CN102933041A - Manufacturing method of composite heat-conducting PCB board - Google Patents

Abstract

The invention provides a manufacturing method of a composite heat-conducting PCB, which comprises the following steps: step 1, providing a PCB substrate and a small-size copper block, and slotting at a position where the PCB substrate is to be embedded into the small-size copper block; step 2, embedding the small-size copper block into a slotted hole of the PCB substrate and penetrating the whole PCB substrate in the thickness direction; step 3, providing a large-size copper base, and printing solder paste on the upper surface of the large-size copper base; step 4, attaching the PCB substrate embedded with the small-size copper block to the surface of the solder paste far away from the large-size copper base, wherein the small-size copper block is also attached to the surface of the solder paste far away from the large-size copper base; and 5, placing the assembly obtained in the step 4 into a reflow soldering furnace for reflow soldering, melting and cooling the solder paste to form a tin layer, and soldering the large-size copper base, the PCB substrate and the small-size copper block into the composite heat-conducting PCB through the tin layer.

Description

Manufacturing method of composite heat-conducting PCB board

technical field

The invention relates to the field of metal-based printed circuit boards (PCBs), in particular to a method for manufacturing a composite heat-conducting PCB board.

Background technique

With the rapid development of 3G and other communication technologies and modern electronic technologies in the direction of multi-function, miniaturization and high power, traditional electronic and electrical design can no longer meet the increasingly complex high-end electronic equipment for high-intensity and multi-functional design of electronic and electrical Requirements for integration, heat conduction, electrical performance, mechanical performance and other special performance requirements of high-power electronic equipment power amplifier devices have increasingly become an important part of electronic product performance indicators.

However, in terms of the heat dissipation of the PCB substrate, its requirements are becoming more and more urgent. If the heat dissipation of the substrate is not good, it will cause overheating of the components on the printed circuit board, thereby reducing the reliability of the electronic equipment. In this context, a high heat dissipation metal PCB substrate was born.

The metal PCB substrate is composed of a metal substrate (such as aluminum plate, copper plate, iron plate, silicon steel plate), a high thermal conductivity insulating dielectric layer and copper foil. The insulating medium layer generally adopts high thermal conductivity epoxy glass fiber cloth bonding sheet or high thermal conductivity epoxy resin, the thickness of the insulating medium layer is 80μm-100μm, and the thickness specification of the metal plate is 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0mm.

The characteristics and application fields of various metal substrates:

Iron-based copper clad laminates and silicon steel copper clad laminates have excellent electrical properties, magnetic permeability, pressure resistance, and high substrate strength. Mainly used for brushless DC motors, tape recorders, spindle motors for all-in-one recorders and intelligent drives. However, the magnetism of silicon steel copper clad laminates is better than that of iron-based copper clad laminates;

Copper-based copper-clad laminates have the basic properties of aluminum-based copper-clad laminates. Large, high value, easy to oxidize, so its application is limited, and the dosage is far lower than that of aluminum-based copper-clad laminates;

Aluminum-based copper clad laminates have excellent electrical properties, heat dissipation, electromagnetic shielding, high withstand voltage and bending properties. They are mainly used in automobiles, motorcycles, computers, home appliances, communication electronic products, power electronic products, and aluminum in metal PCB substrates. The market volume of base copper clad laminate is the largest.

Although the thermal conductivity of the metal-based PCB substrate is good, the power device mounted on the metal substrate PCB and the metal base are still separated by a PCB board with poor thermal conductivity. The heat generated by the high-power device cannot be effectively conducted to the It is difficult to effectively dissipate heat on a metal base, and cannot meet the thermal conductivity requirements of power amplifier devices for high-power electronic equipment.

Contents of the invention

The object of the present invention is to provide a kind of manufacturing method of composite heat conduction type PCB board, and its procedure is simple, and production efficiency is high, and production cost is low; Excellent electrical and mechanical properties; the small-sized copper block that runs through the PCB substrate is used as a heat conduction channel, which has excellent thermal conductivity, and can effectively conduct the heat generated by high-power devices to the large copper base to dissipate.

In order to achieve the above object, the present invention provides a method for manufacturing a composite heat-conducting PCB board, comprising the following steps:

Step 1. Provide a PCB substrate and a small-sized copper block, and slot the PCB substrate at the position where the small-sized copper block is to be embedded;

Step 2, embedding the small-sized copper block into the slot hole of the PCB substrate and passing through the entire PCB substrate in the thickness direction;

Step 3, providing a large-size copper base, and printing solder paste on the upper surface of the large-size copper base;

Step 4. Attach the PCB substrate embedded with the small-sized copper block on the surface of the solder paste away from the large-sized copper base, and the small-sized copper block is also attached to the solder paste away from the large-sized copper base. dimensions on the surface of the copper base;

Step 5. Put the components obtained in step 4 into a reflow soldering furnace for reflow soldering. The solder paste is melted and cooled to form a tin layer, and the large-size copper base, the PCB substrate and the small The size copper block is welded into a composite heat-conducting PCB board.

