CN212811639U - Embedded high-power microwave functional module - Google Patents
Embedded high-power microwave functional module Download PDFInfo
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- CN212811639U CN212811639U CN202021258409.0U CN202021258409U CN212811639U CN 212811639 U CN212811639 U CN 212811639U CN 202021258409 U CN202021258409 U CN 202021258409U CN 212811639 U CN212811639 U CN 212811639U
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Abstract
The utility model discloses an embedded high-power microwave function module, including output matching circuit, input matching circuit, functional circuit interface, microwave interface, test interface, DC power supply interface, mechanical mounting interface, heat sink, microwave power tube, locating pin, liquid cooling input port and liquid cooling delivery outlet. The microwave power tube, the matching and functional circuit thereof and the heat sink at the bottom are separated from the power amplifier, and the power amplifier is provided with an interface supporting conduction heat dissipation and liquid cooling heat dissipation. The plug-and-play high-power component can be independently replaced, has complete functions of temperature compensation, temperature compensation protection, time sequence control and the like, has a flexible heat dissipation mode, can be conveniently produced and debugged while keeping good high-power performance, and can be replaced in time in an external use environment.
Description
Technical Field
The utility model relates to a microwave power amplifier especially relates to an embedded high-power microwave functional module.
Background
Microwave power amplifiers are important components of transmission systems and are also expensive and vulnerable. When the output power of a single power amplifier module exceeds 100W, its reliability, producibility, and maintainability are all drastically reduced.
Existing solutions generally use multiple modules for synthesis in order to avoid the manufacture of large modules, but this results in increased module size and cost. In view of this, a power microwave functional module with reliability, productivity and easy maintenance is a technical problem to be solved in the field, so as to ensure that the performance, structure, process, maintenance, cost and the like of the module meet the requirements of practical application.
SUMMERY OF THE UTILITY MODEL
The utility model provides an embedded high-power microwave function module, with the microwave power tube, match and function circuit (including temperature compensation circuit, temperature protection circuit, sequential control circuit etc.) and the heat sink of bottom is independent from power amplifier comes out to become independent fungible, possess complete temperature compensation, temperature protection, sequential control function, the high-power component who has nimble radiating mode, when keeping good high-power performance, can also produce and debug, can in time change under outside service environment.
In order to realize the purpose, the utility model discloses a technical scheme as follows:
an embedded high-power microwave functional module comprises an output matching circuit, an input matching circuit, a functional circuit interface, a microwave interface, a test interface, a direct-current power supply interface, a mechanical installation interface, a heat sink, a microwave power tube, a positioning pin, a liquid cooling input port and a liquid cooling output port;
the upper surface of the heat sink is provided with a plurality of threaded holes for installing an output matching circuit, an input matching circuit and a microwave power tube connected between the output matching circuit and the input matching circuit; the output matching circuit and the input matching circuit are provided with a functional circuit interface, a microwave interface and a direct current power supply interface; test interfaces are arranged on two sides of the heat sink and used for mounting microwave signal connectors; the mechanical mounting interfaces are positioned at four corners of the hot upper surface and are used for mounting the heat sink into the power amplifier;
the functional circuit interface is connected with the microwave power tube; the liquid cooling input port and the liquid cooling output port are arranged on the lower surface of the heat sink, and the liquid cooling input port and the liquid cooling output port are conducted in the heat sink.
Furthermore, the output matching circuit, the input matching circuit and the microwave power tube are connected with the heat sink in a crimping, bonding or welding mode.
Furthermore, the middle part of the upper surface of the heat sink is recessed inwards to form an inner concave layer for mounting the microwave power tube, and the edge of the inner concave layer is provided with a flow guide groove for accommodating redundant soldering tin when the heat sink is welded with the microwave power tube.
Further, the mechanical mounting interface is a retractable mechanical mounting interface.
Further, the heat sink is made of copper or aluminum, and a gold plating layer or a silver plating layer is arranged on the surface of the heat sink.
Furthermore, the lower surface of the heat sink is also provided with a positioning pin, and the liquid cooling input port and the liquid cooling output port are correctly butted through the positioning pin.
Compared with the prior art, the utility model discloses following beneficial effect has:
(1) the utility model discloses a high-power functional module of embedded microwave, with microwave power tube, match and functional circuit (including temperature compensation, temperature protection, sequential control circuit), the heat sink of bottom independently comes out from power amplifier, possesses the radiating interface of support conduction heat dissipation and liquid cooling. The plug-and-play high-power component can be independently replaced, has complete functions of temperature compensation, temperature compensation protection, time sequence control and the like, has a flexible heat dissipation mode, can be conveniently produced and debugged while keeping good high-power performance, and can be replaced in time in an external use environment.
(2) The utility model discloses a heat sink is provided with the water conservancy diversion slot with the face of weld of power tube, is the soldering tin welding that adopts between heat sink and the microwave power tube to this increases electric and the reliability of hot contact, reduces the thermal resistance of contact surface. The flow guide groove can contain redundant soldering tin, and short circuit between the pin of the microwave power tube and the heat sink caused by overflowing of the soldering tin is avoided.
