CN101784160B - Method for manufacturing press in type printed circuit board with high thermal conductivity - Google Patents

Method for manufacturing press in type printed circuit board with high thermal conductivity Download PDF

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Publication number
CN101784160B
CN101784160B CN2010101015684A CN201010101568A CN101784160B CN 101784160 B CN101784160 B CN 101784160B CN 2010101015684 A CN2010101015684 A CN 2010101015684A CN 201010101568 A CN201010101568 A CN 201010101568A CN 101784160 B CN101784160 B CN 101784160B
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CN
China
Prior art keywords
heat
press
pcb
conducting piece
groove
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CN2010101015684A
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Chinese (zh)
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CN101784160A (en
Inventor
陈立宇
袁继旺
辜义成
董浩彬
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东莞生益电子有限公司
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Priority to CN2010101015684A priority Critical patent/CN101784160B/en
Publication of CN101784160A publication Critical patent/CN101784160A/en
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Publication of CN101784160B publication Critical patent/CN101784160B/en

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Abstract

The invention provides a method for manufacturing a press in type printed circuit board (PCB) with high thermal conductivity, comprising the following steps: 1. providing a base PCB provided with a component side (CS) and a solder side (SS); 2. milling a groove in the corresponding position of the base PCB to form a through groove; 3. depositing copper on the side wall of the through groove; 4. electroplating the side wall of the through groove after copper depositing to form a conductive plating to be electrically connected with an earthed circuit in an inner circuit; 5. providing a thermal conductive material; 6. manufacturing the thermal conductive material into a thermal conductive part; 7. embedding the thermal conductive part into the base PCB through external mechanical forces; 8. filling solder mask in the gap between the thermal conductive part and the side wall of the through groove; and 9. processing the base PCB to manufacture the PCB finished product. The method is characterized by simple manufacturing flow and easily controlled operation process; in the method, the thermal conductive material is pressed in the PCB through external mechanical forces so that the heat generated by the component stuck on the CS of the PCB can be transferred to the cooling fin stuck on the SS by the thermal conductive material, thus the PCB has higher thermal conductivity; and the size of the PCB finished product is reduced by about 1/3, thus realizing high power miniature PCB design. In addition, the inner circuit can be earthed through earthing of the thermal conductive part.

Description

The manufacture method of press in type printed circuit board with high thermal conductivity

Technical field

The present invention relates to a kind of manufacture method of pcb board, relate in particular to a kind of method that adopts forced making to have high capacity of heat transmission pcb board.

Background technology

Along with being extensive use of of high-frequency electronic signal, go up the heat that components and parts produced of chip at printed circuit board (PCB) (PCB), the heat that produces when especially high performance components is worked can cause very big infringement to components and parts, need to utilize heat radiation or cooling means to help heat energy is discharged, therefore one on pcb board a kind of effective heat dissipating method of design effectively distribute the high heat that produces in the chip running just necessary at any time.Traditional method is to adhere to the long-pending very big heat dissipation metal substrate of a block at the back side of entire circuit plate, and its specific aim is not strong, and signal of telecommunication transmission loss is bigger; And the welding procedure complexity in this method production process, the pcb board volume of producing is bigger, has increased the shared space of equipment complete machine.

At present, the method that is pressed into fin in printed circuit board can effectively realize the heat radiation of pcb board, but heat sink that is pressed into and internal layer circuit can not be realized electric connection, thereby is unfavorable for the ground connection of internal layer circuit.

Summary of the invention

The objective of the invention is to, a kind of manufacture method of press in type printed circuit board with high thermal conductivity is provided, this method is pressed into Heat Conduction Material in the pcb board by mechanical external force, and by Heat Conduction Material and the thick coupling of pcb board, make pcb board have the higher capacity of heat transmission, and Heat Conduction Material can electrically connect the demand of realization internal layer circuit ground connection with the internal layer circuit of pcb board, and heat dispersed by internal layer circuit, strengthen heat-sinking capability.To achieve these goals, the invention provides a kind of manufacture method of press in type printed circuit board with high thermal conductivity, comprising:

Step 1, provide PCB substrate, this PCB substrate has a component side and solder side;

Step 2, in the groove milling of the corresponding position of PCB substrate, form a groove;

Step 3, the groove sidewall is sunk copper;

Step 4, the groove sidewall behind the heavy copper is electroplated, formed in conductive coating and the internal layer circuit earthed circuit and realize electric connection;

Step 5, provide Heat Conduction Material;

Step 6, this Heat Conduction Material is made into heat-conducting piece;

Step 7, heat-conducting piece is embedded in the PCB substrate by mechanical external force;

Green oil is filled in step 8, the slit between heat-conducting piece and groove sidewall;

Step 9, this PCB substrate is processed, be made into the pcb board finished product.

