CN216531910U

CN216531910U - Super-thick PCB

Info

Publication number: CN216531910U
Application number: CN202122856069.2U
Authority: CN
Inventors: 阙勋; 欧健强
Original assignee: Zhaoqing Changlong Electronics Co ltd
Current assignee: Zhaoqing Changlong Electronics Co ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-05-13
Anticipated expiration: 2031-11-19

Abstract

The utility model discloses an ultra-thick PCB which comprises a PCB body with double rows of through holes at two ends, and a fixing frame which is arranged at two ends of the PCB body and is used for supporting the PCB body, wherein the PCB body comprises a PCB substrate, a copper layer which covers the upper surface of the PCB substrate, and a heat dissipation layer which covers the lower surface of the PCB substrate, the lower surface of the heat dissipation layer is provided with a heat dissipation groove, and a heat dissipation fin which inclines to one side is arranged in the heat dissipation groove; according to the utility model, the heat dissipation groove is formed in the lower surface of the heat dissipation layer, and the heat dissipation fins are arranged in the heat dissipation groove, so that the heat dissipation effect can be improved, enough heat dissipation gaps are ensured, and the heat dissipation requirements required by the work of the circuit board are ensured.

Description

Super-thick PCB

Technical Field

The utility model particularly relates to an ultra-thick PCB.

Background

With the rapid development of electronic and power communication technologies, some high-current and high-power supply products are more and more widely applied, the number of integrated functional elements on a circuit board is more and more, the requirements on the current conduction capability and the bearing capability of the circuit are higher and higher, and correspondingly, the copper thickness of the circuit board is thicker and thicker, so that the thick copper circuit board gradually becomes a circuit board with a wide market prospect; the thick copper circuit board has the following problems in use: the thick copper circuit board is stronger to the electric current conducting capacity and the bearing capacity of circuit, often can give off a lot of heat in department during the operation, consequently just needs the circuit board to possess good heat dispersion, and the circuit board on the existing market is mostly direct mount, and heat radiating area is less, can not satisfy the heat dissipation demand of circuit board.

Disclosure of Invention

In view of this, the present invention provides an ultra-thick PCB board with good heat dissipation effect and capable of meeting the work heat dissipation requirement of a circuit board.

In order to solve the technical problem, the technical scheme of the utility model is as follows:

the utility model provides an ultra-thick PCB board, includes that the PCB plate body of double through-hole is seted up at both ends sets up the mount that PCB plate body both ends, be used for supporting the PCB plate body, the PCB plate body includes the PCB base plate, covers the copper layer of PCB base plate upper surface covers the heat dissipation layer of PCB base plate lower surface, the lower surface on heat dissipation layer is provided with the heat dissipation recess, and the inside of heat dissipation recess is provided with the radiating fin to one side slope.

Preferably, the inclination angle of the heat dissipation fins is 60 °.

Preferably, the heat dissipation layer is a ceramic heat dissipation layer.

Preferably, the fixing frame comprises an upper fixing piece and a lower fixing piece.

Preferably, the upper fixing member includes a fixing member body, an inner groove 212 formed on an edge side of one surface of the fixing member body, and a stud integrally formed on the other surface of the fixing member body and located on a thicker portion of the fixing member body.

Preferably, the inner groove is provided with a screw hole.

Preferably, the structure of the lower fixing member is identical to that of the upper fixing member.

The technical effects of the utility model are mainly reflected in the following aspects: according to the utility model, the heat dissipation groove is formed in the lower surface of the heat dissipation layer, and the heat dissipation fins are arranged in the heat dissipation groove, so that the heat dissipation effect can be improved, enough heat dissipation gaps can be ensured, and the heat dissipation requirements required by the work of the circuit board can be ensured.

Drawings

FIG. 1 is a structural diagram of an ultra-thick PCB of the present invention;

fig. 2 is a structural view of the upper fixture in fig. 1.

Detailed Description

The following detailed description of the embodiments of the present invention is provided in order to make the technical solution of the present invention easier to understand and understand.