(3) The utility model discloses a micropower tube, input/output matching circuit take crimping, bonding or welded mode to link to each other with heat sink, and connected mode is simple swift.
(4) The utility model discloses a power supply, microwave, control, liquid cooling interface have been left on heat sink and the matching circuit, and the independent test is realized to this microwave function module of being convenient for, does realize the electrical connection behind the heat sink embedding power amplifier.
(5) The utility model discloses a functional module utilizes the formula mechanical mounting interface that contracts in, can install inside power amplifier with the compact embedding of one or more this power module for power amplifier has good productivity, reliability and the maintenance of being convenient for under the unchangeable condition of performance, has reduced the manufacturing cost of whole piece simultaneously.
Drawings
Fig. 1 is a schematic front structural diagram of an embedded high-power microwave functional module according to an embodiment of the present invention.
Fig. 2 is a schematic back structure diagram of the embedded high-power microwave functional module according to an embodiment of the present invention.
Fig. 3 is a diagram of an actual application of the embedded high-power microwave functional module according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a functional circuit module according to an embodiment of the present invention.
Fig. 5 is a schematic view of a flow guide groove provided in the embodiment of the present invention.
Fig. 6 is a cross-sectional view of a positioning pin provided by an embodiment of the present invention.
In the drawings, the names of the parts corresponding to the reference numerals are as follows:
1-output matching circuit, 2-input matching circuit, 3-functional circuit interface, 4-microwave interface, 5-test interface, 6-direct current power supply interface, 7-mechanical installation interface, 8-heat sink, 9-microwave power tube, 10-flow guide groove, 11-positioning pin, 12-liquid cooling input port and 13-liquid cooling output port.
Detailed Description
The present invention will be further described with reference to the following drawings and examples, and embodiments of the present invention include, but are not limited to, the following examples.
Referring to fig. 1 and 2, an embedded high-power microwave functional module includes a heat sink 8, and a plurality of threaded holes are formed in an upper surface of the heat sink 8 and used for mounting an output matching circuit 1, an input matching circuit 2, and a microwave power tube 9.
Still be provided with function circuit interface 3, microwave interface 4 and DC power supply interface 6 on output matching circuit 1 and the input matching circuit 2, be used for the utility model discloses a microwave function module's independent test to and this module is embedded into the electric and signal connection after the power amplifier. The output matching circuit 1 and the input matching circuit 2 are microwave printed boards or hybrid printed boards carrying various devices and circuits.
The two sides of the heat sink 8 are provided with test interfaces 5 for installing microwave signal interfaces to perform external independent tests. The output matching circuit 1 and the input matching circuit 2 are respectively connected to an output pin and an input pin of the microwave power tube 9, so that the input and output impedance matching of the microwave power tube 9 is realized. The output matching circuit 1 and the input matching circuit 2 can be connected with the heat sink 8 by adopting a screw compression joint, a conductive adhesive bonding or a soldering tin welding mode, and the like, and are specifically selected according to the working frequency and the project of the working microwave power amplifier.
The heat sink 8 is integrally plated with gold or silver, so that an alloy layer can be conveniently formed with soldering tin for welding the microwave power tube 9, the output matching circuit 1 and the input matching circuit 2. The heat sink 8 and the microwave power tube 9 are welded by soldering tin, so that the reliability of electrical and thermal contact is improved, and the thermal resistance of a contact surface is reduced. The middle part of the upper surface of the heat sink is concave for installing the microwave power tube 9, the edge of the concave layer is provided with a flow guide groove 10 for accommodating redundant soldering tin during welding, so that the situation that the soldering tin overflows to cause short circuit between a pin of the microwave power tube 9 and the heat sink 8 is avoided, and the flow guide groove 10 is lower than the installation layer of the microwave power tube 9.
The upper surface of the heat sink 8 is provided with mechanical mounting interfaces 7 for the microwave functional module to be embedded and mounted on the power amplifier, and more preferably, the upper surface of the heat sink 8 is provided with 4 mechanical mounting interfaces 7 respectively located at four corners of the upper surface of the heat sink 8, so as to firmly fix the heat sink 8 on the power amplifier, thereby fixing the microwave functional module on the power amplifier. The mechanical mounting interface 7 is a retraction type mechanical mounting interface, and a fastener for fixing the heat sink 8 and the power amplifier is hidden at the end part of the mechanical mounting interface 7, so that the mechanical mounting interface is hidden in the heat sink 8 and the flatness of the whole functional module is kept.
Referring to fig. 6, the lower surface of the heat sink 8 is further provided with a positioning pin 11, and the liquid cooling input port 12 and the liquid cooling output port 13 are correctly butted by the positioning pin 11. The positioning pins 11 are arranged on two sides of the liquid cooling input port 12 and the liquid cooling output port (not shown in the figure), the height of the positioning pins 11 is smaller than the thickness of the heat sink 8, and the positioning pins 11 are inserted into the positioning holes of the power amplifier when the heat sink 8 is installed in the power amplifier, so that the guiding and stabilizing effects are achieved, the liquid cooling input port and the liquid cooling output port are prevented from being misaligned and suffering from the problem of extra tangential shearing force, and the long-term stable and reliable connection of the liquid cooling is guaranteed.
