CN102983249B (en) | 2012-11-27 | 2012-11-27 | Modified model thermally conductive LED substrate and processing technology thereof |
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| CN201210490145.5A CN102983249B (en) | 2012-11-27 | 2012-11-27 | Modified model thermally conductive LED substrate and processing technology thereof |
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| CN102983249A true CN102983249A (en) | 2013-03-20 |
| CN102983249B CN102983249B (en) | 2015-10-21 |
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| KR20080103366A (en) * | 2007-05-23 | 2008-11-27 | (주)비스로 | A radiatior of l.e.d lighting module |
| CN201599745U (en) * | 2010-01-20 | 2010-10-06 | 深圳市同洲电子股份有限公司 | LED lamp and substrate thereof |
| CN102456814A (en) * | 2010-10-27 | 2012-05-16 | 上海卓凯电子科技有限公司 | System circuit carrying board for light-emitting diode module |
| CN202363517U (en) * | 2011-12-01 | 2012-08-01 | 珠海全宝电子科技有限公司 | Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) |
| CN202551494U (en) * | 2012-04-08 | 2012-11-21 | 嵇刚 | High heat conductivity PCB (Printed Circuit Board) metal substrate |
| CN202948970U (en) * | 2012-11-27 | 2013-05-22 | 东莞勤上光电股份有限公司 | Improved heat conduction light emitting diode (LED) substrate |
-
2012
- 2012-11-27 CN CN201210490145.5A patent/CN102983249B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080103366A (en) * | 2007-05-23 | 2008-11-27 | (주)비스로 | A radiatior of l.e.d lighting module |
| CN201599745U (en) * | 2010-01-20 | 2010-10-06 | 深圳市同洲电子股份有限公司 | LED lamp and substrate thereof |
| CN102456814A (en) * | 2010-10-27 | 2012-05-16 | 上海卓凯电子科技有限公司 | System circuit carrying board for light-emitting diode module |
| CN202363517U (en) * | 2011-12-01 | 2012-08-01 | 珠海全宝电子科技有限公司 | Aluminium base plate heat dissipation mechanism used for LED (light-emitting diode) |
| CN202551494U (en) * | 2012-04-08 | 2012-11-21 | 嵇刚 | High heat conductivity PCB (Printed Circuit Board) metal substrate |
| CN202948970U (en) * | 2012-11-27 | 2013-05-22 | 东莞勤上光电股份有限公司 | Improved heat conduction light emitting diode (LED) substrate |
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Effective date of registration: 20171106 Address after: 523565 Guangdong city of Dongguan province Changping Zhen Heng Jiang Jiang Xia Heng Industrial Road, set up a file Patentee after: KINGSUN OPTOELECTRONIC CO., LTD. Address before: 523565 Guangdong province Dongguan city Changping town Hengjiang Dongguan KingSun Au Optronics Co set up a file Patentee before: Dongguan Qinshang Photoelectric Co., Ltd. |