WO2022252453A1

WO2022252453A1 - Buried component circuit board, manufacturing method therefor, and electronic apparatus

Info

Publication number: WO2022252453A1
Application number: PCT/CN2021/121087
Authority: WO
Inventors: 林继生; 谢占昊; 邓杰雄
Original assignee: 深南电路股份有限公司
Priority date: 2021-06-03
Filing date: 2021-09-27
Publication date: 2022-12-08
Also published as: CN115442963A

Abstract

The present application discloses a buried component circuit board, a manufacturing method therefor, and an electronic apparatus. The buried component circuit board comprises: an electrically conductive block, the electrically conductive block being provided with at least one blind groove; a layer of thermally conductive material disposed on the electrically conductive block, the layer of thermally conductive material being provided with at least one first through groove directly opposite the blind groove; a core plate disposed on the layer of thermally conductive material, the core plate being provided with at least one second through groove directly opposite the first through groove; a buried component provided in the first through groove, the second through groove, and the blind groove, which are in communication with each other, and an electrically conductive medium filled between at least one side of the buried component and groove walls of the first through groove, the second through groove, and the blind groove, so that the electrically conductive block is electrically connected to the core plate via the electrically conductive medium. In the described means, the buried component circuit board of the present application effectively avoids the use of an expensive electrically conductive adhesive film to implement thermal conduction and electrical conduction requirements between a core plate and a conductive block, thereby reducing corresponding material use costs.

Description

Embedded component circuit board, manufacturing method thereof, and electronic device

【Technical field】

The present application relates to the technical field of circuit boards, in particular to an embedded component circuit board, a manufacturing method thereof, and an electronic device.

【Background technique】

With the rapid development of electronic technology, higher and higher requirements are put forward for the connection between PCB (circuit board) and devices, especially for power amplifier RF products. The connection between PCB and devices must not only meet the requirements of heat dissipation, but also meet the The requirement of signal grounding, in other words, needs to provide a short electrical connection circuit for signal layer change to reduce external radiation. Therefore, under normal circumstances, after the surface of the PCB needs to be treated (such as chemical nickel gold), a thermally conductive conductive adhesive film is used to bond the copper block (the copper block has a strong heat dissipation function) to achieve contact. The thermal and electrical conduction requirements of the interface.

However, in order to realize the thermal and electrical conduction function of the interface between the PCB and the heat-dissipating copper block, the conductive adhesive film is generally used in the industry at present, and the conductive adhesive is usually mainly composed of a resin matrix, conductive particles, dispersing additives, additives, etc., and among them Filler particles with both electrical and thermal conductivity functions are generally gold, silver, silver-coated copper powder, etc. The biggest disadvantage is that the price of thermal and conductive particles is relatively expensive, and the heat resistance is low, and the chemical resistance and toughness are poor.

【Content of invention】

The present application provides an embedded component circuit board and its manufacturing method and electronic device, so as to solve the problem of the embedded component circuit board in the prior art to realize the conductive adhesive film between the circuit board and the heat-dissipating copper block. The price is more expensive, and the heat resistance is low, the chemical resistance and toughness are poor.

In order to solve the above technical problems, a technical solution adopted by the present application is to provide an embedded component circuit board, wherein the embedded component circuit board includes: a conductive block, the conductive block is provided with at least one blind slot; a thermally conductive material The layer is arranged on the conductive block, and the heat-conducting material layer is provided with at least one first through-slot facing the blind groove; the core plate is arranged on the heat-conducting material layer, and the core board is provided with at least one second through-slot facing the first through-slot. Groove; Embedded components are arranged in the through first through groove, second through groove and blind groove, and at least one side of the embedded element is in contact with the groove walls of the first through groove, second through groove and blind groove A conductive medium is filled therebetween, so that the conductive block is electrically connected to the core board through the conductive medium.

