CN201064069Y - Heat radiating structure for circuit board - Google Patents
Heat radiating structure for circuit board Download PDFInfo
- Publication number
- CN201064069Y CN201064069Y CNU2007200550543U CN200720055054U CN201064069Y CN 201064069 Y CN201064069 Y CN 201064069Y CN U2007200550543 U CNU2007200550543 U CN U2007200550543U CN 200720055054 U CN200720055054 U CN 200720055054U CN 201064069 Y CN201064069 Y CN 201064069Y
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- Prior art keywords
- copper foil
- foil layer
- heat
- terminal pad
- wiring board
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Abstract
The utility model discloses a heat dissipation structure for circuit board, comprising a heat dissipation aluminum plate and an insulating layer and a copper foil layer which are orderly coated on the heat dissipation aluminum plate, wherein the copper foil layer is divided into two or more than two copper foil areas by insulating tapes, the copper foil areas are provided with anode bonding pads and cathode bonding pads which are in soldering joint with anode pins and cathode pins of luminous bodies; the area of the copper foil areas is larger than the total area of anode bonding pads and cathode bonding pads; the anode bonding pad and cathode bonding pad which are soldered on two pins of the same luminous body are arranged on adjacent copper foil areas respectively. The copper foil layer in the circuit board structure can be used as an electric conduction part for connecting external wires and luminous body; also because the area of the copper foil layer is maximally designed, the utility model has a good heat dissipation function and heat conduction effect of conducting the heat energy to the heat dissipation aluminum plate, thereby the heat generated by luminous bodies can not only be directly conducted to the copper foil layer for heat dissipation through bottom parts of the luminous bodies, but also be conducted to the copper foil layer for heat dissipation through anodes and cathodes of luminous bodies.
Description
Technical field
The utility model relates to a kind of circuit board structure, specifically a kind of wiring board cooling mechanism that self has great heat radiation effect.
Background technology
Fixing luminous element sandwich construction as the wiring board of LED lamp etc., comprise heat-dissipating aluminium plate and be affixed on insulating barrier, copper foil layer and welding resisting layer on the heat-dissipating aluminium plate, be provided with fixedly positive terminal pad, the negative terminal pad of luminous element positive and negative electrode in PCB surface, positive terminal pad, negative terminal pad directly connect with outer lead, and are the less pad of area.Clearly, the wiring board of this version is for the non-constant of luminous element radiating effect.In order to improve radiating effect, scheme has preferably appearred in the industry much.
Be a kind of known luminous element and heat-dissipating aluminium plate syndeton schematic diagram as shown in Figure 1, this structure mainly comprises heat-dissipating aluminium plate 01, insulating barrier 02 is arranged on the heat-dissipating aluminium plate 01 successively, copper foil layer 03, welding resisting layer 04, light-guiding shade 05 and luminous element 06, in aluminium sheet 01 center fixed one encapsulate 08 is arranged, encapsulate 08 fits tightly with aluminium sheet 01 and is beneficial to heat conduction, one radiating seat 07 is installed in the middle of encapsulate 08, radiating seat 07 is used for directly fixedly luminous element 06, and with the heat of luminous element 06 through radiating seat 07, encapsulate 08 conducts on the aluminium sheet 01, also is provided with the fixedly coil holder 09 of encapsulate 08 in the both sides of encapsulate 08.The LED lamp of this form is not directly to contact with aluminium sheet 01, and radiating effect is still not good.
At the problems referred to above point, the patent No. be 200520000466.8 and be called " LED radiator structure " with high cooling efficiency patent disclosure a kind of improvement project, the radiator structure that this scheme disclosed is made up of copper metal layer, insulating barrier and copper foil layer from the bottom up successively, the cut-out material is formed with groove in the middle of copper foil layer, insulating barrier, groove is used to install the LED lamp, and LED lamp underrun one a tin layer and a copper metal layer are fixed.The radiator structure of this scheme is compared with the heat radiation result who adopts heat-conducting glue as heat-conducting medium, and radiating efficiency is higher, is a scheme preferably, but this scheme is owing to need to adopt soldering tin technique, and there is negative effect in scolding tin to environment.
The utility model content
The technical problems to be solved in the utility model provides a kind of wiring board radiator structure of simple in structure, good heat dissipation effect.
For solving the problems of the technologies described above, the utility model by the following technical solutions:
A kind of wiring board radiator structure, comprise heat-dissipating aluminium plate and be affixed on insulating barrier, copper foil layer on the heat-dissipating aluminium plate successively, described copper foil layer is divided into two or more Copper Foil districts by insulating tape, the Copper Foil district is provided with positive terminal pad, the negative terminal pad that is used to weld luminous element positive and negative electrode pin, Copper Foil district area is greater than positive terminal pad, negative terminal pad area sum, and positive terminal pad, the negative terminal pad of fixing positive and negative the two poles of the earth of same luminous element pin lay respectively in the adjacent Copper Foil district.Copper foil layer in this circuit board structure is not only as the conductive component that connects outer lead and luminous element, because with its area design is maximum, make it possess good heat sinking function and with the heat-conducting effect of heat transferred to heat-dissipating aluminium plate, the heat that luminous element produced can be directly conducted on the copper foil layer by the luminous element bottom and scatter and disappear, and also can conduct on the copper foil layer by the luminous element positive and negative electrode and scatter and disappear.