The PCB substrate is a double-sided PCB substrate or a multi-layer PCB substrate.

The insulating medium layer material of the PCB substrate is a high-frequency material, a glass fiber reinforced epoxy resin material, a glass fiber reinforced PTFE material, a mixed lamination material of a glass fiber reinforced epoxy resin material and a high frequency material, or a glass fiber reinforced PTFE material Hybrid laminated materials with high frequency materials.

The small-sized copper block is a "one"-shaped small-sized copper block, a "T"-shaped small-sized copper block or an inverted "T"-shaped small-sized copper block.

The PCB substrate is a double-sided PCB substrate, the insulating medium layer material of the double-sided PCB substrate is a high-frequency material, and the small-sized copper block is a "one"-shaped small-sized copper block.

The PCB substrate is a multi-layer PCB substrate, and the insulating medium layer material of the multi-layer PCB substrate is a mixed laminated material of glass fiber reinforced epoxy resin material and high-frequency material, and the small-sized copper block is "one" Small size copper block.

The PCB substrate is a multi-layer PCB substrate, the insulating medium layer material of the multi-layer PCB substrate is a mixed lamination material of glass fiber reinforced epoxy resin material and high-frequency material, and the small-sized copper block is an inverted "T" shape Small size copper block.

The PCB substrate is a multi-layer PCB substrate, the insulating medium layer material of the multi-layer PCB substrate is a glass fiber reinforced epoxy resin material, and the small-sized copper block is a "one"-shaped small-sized copper block.

The PCB substrate is a multilayer PCB substrate, the insulating medium layer material of the multilayer PCB substrate is glass fiber reinforced epoxy resin material, and the small-sized copper block is an inverted "T"-shaped small-sized copper block.

The PCB substrate is a double-sided PCB substrate, the insulating medium layer material of the double-sided PCB substrate is a glass fiber reinforced epoxy resin material, and the small-sized copper block is a "one"-shaped small-sized copper block.

Beneficial effects of the present invention: firstly, the compound heat conduction type PCB board made by the method of making composite heat conduction type PCB of the present invention can be equipped with high-power electronic devices, and a large amount of heat generated by high-power components during operation of electronic devices or equipment can be passed through small size The copper block is conducted to the large-size copper base to achieve the purpose of heat dissipation of the whole board and local heat dissipation;

Secondly, the solder paste used in the manufacturing method of the composite heat-conducting PCB board of the present invention has excellent dual functions of heat conduction and electricity conduction, which can effectively improve the heat dissipation and signal shielding ability of the PCB board, and the prepared composite heat-conducting PCB board can be widely used In the high-frequency microwave signal base station;

Furthermore, the solder paste used in the manufacturing method of the composite heat-conducting PCB board of the present invention welds the large-size copper base, the PCB substrate and the small-size copper block into a whole, which enhances the mechanical properties of the obtained composite heat-conducting PCB board;

Finally, the manufacturing method of the composite heat-conducting PCB board of the present invention adopts the composite molding process of copper embedding and welding, and the small-sized copper block is embedded in the PCB board in advance, and then the PCB board embedded with the copper block is welded with the large-sized copper base to form, the small The copper block and the surface of the PCB substrate have good coplanarity, high bonding reliability, simple welding operation, high production efficiency and low production cost.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.

Description of drawings

The technical solutions and other beneficial effects of the present invention will be apparent through the detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings.

In the attached picture,

Fig. 1 is the flow chart of the manufacture method of composite heat conduction type PCB board of the present invention;

Fig. 2 is the schematic flow sheet of the manufacture method of composite heat conduction type PCB board of the present invention;

Fig. 3 is the structural representation of the first embodiment of the manufacturing method of composite heat-conducting PCB board of the present invention;

Fig. 4 is the structural representation of the second embodiment of the manufacturing method of composite heat-conducting PCB board of the present invention;

Fig. 5 is the structural representation of the third embodiment of the manufacturing method of composite heat-conducting PCB board of the present invention;

Fig. 6 is the schematic structural view of the fourth embodiment of the manufacturing method of the composite thermally conductive PCB board of the present invention;

7 is a schematic structural view of a fifth embodiment of the method for manufacturing a composite heat-conducting PCB of the present invention;

FIG. 8 is a schematic structural view of the sixth embodiment of the manufacturing method of the composite thermally conductive PCB board of the present invention.