Wherein, the distance between the inner side wall of the first through groove and the outer surface of the embedded element is greater than the distance between the inner side wall of the second through groove and the outer surface of the embedded element, and the conductive medium is also filled into the second through groove Corresponding to the gap between the core board and the conductive block, the conductive block is electrically connected to the side of the core board facing the conductive block through a conductive medium.

Wherein, the distance between the inner wall of the first through groove and the outer surface of the embedded element is 1-20 mm larger than the distance between the inner wall of the second through groove and the outer surface of the embedded element.

Wherein, the inner side wall of the second through groove of the core board is also provided with a conductive layer, and the distance between the inner side wall of the first through groove and the outer surface of the embedded component is equal to the distance between the inner side wall of the second through groove and the embedded component. The distance between the outer surfaces, the conductive block is electrically connected to the conductive layer through a conductive medium.

Wherein, the embedded component includes assembly leads, and the assembled leads are pasted on the other side of the core board away from the conductive block, so as to realize electrical connection between the embedded component and the core board.

Wherein, a conductive medium is also filled between the bottom of the embedded component and the bottom of the blind groove.

Wherein, the thermally conductive material layer is a thermally conductive prepreg.

Wherein, the thermally conductive material layer is made of graphene conductive adhesive material, so that the conductive block is electrically connected to the core board through the conductive medium and the thermally conductive material layer.

In order to solve the above technical problems, another technical solution adopted by the present application is to provide a method for manufacturing an embedded component circuit board, wherein the method for manufacturing the embedded component circuit board includes: providing a conductive block, The conductive block is provided with at least one blind slot; a thermally conductive material layer is provided on the conductive block, and the thermally conductive material layer is provided with at least one first through slot facing the blind slot; a core board is provided on the thermally conductive material layer, and the core board is facing the first through slot. The groove is provided with at least one second through groove; a conductive medium is arranged at the bottom of the blind groove; the embedded component is arranged on the conductive medium through the first through groove, the second through groove and the blind groove, and the embedded component There is a gap between at least one side and the first through groove, the second through groove and the wall of the blind groove; the conductive medium is melted so that the melted conductive medium fills the gap, so that the conductive block passes through the conductive medium And electrically connected to the core board.

In order to solve the above technical problems, another technical solution adopted by the present application is to provide an electronic device, wherein the electronic device includes the embedded component circuit board as described in any one of the above items.

The beneficial effects of the present application are: different from the situation of the prior art, the embedded component circuit board in the present application includes: a conductive block, a heat-conducting material layer, a core board and an embedded component; and wherein the conductive block is provided with at least one Blind groove, the thermal conductive material layer is provided with at least one first through groove facing the blind groove, and the core plate is provided with at least one second through groove facing the first through groove, and the embedded element is arranged in the through first through groove, In the second through groove and the blind groove, and between at least one side of the embedded element and the groove walls of the first through groove, the second through groove and the blind groove, a conductive medium is filled, so that the conductive block can pass through the conductive medium And it is electrically connected to the core board, so that it can effectively avoid the use of expensive conductive adhesive film to realize the heat conduction and conduction requirements between the core board and the conductive block, so as to reduce the cost of materials used in the production of embedded component circuit boards, and heat conduction The heat resistance, chemical resistance and toughness of the material layer and the conductive medium are also relatively high.

【Description of drawings】

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative work, in which:

FIG. 1 is a schematic structural view of the first embodiment of the embedded component circuit board of the present application;

2 is a schematic structural view of the second embodiment of the embedded component circuit board of the present application;

Fig. 3a is a schematic flow diagram of an embodiment of the manufacturing method of the embedded component circuit board of the present application;

Figure 3b-Figure 3g is a schematic structural view of an embodiment corresponding to S35-S36 in Figure 3a;

FIG. 4 is a schematic structural diagram of an embodiment of an electronic device of the present application.

【Detailed ways】

In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

Please refer to FIG. 1 . FIG. 1 is a structural diagram of a first embodiment of an embedded component circuit board of the present application. In this embodiment, the embedded component circuit board 1 includes: a conductive block 11 , a thermally conductive material layer 12 , a core board 13 and an embedded component 14 .