Use the utility model discloses a during the microwave function module, insert the microwave signal through test installation interface 5 and connect, insert the functional circuit through functional circuit interface 3, power supply interface 6 inserts the direct current power supply source, and the microwave interface inserts microwave signal, accomplishes the independent external test to the microwave function module. After the test is finished, the power functional module is embedded into the power amplifier through the mechanical mounting interface 7 on the heat sink 8, and the bottom surface of the heat sink 8 ensures good flatness and roughness. If the microwave function module is used for heat conduction and dissipation, an extremely thin heat conduction and conduction layer, such as copper foil, heat conduction grease and the like, is filled between the microwave function module and the power amplifier. If the liquid cooling heat dissipation is performed, the liquid cooling input port 12 and the liquid cooling output port 13 are correctly butted through the positioning pin. Because the functional circuit interface 3, the microwave interface 4 and the direct current power supply interface 6 are reserved on the output matching circuit 1 and the input matching circuit 2, the microwave functional module can be electrically connected after being embedded into the power amplifier. After the microwave functional module is installed inside the power amplifier, the microwave functional module and the power amplifier form a whole, the appearance of the microwave functional module is not different from that of the power amplifier with the conventional design, but the microwave functional module has better productivity and maintainability and is convenient to replace. More reliable and at the same time less costly than several low power amplifiers.
The above-mentioned embodiment is only the preferred embodiment of the present invention, and is not a limitation to the protection scope of the present invention, but all the changes made by adopting the design principle of the present invention and performing non-creative work on this basis should belong to the protection scope of the present invention.
Claims (6)
1. An embedded high-power microwave functional module is characterized by comprising an output matching circuit (1), an input matching circuit (2), a functional circuit interface (3), a microwave interface (4), a test interface (5), a direct-current power supply interface (6), a mechanical installation interface (7), a heat sink (8), a microwave power tube (9), a positioning pin (11), a liquid cooling input port (12) and a liquid cooling output port (13);
the upper surface of the heat sink (8) is provided with a plurality of threaded holes for installing the output matching circuit (1), the input matching circuit (2) and a microwave power tube (9) connected between the output matching circuit (1) and the input matching circuit (2); the output matching circuit (1) and the input matching circuit (2) are provided with a functional circuit interface (3), a microwave interface (4) and a direct current power supply interface (6); test interfaces (5) are arranged on two sides of the heat sink (8) and used for mounting microwave signal connectors; the mechanical mounting interfaces (7) are positioned at four corners of the upper surface of the heat sink (8) and are used for mounting the heat sink (8) into the power amplifier;
the functional circuit interface (3) is connected with the microwave power tube (9); the liquid cooling input port (12) and the liquid cooling output port (13) are arranged on the lower surface of the heat sink (8), and the liquid cooling input port (12) and the liquid cooling output port (13) are conducted in the heat sink (8).
2. The embedded high-power microwave functional module according to claim 1, characterized in that the output matching circuit (1), the input matching circuit (2) and the microwave power tube (9) are connected with the heat sink (8) by crimping, bonding or welding.
3. An embedded high-power microwave functional module according to claim 2, characterized in that the middle of the upper surface of the heat sink (8) is recessed to form an inner concave layer for mounting the microwave power tube (9), and the edge of the inner concave layer is provided with a flow guiding groove (10) for accommodating the excessive solder when the heat sink (8) is welded with the microwave power tube (9).
4. An embedded high power microwave function module according to claim 3, characterized in that the mechanical mounting interface (7) is a retractable mechanical mounting interface.
5. An embedded high-power microwave functional module according to claim 4, characterized in that the heat sink (8) is made of copper or aluminum, and a silver plating layer or a gold plating layer is arranged on the surface of the heat sink (8).
6. The embedded high-power microwave functional module according to claim 5, characterized in that the lower surface of the heat sink (8) is further provided with a positioning pin (11), and the liquid cooling input port (12) and the liquid cooling output port (13) are correctly butted through the positioning pin (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021258409.0U CN212811639U (en) | 2020-06-30 | 2020-06-30 | Embedded high-power microwave functional module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021258409.0U CN212811639U (en) | 2020-06-30 | 2020-06-30 | Embedded high-power microwave functional module |
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| Publication Number | Publication Date |
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| CN212811639U true CN212811639U (en) | 2021-03-26 |
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| CN202021258409.0U Active CN212811639U (en) | 2020-06-30 | 2020-06-30 | Embedded high-power microwave functional module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111865235A (en) * | 2020-06-30 | 2020-10-30 | 成都四威功率电子科技有限公司 | Embedded high-power microwave functional module |
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- 2020-06-30 CN CN202021258409.0U patent/CN212811639U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111865235A (en) * | 2020-06-30 | 2020-10-30 | 成都四威功率电子科技有限公司 | Embedded high-power microwave functional module |
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