CN102510663A - Printed board component and processing method thereof - Google Patents
Printed board component and processing method thereof Download PDFInfo
- Publication number
- CN102510663A CN102510663A CN2011102996117A CN201110299611A CN102510663A CN 102510663 A CN102510663 A CN 102510663A CN 2011102996117 A CN2011102996117 A CN 2011102996117A CN 201110299611 A CN201110299611 A CN 201110299611A CN 102510663 A CN102510663 A CN 102510663A
- Authority
- CN
- China
- Prior art keywords
- printed board
- high frequency
- substrate
- power device
- frequency printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a printed board component applied to a high-frequency and high-power circuit and a processing method thereof. The printed board component provided by the invention comprises a conventional printed board, a high-frequency printed board, a substrate and a power device, wherein the substrate is embedded in the window of the conventional printed board; one part of the high-frequency printed board is fixed on the conventional printed board through a surface-mounted welding end, and the other part of the high-frequency printed board is fixed on the substrate; the power device is contacted with the substrate through the window of the high-frequency printed board; and the power device pin of the power device is welded on the high-frequency printed board.
Description
Technical field
The present invention relates to circuit board, relate in particular to a kind of printed board assembly and processing method thereof that is applied in high frequency, the high-power circuit.
Background technology
In the art, adopt the mode of printed circuit board (pcb) to realize being electrically connected of electronic component and fixing usually.For the electronic component of general power and signal frequency, the conventional printed circuit board sheet material of employing such as FR4 (flame retardant rating 4) sheet material can meet the demands as the sheet material of printed circuit board.But for the communication base station product,, therefore must use some high frequencies, high power device because it requires to realize high frequency, powerful function.If these devices adopt aforesaid conventional printed circuit board sheet material, then can't bear powerful load, there are high-frequency effects simultaneously.In the case, the common solution of industry is to adopt high frequency sheet material, like PTFE (polytetrafluoroethylene) sheet material, to solve the problem of high frequency, high-power circuit coupling, loss and heat radiation.Simultaneously, also to consider miniaturization, low cost, light weight, machinability, the reliability that printed board assembly is whole.
Fig. 1 a has schematically shown the first kind of example that is applied to the printed board assembly in high frequency, the high-power circuit (a plate integrated form scheme) of prior art one.Shown in Fig. 1 a, printed board assembly 100 mainly comprises the substrate 107 that conventional printed board 101, high frequency printed board 102, power device 105, metal derby constitute.Conventional printed board 101 for example presses together through special processing technologys such as whole plate mixed pressure or local mixed pressures with high frequency printed board 102; Thereby be integrated into a plate; Wherein as well-known to those skilled in the art, the process for pressing of above-mentioned whole plate mixed pressure or local mixed pressure makes and realizes connecting between the conventional printed board 101 that is integrated into a plate and the high frequency printed board 102.Be provided with special be high frequency, the connection of high-power circuit designed circuit in the high frequency printed board 102; Power device 105 such as power tube is welded to high frequency printed board 102 through its power device pin 106 via scolder 104, so that being electrically connected and fixing of power device 105 to be provided.Other conventional devices then are connected in conventional printed board 101.In addition, radiator 103 is connected in substrate 107 in order to heat radiation.
In first kind of example of the prior art shown in Fig. 1 a one; Because conventional printed board and high frequency printed board are integrated into a plate; High frequency, high power device and other conventional devices are connected respectively to integrated conventional printed board and high frequency printed board; Therefore a this plate integrated form scheme processing technology is simple, need not mother daughter board connector, and assembling is simple.It is easy to be connected signal processing between device and the device under the integrated situation of one plate.Also minimum to the veneer area consumption in theory.But, in an above-mentioned plate integrated form scheme, because high frequency, high power device and conventional device are integrated in the printed board; For example have following shortcoming: (1) high frequency, high power device and conventional device one plate are integrated; Need multi-layer sheet to realize,, must use high-performance sheet material in order to satisfy high frequency, high power device requirement; Can adopt generally that high-performance sheet material and conventional sheet material press together between special processing technologys such as whole plate mixed pressure or local mixed pressure, processed complex, cost are higher; (2) need to adopt schemes such as the back of the body copper, embedding copper or local substrate to solve the power device heat dissipation problem, the cost that solves heat dissipation problem is higher; (3) the integrated level raising must be adopted the multilayer printed board scheme, especially increases and improves multilayer printed board high frequency, high power device signal return flow path cost; (4) high frequency, high-power circuit construction cycle are grown much than custom circuit, and a plate is integrated to integrate high frequency, high power device and conventional device, influences the whole development cycle.
Fig. 1 b has schematically shown the second kind of example that is applied to the printed board assembly in high frequency, the high-power circuit (an another kind of plate integrated form scheme) of prior art one.Shown in Fig. 1 b, all printed board sheet materials all adopt high frequency sheet material, and high frequency, high power device and other conventional devices one plate are integrated into high frequency sheet material.In detail, printed board assembly 100 ' mainly comprise high frequency printed board 102 ', power device 105 ', the substrate 107 that constitutes of metal derby '.High frequency printed board 102 ' in be provided with and special connect for high frequency, high-power circuit designed circuit; Such as the power device 105 of power tube ' pass high frequency printed board 102 '; Power device pin 106 ' via scolder 104 ' be welded to high frequency printed board 102 ', with provide power device 105 ' be electrically connected and fixing.Other conventional devices also be connected in similarly high frequency printed board 102 '.In addition, radiator 103 ' be connected in substrate 107 ' in order to heat radiation.
In second kind of example of the prior art shown in Fig. 1 b one; Because all printed board sheet materials all adopt high frequency sheet material; High frequency, high power device and other conventional devices one plate are integrated into high frequency sheet material, and therefore a this plate integrated form scheme processing technology is simple, and assembling is simple.It is easy to be connected signal processing between device and the device under the integrated situation of one plate.Also minimum to the veneer area consumption in theory.But; In an above-mentioned plate integrated form scheme; Because high frequency, high power device and conventional device are integrated on the high frequency sheet material, for example have following shortcoming: (1) high frequency, high power device and conventional device one plate are integrated, in order to satisfy high frequency, high power device requirement; Must all use high-performance sheet material, thereby cost is higher; (2) need to adopt schemes such as the back of the body copper, embedding copper or local substrate to solve the power device heat dissipation problem, the cost that solves heat dissipation problem is higher; (3) high frequency, high-power circuit construction cycle are grown much than custom circuit, and a plate is integrated to integrate high frequency, high power device and conventional device, influences the whole development cycle.