Wherein, the embedded component circuit board 1 specifically refers to including the embedded component 14, and the embedded component 14 and the corresponding core board 13 need to dissipate heat and meet the requirements of signal grounding, and specifically can be Power amplifier radio frequency products, or any other reasonable circuit board, this application does not limit it.

Specifically, the conductive block 11 in the embedded component circuit board 1 is provided with at least one blind slot, and the thermally conductive material layer 12 is further arranged on the side of the conductive block 11 corresponding to the opening of the blind slot, and on the thermally conductive On the material layer 12 , at least one first through-slot is opened corresponding to the blind slot on each conductive block 11 .

The core plate 13 is further disposed on the side of the heat conducting material layer 12 facing away from the conductive block 11 , and the core plate 13 is provided with at least one second through groove corresponding to the first through groove in each heat conducting material layer 12 .

It can be understood that the number of the second through slot is equal to that of the first through slot and the blind slot, and the three pass through each other. The core plate 13 may specifically include at least one layer of sub-body, or at least two layers of sub-body, and at least two layers of sub-body are provided with a through groove at the same position, that is, the second through groove, and the Each sub-body can be a copper-clad laminate or other materials that can be used to manufacture circuit boards, and prepregs can also be stacked between every two adjacent sub-bodies. It can be seen from this that the core board 13 can be specifically used to realize the circuit design logic of the embedded component circuit board 1 to realize corresponding electrical connections.

Further, the embedded element 14 is disposed in the first through groove, the second through groove and the blind groove, that is, the thickness of the embedded element 14 is greater than the sum of the thicknesses of the first through groove and the second through groove, And it can pass through the first through slot and the second through slot and attach to the bottom of the blind slot. And at least one side of the embedded element 14 is spaced from the groove walls of the first through groove, the second through groove and the blind groove, and has a gap, and the gap is filled with a conductive medium 15, so that the conductive block 11 can pass through the gap. The electrical connection with the core board 13 is realized through the conductive medium 15 . That is, the core board 13 is electrically connected to the conductive block 11 , so that the core board 13 and the embedded component 14 can be signal-grounded through the conductive block 11 .

Optionally, the conductive block 11 is any reasonable metal block such as a copper block or a silver block that can realize heat dissipation and conduct electricity, which is not limited in the present application.

Optionally, the thermally conductive material layer 12 is a low-flow adhesive and insulating thermally conductive prepreg, so as to dissipate heat from the core board 13 by being laminated between the core board 13 and the conductive block 11 . In other embodiments, the thermally conductive material layer 12 can also be made of a material that conducts heat and has a certain conductive function, such as a graphene conductive adhesive material, etc., while dissipating heat from the core board 13, it can also The electrical connection between the core board 13 and the conductive block 11 realized by the conductive medium 15 is compensated and strengthened, so that the conductive block 11 can be electrically connected to the core board 13 through the conductive medium 15 and the thermally conductive material layer 12 .

Optionally, the conductive medium 15 may specifically be a solidified metal block that can be melted to fill the gap between the embedded component 14 and the through first through groove, second through groove and blind groove, such as , tin metal sheet or any other reasonable conductive medium, which is not limited in this application.

It can be seen that, compared with laminating the conductive adhesive film between the core board 13 and the conductive block 11 , the adhesion, thermal conductivity and electrical conductivity between the core board 13 and the conductive block 11 can be achieved. Obviously, using the thermally conductive material layer 12 to achieve bonding and heat conduction between the core board 13 and the conductive block 11, and using the conductive medium 15 to realize the electrical conductivity between the core board 13 and the conductive block 11, the corresponding implementation cost is lower, and It can effectively reduce the cost of materials used in making the embedded component circuit board 1 , and the heat resistance, chemical resistance and toughness of the heat conduction material layer 12 and the conduction medium 15 are also relatively high.