PCB substrate one or more layers material of the most close component side adopts advanced low-k materials, for example: Ro4350, Ro3003 or RF35-A2 etc.

In the step 3 on the groove sidewall thickness of heavy copper be 3~5um.

This Heat Conduction Material is the metal copper billet.

This heat-conducting piece comprises a body and is located at this body several salient points of end face on every side.

These salient point top and bottom adopt the chamfering structure setting to form the copper pawl to avoid salient point stress deformation in process of press in.

In the step 7, this heat-conducting piece embeds in the groove of PCB substrate by several salient points, the width size of this groove is between the width size of heat-conducting piece and heat-conducting piece body, several salient point interference engagement of end face are on the groove sidewall around this heat-conducting piece, and the conductive coating in this salient point and the groove electrically connects.

Upper and lower surface to this PCB substrate in the process of press in of step 7 is added with padded coaming so that this heat-conducting piece and PCB substrate at the drop of component side in-100um~0um scope, the drop of solder side-50um~+ the 50um scope in.

This padded coaming is silica gel sheet, release film or aluminium flake.

Step 9 is included on the component side of this PCB substrate the bonding power pipe on the surface of this heat-conducting piece.

Beneficial effect of the present invention: the manufacture method of press in type printed circuit board with high thermal conductivity provided by the invention, its making flow process is simple, operating process is easy to control, by mechanical external force Heat Conduction Material is pressed in the pcb board, and by Heat Conduction Material and the thick coupling of pcb board, make heat that the components and parts that mount on the CS face of pcb board produce to be delivered to above the fin that the SS face mounts, have the higher capacity of heat transmission, and heat dispersion is stable by Heat Conduction Material; In addition, the PCB finished product size that adopts this method to make reduces 1/3 approximately, can realize high-power miniaturized PCB design.And, conductive coating in the groove of this heat-conducting piece salient point and PCB substrate electrically connects, thus the ground connection that can realize internal layer circuit by the ground connection of this heat-conducting piece, and by the heat transferred internal layer circuit of conductive coating with heat-conducting piece, thereby be beneficial to dispersing of heat, increase heat-sinking capability.

For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.

Description of drawings

Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.

Fig. 1 is the schematic flow sheet of the manufacture method of press in type printed circuit board with high thermal conductivity of the present invention;

Fig. 2 is the structural representation of PCB substrate in the manufacture method of the present invention and heat-conducting piece;

Fig. 3 makes the generalized section of pcb board for the present invention.

Embodiment

As Figure 1-3, the manufacture method of press in type printed circuit board with high thermal conductivity of the present invention, it comprises:

Step 1, provide PCB substrate 2.This PCB substrate can adopt prior art to make, and for example detects processing such as processing through punching press, internal layer imaging, automated optical.This PCB substrate has a component side (CS) and solder side (SS), its one or more layers material 21 of the most close component side adopt low-k (LOW Dk) materials, for example the model that can buy on the market has materials such as Ro4350, Ro3003 or RF35-A2.

Step 2, in the groove milling of the corresponding position of PCB substrate 2, form a groove 22.

Step 3, the groove sidewall is sunk copper.The thickness of heavy copper is 3~5um on the groove sidewall.

Step 4, the groove sidewall behind the heavy copper is electroplated, formed in conductive coating and the internal layer circuit earthed circuit and realize electric connection.

Step 5, provide Heat Conduction Material.This Heat Conduction Material can be heat-conducting metal, and in embodiments of the present invention, this Heat Conduction Material is the metal copper billet.

Step 6, this Heat Conduction Material is made into heat-conducting piece.This heat-conducting piece 4 comprises a body 42 and is located at this body 42 several salient points 44 of end face on every side.In embodiments of the present invention, heat-conducting piece 4 is a copper billet, and end face is integrally formed with several salient points 44 around this copper billet, and these salient point 44 top and bottom adopt chamfering structure 442 to be provided with to avoid salient point 44 stress deformation in process of press in to form the copper pawl.