Fig. 2 has schematically shown the printed board assembly (embedded scheme) in high frequency, the high-power circuit that is applied to of prior art two.As shown in Figure 2, printed board assembly 200 mainly comprises the substrate 207 that conventional printed board 201, high frequency printed board 202, power device 205, metal derby constitute.Be provided with special be high frequency, the connection of high-power circuit designed circuit in the high frequency printed board 202; Power device 205 such as power tube passes high frequency printed board 202; Power device pin 206 is welded to high frequency printed board 202 via scolder 204, so that being electrically connected and fixing of power device 205 to be provided.Other conventional devices then are connected in conventional printed board 201.In addition, radiator 203 is connected in substrate 207 in order to heat radiation.Power device 205, high frequency printed board 202 and substrate 207 form an integral body, are referred to as high frequency printed board module.This high frequency printed board module with regard to modularization, will be avoided design iterations later on after once designing moulding, for similar application scenario, just can this module be regarded as an element and use.At conventional printed board 201 uplifting windows, in the whole window that is embedded into conventional printed board 201 of this high frequency printed board module.The high frequency printed board 202 that embeds in the window is connected with conventional printed board 201 through jumper coupler 208, realizes being electrically connected of high frequency printed board 202 and conventional printed board 201.
In this embedded scheme as prior art two as shown in Figure 2; High frequency, high power device separate connection are in the high frequency printed board; Conventional device is connected in conventional printed board, realizes the electrical connection of high frequency printed board and conventional printed board then through jumper coupler.In this embedded scheme, high frequency, high power device are separated with conventional device, lowered the high-performance board cost, simultaneously, problems such as high frequency, high power device heat radiation, backflow, loss have all obtained solution.But; In above-mentioned embedded scheme, also for example there is following shortcoming: link to each other through jumper coupler between (1) high frequency printed board and the conventional printed board; Jumper coupler takies the printed board area, is unfavorable for miniaturization, and jumper coupler has increased whole Material Cost simultaneously; (2) because the welding of wire jumper can not be taked automatic welding sequence, therefore increase manual welding wire jumper link, make welding sequence complicated, efficiency of assembling reduces, and welding quality is difficult to guarantee; (3) the intrinsic slit between high frequency printed board and the conventional printed board influences the isolation between the multi-channel power amplifying circuit; (4) because the existence of jumper coupler causes return flow path long, bring jumper coupler high frequency performance and module electromagnetic radiation.
Fig. 3 has schematically shown the printed board assembly (castle scheme) in high frequency, the high-power circuit that is applied to of prior art three.As shown in Figure 3, printed board assembly 300 mainly comprises the substrate 307 that conventional printed board 301, high frequency printed board 302, power device 305, metal derby constitute.Be provided with special be high frequency, the connection of high-power circuit designed circuit in the high frequency printed board 302; Power device 305 such as power tube is welded to high frequency printed board 302 through its power device pin 306 through scolder 304, so that being electrically connected and fixing of power device 305 to be provided.Other conventional devices then are connected in conventional printed board 301.High frequency printed board 302 welds together via scolder 304 with conventional printed board 301.In addition, radiator 303 is connected in substrate 307 in order to heat radiation.As shown in Figure 3, power device 305 is inserted into and is formed in the windowing in high frequency printed board 302 and the conventional printed board 301, is connected in the boss of substrate 307 through its ring flange.
In this castle scheme as prior art three as shown in Figure 3; The high frequency printed board is welded in the conventional printed board; Power device is through the heat radiation that links to each other with the substrate that is connected conventional printed board backboard face of windowing of high frequency printed board and conventional printed board; Both promote high frequency, high power device loss, backflow, heat dispersion, solved problems such as cost that embedded scheme wire jumper brings, assembling, backflow, electromagnetic radiation, multi-channel power amplifying circuit isolation again.But along with power grade constantly promotes, the device scale constantly increases, and this existing its shortcoming of castle scheme constantly comes out; For example, (1) conventional device is welded in conventional printed board, and high frequency, high power device are welded in the high frequency printed board; High frequency printed board and conventional printed board weld together; Conventional printed board and substrate weld together, and welding process fixing tool anchor clamps, whole weight of material are whole material summations.Along with the veneer scale increases, whole weight of material exceeds the chip mounter load; (2) heat-sinking capability is not enough, and in this scheme, the ring flange of high frequency, high power device only links to each other with the boss of substrate, can not be suitable for the heat radiation of more high-power grade occasion; (3) return flow path of high frequency, high power device is: high frequency printed board and conventional printed board joint face one conventional printed board plate window electroplating film one substrate one high frequency, high power device ring flange, so return flow path is longer.
Summary of the invention
The embodiment of the invention provides a kind of printed board assembly and processing method thereof, and the weight of whole material when welding to reduce is suitable for different capacity classes of applications occasion thereby improve the substrate heat-sinking capability.
According to an aspect of the present invention, a kind of printed board assembly comprises conventional printed board, high frequency printed board, substrate and power device, and wherein: said substrate is embedded in the windowing of said conventional printed board; The part of said high frequency printed board is fixed in the said conventional printed board through surface-mount type weldering end, and another part of said high frequency printed board is fixed on the said substrate; Said power device contacts with said substrate through windowing of said high frequency printed board; The power device pin of said power device is welded in said high frequency printed board.
According to a further aspect in the invention; A kind of printed board assembly processing method comprises: in high frequency printed board and conventional printed board, window respectively; Wherein, Said high frequency printed board is being windowed corresponding to the position of placing power device, and said conventional printed board is being windowed corresponding to substrate embedded location part; Substrate is embedded in the windowing of said conventional printed board, forms the integral body that is together with each other; Said high frequency printed board is welded in the said conventional printed board that is embedded with said substrate; Make the part of said high frequency printed board be fixed in the said conventional printed board, and another part of said high frequency printed board is fixed on the said substrate through surface-mount type weldering end; Power device is passed windowing of said high frequency printed board contact, and the power device pin of said power device is welded in said high frequency printed board with said substrate.