As improvement to such scheme, for the benefit of heat is conducted to direct contact the on the copper foil layer between described luminous element bottom and the copper foil layer, or a holder is set on copper foil layer, the luminous element bottom directly is affixed on the holder.
As further improvement, have in the circuit panel edges and to intert the circular hole of hold-down screw, the direct bonding structure of heat conduction for the benefit of between screw nut and the copper foil layer such scheme.Directly with after copper foil layer contacts, screw is fixed on the exterior object screw nut, and the part heat on the copper foil layer can also be passed on the exterior object lost by screw, makes whole wiring board radiating effect better.
Simultaneously, for the benefit of make lead become the direct connection of heat radiation conducting-heat elements between the positive pole of connection external power source, the cathode conductor Copper Foil district.Clearly, because lead is the good conductor of heat, the part heat on the copper foil layer can scatter and disappear by lead, also can conduct on the exterior object by lead and scatter and disappear, and has further strengthened the radiating effect of whole wiring board.
The utility model is simple in structure, the copper foil layer area that connects outer lead and luminous element electrode is increased, make it from single conductive component, become be conductive component be again the parts of main heat conduction and heat radiation, the heat that luminous element sends can be directly conducted on the copper foil layer by the luminous element bottom, also better heat-radiation effect can be conducted on the copper foil layer by the luminous element positive and negative electrode.Simultaneously, also make full use of the lead that connects with the positive and negative electrode pad and the screw of fixing circuit board and dispelled the heat, realized comprehensive heat radiation.
Description of drawings
Accompanying drawing 1 is existing a kind of circuit board structure schematic diagram; Accompanying drawing 2 is the utility model embodiment one planar structure schematic diagram; Accompanying drawing 3 is accompanying drawing 2 cross section structure schematic diagrames; Accompanying drawing 4 is the utility model embodiment two planar structure schematic diagrames; Accompanying drawing 5 is the utility model embodiment three planar structure schematic diagrames.
Embodiment
For the ease of those skilled in the art's understanding, the utility model structural principle is described in further detail below in conjunction with specific embodiment and accompanying drawing:
Embodiment one: shown in accompanying drawing 2～3, the wiring board that present embodiment disclosed comprises heat-dissipating aluminium plate 1, is positioned at the insulating barrier 2 and the copper foil layer 3 on heat-dissipating aluminium plate 1 surface.
Copper foil layer 3 is divided into the Copper Foil district 37 of a plurality of mutually insulateds by insulating tape 36, and each Copper Foil district 37 is provided with positive terminal pad 31, negative terminal pad 32 and the fixing holder 33 of luminous element.The Copper Foil in Copper Foil district 37 is the sheet material of area greater than positive terminal pad 31, negative terminal pad 32 area sums, so that each Copper Foil district 37 areas are maximum as far as possible, it is more conducive to heat transferred to heat-dissipating aluminium plate 1, also can make himself to have good performance of heat dissipation.
The positive and negative the two poles of the earth of same luminous element pin is welded on respectively on the positive and negative electrode pad in adjacent two Copper Foil districts 37, when a plurality of luminous element, both can be coupled in series between each luminous element, also can be in parallel or grouping side by side, be the mixing connection form of series connection in each family.The connecting mode that this programme discloses be two groups side by side, luminous element connects form for the mixing of series connection in each group.
In order further to make full use of each parts, improve radiating effect, have in the circuit board and intert the circular hole 34 of screw 4, the nut of screw 4 can directly contact with copper foil layer 3, part heat on the copper foil layer 3 can be conducted on the exterior object by screw lose.Certainly, cause the both positive and negative polarity short circuit, be installed on the screw and 37 insulation of Copper Foil district in positive terminal or negative pole end Copper Foil district 37 in order to prevent that screw 4 from connecting with exterior object.Simultaneously, the lead 35 that connects external power source directly is connected on the copper foil layer 3, and the part heat on the copper foil layer can scatter and disappear by lead, also can conduct on the exterior object by lead and scatter and disappear, and has further strengthened the radiating effect of whole wiring board.
Embodiment two: as shown in Figure 4, present embodiment and embodiment one difference are that Copper Foil district 37 layouts have difference slightly in the wiring board, and other are all consistent with embodiment one, no longer relate at this.
More than two embodiment generally be used for fixing the bigger SMD electronic original part of caloric value, so set up holder 33.Following examples are the wiring board planar structure schematic diagram of fixing general plug-in type electronic original part.
