CN210629970U - High-density circuit board for set top box - Google Patents
High-density circuit board for set top box Download PDFInfo
- Publication number
- CN210629970U CN210629970U CN201921676670.XU CN201921676670U CN210629970U CN 210629970 U CN210629970 U CN 210629970U CN 201921676670 U CN201921676670 U CN 201921676670U CN 210629970 U CN210629970 U CN 210629970U
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- Prior art keywords
- layer
- circuit board
- insulating substrate
- heat dissipation
- glue
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- Expired - Fee Related
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Abstract
The utility model provides a high-density circuit board for a set top box, which comprises an insulating substrate, wherein both sides of the insulating substrate are provided with a surface layer circuit board, the insulating substrate comprises a heat dissipation ceramic plate, both ends of the heat dissipation ceramic plate are provided with a limiting lug, the two limiting lugs are respectively positioned at both ends of the surface layer circuit board in the x direction, a reinforcing glue layer is connected between the limiting lug and the end surface of the surface layer circuit board, and both ends of the heat dissipation ceramic plate in the y direction are provided with an insulating glue block; the surface circuit board comprises a bonding layer, one side, away from the insulating substrate, of the bonding layer is sequentially provided with a conductive circuit layer and a solder mask layer, a welding notch is formed in one solder mask layer, and a conductive column is connected between the two conductive circuit layers. The utility model discloses can satisfy the high density design demand of complicated circuit, the border position of circuit board is provided with spacing lug and consolidates the glue film structure, can effectively avoid the marginal separation perk of each layer structure of circuit board, and in addition, the heat dispersion of circuit board is good.
Description
Technical Field
The utility model relates to a STB circuit board specifically discloses a high density circuit board for STB.
Background
A circuit board, also called a printed circuit board, is an important electronic component, which is a support for an electronic component and a carrier for electrical connection of the electronic component. In various electronic products, such as computers, televisions, set-top boxes, etc., circuit boards are currently used as substrates for fixing components and connecting circuits.
When the circuit board is applied, various corresponding electronic components are welded on the circuit board, along with the continuous progress of the society, the requirements on various electronic products are higher and higher, and the circuit board for the set top box also needs to be connected with a large number of electronic components so as to realize the multifunctional and high-quality working effect. In the prior art, a circuit board for a set top box needs to be provided with a complex circuit structure, and is often designed into a structure of a multilayer circuit board, so that a large heat dissipation problem can be formed in the working process of the multilayer circuit board, the edge position of the circuit board is easy to tilt, and each layer structure at the edge position of the circuit board is easy to separate.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a high-density circuit board for a set-top box, which can meet the high-density design requirement of a complex circuit and has a stable and reliable structure, in order to solve the problems in the prior art.
In order to solve the prior art problem, the utility model discloses a high-density circuit board for a set-top box, which comprises an insulating substrate, wherein the surfaces of the insulating substrate at two sides in the z direction are respectively provided with a surface layer circuit board, the insulating substrate comprises a radiating ceramic plate, two ends in the x direction of the radiating ceramic plate are respectively provided with a limiting lug, the two limiting lugs are respectively positioned at two ends in the x direction of the surface layer circuit board, a reinforcing glue layer is connected between the limiting lug and the end surface of the surface layer circuit board, and two ends in the y direction of the radiating ceramic plate are respectively provided with an;
the surface circuit board comprises a bonding layer, one side, away from the insulating substrate, of the bonding layer is sequentially provided with a conducting circuit layer and a solder mask layer, a welding notch is formed in one solder mask layer, a conducting post is connected between the two conducting circuit layers, and the conducting post penetrates through the insulating rubber block and the bonding layer.
Furthermore, one side of the limiting lug, which is close to the surface layer circuit board, is an inclined plane.
Furthermore, the insulating rubber block is a heat dissipation silica gel block.
Furthermore, a conductive silver adhesive layer is arranged in the welding gap and is positioned on one side, far away from the bonding layer, of the conductive circuit layer.