Step 7, by mechanical external force heat-conducting piece 4 is embedded in the PCB substrates 2, this heat-conducting piece 4 embeds in the groove 22 of PCB substrates 2 by several salient points 44.The width size of this groove 22 is between the width size of heat-conducting piece 4 and heat-conducting piece body 42, and several salient point 44 interference engagement of end face make heat-conducting piece firmly to be located on the substrate 2 on groove 22 sidewalls around this heat-conducting piece 4.Upper and lower surface to this PCB substrate in process of press in is added with padded coaming so that this heat-conducting piece 4 and PCB substrate 2 at the drop of component side in-100um~0um scope, the drop of solder side-50um~+ the 50um scope in, be beneficial to follow-up soldered elements.This padded coaming can be silica gel sheet, release film or aluminium flake etc.This salient point 44 electrically connects with conductive coating in the groove 22, thus the ground connection that can realize internal layer circuit by the ground connection of this heat-conducting piece 4, and by the heat transferred internal layer circuit of conductive coating with heat-conducting piece, thereby be beneficial to dispersing of heat, increase heat-sinking capability.

Step 8, the slit between heat-conducting piece and groove sidewall are filled green oil (SOLDER MASK) 6, and scolding tin flows in the slit between heat-conducting piece and the groove sidewall when preventing follow-up welding.

Step 9, this PCB substrate is processed, be made into the pcb board finished product.This PCB substrate is being carried out in the following process, and power tube is arranged at by welding on the surface of this heat-conducting piece 2, and power tube can well dispel the heat by this heat-conducting piece 2, and not only signal of telecommunication transmission loss is less for the pcb board finished product of making, and the finished product size reduces 1/3 approximately.

In sum, the manufacture method of press in type printed circuit board with high thermal conductivity provided by the invention, its making flow process is simple, operating process is easy to control, by mechanical external force Heat Conduction Material is pressed in the pcb board, and by Heat Conduction Material and the thick coupling of pcb board, makes heat that the components and parts that mount on the CS face of pcb board produce to be delivered to above the fin that the SS face mounts by Heat Conduction Material, have the higher capacity of heat transmission, and heat dispersion is stable; In addition, the PCB finished product size that adopts this method to make reduces 1/3 approximately, can realize high-power miniaturized PCB design.And, conductive coating in the groove of this heat-conducting piece salient point and PCB substrate electrically connects, thus the ground connection that can realize internal layer circuit by the ground connection of this heat-conducting piece, and by the heat transferred internal layer circuit of conductive coating with heat-conducting piece, thereby be beneficial to dispersing of heat, increase heat-sinking capability.

The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.

Claims (9)