Wherein, the distance between the inner sidewall of the first through groove in the heat conducting material layer 12 and the outer side of the embedded element 14 is greater than that between the inner sidewall of the second through groove in the core board 13 and the outer side of the embedded element 14 The distance, that is, the cross-sectional dimension of the second through-slot is larger than the cross-sectional dimension of the first through-slot. There is also a gap between the part structure of the core board 13 facing the side of the conductive block 11 and the conductive block 11, and the core board 13 exposes the conductive layer through this part of the structure, and the gap, that is, the second through groove corresponds to the core The gap between the plate 13 and the conductive block 11 is also filled with a conductive medium 15, so that the conductive block 11 can be electrically connected to the part of the structure of the core plate 13 facing the side of the conductive block 11 through the conductive medium 15, and It is electrically connected with the core board 13 .

Optionally, the distance between the inner sidewall of the first through groove and the outer surface of the embedded element 14 is 1-20mm larger than the distance between the inner sidewall of the second through groove and the outer surface of the embedded element 14, so as to be able to Effectively realize the electrical connection between the core board 13 and the conductive block 11 .

Wherein, the embedded component 14 further includes an assembly lead 141 , and the assembly lead 141 is pasted on the other side of the core board 13 away from the conductive block 11 to electrically connect the embedded component 14 and the core board 13 .

It can be understood that the depth of the blind groove in the conductive block 11 is specifically determined by the thickness of the embedded element 14 protruding from the first through groove and the second through groove after passing through the first through groove and the second through groove, so as to When the embedded component 14 abuts against the bottom of the blind groove, the distance between the assembly lead 141 and the other side of the core board 13 away from the conductive block 11 can be as short as possible, so that it can be directly attached On the other side of the core board 13 to ensure a shorter wiring distance and better electrical connection performance. Wherein, the assembly leads 141 specifically refer to soldering pins on the embedded component 14 . In other embodiments, when the thickness of the embedded element 14 is equal to the sum of the depths of the first through groove and the second through groove, the blind groove may not be formed in the conductive block 11, and the embedded element 14 The bottom directly abuts against one side of the conductive block 11 .

Optionally, a conductive medium 15 is also filled between the bottom of the embedded element 14 and the bottom of the blind groove, and the conductive medium 15 may be stacked between the bottom of the embedded element 14 and the bottom of the blind groove The metal blocks between them, such as tin metal sheets, are melted to fill the gaps between the embedded component 14 and the through groove walls of the first through groove, the second through groove and the blind groove, and are obtained after solidification. In other embodiments, the conductive medium 15 can also only be filled in the gap between the side wall of the embedded element 14 and the through groove wall of the first through groove, the second through groove and the blind groove. This is not limited.

Please refer to FIG. 2 . FIG. 2 is a schematic structural diagram of a second embodiment of an embedded component circuit board of the present application. The difference between the embedded component circuit board of this embodiment and the first embodiment of the embedded component circuit board provided by the present application in FIG. 1 is that the second through groove of the core board 23 in the embedded component circuit board 2 A conductive layer 26 is also provided on the inner sidewall of the .

And the distance between the inner sidewall of the first through groove in the heat-conducting material layer 22 in the embedded element circuit board 2 and the outer surface of the embedded element 24 is equal to the inner sidewall and the inner sidewall of the second through groove in the core board 23 The distance between the outer surfaces of the embedded components 24 enables the conductive block 21 to be electrically connected to the conductive layer 26 through the conductive medium 25 to realize electrical connection with the core board 23 .

In other embodiments, the distance between the inner side wall of the first through groove in the heat-conducting material layer 22 and the outer surface of the embedded element 24 can also be greater than the distance between the inner side wall of the second through groove in the core plate 23 and the embedded element. The distance between the outer surfaces of the formula element 24, so that the conductive block 21 can pass through the conductive layer 26, and the conductive medium 25 filled in the gap corresponding to the core plate 13 and the conductive block 11 in the second through groove, And it is electrically connected with the core board 23 .