Beneficial effect of the present invention for example comprises: because substrate embeds in the conventional printed board; The integral body that the two formation is together with each other; And the high frequency printed board is welded in the conventional printed board that is embedded with substrate, so the frock design is simple than the prior art scheme, and whole weight of material alleviates greatly.In addition, owing to power device contacts with substrate through windowing of high frequency printed board, thereby the contact area between the power device ring flange of substrate and power device increases, and has promoted heat-sinking capability, thereby can be suitable for the application scenarios of more power grades.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use among the embodiment below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 a has schematically shown the first kind of example that is applied to the printed board assembly in high frequency, the high-power circuit of prior art one.
Fig. 1 b has schematically shown the second kind of example that is applied to the printed board assembly in high frequency, the high-power circuit of prior art one.
Fig. 2 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to of prior art two.
Fig. 3 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to of prior art three.
Fig. 4 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to according to the embodiment of the invention one.
Fig. 5 has schematically shown the structure of the via hole surface-mount type weldering end in the printed board assembly as shown in Figure 4; Wherein a left side illustrates the part stereogram of the high frequency printed board in the printed board assembly, and the right side illustrates the cutaway view that dissects high frequency printed board gained along direction shown in the arrow among the left figure.
Fig. 6 a has schematically shown the processing method embodiment flow chart that is applied to the printed board assembly in high frequency, the high-power circuit according to the embodiment of the invention one.
Fig. 6 b has schematically shown the processing method variant embodiment flow chart that is applied to the printed board assembly in high frequency, the high-power circuit according to the embodiment of the invention one.
Fig. 7 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to according to the embodiment of the invention two.
Fig. 8 has schematically shown the structure of the side surface-mount type weldering end in the printed board assembly as shown in Figure 7.
Fig. 9 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to according to the embodiment of the invention three.
Figure 10 a has schematically shown the processing method embodiment flow chart that is applied to the printed board assembly in high frequency, the high-power circuit according to the embodiment of the invention three.
Figure 10 b has schematically shown the processing method variant embodiment flow chart that is applied to the printed board assembly in high frequency, the high-power circuit according to the embodiment of the invention three.
Figure 11 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to according to the embodiment of the invention four.
Embodiment
Below will combine accompanying drawing through concrete embodiment come clear, intactly the present invention described.Obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment, and those skilled in the art can understand further feature of the present invention and effect through the disclosed content of the present invention.
At first definition made in following technical term as used in this specification." power device ": such as high frequency, the high power device of power amplifier, power tube etc.; It can amplify the input small-signal; Because its conversion efficiency can not be 100%, externally distribute the heat of certain ratio during work simultaneously, thereby need to pay close attention to its heat radiation and return flow path; " return flow path ": for the signal of telecommunication, when signal transmits, have the opposite direction signal that refluxes in reference the ground of PCB transmission line on transmission printed circuit board (pcb) transmission line, the delivering path of backflow signal is called return flow path; " conventional printed board ": like FR4 sheet material, refer to bear high-power load, have the sheet material of high-frequency effects, generally be not suitable for being applied in high frequency, powerful scene; " high frequency printed board ": like PTFE sheet material, can bear high-power load, high frequency characteristics is good, can solve the sheet material of the problem of high frequency, high-power functional circuit coupling, loss and heat radiation; " power device ring flange ": be meant the metal dish below the chip in the power device encapsulation here, play the carrier function of internal die support, ground connection, outside heat radiation; " substrate ": between power device ring flange and radiator, be used for the heat conduction between power device ring flange and the radiator, support power device simultaneously, its concrete form for example is the prefabricated metal piece in the present invention.
Embodiment one
Fig. 4 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to according to the embodiment of the invention one.As shown in Figure 4, the printed board assembly 400 that is applied in high frequency, the high-power circuit of the embodiment of the invention one comprises: conventional printed board 401, high frequency printed board 402, substrate 407 and power device 405.Substrate 407 is embedded in the windowing of conventional printed board 401.The part of high frequency printed board 402 is fixed in the conventional printed board 401 through surface-mount type weldering end 408, and another part of high frequency printed board 402 is fixed on the substrate 407.Power device 405 contacts with substrate 407 through windowing of high frequency printed board 402, and the power device pin 406 of power device 405 is welded in high frequency printed board 402 through scolder 404.
High frequency printed board 402 is welded in conventional printed board 401 through a plurality of surface-mount type weldering ends 408 that set within it.The part of high frequency printed board 402 lower surfaces links to each other with conventional printed board 401, and another part for example links to each other through scolder welding or gluing the connecing with substrate 407 of heat-conductivity conducting.Therefore, high frequency printed board 402 is electrically connected through 408 realizations of above-mentioned a plurality of surface-mount type weldering end and conventional printed board 401, and signals such as the radio frequency in the for example conventional printed board 401, power supply, control are delivered to high frequency printed board 402 via surface-mount type weldering end 408.
High frequency printed board 402 is provided with in the position of placing power device 405 corresponding to needs and windows.Power device 405 passes windowing of high frequency printed board 402 and contacts with substrate 407, realizes the fixing of power device 405.Being connected between power device 405 and the substrate 407 can be the scolder welding, also can be that electrically and thermally conductive adhesive is bonding.Simultaneously, the power device pin 406 of power device 405 is welded in the high frequency printed board 402 via scolder 404, realizes being electrically connected between power device 405 and the high frequency printed board 402.The small-power radiofrequency signal is transferred to the transmission line in the high frequency printed board 402 through above-mentioned via hole surface-mount type weldering end 408 from conventional printed board 401, zooms into high-power signal through power device 405 then.Than conventional printed board 401, the loss of 402 pairs of radiofrequency signals of high frequency printed board is much smaller, and this has guaranteed the high-quality of radiofrequency signal, has also guaranteed excellent batch consistent performance simultaneously.In addition, as stated, the bottom of power device 405 (being the power device ring flange) is connected in substrate 407, contacts heat radiation with substrate 407, thus functions such as the ground connection of substrate 407 realization power devices 405, heat radiation.