1. the manufacture method of a press in type printed circuit board with high thermal conductivity is characterized in that, comprising:
Step 1, provide PCB substrate, this PCB substrate has a component side and solder side;
Step 2, in the groove milling of the corresponding position of PCB substrate, form a groove;
Step 3, the groove sidewall is sunk copper;
Step 4, the groove sidewall behind the heavy copper is electroplated, formed in conductive coating and the internal layer circuit earthed circuit and realize electric connection;
Step 5, provide Heat Conduction Material; This Heat Conduction Material is the metal copper billet;
Step 6, this Heat Conduction Material is made into heat-conducting piece; This heat-conducting piece comprises a body and is located at this body several salient points of end face on every side;
Step 7, heat-conducting piece is embedded in the PCB substrate by mechanical external force;
Green oil is filled in step 8, the slit between heat-conducting piece and groove sidewall;
Step 9, this PCB substrate is processed, be made into the pcb board finished product.
2. the manufacture method of press in type printed circuit board with high thermal conductivity as claimed in claim 1 is characterized in that, PCB substrate one or more layers material of the most close component side adopts advanced low-k materials.
3. the manufacture method of press in type printed circuit board with high thermal conductivity as claimed in claim 2 is characterized in that, the material of this low-k is Ro4350, Ro3003 or RF35-A2.
4. the manufacture method of press in type printed circuit board with high thermal conductivity as claimed in claim 1 is characterized in that, in the step 3 on the groove sidewall thickness of heavy copper be 3~5um.
5. the manufacture method of press in type printed circuit board with high thermal conductivity as claimed in claim 1 is characterized in that, these salient point top and bottom adopt the chamfering structure setting to form the copper pawl to avoid salient point stress deformation in process of press in.
6. the manufacture method of press in type printed circuit board with high thermal conductivity as claimed in claim 1, it is characterized in that, in the step 7, this heat-conducting piece embeds in the groove of PCB substrate by several salient points, the width size of this groove is between the width size of heat-conducting piece and heat-conducting piece body, several salient point interference engagement of end face are on the groove sidewall around this heat-conducting piece, and the conductive coating in this salient point and the groove electrically connects.
7. the manufacture method of press in type printed circuit board with high thermal conductivity as claimed in claim 6, it is characterized in that, upper and lower surface to this PCB substrate in the telescopiny of step 7 is added with padded coaming, so that this heat-conducting piece and PCB substrate at the drop of component side in-100um~0um scope, the drop of solder side-50um~+ the 50um scope in.
8. the manufacture method of press in type printed circuit board with high thermal conductivity as claimed in claim 7 is characterized in that, this padded coaming is silica gel sheet, release film or aluminium flake.
9. the manufacture method of press in type printed circuit board with high thermal conductivity as claimed in claim 1 is characterized in that, step 9 is included on the component side of this PCB substrate the bonding power pipe on the surface of this heat-conducting piece.
CN2010101015684A 2010-01-22 2010-01-22 Method for manufacturing press in type printed circuit board with high thermal conductivity CN101784160B (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010101015684A CN101784160B (en) 2010-01-22 2010-01-22 Method for manufacturing press in type printed circuit board with high thermal conductivity

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CN101784160B true CN101784160B (en) 2011-11-09

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781158A (en) * 2011-05-09 2012-11-14 代芳 PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect
CN102307429B (en) * 2011-09-02 2013-11-27 东莞生益电子有限公司 Embedded high-thermal conductive PCB and manufacturing method thereof
CN103096638B (en) * 2011-10-27 2016-01-13 北大方正集团有限公司 A kind of press in type printed circuit board with high thermal conductivity and preparation method thereof
CN102523684B (en) * 2011-12-02 2014-03-05 东莞生益电子有限公司 Manufacture method for printed circuit board (PCB) with step groove
CN102938970A (en) * 2012-11-08 2013-02-20 东莞生益电子有限公司 Composite heat conduction type printed circuit board (PCB) and manufacture method thereof
CN102933041A (en) * 2012-11-08 2013-02-13 东莞生益电子有限公司 Manufacture method of composite heat-conduction type printed circuit board (PCB) board
CN103079364B (en) * 2012-12-27 2015-09-16 深圳市五株科技股份有限公司 A kind of manufacture craft of local pressing copper billet height heat radiating metal base circuit board
CN103281860A (en) * 2013-06-13 2013-09-04 汕头超声印制板(二厂)有限公司 Heat dissipation conducting circuit board and manufacturing method thereof
CN105163526B (en) * 2015-08-21 2017-12-26 深圳崇达多层线路板有限公司 A kind of preparation method of step trough and the printed circuit board comprising step trough
CN105472869A (en) * 2015-12-14 2016-04-06 深圳崇达多层线路板有限公司 Printed circuit board with semi-embedded type embedded heat conductive block
CN106102324B (en) * 2016-06-30 2018-12-25 景旺电子科技(龙川)有限公司 A method of copper billet deviation is buried in prevention
CN106102325A (en) * 2016-06-30 2016-11-09 广德宝达精密电路有限公司 A kind of manufacture method of half built-in copper billet printed board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1359606A (en) * 1999-06-30 2002-07-17 艾利森电话股份有限公司 Printed circuit board
CN1744794A (en) * 2004-09-03 2006-03-08 华为技术有限公司 Step type printed circuit board and its manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1359606A (en) * 1999-06-30 2002-07-17 艾利森电话股份有限公司 Printed circuit board
CN1744794A (en) * 2004-09-03 2006-03-08 华为技术有限公司 Step type printed circuit board and its manufacturing method

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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of

Patentee after: Shengyi electronic Limited by Share Ltd

Address before: 413 No. 523039 Guangdong province Dongguan City Wanjiang Wando spike Avenue

Patentee before: Dongguan Shengyi Electronics Ltd.

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