Detailed ways

In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

Please refer to Fig. 1 to Fig. 3, the present invention provides a kind of manufacturing method of composite heat conduction type PCB board, comprises the following steps:

Step 1. Provide the PCB substrate 24 and the small-sized copper block 26 , and slot the PCB substrate 24 at the position where the small-sized copper block 26 is to be embedded.

The PCB substrate 24 is a double-sided PCB substrate or a multilayer PCB substrate. In this embodiment, the PCB substrate 24 is a double-sided PCB substrate.

The insulating medium layer material 25 of the PCB substrate 24 is a high-frequency material, a glass fiber reinforced epoxy resin material, or a mixed lamination material of a glass fiber reinforced epoxy resin material and a high frequency material. In this embodiment, the insulating medium layer Layer material 25 is a high-frequency material.

Step 2. Insert the small-sized copper block 26 into the slot 23 of the PCB substrate 24 and penetrate the entire PCB substrate 24 in the thickness direction.

The small-sized copper block 26 is a "one"-shaped small-sized copper block or an inverted "T"-shaped small-sized copper block. In this embodiment, the small-sized copper block 26 is a "one"-shaped small-sized copper block .

Step 3. Provide a large-size copper base 20, and print solder paste 22' on the upper surface of the large-size copper base 20.

Step 4. Attach the PCB substrate 24 embedded with the small-sized copper block 26 on the surface of the solder paste 22' away from the large-sized copper base 20, and the small-sized copper block 26 is also attached to the The solder paste 22 ′ is on the surface away from the large-sized copper substrate 20 .

Step 5. Put the components obtained in step 4 into a reflow soldering furnace for reflow soldering. The solder paste 22' is melted and cooled to form a tin layer 22, and through the tin layer 22, the large-size copper base 20, the PCB The substrate 24 and the small-sized copper block 26 are welded to form a composite heat-conducting PCB.

It can be seen from the above steps that the present invention adopts a welding forming process to make a composite heat-conducting PCB board. This method has simple procedures, high production efficiency, reduces production costs, and improves the comprehensive performance of the existing composite heat-conducting PCB board.

When the composite thermally conductive PCB board prepared by the above method carries a high-power device 29, a large amount of heat generated by the high-power device 29 during operation can be conducted to the said small-sized copper block 26 and the tin layer 22. The large-size copper base 20 achieves the purpose of heat dissipation of the whole board and local heat dissipation.

The solder paste 22' used in the above method has excellent dual functions of heat conduction and conduction, which can effectively improve the heat dissipation and signal shielding ability of the PCB board. The heat-conducting PCB board can be widely used in high-frequency microwave signal base stations; the solder paste 22' is melted and cooled to form a tin layer 22 after reflow soldering, and the tin layer 22 combines the large-size copper base 20, the PCB substrate 24 and the small-size copper The block 26 is welded as a whole, which enhances the mechanical properties of the composite thermally conductive PCB board of the present invention.

Please refer to FIG. 4 , which is a schematic structural view of the second embodiment of the method for manufacturing a composite heat-conducting PCB board of the present invention, wherein the small-sized copper block 26 is a "one"-shaped small-sized copper block, and the PCB substrate 24 ′ is a multi-layer board, and the insulating medium layer material 25 ′ of the PCB substrate 24 ′ is a mixed lamination material of glass fiber reinforced epoxy resin material 250 and high frequency material 252 .

Please refer to Fig. 5, which is a structural schematic diagram of the third embodiment of the method for manufacturing a composite heat-conducting PCB board of the present invention, wherein the small-sized copper block 26' is an inverted "T"-shaped small-sized copper block, and the PCB substrate 24 ′ is a multi-layer board, and the insulating medium layer material 25 ′ of the PCB substrate 24 ′ is a mixed lamination material of glass fiber reinforced epoxy resin material 250 and high frequency material 252 .

Please refer to FIG. 6 , which is a schematic structural view of the fourth embodiment of the method for manufacturing a composite heat-conducting PCB board of the present invention, wherein the small-sized copper block 26 is a "one"-shaped small-sized copper block, and the PCB substrate 24 ' is a multi-layer board, and the insulating medium layer material 25" of the PCB substrate 24' is a glass fiber reinforced epoxy resin material.

Please refer to FIG. 7, which is a schematic structural view of the fifth embodiment of the method for manufacturing a composite thermally conductive PCB board of the present invention, wherein the small-sized copper block 26' is an inverted "T"-shaped small-sized copper block, and the PCB substrate 24' is a multi-layer board, and the insulating medium layer material 25" of the PCB substrate 24' is a glass fiber reinforced epoxy resin material.