Preferably; In order to realize power device 405 being electrically connected between fixing and power device 405 and the high frequency printed board 402 in the high frequency printed board 402 best, the position of windowing corresponding to high frequency printed board 402 of the substrate 407 in being embedded into conventional printed board 401 is provided with groove.Power device 405 passes windowing of high frequency printed board 402, and fixed in position is in the groove of substrate 407.The arrangement of power device 405 in the groove of substrate 407 for example can connect realization through heat-conductivity conducting is gluing.Thus, the bottom of power device 405 (being the power device ring flange) is placed in the groove of substrate 407, contacts heat radiation with substrate 407, thus functions such as the ground connection of substrate 407 realization power devices 405, heat radiation.
As previously mentioned, high frequency printed board 402 is welded in conventional printed board 401 through a plurality of surface-mount type weldering ends 408 that set within it.In the embodiment of the invention one, above-mentioned surface-mount type weldering end 408 is via hole surface-mount type weldering end.Fig. 5 has schematically shown the structure of the via hole surface-mount type weldering end in the printed board assembly as shown in Figure 4; Wherein a left side illustrates the part stereogram of the high frequency printed board in the printed board assembly, and the right side illustrates the cutaway view that dissects high frequency printed board gained along direction shown in the arrow among the left figure.As shown in Figure 5; In high frequency printed board 402, be provided with a plurality of via hole surface-mount types weldering end, said via hole surface-mount type weldering end comprises: be formed on end face pad 501 on high frequency printed board 402 upper surfaces, be formed on the bottom surface pad 503 on high frequency printed board 402 lower surfaces and run through end face pad 501 and bottom surface pad 503 and be formed on the via hole 502 in the high frequency printed board 402.Metal-plated membrane on the inner peripheral surface of via hole 502.Therefore; Above-mentioned via hole surface-mount type weldering is held except being used for thereby high frequency printed board 402 is welded in the fixing of conventional printed board 401 realization high frequency printed boards 402, can also realize end face pads 501 and being electrically connected also of bottom surface pad 502 and then being electrically connected of printed board 402 of realization high frequency and conventional printed board 401 through the via hole 502 of metal-plated membrane.Self-evident, the position of above-mentioned via hole surface-mount type weldering end and number can be decided according to the concrete function of circuit in high frequency printed board 402 and the conventional printed board 401.
Below specify the processing method of the printed board assembly of the foregoing description one.Fig. 6 a has schematically shown the flow chart according to the processing method embodiment that is applied to the printed board assembly 400 in high frequency, the high-power circuit of the embodiment of the invention one.Shown in Fig. 6 a; The processing method that is applied to the printed board assembly in high frequency, the high-power circuit according to the embodiment of the invention one comprises the steps: step S601: in high frequency printed board and conventional printed board, window respectively; Wherein, The high frequency printed board is being windowed corresponding to the position of placing power device, and conventional printed board is being windowed corresponding to substrate embedded location part; Step S602: substrate is embedded in the windowing of conventional printed board, forms the integral body that is together with each other; Step S603: the high frequency printed board is welded in the conventional printed board that is embedded with substrate, make the part of high frequency printed board be fixed in the conventional printed board, and another part of high frequency printed board is fixed on the substrate through surface-mount type weldering end; And step S604: power device is passed windowing of high frequency printed board contact, and the power device pin of power device is welded in the high frequency printed board with substrate.
In step S601; High frequency printed board 402 is windowed in the position of placing power device 405 corresponding to needs; The power device ring flange size of window size and power device 405 in the high frequency printed board 402 adapts; For example, the power device ring flange size that the size of windowing in the high frequency printed board 402 should specific power device 405 is big a little, so that power device 405 can pass windowing in the high frequency printed board 402.Conventional printed board 401 is being windowed corresponding to substrate 407 embedded location parts; Windowing and to closely cooperate with the substrate that will embed 407 in the conventional printed board 401; For example; The size of windowing in the conventional printed board 401 can be slightly less than the size of the substrate 407 that will embed, so that substrate 407 can be interlocked with the sidewall of conventional printed board 401.
In step S602, the substrate 407 of prefabricated metal piece form is embedded in the windowing in the conventional printed board 401, thereby forms the integral body that is together with each other.Mode and the conventional printed board 401 of substrate 407 through the sidewall interlock that is embedded in the windowing of conventional printed board 401 is combined together to form an integral body, perhaps can be through the heat-conductivity conducting glue bond in conventional printed board 401 to be combined together to form an integral body with conventional printed board 401.
In step S603, the part of high frequency printed board 402 is fixed in the conventional printed board 401 through surface-mount type weldering end 408, and another part of high frequency printed board 402 is fixed on the substrate 407.As previously mentioned, through the via hole surface-mount type weldering end that is arranged in the high frequency printed board 402 the high frequency printed board is welded in conventional printed board 401.Via hole surface-mount type weldering end is convenient to the Surface Mount welding, utilizes this weldering end, can be efficiently, reliably high frequency printed board 402 is welded in the conventional printed board 401.Can in high frequency printed board 402, form via hole surface-mount type weldering end through following method: form end face pad 501 on high frequency printed board 402 upper surfaces, on high frequency printed board 402 lower surfaces, form bottom surface pad 503, run through end face pad 501 and bottom surface pad 503 bore in high frequency printed board 402 via hole 502 and on the inner peripheral surface of via hole 502 the metal plated film.Utilize via hole surface-mount type weldering end;, can also realize end face pads 501 and being electrically connected also of bottom surface pad 502 and then being electrically connected of printed board 402 of realization high frequency and conventional printed board 401 through the via hole 502 of metal-plated membrane except can thereby high frequency printed board 402 being welded in the fixing of conventional printed board 401 realization high frequency printed boards 402.