In the present embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a bolt fixing manner, a pin connecting manner, or the like, which is commonly used in the prior art, and therefore, details thereof are not described in the present embodiment.

Examples

The utility model provides an ultra-thick PCB board, as shown in figure 1, set up PCB plate body 1 including the double through-hole of both ends, set up the mount 2 that is used for supporting PCB plate body 1 at 1 both ends of PCB plate body, PCB plate body 1 includes PCB base plate 11, covers the copper layer 12 of 11 upper surfaces of PCB base plate covers the heat dissipation layer 13 of 11 lower surfaces of PCB base plate, its characterized in that: the lower surface of the heat dissipation layer 13 is provided with a heat dissipation groove 131, and a heat dissipation fin 132 inclined to one side is provided inside the heat dissipation groove 131. The inclination angle of the heat dissipation fins 132 is 60 °, and the contact area between the heat dissipation fins 132 and the air is increased in an inclined manner, so that the heat dissipation speed of the PCB substrate 11 is increased. The fixing frame 2 comprises an upper fixing piece 21 and a lower fixing piece 22, specifically, the upper fixing piece 21 and the lower fixing piece 22 are installed on the PCB body 1 and are fixed by nuts after being correspondingly clamped, and the whole PCB body 1 can be fixed.

As shown in fig. 2, the upper fixing member 21 includes a fixing member body 211, an inner groove 212 formed on one side of one surface of the fixing member body 211, and a stud 213 integrally formed on the other surface of the fixing member body 211 and located on a thicker portion of the fixing member body 211. The inner groove 212 is provided with a screw hole 2121.

In this embodiment, the heat dissipation layer 13 is a ceramic heat dissipation layer, and can bear the high temperature generated by the PCB substrate 11, and is also beneficial to rapid heat conduction and dissipation.

Referring to fig. 1-2, in the present embodiment, the structure of the lower fixture 22 is identical to that of the upper fixture 21. When the PCB 1 is fixed, the lower fixing member 22 and the upper fixing member 21 both pass through the PCB 1 and are screwed and fixed by nuts, that is, the stud in the upper fixing member 21 extends to the screw hole in the lower fixing member 22, and the stud in the lower fixing member 22 extends to the screw hole in the upper fixing member 21, and then the stud is screwed by the nuts, so as to fix the PCB 1.

The above are only typical examples of the present invention, and besides, the present invention may have other embodiments, and all the technical solutions formed by equivalent substitutions or equivalent changes are within the scope of the present invention as claimed.

Claims

1. The utility model provides an ultra-thick PCB board, includes that the PCB plate body of double through-hole is seted up at both ends, sets up the mount that is used for supporting the PCB plate body at PCB plate body both ends, the PCB plate body includes the PCB base plate, covers the copper layer of PCB base plate upper surface covers the heat dissipation layer of PCB base plate lower surface, its characterized in that: the lower surface of the heat dissipation layer is provided with a heat dissipation groove, and a heat dissipation fin inclined towards one side is arranged in the heat dissipation groove.

2. An ultra-thick PCB board as claimed in claim 1, wherein: the inclination angle of the radiating fins is 60 degrees.

3. An ultra-thick PCB board as claimed in claim 1, wherein: the heat dissipation layer is a ceramic heat dissipation layer.

4. An ultra-thick PCB board as claimed in claim 1, wherein: the fixing frame comprises an upper fixing piece and a lower fixing piece.

5. An ultra-thick PCB board as claimed in claim 4, wherein: the upper fixing piece comprises a fixing piece body, an inner groove 212 formed in the side of one surface of the fixing piece body and a stud integrally formed on the other surface of the fixing piece body and located on the thicker part of the fixing piece body.

6. An ultra-thick PCB board as claimed in claim 5, wherein: and the inner groove is provided with a screw hole.

7. An ultra-thick PCB board as claimed in claim 4, wherein: the structure of the lower fixing piece is consistent with that of the upper fixing piece.