Furthermore, the inner wall of the welding gap is covered with a graphite layer.
The utility model has the advantages that: the utility model discloses a high density circuit board for STB, be provided with the structure on double-deck conductive circuit layer, can satisfy the high density design demand of complicated circuit, and complicated circuit structure and electronic components's welding sets up respectively on the conductive circuit layer of difference, can conveniently carry out the design of high density, avoid the circuit of high density to influence electronic components's the design of arranging, the border position of circuit board is provided with spacing lug and reinforcement glue film structure, can effectively avoid the marginal alternate segregation perk of each layer structure of circuit board, can ensure that the holistic stable in structure of circuit board is reliable, furthermore, the heat dispersion of circuit board is good.
Drawings
Fig. 1 is a schematic top view of the present invention.
3 fig. 3 2 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 along 3 a 3- 3 a 3' 3 in 3 fig. 3 1 3. 3
Fig. 3 is a schematic cross-sectional view along B-B' in fig. 1.
The reference signs are: the circuit board comprises an insulating substrate 10, a heat dissipation ceramic plate 11, a limiting bump 111, a reinforcing adhesive layer 112, an insulating adhesive block 12, a surface circuit board 20, a bonding layer 21, a conductive circuit layer 22, a solder mask layer 23, a welding gap 24, a conductive silver adhesive layer 25, a graphite layer 26 and a conductive column 30.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1 to 3.
The embodiment of the utility model discloses a high-density circuit board for a set-top box, which comprises an insulating substrate 10, wherein the surfaces of the two sides of the insulating substrate 10 in the z direction are respectively provided with a surface layer circuit board 20, the insulating substrate 10 comprises a heat dissipation ceramic plate 11 with the thickness of D, the heat dissipation ceramic has good insulating property and heat dissipation performance and has a stable structure, the hardness is large enough to provide a stable foundation for the attachment of the surface layer circuit board 20, both ends in the x direction of the heat dissipation ceramic plate 11 are respectively provided with a limiting lug 111 with the thickness of P, preferably, the limiting lug 111 is a ceramic limiting block, the limiting lug 111 and the heat dissipation ceramic plate 11 are in an integrated structure, P is greater than D, the thickness of the high-density circuit board is P, the two limiting lugs 111 are respectively positioned at both ends in the x direction of the surface layer circuit board 20, and provide a, the edge end face of the circuit board can be effectively prevented from being cracked and tilted, the reinforcing glue layer 112 is connected between the limiting lug 111 and the end face of the surface layer circuit board 20, the reinforcing glue layer 112 is an insulating glue layer, the structure of the edge position of the surface layer circuit board 20 can be further stabilized through the reinforcing glue layer 112, the stability of the edge structure of the surface layer circuit board 20 can be effectively improved, the edge of the circuit board can be further prevented from being tilted, and the two ends of the radiating ceramic plate 11 in the y direction are respectively provided with the insulating glue block 12 with the thickness of D;
surface circuit board 20 includes adhesion layer 21, preferably, adhesion layer 21 is the prepreg layer, adhesion layer 21 keeps away from one side of insulating substrate 10 and is equipped with conducting wire layer 22 and solder mask layer 23 in proper order, be equipped with a plurality of welding breach 24 in one of them solder mask layer 23, each SMD electronic components's pin inserts and welds in the welding breach 24, can effectively improve the location effect to SMD electronic component, be connected with between two conducting wire layers 22 and lead electrical pillar 30, it runs through insulating rubber piece 12 and adhesion layer 21 setting to lead electrical pillar 30, can avoid leading electrical pillar 30 to receive 11 blockings of radiating ceramic plate and influence the bilayer design that switches on.