In step S604, power device 405 passes windowing of high frequency printed board 402 and contacts with substrate 407, and power device pin 406 is welded in the high frequency printed board 402, realize power device 405 being electrically connected and fixing.
Preferably or additionally; As schematically showing according to shown in Fig. 6 b of the flow chart of the processing method variant embodiment that is applied to the printed board assembly 400 in high frequency, the high-power circuit of the embodiment of the invention one; In order to realize power device 405 being electrically connected between fixing and power device 405 and the high frequency printed board 402 in the high frequency printed board 402 best; Before step S602; What can also be included in substrate 407 is provided with the step of groove, i.e. step S602 ' corresponding to the position of windowing of high frequency printed board 402: groove is set on substrate.The size of the power device ring flange of groove length and width and power device 405 adapts, and is advisable less times greater than the power device ring flange of power device 405, can be placed in this groove through high frequency printed board 402 to guarantee power device 405.Simultaneously, depth of groove is wanted the thickness of the power device ring flange of consideration of power device 405, guarantees depth of groove and the high frequency printed board 402 thickness sums thickness less times greater than the power device ring flange of power device 405.
Embodiment two
Fig. 7 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to according to the embodiment of the invention two.As shown in Figure 7, the embodiment of the invention two be applied to the printed board assembly 400 ' comprising in high frequency, the high-power circuit: conventional printed board 401, high frequency printed board 402, substrate 407 and power device 405.Substrate 407 is embedded in the windowing of conventional printed board 401.The part of high frequency printed board 402 is through surface-mount type weldering end 408 ' be fixed in the conventional printed board 401, and another part of high frequency printed board 402 is fixed on the substrate 407.Power device 405 contacts with substrate 407 through windowing of high frequency printed board 402, and the power device pin 406 of power device 405 is welded in high frequency printed board 402 through scolder 404.
Embodiment two shown in Figure 7 and embodiment one shown in Figure 4 are except the structure of surface-mount type weldering end is different; Others are all identical with embodiment illustrated in fig. 4 one; Therefore only describe to surface-mount type weldering end and relevant structure below, other identical contents then repeat no more.
As shown in Figure 7, the part of high frequency printed board 402 is through surface-mount type weldering end 408 ' be fixed in the conventional printed board 401.In the embodiment of the invention two, above-mentioned surface-mount type weldering end 408 ' be side surface-mount type weldering end, this side surface-mount type weldering end is positioned at high frequency printed board 402 outer side edges edges, rather than as in the embodiment of the invention one, is positioned at high frequency printed board 402.Fig. 8 has schematically shown the structure of the side surface-mount type weldering end in the printed board assembly as shown in Figure 7.As shown in Figure 8; Side surface-mount type weldering end comprises: be formed on high frequency printed board 402 upper surface edges upper surface edge pad 801, be formed on the lower surface edge pad 803 at high frequency printed board 402 lower surface edges and run through upper surface edge pad 801 and lower surface edge pad 803 and be formed on the groove 802 on high frequency printed board outer side edges edge, metal-plated membrane on the inner peripheral surface of groove 802 wherein.Above-mentioned side surface-mount type weldering is held except being used for thereby high frequency printed board 402 is welded in the fixing of conventional printed board 401 realization high frequency printed boards 402, can also realize being electrically connected also of upper surface edge pads 801 and lower surface edge pad 803 and then being electrically connected of printed board 402 of realization high frequency and conventional printed board 401 through the groove 802 of metal-plated membrane.The method that forms groove 802 is for example: the system of boring processes the groove that connects upper surface edge pad 801 and lower surface edge pad 803 in edge, high frequency printed board 402 outside; The structure of groove 802 can be diversified, and its cross section can be chosen as semicircle, square or triangle or other shape according to processing technology.
The processing method of the printed board assembly of the foregoing description two only is with the difference of the processing method of the printed board assembly that combines the described embodiment one of Fig. 6 a and 6b: in the processing method of the printed board assembly of embodiment one, through the via hole surface-mount types weldering end that is arranged in the high frequency printed board 402 high frequency printed board 402 is welded in conventional printed board 401; And in the processing method of the printed board assembly of embodiment two, high frequency printed board 402 is welded in conventional printed board 401 through the side surface-mount type weldering end that is arranged on high frequency printed board 402 outer side edges edges.For this reason; In the processing method of the printed board assembly of embodiment two; Replace and high frequency printed board 402 in, to form via hole surface-mount type weldering end in the processing method of printed board assembly of embodiment one, but form upper surface edge pad 801 at high frequency printed board 402 upper surface edges, form lower surface edge pad 803 at high frequency printed board 402 lower surface edges, run through upper surface edge pad 801 and lower surface edge pad 803 and high frequency printed board outer side edges along formation groove 802 and on the inner peripheral surface of groove 802 the metal plated film.Because the processing method of the printed board assembly of the foregoing description two is similar to the processing method of the printed board assembly of embodiment one except above difference, so duplicate contents will repeat no more.
Embodiment three
Fig. 9 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to according to the embodiment of the invention three.As shown in Figure 9, being applied to the printed board assembly 400 in high frequency, the high-power circuit and " comprising: conventional printed board 401, high frequency printed board 402, substrate 407 and power device 405 of the embodiment of the invention three.Substrate 407 is embedded in the windowing of conventional printed board 401.The part of high frequency printed board 402 is fixed in the conventional printed board 401 through surface-mount type weldering end 408, and another part of high frequency printed board 402 is fixed on the substrate 407.Power device 405 contacts with substrate 407 through windowing of high frequency printed board 402, and the power device pin 406 of power device 405 is welded in high frequency printed board 402 through scolder 404.
Embodiment three shown in Figure 9 compares with embodiment one shown in Figure 4; Except increase is provided with radiator 403; Therefore others are all identical with embodiment illustrated in fig. 4 one, only describe to radiator 403 and relevant structure below, and other identical contents then repeat no more.