Based on the general inventive concept, the present application also provides a method for manufacturing an embedded component circuit board, please refer to Fig. 3a-Fig. A schematic flow chart of an embodiment, FIG. 3b-3g is a schematic structural diagram of an implementation manner corresponding to S35-S36 in FIG. 3a. This embodiment includes the following steps:

S31: Provide a conductive block, the conductive block is provided with at least one blind slot.

Specifically, as shown in FIG. 3 b , a conductive block 31 is provided, and at least one blind slot 311 is opened on the conductive block 31 , that is, the depth of the blind slot 311 is smaller than the thickness of the conductive block 31 .

Optionally, the conductive block 31 is any reasonable metal block such as a copper block or a silver block that can realize heat dissipation and conduct electricity, which is not limited in this application.

For the convenience of description, in this embodiment, one blind slot 311 is provided in the conductive block 31 as an example for illustration, but in other embodiments, only two or three blind slots 311 may be provided. , or any reasonable number of blind slots 311 such as 5, which is not limited in this application.

S32: disposing a thermally conductive material layer on the conductive block, the thermally conductive material layer is provided with at least one first through groove facing the blind groove.

Further, as shown in FIG. 3c, a heat-conducting material layer 32 is pasted on the side of the conductive block 31 corresponding to the opening of the blind groove 311, and on the heat-conducting material layer 32, it is opposite to each conductive block 31. The blind slot 311 is correspondingly provided with at least one first through slot 321 .

Optionally, the thermally conductive material layer 32 is a low-flow adhesive and insulating thermally conductive prepreg, so as to dissipate heat from the core board 33 by being laminated between the core board 33 and the conductive block 31 . In other embodiments, the heat-conducting material layer 32 may also be made of a material that conducts heat and conducts electricity, such as graphene conductive adhesive material, which is not limited in this application.

S33: Arranging a core plate on the heat-conducting material layer, the core plate is provided with at least one second through-slot facing the first through-slot.

Further, as shown in FIG. 3 d , a core plate 33 is pasted on the side of the heat-conducting material layer 32 facing away from the conductive block 31 , and the core plate 33 faces the first through-slot 321 in each heat-conducting material layer 32 Correspondingly, at least one second through groove 331 is opened.

It can be understood that the number of the second through slot 331 is equal to that of the first through slot 321 and the blind slot 311 , and the three communicate with each other. Specifically, the core plate 33 may include at least one layer of sub-body, or at least two layers of sub-body, and at least two layers of sub-body are provided with a through groove body at the same position, that is, the second through groove 331, wherein Each sub-body can be a copper-clad laminate or other materials that can be used to manufacture circuit boards, and prepregs can also be stacked between each adjacent two sub-bodies. It can be seen from this that the core board 33 can be specifically used to realize the circuit design logic of the embedded component circuit board, so as to realize the corresponding electrical connection.

S34: setting a conductive medium at the bottom of the blind groove.

Specifically, as shown in FIG. 3 e , a conductive medium 34 is disposed at the bottom of each blind slot 311 in the conductive block 31 .

Optionally, the conductive medium 34 is a metal block, such as a tin metal sheet or any other reasonable conductive medium, which is not limited in the present application.

S35: Install the embedded element on the conductive medium through the first through groove, the second through groove and the blind groove, and make at least one side of the embedded element connect with the through first through groove, the second through groove and the blind groove The grooves have gaps between the groove walls.

Further, as shown in FIG. 3f, an embedded element 35 is pasted on the conductive medium 34 through the first through groove 321, the second through groove 331 and the blind groove 311, that is, the thickness of the embedded element 35 is It is greater than the sum of the thicknesses of the first through groove 321 and the second through groove 331 , and can be pasted on the conductive medium 34 through the first through groove 321 and the second through groove 331 . Moreover, at least one side of the embedded component 35 is spaced from the groove walls of the first through groove 321 , the second through groove 331 and the blind groove 311 , so as to have a gap.

S36: Melting the conductive medium, so that the melted conductive medium fills the gap, so that the conductive block is electrically connected to the core board through the conductive medium.