The utility model discloses a high density circuit board for STB, set up two top layer circuit board 20, and only set up welding breach 24 in the anti-welding layer 23 of one side, all electronic components concentrate and set up in one side of whole circuit board, electronic components realizes the welding with the conducting wire layer 22 that is close to, the conducting wire layer 22 of opposite side switches on through leading electrical pillar 30, can avoid complicated circuit structure to set up in the conducting wire layer 22 that is close to electronic components one side, be convenient for carry out the high density design, the spacing lug 111 of edge has good protection and adhesion, can effectively avoid the edge fracture perk of circuit board, overall structure's heat dispersion is good, can avoid the heat to gather in the circuit board.
In this embodiment, a side of the limiting protrusion 111 close to the surface layer circuit board 20 is an inclined surface, and preferably, the inclined surface is a structure that is widened from one side of the heat dissipating ceramic plate 11 to an edge, that is, the limiting protrusion 111 is a structure that is narrow in the middle and wide in both sides, so that a contact area between the limiting protrusion 111 and the edge of the surface layer circuit board 20 can be increased, and thus a protection effect on the edge position of the surface layer circuit board 20 can be effectively increased.
In the embodiment, the insulating rubber block 12 is a heat dissipation silicone block, and the heat dissipation silicone has good insulating property and heat dissipation performance, so that the heat dissipation performance of the insulating substrate 10 can be further improved.
In this embodiment, a conductive silver glue layer 25 is disposed in the welding gap 24, the conductive silver glue layer 25 is located on one side of the conductive circuit layer 22 away from the adhesive layer 21, and the conductive silver glue has good conductive performance, so that the conduction effect between the electronic component and the conductive circuit layer 22 can be further improved.
In this embodiment, the inner wall of the soldering gap 24 is covered with a graphite layer 26, which has good conductivity and chemical resistance and can protect the solder layer structure formed during soldering.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The high-density circuit board for the set top box is characterized by comprising an insulating substrate (10), wherein surface layer circuit boards (20) are arranged on the surfaces of the insulating substrate (10) on two sides in the z direction, the insulating substrate (10) comprises a heat dissipation ceramic board (11), two limiting convex blocks (111) are arranged at two ends of the heat dissipation ceramic board (11) in the x direction, the two limiting convex blocks (111) are respectively arranged at two ends of the surface layer circuit boards (20) in the x direction, a reinforcing glue layer (112) is connected between the limiting convex blocks (111) and the end surface of the surface layer circuit boards (20), and two insulating glue blocks (12) are arranged at two ends of the heat dissipation ceramic board (11) in the y direction;
top layer circuit board (20) are including gluing layer (21), it keeps away from to glue layer (21) one side of insulating substrate (10) is equipped with conducting wire layer (22) and prevents solder layer (23) in proper order, one of them be equipped with welding gap (24) in preventing solder layer (23), two be connected with between conducting wire layer (22) and lead electrical pillar (30), it runs through to lead electrical pillar (30) insulating rubber piece (12) with it sets up to glue layer (21).
2. The high-density circuit board for the set-top box according to claim 1, wherein a side of the limiting bump (111) close to the surface circuit board (20) is a slope.
3. The high-density circuit board for the set-top box according to claim 1, wherein the insulating glue block (12) is a heat-dissipating silicone block.
4. A high-density circuit board for set-top box according to claim 1, characterized in that a conductive silver glue layer (25) is arranged in the soldering gap (24), and the conductive silver glue layer (25) is located on the side of the conductive circuit layer (22) far from the adhesive layer (21).
5. A high-density wiring board for set-top boxes according to claim 1 or 4, characterized in that the inner wall of the soldering indentation (24) is covered with a graphite layer (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921676670.XU CN210629970U (en) | 2019-09-30 | 2019-09-30 | High-density circuit board for set top box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921676670.XU CN210629970U (en) | 2019-09-30 | 2019-09-30 | High-density circuit board for set top box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210629970U true CN210629970U (en) | 2020-05-26 |
Family
ID=70750348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921676670.XU Expired - Fee Related CN210629970U (en) | 2019-09-30 | 2019-09-30 | High-density circuit board for set top box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210629970U (en) |
-
2019
- 2019-09-30 CN CN201921676670.XU patent/CN210629970U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200526 Termination date: 20210930 |