CN216719930U

CN216719930U - Constant-temperature power supply chip

Info

Publication number: CN216719930U
Application number: CN202123164957.4U
Authority: CN
Inventors: 陈建维; 李曙光
Original assignee: Minsken Aviation Technology Xi'an Co ltd
Current assignee: Minsken Aviation Technology Xi'an Co ltd
Priority date: 2021-12-16
Filing date: 2021-12-16
Publication date: 2022-06-10
Anticipated expiration: 2031-12-16

Abstract

The utility model discloses a constant-temperature power supply chip which comprises a chip shell, wherein a chip body is arranged in the chip shell, pins are arranged on two sides of the chip shell, the chip body is electrically connected with the pins through wires, and first heat dissipation assemblies are arranged in the two sides of the chip shell. By adopting the structure, the first heat dissipation assembly and the second heat dissipation assembly are arranged, so that heat on the male pin and the female pin can be transferred out through the heat conduction pad when the chip generates temperature, the heat dissipation is accelerated through the external radiator, the temperature of the pins is reduced, heat in the shell of the chip is concentrated through the heat collection cotton, then the heat is concentrated and dissipated through the heat conduction copper sheet, the heat dissipation area is increased through the oblique heat dissipation sheet and the support sheet, and a certain dustproof effect is achieved, so that the situation that the power supply chip is damaged when working at high temperature can be avoided, the normal use of the power supply chip is ensured, the service life is further prolonged, and the cost is reduced.

Description

Constant-temperature power supply chip

Technical Field

The utility model belongs to the technical field of power supply chips, and particularly relates to a constant-temperature power supply chip.

Background

The power supply chip is a chip which plays roles of conversion, distribution, detection and other electric energy in an electronic equipment system, and is mainly responsible for identifying the power supply amplitude of a CPU (central processing unit), generating corresponding short moment waves and pushing a rear-stage circuit to output power.

Traditional power chip structure is too simple, and it can produce a large amount of heats when the high-speed operation of welding back on the mainboard, though mostly install quick-witted incasement and be furnished with the radiator more, still can not be better with the heat effluvium in the power chip, the time of a specified duration can lead to the power chip to damage, and life is short, because chip cost is with high costs, and then increases use cost.

SUMMERY OF THE UTILITY MODEL

In view of the problems mentioned in the background art, an object of the present invention is to provide a constant-temperature power chip to solve the problem of poor heat dissipation effect of the power chip.

The technical purpose of the utility model is realized by the following technical scheme:

the utility model provides a thermostatic type power chip, includes the chip shell, the internally mounted of chip shell has the chip body, the both sides of chip shell all are equipped with the pin, the chip body passes through wire and pin electric connection, the inside first radiator unit that is equipped with in both sides of chip shell, the both sides of chip shell all are equipped with fixed subassembly, the louvre has been seted up to the upside of chip shell, one side of louvre is equipped with the second radiator unit, the equal fixedly connected with location strip in both sides of chip shell.

Through adopting above-mentioned technical scheme, through setting up first radiator unit and second radiator unit, accessible heat conduction pad goes out the heat transfer on the negative pin when making the chip produce the temperature, accelerate the heat effluvium through outside radiator, reduce the temperature of pin, and concentrate the heat in the chip shell through the thermal-arrest cotton, then concentrate the effluvium with the heat again through the heat conduction copper sheet, through slant fin and branch piece increase heat radiating area, and play certain dustproof effect, thereby can avoid power chip to work impaired condition under the high temperature condition, ensure power chip normal use, and then increase of service life, and therefore the cost is reduced.

Further, as a preferred technical scheme, the first heat dissipation assembly comprises mounting holes, the mounting holes are respectively formed in the left side and the right side of the chip shell, and heat conducting pads are inserted in the mounting holes.

Through adopting above-mentioned technical scheme, through setting up first radiator unit, utilize the heat conduction pad bottom in the mounting hole to laminate mutually with one side of pin, can go out the heat transfer on the pin, and then convenient high-efficient heat dissipation.

Further, as a preferable technical solution, a section of the heat conduction pad is set to be T-shaped.

Through adopting above-mentioned technical scheme, establish the tangent plane through the tangent plane with the heat conduction pad into the T shape, specifically be the tangent plane that the side section was regarded as for the upside of heat conduction pad can be with the heat of multiunit pin concentratedly derive.

