CN216600195U - Multilayer circuit board with thermoelectric separation base plate - Google Patents
Multilayer circuit board with thermoelectric separation base plate Download PDFInfo
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- CN216600195U CN216600195U CN202122766529.2U CN202122766529U CN216600195U CN 216600195 U CN216600195 U CN 216600195U CN 202122766529 U CN202122766529 U CN 202122766529U CN 216600195 U CN216600195 U CN 216600195U
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- layer
- thermoelectric separation
- led lamp
- circuit board
- multilayer circuit
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Abstract
The utility model discloses a multilayer circuit board with a thermoelectric separation substrate, which comprises the thermoelectric separation substrate, wherein the thermoelectric separation substrate comprises a copper foil circuit layer, an insulating layer and a metal substrate layer which are parallelly attached from top to bottom, a first groove is formed in the insulating layer, an LED lamp bead is arranged in the first groove, a lower end heat dissipation part of the LED lamp bead is in contact with the upper surface of the metal substrate layer, a second groove for avoiding the LED lamp bead is formed in the copper foil circuit layer, a plurality of conductive connecting pieces are arranged at the upper end of the copper foil circuit layer, and the other end of each conductive connecting piece is connected with the LED lamp bead.
Description
Technical Field
The present invention relates to a circuit board, and more particularly, to a multilayer circuit board with a thermoelectric separation substrate.
Background
The traditional heat dissipation conduction mode of the metal substrate usually needs to dissipate heat through the dielectric layer, and the heat dissipation effect is greatly influenced by the dielectric layer, so that certain limitation is realized.
Disclosure of Invention
To overcome the deficiencies of the prior art, the present invention provides a multi-layer circuit board with a thermoelectric separation substrate.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
the utility model provides a multilayer circuit board with thermoelectric separation base plate, including the thermoelectric separation base plate, the thermoelectric separation base plate includes from last copper foil circuit layer, insulating layer and the metal substrate layer to parallel laminating setting down, first fluting has been seted up on the insulating layer, be provided with LED lamp pearl in the first fluting, the lower extreme radiating part of LED lamp pearl with the last surface contact on metal substrate layer, offer on the copper foil circuit layer and be used for dodging the second fluting of LED lamp pearl, copper foil circuit layer upper end is provided with a plurality of electrically conductive connecting pieces, electrically conductive connecting piece's the other end with LED lamp pearl is connected.
The slot width of the second slot is greater than the slot width of the first slot.
The conductive connecting piece is a solder connecting piece or a conductive adhesive connecting piece.
The metal substrate layer is provided with a thermal interface material layer for assisting heat dissipation below, a radiator is arranged below the thermal interface material layer, and a plurality of heat dissipation grooves are formed in the lower end of the radiator.
The metal substrate layer is a copper substrate layer.
The utility model has the beneficial effects that: the utility model adopts a thermoelectric separation structure, the lower end heat dissipation part of the LED lamp bead is in direct contact with the metal substrate layer to realize zero thermal resistance, the light attenuation of the lamp bead is effectively reduced, the service life of the lamp bead is prolonged, and a better heat dissipation and conduction (zero thermal resistance) effect is achieved.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" or "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1, a multilayer circuit board with thermoelectric separation base plate, including thermoelectric separation base plate 1, thermoelectric separation base plate 1 includes from last copper foil circuit layer 2, insulating layer 3 and the metal substrate layer 4 to parallel laminating setting down, first fluting 5 has been seted up on insulating layer 3, be provided with LED lamp pearl 6 in the first fluting 5, LED lamp pearl 6's lower extreme radiating part 7 with the last surface contact on metal substrate layer 4, offer on the copper foil circuit layer 2 and be used for dodging LED lamp pearl 6's second fluting 8, 2 upper ends on copper foil circuit layer are provided with a plurality of electrically conductive connecting piece 9, electrically conductive connecting piece 9's the other end with LED lamp pearl 6 is connected.
The embodiment adopts a thermoelectric separation structure, the lower end heat dissipation part 7 of the LED lamp bead 6 is in direct contact with the metal substrate layer 4 to realize zero thermal resistance, the light attenuation of the lamp bead is effectively reduced, the service life of the lamp bead is prolonged, and a better heat dissipation and conduction (zero thermal resistance) effect is achieved.
The width of the second slot 8 is larger than that of the first slot 5, the first slot 5 can accommodate and limit the LED lamp bead 6, so that the LED lamp bead is not in direct contact with the copper foil circuit layer 2, and the zero thermal resistance effect is realized.
The conductive connecting piece 9 is a solder connecting piece or a conductive adhesive connecting piece.
The metal substrate layer 2 is a copper substrate layer, and has high density, strong heat bearing capacity of the substrate and good heat conduction and heat dissipation.
The above embodiments do not limit the scope of the present invention, and those skilled in the art can make equivalent modifications and variations without departing from the overall concept of the present invention.
Claims (5)
1. The utility model provides a multilayer circuit board with thermoelectric separation base plate, its characterized in that is including thermoelectric separation base plate (1), thermoelectric separation base plate (1) includes from last copper foil circuit layer (2), insulating layer (3) and metal substrate layer (4) to parallel laminating setting down, first fluting (5) have been seted up on insulating layer (3), be provided with LED lamp pearl (6) in first fluting (5), the lower extreme radiating part (7) of LED lamp pearl (6) with the last surface contact of metal substrate layer (4), offer on copper foil circuit layer (2) and be used for dodging the second fluting (8) of LED lamp pearl (6), copper foil circuit layer (2) upper end is provided with a plurality of electrically conductive connecting piece (9), the other end of electrically conductive connecting piece (9) with LED lamp pearl (6) are connected.
2. The multilayer circuit board with a thermoelectric separation substrate according to claim 1, characterized in that the second slot (8) has a slot width larger than that of the first slot (5).
3. The multilayer circuit board with the thermoelectric separation substrate according to claim 1, wherein the conductive connection member (9) is a solder connection member or a conductive adhesive connection member.
4. The multilayer circuit board with thermoelectric separation substrates according to claim 1, wherein a thermal interface material layer (10) for assisting heat dissipation is disposed below the metal substrate layer (4), a heat sink (11) is disposed below the thermal interface material layer (10), and a plurality of heat dissipation grooves (12) are formed at the lower end of the heat sink (11).
5. Multilayer circuit board with thermoelectric separation substrate according to claim 1, characterized in that the metal substrate layer (4) is a copper substrate layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122766529.2U CN216600195U (en) | 2021-11-11 | 2021-11-11 | Multilayer circuit board with thermoelectric separation base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122766529.2U CN216600195U (en) | 2021-11-11 | 2021-11-11 | Multilayer circuit board with thermoelectric separation base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600195U true CN216600195U (en) | 2022-05-24 |
Family
ID=81644180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122766529.2U Active CN216600195U (en) | 2021-11-11 | 2021-11-11 | Multilayer circuit board with thermoelectric separation base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216600195U (en) |
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2021
- 2021-11-11 CN CN202122766529.2U patent/CN216600195U/en active Active
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