Printed board assembly 400 in the embodiment of the invention three " in; for fixing whole printed board assembly; simultaneously in order to guarantee the heat dispersion of whole printed board assembly, the lower surface of substrate 407 and the lower surface that is embedded with the conventional printed board 401 of substrate 407 contact with radiator 403.The lower surface of conventional printed board 401 is generally large-area ground connection heat radiation copper sheet; These copper sheets be embedded in the conventional printed board 401 the substrate seamless link together; Radiator 403 contacts with the lower surface of these copper sheets and substrate 407, guarantees the ground connection and the heat radiation of whole printed board assembly.Radiator 403 can be realized through the scolder welding with the contacting of lower surface of substrate 407 and conventional printed board 401, also can realize through the conductive and heat-conductive pad is bonding.
The processing method of the printed board assembly of the foregoing description three below is described.Figure 10 a has schematically shown the printed board assembly 400 in high frequency, the high-power circuit that is applied to according to the embodiment of the invention three " the flow chart of processing method embodiment.Shown in Figure 10 a; The processing method that is applied to the printed board assembly in high frequency, the high-power circuit according to the embodiment of the invention three comprises the steps: step S601: in high frequency printed board and conventional printed board, window respectively; Wherein, The high frequency printed board is being windowed corresponding to the position of placing power device, and conventional printed board is being windowed corresponding to substrate embedded location part; Step S602: substrate is embedded in the windowing of conventional printed board, forms the integral body that is together with each other; Step S603: the high frequency printed board is welded in the conventional printed board that is embedded with substrate, make the part of high frequency printed board be fixed in the conventional printed board, and another part of high frequency printed board is fixed on the substrate through surface-mount type weldering end; Step S604: power device is passed windowing of high frequency printed board contact, and the power device pin of power device is welded in the high frequency printed board with substrate.In addition; Be with the processing method difference of the printed board assembly of embodiment one; For fixing whole printed board assembly; Simultaneously, after step S604, also comprise step S605: the lower surface of radiator and substrate and the lower surface that is embedded with the conventional printed board of substrate are linked to each other in order to guarantee the heat dispersion of whole printed board assembly.The lower surface of conventional printed board 401 is generally large-area ground connection heat radiation copper sheet; These copper sheets be embedded in the conventional printed board 401 the substrate seamless link together; Radiator 403 contacts with the lower surface of these copper sheets and substrate 407, guarantees the ground connection and the heat radiation of whole printed board assembly.Radiator 403 can be realized through the scolder welding with the lower surface of substrate 407 and the contacting of lower surface of conventional printed board 401, also can realize through the conductive and heat-conductive pad is bonding.
Preferably or additionally; As at the printed board assembly 400 in high frequency, the high-power circuit that is applied to that schematically shows according to the embodiment of the invention three " Figure 10 b of flow chart of processing method variant embodiment shown in; in order to realize power device 405 being electrically connected between fixing and power device 405 and the high frequency printed board 402 in the high frequency printed board 402 best; before step S602; what can also be included in substrate 407 is provided with the step of groove, i.e. step S602 ' corresponding to the position of windowing of high frequency printed board 402: groove is set on substrate.The size of the power device ring flange of groove length and width and power device 405 adapts, and is advisable less times greater than the power device ring flange of power device 405, can be placed in this groove through high frequency printed board 402 to guarantee power device 405.Simultaneously, depth of groove is wanted the thickness of the power device ring flange of consideration of power device 405, guarantees depth of groove and the high frequency printed board 402 thickness sums thickness less times greater than the power device ring flange of power device 405.
Embodiment four
Figure 11 has schematically shown the printed board assembly in high frequency, the high-power circuit that is applied to according to the embodiment of the invention four.Shown in figure 11, the embodiment of the invention four be applied to the printed board assembly 400 ' " comprising: conventional printed board 401, high frequency printed board 402, substrate 407 and power device 405 in high frequency, the high-power circuit.Substrate 407 is embedded in the windowing of conventional printed board 401.The part of high frequency printed board 402 is through surface-mount type weldering end 408 ' be fixed in the conventional printed board 401, and another part of high frequency printed board 402 is fixed on the substrate 407.Power device 405 contacts with substrate 407 through windowing of high frequency printed board 402, and the power device pin 406 of power device 405 is welded in high frequency printed board 402 through scolder 404.
Embodiment four shown in Figure 11 and embodiment three shown in Figure 9 are except the structure of surface-mount type weldering end is different, and others are all identical with embodiment illustrated in fig. 9 three, so identical content then repeats no more.The printed board assembly 400 of the embodiment of the invention four ' " in, the part of high frequency printed board 402 is through surface-mount type weldering end 408 ' be fixed in the conventional printed board 401.Above-mentioned surface-mount type weldering end 408 ' be side surface-mount type weldering end, this side surface-mount type weldering end is positioned at high frequency printed board 402 outer side edges edges, rather than as in the embodiment of the invention three, is positioned at high frequency printed board 402.The structure of relevant side surface-mount type weldering end sees also the side surface-mount type weldering end in the embodiment of the invention two that above combination Fig. 8 describes, and no longer repeats here to detail.
The processing method of the printed board assembly of the foregoing description four only is with the difference of the processing method of the printed board assembly that combines the described embodiment three of Figure 10 a and 10b: in the processing method of the printed board assembly of embodiment three, through the via hole surface-mount types weldering end that is arranged in the high frequency printed board 402 high frequency printed board 402 is welded in conventional printed board 401; And in the processing method of the printed board assembly of embodiment four, high frequency printed board 402 is welded in conventional printed board 401 through the side surface-mount type weldering end that is arranged on high frequency printed board 402 outer side edges edges.For this reason; In the processing method of the printed board assembly of embodiment four; Replace and high frequency printed board 402 in, to form via hole surface-mount type weldering end in the processing method of printed board assembly of embodiment three, but form upper surface edge pad 801 at high frequency printed board 402 upper surface edges, form lower surface edge pad 803 at high frequency printed board 402 lower surface edges, run through upper surface edge pad 801 and lower surface edge pad 803 and high frequency printed board outer side edges along formation groove 802 and on the inner peripheral surface of groove 802 the metal plated film.Because the processing method of the printed board assembly of the foregoing description four is similar to the processing method of the printed board assembly of embodiment three except above difference, so its detailed content will repeat no more.