Further, as a preferred technical scheme, the fixing assembly comprises a threaded hole, the threaded hole is formed in one side of the heat conducting pad and one side of the chip shell in a threaded mode, and a fixing screw is connected to the inner thread of the threaded hole in a threaded mode.

Through adopting above-mentioned technical scheme, through setting up fixed subassembly for after the heat conduction pad installation, can pass the heat conduction pad screw thread with the fixed screw on the chip shell, the position of heat conduction can stabilize, avoids taking place to drop.

Further, as a preferred technical scheme, the second heat dissipation assembly comprises heat dissipation fins, a heat conduction copper sheet and heat collection cotton, the heat dissipation fins are fixedly connected inside the heat dissipation holes, the heat conduction copper sheet is fixedly installed on one side of the inside of the heat dissipation holes, the heat collection cotton is fixedly installed inside the chip shell, and one side of the heat collection cotton is attached to one side of the heat conduction copper sheet.

Through adopting above-mentioned technical scheme, through setting up second radiator unit, the fin is the slant setting in the radiating hole, multiplicable heat radiating area, and it is dustproof also to be convenient for, concentrates the thermal-arrest cotton with the inside heat of chip shell concentrate here to spill after concentrating the heat again through the heat conduction copper sheet, make the radiating effect better.

Further, as a preferred technical scheme, both sides of the heat radiating fin are fixedly connected with support fins, and the support fins are obliquely arranged on the heat radiating fin.

Through adopting above-mentioned technical scheme, through setting up the slant brace on the fin, strengthen dustproof ability, and do not influence the heat dissipation.

Further, as a preferred technical scheme, guide holes are formed in both sides of the chip shell, one side of each pin penetrates through the guide holes, and the guide holes are communicated with the mounting holes.

Through adopting above-mentioned technical scheme, through setting up the guiding hole in the chip shell for the pin stretches out, through being linked together guiding hole and mounting hole, makes things convenient for heat conduction pad and pin to laminate mutually.

Further, as a preferred technical scheme, the positioning strip is arranged on the outer side of the guide hole.

Through adopting above-mentioned technical scheme, through setting up guiding hole outside location strip, play the effect of firm negative and positive pin.

Further, as a preferred technical scheme, the bottom end of the chip shell is provided with a limiting groove.

Through adopting above-mentioned technical scheme, through the spacing groove that sets up chip housing bottom, can be spacing with the cylinder block of reserving on the mainboard, strengthen the effect of firm power chip.

In summary, the utility model mainly has the following beneficial effects:

firstly, by arranging the first radiating assembly and the second radiating assembly, heat on the male pin and the female pin can be transferred out through the heat conducting pad when the chip generates temperature, the heat dissipation is accelerated through an external radiator, the temperature of the pins is reduced, heat in the chip shell is concentrated through heat collecting cotton, then the heat is concentrated and dissipated through the heat conducting copper sheet, the radiating area is increased through the oblique radiating fins and the supporting fins, and a certain dustproof effect is achieved, so that the situation that the power supply chip is damaged when working at high temperature can be avoided, the normal use of the power supply chip is ensured, the service life is prolonged, and the cost is reduced;

the second, through setting up the location strip of pin one side, the mounted position of pin can stabilize provides certain holding power, avoids taking place to warp with chip shell contact position for welding more stably, the spacing groove of bottom in addition can be connected with the cylinder of reserving on the mainboard, thereby can further stabilize power chip's position, avoids droing, ensures stable work.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a schematic structural view of the present invention;

FIG. 3 is an enlarged view of section A of FIG. 2 of the present invention;

fig. 4 is an enlarged view of the portion B of fig. 2 according to the present invention.