Please refer to FIG. 8 , which is a schematic structural view of the sixth embodiment of the method for manufacturing a composite thermally conductive PCB board of the present invention, wherein the small-sized copper block 26 is a "one"-shaped small-sized copper block, and the PCB substrate 24 It is a double-sided board, and the insulating medium layer material 25" of the PCB substrate 24 is a glass fiber reinforced epoxy resin material.

In summary, the present invention provides a method for manufacturing a composite heat-conducting PCB board, which uses solder paste to weld a large-size copper base, a PCB substrate, and a small-size copper block into one, thereby enhancing the composite heat-conducting PCB board. mechanical properties; the composite heat-conducting PCB board made by it can be equipped with high-power electronic devices, and the large amount of heat generated by high-power components when the electronic devices or equipment are running can be conducted to the large-size copper base through the small-size copper block to achieve the overall The purpose of board heat dissipation and local heat dissipation; the solder paste used has excellent dual functions of heat conduction and conduction, which can effectively improve the heat dissipation and signal shielding ability of the PCB board. The composite heat conduction PCB board can be widely used in high-frequency microwave signal In the base station; the manufacturing method of the composite heat-conducting PCB board adopts a one-time welding molding process, the process is simple, the production efficiency is high, the production cost is low, and the comprehensive performance of the existing composite heat-conducting PCB board is improved.

As mentioned above, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical scheme and technical concept of the present invention, and all these changes and deformations should belong to the protection scope of the claims of the present invention .

Claims (10)

1. the manufacture method of a composite guide pattern of fever pcb board is characterized in that, comprises the steps:

Step 1, provide PCB substrate and small size copper billet, embed the position fluting of described small size copper billet in described PCB substrate wish;

Step 2, described small size copper billet embedded in the slotted eye of described PCB substrate and at thickness direction and run through whole PCB substrate;

Step 3, provide large scale copper base, in the upper surface print solder paste of described large scale copper base;

Step 4, will be embedded with the small size copper billet the PCB baseplate-laminating on the surface of described tin cream away from described large scale copper base, and described small size copper billet also fits on the surface of described tin cream away from described large scale copper base;

Step 5, the assembly that step 4 is obtained are put into reflow soldering furnace and are carried out reflow soldering, described tin cream melting cooling forms the tin layer, and by this tin layer described large scale copper base, described PCB substrate and described small size copper billet is welded into compound heat-conducting type pcb board.

2. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 1 is characterized in that, described PCB substrate is two-sided PCB substrate or multi-layer PCB substrate.

3. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 2, it is characterized in that, the dielectric layer material of described PCB substrate be high frequency material, glass fiber reinforced epoxy resin material, glass fibre strengthen PTFE material, glass fiber reinforced epoxy resin material and high frequency material mix pressing material or glass fibre enhancing PTFE material and high frequency material mix the pressing material.

4. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 3 is characterized in that, described small size copper billet is " one " font small size copper billet, T-shape small size copper billet or the small size of falling T-shape copper billet.

5. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 4 is characterized in that, described PCB substrate is two-sided PCB substrate, and the dielectric layer material of this two-sided PCB substrate is high frequency material, and described small size copper billet is " one " font small size copper billet.

6. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 4, it is characterized in that, described PCB substrate is the multi-layer PCB substrate, the dielectric layer material of this multi-layer PCB substrate be the glass fiber reinforced epoxy resin material with high frequency material mix the pressing material, described small size copper billet is " one " font small size copper billet.

7. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 4, it is characterized in that, described PCB substrate is the multi-layer PCB substrate, the dielectric layer material of this multi-layer PCB substrate be the glass fiber reinforced epoxy resin material with high frequency material mix the pressing material, described small size copper billet is the small size of falling T-shape copper billet.

8. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 4, it is characterized in that, described PCB substrate is the multi-layer PCB substrate, and the dielectric layer material of this multi-layer PCB substrate is the glass fiber reinforced epoxy resin material, and described small size copper billet is " one " font small size copper billet.

9. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 4, it is characterized in that, described PCB substrate is the multi-layer PCB substrate, and the dielectric layer material of this multi-layer PCB substrate is the glass fiber reinforced epoxy resin material, and described small size copper billet is the small size of falling T-shape copper billet.

10. the manufacture method of composite guide pattern of fever pcb board as claimed in claim 4, it is characterized in that, described PCB substrate is two-sided PCB substrate, and the dielectric layer material of this two-sided PCB substrate is the glass fiber reinforced epoxy resin material, and described small size copper billet is " one " font small size copper billet.

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