Further, as shown in Figure 3g, the conductive medium 34 is melted, for example, it is put into an oven to heat and melt the conductive medium 34, so that the conductive medium 34 after melting is filled in the embedded The conductive block 31 can be electrically connected to the core board 33 through the conductive medium 34 in the gap formed between the element 35 and the first through slot 321 , the second through slot 331 and the blind slot 311 .

It can be seen that, compared with laminating the conductive adhesive film between the core board 33 and the conductive block 31 , the adhesion, thermal conductivity and electrical conductivity between the core board 33 and the conductive block 31 can be achieved. Obviously, using the thermally conductive material layer 32 to achieve bonding and heat conduction between the core board 33 and the conductive block 31, and using the conductive medium 34 to realize the electrical conductivity between the core board 33 and the conductive block 31, the corresponding implementation cost is lower, and It can effectively reduce the cost of materials used for making embedded component circuit boards, and the heat resistance, chemical resistance and toughness of the heat conduction material layer 32 and the conduction medium 34 are also relatively high.

In one embodiment, the distance between the inner sidewall of the first through groove 321 in the heat conducting material layer 32 and the outer side of the embedded element 35 is greater than the distance between the inner sidewall of the second through groove 331 in the core board 33 and the embedded element 35 . The distance between the outer surfaces of the elements 35 , that is, the cross-sectional dimension of the second through groove 331 is greater than the cross-sectional dimension of the first through groove 321 . And there is a gap between the part structure of the core board 33 facing the side of the conductive block 31 and the conductive block 31, and the core board 33 exposes the conductive layer through this part structure, and the gap, that is, the second through groove 331 corresponds to The gap between the core plate 33 and the conductive block 31 is also filled with a conductive medium 34, so that the conductive block 31 can be electrically connected to the part of the structure on the side of the core plate 33 facing the conductive block 31 through the conductive medium 34 , and achieve electrical connection with the core board 33 .

Optionally, the distance between the inner side wall of the first through groove 321 and the outer side of the embedded element 35 is 1-20 mm larger than the distance between the inner side wall of the second through groove 331 and the outer side of the embedded element 35, In order to effectively realize the electrical connection between the core board 33 and the conductive block 31 .

In one embodiment, the embedded component 35 also includes an assembly lead, and the assembled lead is attached to the other side of the core board 33 away from the conductive block 31, so that the embedded component 35 and the core board 33 are electrically connected. .

It can be understood that the depth of the blind groove 311 in the conductive block 31 is specifically determined by the embedded element 35 protruding from the first through groove 321 and the second through groove 331 after passing through the first through groove 321 and the second through groove 331 The thickness is determined so that when the embedded component 35 abuts against the bottom of the blind groove 311, the distance between the assembly lead and the other side of the core board 33 away from the conductive block 31 can be as short as possible, Instead, it can be directly attached to the other side of the core board 33 to ensure a shorter routing distance and better electrical connection performance. Wherein, the assembly leads specifically refer to soldering pins on the embedded component 35 . In other embodiments, when the thickness of the embedded element 35 is equal to the sum of the depths of the first through groove 321 and the second through groove 331, the blind groove 311 may not be formed in the conductive block 31, but the embedded The bottom of the formula element 35 directly abuts against one side of the conductive block 31 .

Based on the general inventive concept, the present application also provides an electronic device, please refer to FIG. 4 , which is a schematic structural diagram of an embodiment of the electronic device of the present application. Wherein, the electronic device 41 includes an embedded component circuit board 411, and the embedded component circuit board 411 is the embedded component circuit board 1 or the embedded component circuit board 2 as described in any one of the above, here No longer.