Reference numerals: 1. chip shell, 2, chip body, 3, first radiator unit, 31, mounting hole, 32, heat conduction pad, 4, second radiator unit, 41, fin, 410, a piece, 42, heat conduction copper sheet, 43, thermal-arrest cotton, 5, louvre, 6, fixed subassembly, 61, screw hole, 62, fixed screw, 7, pin, 8, guiding hole, 9, location strip, 10, spacing groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

Referring to fig. 1-4, the constant temperature power chip described in this embodiment includes a chip housing 1, a chip body 2 is installed inside the chip housing 1, a heat dissipation cavity is disposed between the chip housing 1 and the chip body 2, pins 7 are disposed on both sides of the chip housing 1, the chip body 2 is electrically connected to the pins 7 through wires, first heat dissipation assemblies 3 are disposed inside both sides of the chip housing 1, fixing assemblies 6 are disposed on both sides of the chip housing 1, heat dissipation holes 5 are formed on the upper side of the chip housing 1, second heat dissipation assemblies 4 are disposed on one sides of the heat dissipation holes 5, positioning bars 9 are fixedly connected to both sides of the chip housing 1, and by disposing the first heat dissipation assemblies 3 and the second heat dissipation assemblies 4, heat on the pins 7 can be transferred out through a heat conduction pad 32 when the chip generates a temperature, and the heat dissipation is accelerated by an external heat sink, reduce the temperature of pin 7 to concentrate the heat in chip shell 1 through thermal-arrest cotton 43, then concentrate the effluvium again with the heat through heat conduction copper sheet 42, increase heat radiating area through slant fin 41 and branch piece 410, and play certain dustproof effect, thereby can avoid power chip to work impaired condition under the high temperature condition, ensure power chip normal use, and then increase of service life, reduce cost.

Example 2

Referring to fig. 2, on the basis of embodiment 1, in order to achieve the purpose of heat dissipation, the present embodiment has an innovative design on the first heat dissipation assembly 3, specifically, the first heat dissipation assembly 3 includes mounting holes 31, the mounting holes 31 are respectively formed inside the left and right sides of the chip housing 1, heat conduction pads 32 are inserted into the mounting holes 31, and the section of the heat conduction pads 32 is T-shaped; through setting up first radiator unit 3, utilize heat conduction pad 32 bottom in the mounting hole 31 to laminate mutually with one side of pin 7, can go out the heat transfer on the pin 7, and then convenient high-efficient heat dissipation establishes the tangent plane with heat conduction pad 32 into the T shape, specifically is the tangent plane that the side cut open was regarded as for the upside of heat conduction pad 32 can be with the heat of multiunit pin 7 concentrate the derivation.

Referring to fig. 3, for the purpose of fixing, the fixing assembly 6 of the present embodiment includes a threaded hole 61, the threaded hole 61 is threaded on one side of the heat conducting pad 32 and the chip housing 1, and a fixing screw 62 is threaded inside the threaded hole 61; through setting up fixed subassembly 6 for after heat conduction pad 32 installs, can pass heat conduction pad 32 screw thread with set screw 62 on chip shell 1, the position of heat conduction can stabilize, avoids taking place to drop.

Example 3

Referring to fig. 2 and 4, in the present embodiment, on the basis of embodiment 1, in order to achieve the purpose of heat dissipation, the second heat dissipation assembly 4 is innovatively designed, specifically, the second heat dissipation assembly 4 includes a heat dissipation fin 41, a heat conduction copper sheet 42 and heat collection cotton 43, the heat dissipation fin 41 is fixedly connected inside the heat dissipation hole 5, the heat conduction copper sheet 42 is fixedly installed at one side inside the heat dissipation hole 5, the heat collection cotton 43 is fixedly installed inside the chip housing 1, and one side of the heat collection cotton 43 is attached to one side of the heat conduction copper sheet 42; through setting up second radiator unit 4, fin 41 is the slant setting in louvre 5, multiplicable heat radiating area, also is convenient for dustproof, concentrates thermal-arrest cotton 43 and concentrates the place with the inside heat of chip housing 1 to through heat conduction copper sheet 42 with the heat after concentrating again, spill for the radiating effect is better.

Referring to fig. 2 and 4, in order to achieve the purpose of xxxxxxx, the two sides of the heat sink 41 of the present embodiment are fixedly connected with the support fins 410, and the support fins 410 are disposed on the heat sink 41 in an oblique manner; by providing the oblique support piece 410 on the heat sink 41, the dust-proof capability is enhanced, and the heat dissipation is not affected.

Referring to fig. 1-2, in order to achieve the purpose of stability, guide holes 8 are formed in both sides of the chip housing 1, one side of each pin 7 penetrates through the guide hole 8, and the positioning bar 9 is arranged outside the guide hole 8; through setting up guiding hole 8 in the chip shell 1 for pin 7 stretches out, through setting up 8 outside location strips 9 of guiding hole, plays the effect of firm negative and positive pin 7.

