CN211210224U

CN211210224U - Totally enclosed metal casing at output back heat dissipation

Info

Publication number: CN211210224U
Application number: CN201921729108.9U
Authority: CN
Inventors: 刘欣; 石豪天; 赵勇; 陈志�
Original assignee: Shenzhen Zhenhua Microelectronics Co Ltd
Current assignee: Shenzhen Zhenhua Microelectronics Co Ltd
Priority date: 2019-10-15
Filing date: 2019-10-15
Publication date: 2020-08-07
Anticipated expiration: 2029-10-15

Abstract

The utility model provides a at radiating totally enclosed metal casing of output back, at radiating totally enclosed metal casing of output back includes the casing, the apron base member, the PCB module, cross the cab apron, the glass insulator, the becket, the lead pin, shell surface top is equipped with the butt joint hole, the butt joint hole is used for installing the radiator additional, PCB module fixed mounting is in the casing, be equipped with first mounting groove on the apron base member, cross and be equipped with the mounting hole on the cab apron, be equipped with the second mounting groove on the casing, thereby apron base member fixed mounting is complete seal shell on the second mounting groove, cross cab apron fixed mounting in first mounting groove, glass insulator parcel is in becket periphery and fixed mounting in the mounting hole, lead pin one end runs through the PCB module and is connected with PCB template electricity, the other end of lead pin runs through the becket and extends to outside the apron base member, becket and lead pin fixed connection.

Description

Totally enclosed metal casing at output back heat dissipation

Technical Field

The utility model relates to a hybrid integrated circuit totally enclosed steel shell designs technical field, especially relates to a at radiating totally enclosed metal casing in output back.

Background

With the development of science and technology and electronic information industry, the requirements for the structural design of integrated circuit modules are higher and higher, and the requirements for higher performance, more convenient and efficient use and lower cost are also required. At present, the direct-insert type full-sealed integrated circuit module shell mostly adopts an insulating lead component mode with sealing performance by brazing cold-rolled steel cavity glass sintered leads or other materials, most high-power high-density modules generate heat more greatly, so that the cavity module mostly adopts an encapsulation mode to lead module heat to a cavity as soon as possible and radiate the heat through a radiator, because of the installation characteristic of vertical pins of a normal module and the heat dissipation principle that a heating device is close to a cavity distribution plate, the heat dissipation surface is always concentrated on a cavity pin surface, and based on the principle that the radiator can conduct and radiate the heat as soon as possible on the main heat dissipation surface of a product, the product is suitable for the conditions that the pin surface is added with the radiator but occupies the bottom surface area when the product is installed, and under the condition, the packaging structure which is full-sealed, high-power and.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a satisfy integrated circuit module's output reverse side heat dissipation demand, accomplish the totally enclosed metal casing of totally enclosed, low weight, high reliability.

The utility model discloses a following technical scheme realizes:

the utility model provides a totally enclosed metal casing of heat dissipation at the output back, the totally enclosed metal casing of heat dissipation at the output back includes casing, apron base member, PCB module, transition board, glass insulator, becket, guide pin, be equipped with the butt joint hole above the casing surface, the butt joint hole is used for installing the radiator additional, PCB module fixed mounting is in the casing, be equipped with the first mounting groove on the apron base member, be equipped with the mounting hole on the transition board, be equipped with the second mounting groove on the casing, the apron base member fixed mounting is in on the second mounting groove thereby totally enclosed the casing, the transition board fixed mounting is in the first mounting groove, the glass insulator wraps up in the becket periphery and fixed mounting is in the mounting hole, guide pin one end run through the PCB module and with PCB template electricity is connected, the other end of the guide pin penetrates through the metal ring and extends out of the cover plate base body, and the metal ring is fixedly connected with the guide pin.

Further, still be equipped with four fixed mounting on the casing be in fixing base on the four corners in the casing, be equipped with first screw on the fixing base, be equipped with the second screw on the PCB template, still include the screw at the radiating totally enclosed metal casing in output back, the screw runs through in proper order the second screw first screw, thereby make the PCB module with casing fixed connection.

Furthermore, two bearing columns fixedly connected with the shell are arranged in the shell, and when the PCB module is fixedly connected with the shell, the bearing columns are in contact with and bear the PCB module.

Furthermore, the PCB module is provided with connecting holes corresponding to the guide pins one to one, and the guide pins penetrate through the connecting holes and are fixedly connected with the PCB module.

Further, the surfaces of the shell, the transition plate and the metal ring are plated with gold.

The utility model has the advantages that:

the utility model provides a shell of the totally enclosed metal shell which radiates heat at the back of the output end, which is made of silicon-aluminum material with low density and high heat conductivity, can realize high heat conductivity, meet the requirement of a high-power circuit, and realize weight reduction while improving performance and power density; the independent PCB module is provided with the packaging structure, so that the PCB module is convenient to test and screen, convenient to assemble and beneficial to glue pouring and packaging; the back of the shell can be additionally provided with a radiator to realize back heat dissipation and reduce the occupied plane area of the integrated circuit module part in the system; the whole sealing package has good reliability.

Drawings

Fig. 1 is an exploded view of the hermetically sealed metal housing of the present invention with heat dissipation at the back of the output end;

fig. 2 is a schematic structural view of the housing of the present invention;

fig. 3 is a perspective view of the fully sealed metal case of the present invention radiating heat from the back of the output end.

Detailed Description

In order to more clearly and completely explain the technical scheme of the present invention, the present invention is further explained with reference to the attached drawings.