Different from the situation in the prior art, the embedded component circuit board in this application includes: a conductive block, a thermally conductive material layer, a core board and embedded components; and the conductive block is provided with at least one blind slot, and the thermally conductive material layer is positively There is at least one first through-slot facing the blind slot, and at least one second through-slot is provided on the core plate facing the first through-slot, and the embedded components are arranged in the first through-slot, the second through-slot and the blind slot through , and at least one side of the embedded component is filled with a conductive medium between the first through groove, the second through groove and the groove walls of the blind groove, so that the conductive block can be electrically connected to the core board through the conductive medium, Therefore, it can effectively avoid the use of expensive conductive adhesive film to realize the heat conduction and conduction requirements between the core board and the conductive block, so as to reduce the cost of materials used in the production of embedded component circuit boards, and the resistance of the heat conduction material layer and the conduction medium Thermal, chemical resistance and toughness are also relatively high.

The above is only an embodiment of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process conversion made by using the specification and drawings of the application, or directly or indirectly used in other related technologies fields, are all included in the scope of patent protection of this application in the same way.

Claims

An embedded component circuit board, characterized in that the embedded component circuit board includes:

A conductive block, the conductive block is provided with at least one blind slot;

A heat-conducting material layer is arranged on the conductive block, and the heat-conducting material layer is provided with at least one first through groove facing the blind groove;

A core plate is arranged on the heat-conducting material layer, and the core plate is provided with at least one second through-slot facing the first through-slot;

Embedded components are arranged in the first through groove, the second through groove and the blind groove through, and at least one side of the embedded element is connected to the first through groove, the A conductive medium is filled between the second through groove and the groove wall of the blind groove, so that the conductive block is electrically connected to the core board through the conductive medium.
The embedded component circuit board according to claim 1, wherein,

The distance between the inner wall of the first through groove and the outer surface of the embedded element is greater than the distance between the inner wall of the second through groove and the outer surface of the embedded element, and the conductive medium It is also filled into the gap corresponding to the core board and the conductive block in the second through groove, and the conductive block is electrically connected to the part of the core board facing the conductive block through the conductive medium. on one side.
The embedded component circuit board according to claim 2, wherein,

The distance between the inner side wall of the first through groove and the outer surface of the embedded element is 1-20 mm larger than the distance between the inner side wall of the second through groove and the outer surface of the embedded element.
The embedded component circuit board according to claim 1, wherein,

A conductive layer is also provided on the inner sidewall of the second through-slot of the core board, and the distance between the inner sidewall of the first through-slot and the outer surface of the embedded component is equal to that of the second through-slot The distance between the inner wall of the embedded element and the outer surface of the embedded element, the conductive block is electrically connected to the conductive layer through the conductive medium.
The embedded component circuit board according to claim 1, wherein,

The embedded component includes an assembly lead, and the assembled lead is attached to the other side of the core board away from the conductive block, so as to realize electrical connection between the embedded component and the core board.
The embedded component circuit board according to claim 1, wherein,

The conductive medium is also filled between the bottom of the embedded element and the bottom of the blind slot.
The embedded component circuit board according to claim 1, wherein,

The thermally conductive material layer is a thermally conductive prepreg.
The embedded component circuit board according to claim 1, wherein,

The thermally conductive material layer is made of graphene conductive adhesive material, so that the conductive block is electrically connected to the core board through the conductive medium and the thermally conductive material layer.
A method for manufacturing an embedded component circuit board, characterized in that the method for manufacturing the embedded component circuit board includes:

providing a conductive block, the conductive block is provided with at least one blind slot;

A heat-conducting material layer is provided on the conductive block, and the heat-conducting material layer is provided with at least one first through-slot facing the blind slot;

A core plate is arranged on the heat-conducting material layer, and the core plate is provided with at least one second through-slot facing the first through-slot;

setting a conductive medium at the bottom of the blind groove;

The embedded element is arranged on the conductive medium through the first through groove, the second through groove and the blind groove, and at least one side of the embedded element is connected to the through first through groove. There is a gap between the first through groove, the second through groove and the groove wall of the blind groove;

Melting the conductive medium, so that the melted conductive medium fills the gap, so that the conductive block is electrically connected to the core board through the conductive medium.
An electronic device comprising the embedded component circuit board according to any one of claims 1-8.