Embodiment three is the wiring board planar structure schematic diagram of fixing general plug-in type electronic original part, and as shown in Figure 5, this embodiment is mainly used in fixing pluge formula electronic original part.Because the plug-in type electronic original part generally is welded on the wiring board by pin, electronic component itself has a determining deviation with wiring board, main by self-radiating or by the heat radiation of pin connection wiring board, so do not need holder 33, its copper foil layer row portion's form and positive and negative electrode pad row portion form all can be consistent with above-mentioned two kinds of embodiment, also no longer relate at this.
By above description as can be known, this programme provides a kind of omnibearing wiring board radiator structure, has made full use of each parts, and radiating effect is desirable more.
The preferred version that the foregoing description is only realized for the utility model, and indefiniteness is exhaustive, under the prerequisite that does not break away from the present utility model design, any conspicuous replacement is all within the utility model protection range.
Claims (5)
1. wiring board radiator structure, comprise heat-dissipating aluminium plate (1) and be affixed on insulating barrier (2), copper foil layer (3) on the heat-dissipating aluminium plate successively, it is characterized in that: described copper foil layer is divided into two or more Copper Foil districts (37) by insulating tape (36), the Copper Foil district is provided with positive terminal pad (31), the negative terminal pad (32) that is used to weld luminous element positive and negative electrode pin, and Copper Foil district area is greater than positive terminal pad, negative terminal pad area sum.
2. wiring board radiator structure according to claim 1 is characterized in that: positive terminal pad, the negative terminal pad of fixing positive and negative the two poles of the earth of same luminous element pin lay respectively in the adjacent Copper Foil district.
3. wiring board radiator structure according to claim 2, it is characterized in that: for the benefit of heat is conducted to direct contact the on the copper foil layer between described luminous element bottom and the copper foil layer, or a holder (33) is set on copper foil layer, the luminous element bottom directly is affixed on the holder.
4. wiring board radiator structure according to claim 3 is characterized in that: have the circular hole (34) of interspersed hold-down screw (4), the direct bonding structure of heat conduction for the benefit of between screw nut and the copper foil layer in the circuit panel edges.
5. wiring board radiator structure according to claim 4 is characterized in that: for the benefit of make lead (35) become the direct connection of heat radiation conducting-heat elements between the positive pole of connection external power source, the cathode conductor Copper Foil district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200550543U CN201064069Y (en) | 2007-08-01 | 2007-08-01 | Heat radiating structure for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200550543U CN201064069Y (en) | 2007-08-01 | 2007-08-01 | Heat radiating structure for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201064069Y true CN201064069Y (en) | 2008-05-21 |
Family
ID=39452458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200550543U Expired - Fee Related CN201064069Y (en) | 2007-08-01 | 2007-08-01 | Heat radiating structure for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201064069Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784158B (en) * | 2010-02-08 | 2011-08-10 | 圆刚科技股份有限公司 | Circuit board with heat dissipation structures and method for manufacturing same |
| CN103298246A (en) * | 2013-06-17 | 2013-09-11 | 广东恒润光电有限公司 | Light-emitting diode (LED) high-voltage circuit printed circuit board (PCB) and LED high-voltage circuit connection method |
| CN103557499A (en) * | 2013-10-21 | 2014-02-05 | 苏州华之杰电讯有限公司 | Light-emitting diode (LED) lamp cap |
| CN108432354A (en) * | 2016-02-16 | 2018-08-21 | 微软技术许可有限责任公司 | Laser diode chip on printed circuit board |
| CN114126366A (en) * | 2017-06-02 | 2022-03-01 | 中兴通讯股份有限公司 | Heat radiation structure |
-
2007
- 2007-08-01 CN CNU2007200550543U patent/CN201064069Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784158B (en) * | 2010-02-08 | 2011-08-10 | 圆刚科技股份有限公司 | Circuit board with heat dissipation structures and method for manufacturing same |
| CN103298246A (en) * | 2013-06-17 | 2013-09-11 | 广东恒润光电有限公司 | Light-emitting diode (LED) high-voltage circuit printed circuit board (PCB) and LED high-voltage circuit connection method |
| CN103298246B (en) * | 2013-06-17 | 2016-12-28 | 广东恒润光电有限公司 | LED high pressure resistant circuit pcb board and the high voltage bearing circuit connecting method of LED |
| CN103557499A (en) * | 2013-10-21 | 2014-02-05 | 苏州华之杰电讯有限公司 | Light-emitting diode (LED) lamp cap |
| CN108432354A (en) * | 2016-02-16 | 2018-08-21 | 微软技术许可有限责任公司 | Laser diode chip on printed circuit board |
| CN114126366A (en) * | 2017-06-02 | 2022-03-01 | 中兴通讯股份有限公司 | Heat radiation structure |
| CN114126366B (en) * | 2017-06-02 | 2023-03-14 | 中兴通讯股份有限公司 | Heat radiation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080521 Termination date: 20090901 |