In sum; According to printed board assembly and the processing method thereof that the embodiment of the invention provided; Substrate embeds in the conventional printed board, the very difficult integral body separately that the two formation is together with each other, and the high frequency printed board is welded on above the conventional printed board that is embedded with substrate; Therefore the frock design is simple than the prior art scheme, and whole weight of material alleviates greatly.In addition, owing to power device contacts with substrate through windowing of high frequency printed board, thereby the contact area between the power device ring flange of substrate and power device increases, and has promoted heat-sinking capability, thereby can be suitable for the application scenarios of more power grades.And in the present invention, high frequency printed board lower surface welds together with substrate around the power device, so the return flow path of power device is equal to two-layer printed board, makes that return flow path is the shortest.
Embodiment described above only is exemplary.Those skilled in the art can carry out various modifications and modification to the above embodiments under situation about not departing from the scope of the present invention with purport.Should be understood that protection scope of the present invention should be limited claim.
Claims (13)
1. a printed board assembly is characterized in that, comprises conventional printed board, high frequency printed board, substrate and power device, wherein:
Said substrate is embedded in the windowing of said conventional printed board;
The part of said high frequency printed board is fixed in the said conventional printed board through surface-mount type weldering end, and another part of said high frequency printed board is fixed on the said substrate;
Said power device contacts with said substrate through windowing of said high frequency printed board;
The power device pin of said power device is welded in said high frequency printed board.
2. printed board assembly as claimed in claim 1; It is characterized in that; Said substrate combines to form an integral body through the mode of sidewall interlock with said conventional printed board, perhaps said substrate forms an integral body in said conventional printed board with combination through the heat-conductivity conducting glue bond.
3. printed board assembly as claimed in claim 1 is characterized in that said printed board assembly also comprises radiator, and said radiator contacts with the lower surface of said conventional printed board and the lower surface of said substrate.
4. printed board assembly as claimed in claim 3; It is characterized in that; Said radiator is welded in the lower surface of said conventional printed board and the lower surface of said substrate through scolder, and perhaps said radiator is adhered to the lower surface of said conventional printed board and the lower surface of said substrate through the conductive and heat-conductive pad.
5. printed board assembly as claimed in claim 1; It is characterized in that; Said surface-mount type weldering end is a via hole surface-mount type weldering end; Said via hole surface-mount type weldering end comprises: be formed on end face pad on the said high frequency printed board upper surface, be formed on the bottom surface pad on the said high frequency printed board lower surface and run through said end face pad and bottom surface pad and be formed on the via hole in the said high frequency printed board, wherein metal-plated membrane on the inner peripheral surface of said via hole.
6. printed board assembly as claimed in claim 1; It is characterized in that; Said surface-mount type weldering end is a side surface-mount type weldering end; Said side surface-mount type weldering end comprises: be formed on said high frequency printed board upper surface edge upper surface edge pad, be formed on the lower surface edge pad at said high frequency printed board lower surface edge and run through said upper surface edge pad and lower surface edge pad and be formed on the groove on said high frequency printed board outer side edges edge, metal-plated membrane on the inner peripheral surface of said groove wherein.
7. printed board assembly as claimed in claim 1 is characterized in that, said substrate is the prefabricated metal piece.
8. like each described printed board assembly in the claim 1 to 7, it is characterized in that said substrate is provided with groove, said power device is windowed fixed in position in said groove through said high frequency printed board.
9. a printed board assembly processing method is characterized in that, comprising:
In high frequency printed board and conventional printed board, window respectively, wherein, said high frequency printed board is being windowed corresponding to the position of placing power device, and said conventional printed board is being windowed corresponding to substrate embedded location part;
Substrate is embedded in the windowing of said conventional printed board, forms the integral body that is together with each other;
Said high frequency printed board is welded in the said conventional printed board that is embedded with said substrate; Make the part of said high frequency printed board be fixed in the said conventional printed board, and another part of said high frequency printed board is fixed on the said substrate through surface-mount type weldering end;
Power device is passed windowing of said high frequency printed board contact, and the power device pin of said power device is welded in said high frequency printed board with said substrate.
10. printed board assembly processing method as claimed in claim 9; It is characterized in that; Said surface-mount type weldering end is a via hole surface-mount type weldering end, and said method also comprises: forming the end face pad on the high frequency printed board upper surface, forming the bottom surface pad on the high frequency printed board lower surface, running through the end face pad and the bottom surface pad forms metal plated film on via hole and the inner peripheral surface at via hole in the high frequency printed board.
11. printed board assembly processing method as claimed in claim 9; It is characterized in that; Said surface-mount type weldering end is a side surface-mount type weldering end, and said method also comprises: form upper surface edge pad at high frequency printed board upper surface edge, form lower surface edge pad at high frequency printed board lower surface edge, run through upper surface edge pad and lower surface edge pad in high frequency printed board outer side edges along forming metal plated film on groove and the inner peripheral surface at groove.
12. printed board assembly processing method as claimed in claim 9; It is characterized in that; Said substrate is embedded into the step of conventional printed board in windowing before; What also be included in substrate is provided with the step of groove corresponding to the position of windowing of high frequency printed board, and wherein said power device is windowed fixed in position in said groove through said high frequency printed board.