Referring to fig. 2, in order to achieve the purpose of mounting, the bottom end of the chip housing 1 of the present embodiment is provided with a limiting groove 10; through the spacing groove 10 that sets up 1 bottom of chip shell, can be spacing with the cylinder block of reserving on the mainboard, strengthen the effect of firm power chip.

Referring to fig. 2, the guide hole 8 of the present embodiment communicates with the mounting hole 31 for the purpose of convenience of use; by communicating the guide hole 8 with the mounting hole 31, the thermal pad 32 is conveniently attached to the pin 7.

The use principle and the advantages are as follows: when the heat dissipation device is used, the limiting groove 10 on the chip shell 1 is clamped and limited with a reserved cylinder on a mainboard, then the cathode pin 7 and the anode pin 7 are welded, the positioning strip 9 on one side of the pin 7 can stabilize the installation position of the pin 7 and provide certain supporting force to avoid deformation of the contact position of the chip shell 1, the first heat dissipation component 3 and the second heat dissipation component 4 are arranged, so that heat on the cathode pin 7 and the anode pin 7 can be transferred out through the heat conduction pad 32 when the chip generates temperature, the heat dissipation is accelerated through an external heat radiator, the temperature of the pin 7 is reduced, heat in the chip shell 1 is concentrated through the heat collection cotton 43, then the heat is concentrated and dissipated out through the heat conduction copper sheet 42, the heat dissipation area is increased through the inclined heat dissipation sheet 41 and the support sheet 410, and a certain dustproof effect is achieved, and the condition that the power supply chip is damaged when working under the high temperature condition can be avoided, the normal use of the power supply chip is ensured, the service life is prolonged, and the cost is reduced.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A constant temperature type power supply chip is characterized in that: including chip shell (1), the internally mounted of chip shell (1) has chip body (2), the both sides of chip shell (1) all are equipped with pin (7), chip body (2) pass through wire and pin (7) electric connection, the inside first radiator unit (3) that is equipped with in both sides of chip shell (1), the both sides of chip shell (1) all are equipped with fixed subassembly (6), louvre (5) have been seted up to the upside of chip shell (1), one side of louvre (5) is equipped with second radiator unit (4), the equal fixedly connected with location strip (9) in both sides of chip shell (1).

2. A constant-temperature type power supply chip according to claim 1, characterized in that: the first heat dissipation assembly (3) comprises mounting holes (31), the mounting holes (31) are respectively formed in the left side and the right side of the chip shell (1), and heat conducting pads (32) are inserted in the mounting holes (31).

3. A constant-temperature type power supply chip according to claim 2, characterized in that: the section of the heat conducting pad (32) is set to be T-shaped.

4. A constant-temperature type power supply chip according to claim 2, characterized in that: the fixing assembly (6) comprises a threaded hole (61), the threaded hole (61) is formed in one side of the heat conducting pad (32) and one side of the chip shell (1) in a threaded mode, and a fixing screw (62) is connected to the inner thread of the threaded hole (61) in a threaded mode.

5. A constant-temperature type power supply chip according to claim 1, characterized in that: the second heat dissipation assembly (4) comprises heat dissipation fins (41), heat conduction copper sheets (42) and heat collection cotton (43), wherein the heat dissipation fins (41) are fixedly connected inside the heat dissipation holes (5), the heat conduction copper sheets (42) are fixedly installed on one side of the inside of the heat dissipation holes (5), the heat collection cotton (43) is fixedly installed inside the chip shell (1), and one side of the heat collection cotton (43) is attached to one side of the heat conduction copper sheets (42).

6. The constant-temperature power supply chip according to claim 5, wherein: both sides of the radiating fin (41) are fixedly connected with supporting fins (410), and the supporting fins (410) are obliquely arranged on the radiating fin (41).

7. A constant-temperature type power supply chip according to claim 2, characterized in that: guiding holes (8) are formed in the two sides of the chip shell (1), one side of each pin (7) penetrates through the corresponding guiding hole (8), and the guiding holes (8) are communicated with the mounting holes (31).

8. A constant-temperature type power supply chip according to claim 7, wherein: the positioning strip (9) is arranged on the outer side of the guide hole (8).

9. A constant-temperature type power supply chip according to claim 1, characterized in that: the bottom end of the chip shell (1) is provided with a limiting groove (10).