Referring to fig. 1-3, the present invention provides a hermetically sealed metal casing for dissipating heat from the back of an output end, the hermetically sealed metal casing for dissipating heat from the back of an output end includes a casing 10, a cover plate base 17, a PCB module 24, a transition plate 19, a glass insulator 21, a metal ring 22, and a pin 23, a butt-joint hole 16 is disposed above the surface of the casing 10, the butt-joint hole 16 is used for installing a heat sink, the PCB module 24 is fixedly mounted in the casing 10, a first mounting groove 18 is disposed on the cover plate base 17, a mounting hole 20 is disposed on the transition plate 19, a second mounting groove 14 is disposed on the casing 10, the cover plate base 17 is fixedly mounted on the second mounting groove 14 to completely seal the casing 10, the transition plate 19 is fixedly mounted in the first mounting groove 18, the glass insulator 21 is wrapped around the metal ring 22 and is fixedly mounted in the mounting hole 20, one end of the lead pin 23 penetrates through the PCB module 24 and is electrically connected with the PCB template, the other end of the lead pin 23 penetrates through the metal ring 22 and extends to the outside of the cover plate base body 17, and the metal ring 22 is fixedly connected with the lead pin 23.

In the present embodiment, the housing 10 and the cover plate base 17 are both made of low-density high-thermal conductivity silicon-aluminum materials, the housing 10 is processed by numerical control milling, and the surface is plated with gold; the transition plate 19 is made of brazing cold-rolled steel with small density, good heat conduction and expansion coefficient matching, and is processed in a numerical control milling mode, and the surface of the transition plate is also subjected to gold plating treatment. The metal inner ring is made of a cold-rolled steel No. 10 material and is processed in a numerical control milling mode, and the surface of the metal inner ring is plated with gold. Two of the mating holes 16 are formed in the back of the housing 10 so that a heat sink can be attached to the back of the housing 10. The connecting gap between the shell 10 and the cover plate base body 17 is sealed by laser, and the connecting gap between the metal ring 22 and the guide pin 23 is sealed by tin seal welding.

Further, still be equipped with four fixed mounting on the casing 10 fixing base 11 on the four corners in the casing 10, be equipped with first screw 12 on the fixing base 11, be equipped with second screw 25 on the PCB template, at radiating totally enclosed metal casing in output back still includes screw 13, screw 13 runs through in proper order second screw 25 first screw 12, thereby make PCB module 24 with casing 10 fixed connection.

In the present embodiment, the PCB module 24 is fixedly connected to the housing 10 by the screws 13. All there is one fixed mounting respectively on four angles in the casing 10 fixing base 11, fixing base 11 can enough make PCB module 24 with casing 10 fixed connection also can make PCB module 24 with the casing 10 back forms certain interval space, makes like this at the radiating totally enclosed metal casing radiating effect in output back better.

Furthermore, two receiving columns 15 fixedly connected with the housing 10 are arranged in the housing 10, and when the PCB module 24 is fixedly connected with the housing 10, the receiving columns 15 contact and receive the PCB module 24. The PCB module 24 is provided with connecting holes 26 corresponding to the pins 23 one to one, and the pins 23 penetrate through the connecting holes 26 and are fixedly connected with the PCB module 24.

In the present embodiment, the receiving posts 15 are disposed on the center line in the housing 10, there are two receiving posts 15, and the receiving posts 15 can also make the housing 10 and the PCB module 24 form a certain spatial position.

Of course, the present invention can also have other various embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative work, and all of them belong to the protection scope of the present invention.

Claims

1. The fully-sealed metal shell capable of dissipating heat at the back of the output end is characterized by comprising a shell, a cover plate base body, a PCB module, a transition plate, a glass insulator, a metal ring and a guide pin, wherein a butt joint hole is formed above the surface of the shell and used for additionally installing a radiator, the PCB module is fixedly installed in the shell, a first installation groove is formed in the cover plate base body, an installation hole is formed in the transition plate, a second installation groove is formed in the shell, the cover plate base body is fixedly installed on the second installation groove so as to completely seal the shell, the transition plate is fixedly installed in the first installation groove, the glass insulator is wrapped in the periphery of the metal ring and is fixedly installed in the installation hole, one end of the guide pin penetrates through the PCB module and is electrically connected with the PCB template, the other end of the guide pin penetrates through the metal ring and extends out of the cover plate base body, and the metal ring is fixedly connected with the guide pin.

2. The hermetically sealed metal case with the back side heat dissipation function at the output end of claim 1, wherein the case further comprises four fixing bases fixedly mounted at four corners inside the case, the fixing bases are provided with first screw holes, the PCB template is provided with second screw holes, the hermetically sealed metal case with the back side heat dissipation function at the output end further comprises screws, and the screws sequentially penetrate through the second screw holes and the first screw holes, so that the PCB module is fixedly connected with the case.

3. The hermetically sealed metal casing for dissipating heat from the back side of an output terminal of claim 1, wherein two receiving posts are disposed in the housing and are fixedly connected to the housing, and when the PCB module is fixedly connected to the housing, the receiving posts contact and receive the PCB module.

4. The hermetically sealed metal case of claim 1, wherein the PCB module has connection holes corresponding to the pins one to one, and the pins penetrate the connection holes and are fixedly connected to the PCB module.

5. The hermetically sealed metal can with heat dissipating on the back side of the output end of claim 1 wherein the housing, the transition plate, and the metal ring are surface plated with gold.