13. like each described printed board assembly processing method in the claim 9 to 12; Also comprise the step that the lower surface with the lower surface of radiator and conventional printed board and substrate links to each other; Wherein radiator is welded in the lower surface of conventional printed board and the lower surface of substrate through scolder, and perhaps radiator is adhered to the lower surface of conventional printed board and the lower surface of substrate through the conductive and heat-conductive pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102996117A CN102510663A (en) | 2011-09-29 | 2011-09-29 | Printed board component and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102996117A CN102510663A (en) | 2011-09-29 | 2011-09-29 | Printed board component and processing method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610136164.6A Division CN105682345A (en) | 2011-09-29 | 2011-09-29 | Printed board assembly and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102510663A true CN102510663A (en) | 2012-06-20 |
Family
ID=46222706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102996117A Pending CN102510663A (en) | 2011-09-29 | 2011-09-29 | Printed board component and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102510663A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298257A (en) * | 2013-05-09 | 2013-09-11 | 华为机器有限公司 | Slot structure for component and PCB (printed circuit board) |
| WO2016127897A1 (en) * | 2015-02-15 | 2016-08-18 | 华为技术有限公司 | Power tube connecting structure of power amplifier and power amplifier |
| WO2016184047A1 (en) * | 2015-05-18 | 2016-11-24 | 中兴通讯股份有限公司 | Device assembling method and circuit board |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN110753447A (en) * | 2018-07-24 | 2020-02-04 | 鹏鼎控股(深圳)股份有限公司 | Embedded circuit board and manufacturing method thereof |
| WO2022252453A1 (en) * | 2021-06-03 | 2022-12-08 | 深南电路股份有限公司 | Buried component circuit board, manufacturing method therefor, and electronic apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920461A (en) * | 1997-05-12 | 1999-07-06 | Lambda Electronics, Inc. | Surface mount power supply device |
| US20010038310A1 (en) * | 1999-12-15 | 2001-11-08 | Lars-Anders Olofsson | Power transistor module, power amplifier and methods in the fabrication thereof |
| CN101415297A (en) * | 2007-10-19 | 2009-04-22 | 华为技术有限公司 | Printed plate component and method of processing the same |
| CN101460018A (en) * | 2007-12-14 | 2009-06-17 | 华为技术有限公司 | Printed circuit board, manufacturing method and radio-frequency apparatus thereof |
| CN101795545A (en) * | 2010-02-25 | 2010-08-04 | 华为技术有限公司 | Device for assembling large plate and power amplifier and base station |
-
2011
- 2011-09-29 CN CN2011102996117A patent/CN102510663A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5920461A (en) * | 1997-05-12 | 1999-07-06 | Lambda Electronics, Inc. | Surface mount power supply device |
| US20010038310A1 (en) * | 1999-12-15 | 2001-11-08 | Lars-Anders Olofsson | Power transistor module, power amplifier and methods in the fabrication thereof |
| CN101415297A (en) * | 2007-10-19 | 2009-04-22 | 华为技术有限公司 | Printed plate component and method of processing the same |
| CN101460018A (en) * | 2007-12-14 | 2009-06-17 | 华为技术有限公司 | Printed circuit board, manufacturing method and radio-frequency apparatus thereof |
| CN101795545A (en) * | 2010-02-25 | 2010-08-04 | 华为技术有限公司 | Device for assembling large plate and power amplifier and base station |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298257A (en) * | 2013-05-09 | 2013-09-11 | 华为机器有限公司 | Slot structure for component and PCB (printed circuit board) |
| CN103298257B (en) * | 2013-05-09 | 2016-12-28 | 华为机器有限公司 | A kind of components and parts notching construction and PCB |
| WO2016127897A1 (en) * | 2015-02-15 | 2016-08-18 | 华为技术有限公司 | Power tube connecting structure of power amplifier and power amplifier |
| JP2018506860A (en) * | 2015-02-15 | 2018-03-08 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | Power pipe connection structure for power amplifier and power amplifier |
| US10165687B2 (en) | 2015-02-15 | 2018-12-25 | Huawei Technologies Co., Ltd. | Power tube connection structure of power amplifier and power amplifier |
| US10426036B2 (en) | 2015-02-15 | 2019-09-24 | Huawei Technologies Co., Ltd. | Power tube connection structure of power amplifier and power amplifier |
| WO2016184047A1 (en) * | 2015-05-18 | 2016-11-24 | 中兴通讯股份有限公司 | Device assembling method and circuit board |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN110753447A (en) * | 2018-07-24 | 2020-02-04 | 鹏鼎控股(深圳)股份有限公司 | Embedded circuit board and manufacturing method thereof |
| CN110753447B (en) * | 2018-07-24 | 2021-05-28 | 鹏鼎控股(深圳)股份有限公司 | Embedded circuit board and manufacturing method thereof |
| WO2022252453A1 (en) * | 2021-06-03 | 2022-12-08 | 深南电路股份有限公司 | Buried component circuit board, manufacturing method therefor, and electronic apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102510663A (en) | Printed board component and processing method thereof | |
| CN101730385B (en) | Circuit board structure | |
| EP2986088B1 (en) | Printed circuit board, manufacturing method thereof and radio-frequency device | |
| CN107394366A (en) | A kind of extensive mimo antenna structure and manufacturing process | |
| WO2009052761A1 (en) | A pcb device and a method of manufacture thereof | |
| CN103517557A (en) | Method for processing groove on printed circuit board, printed circuit board and electronic device | |
| CN101052273B (en) | PCB plate connection structure and connection method | |
| CN207052750U (en) | A kind of extensive mimo antenna structure | |
| WO2013144862A1 (en) | Electronic package for millimeter wave semiconductor dies | |
| CA2574208A1 (en) | Improved multi-layer integrated rf/if circuit board | |
| CA2574211A1 (en) | Improved multi-layer integrated rf/if circuit board | |
| CN114256575B (en) | Multichannel miniaturized microwave component and metal matrix composite substrate structure thereof | |
| CN106604542A (en) | Circuit board assembly, circuit board and terminal | |
| CN105682345A (en) | Printed board assembly and processing method thereof | |
| CN101937900A (en) | Micro and millimeter wave circuit | |
| TWI578862B (en) | Circuit module with lateral surface-mound pads and the corresponding system of the circuit module | |
| CN112004309A (en) | Mobile terminal, soft and hard combined board and manufacturing method thereof | |
| CN105789142A (en) | Organic substrate high-density integrated three-dimensional microwave circuit structure | |
| JP7351552B2 (en) | Board, board manufacturing method, and board connection method | |
| US20200136233A1 (en) | Antenna carrier plate structure | |
| US9172126B2 (en) | Module and coupling arrangement | |
| CN112753289B (en) | Circuit board and manufacturing method thereof, and manufacturing method of circuit board assembly | |
| CN104093263A (en) | Bridging module for flexible substrates and substrate assembly | |
| CN209766822U (en) | Connection structure of integrated circuit board and integrated circuit board | |
| CN109905962A (en) | A kind of flexible circuitry board manufacturing method having plug-in element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120620 |