CN216389339U - Semiconductor device with high-efficient heat dissipation - Google Patents
Semiconductor device with high-efficient heat dissipation Download PDFInfo
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- CN216389339U CN216389339U CN202123299523.5U CN202123299523U CN216389339U CN 216389339 U CN216389339 U CN 216389339U CN 202123299523 U CN202123299523 U CN 202123299523U CN 216389339 U CN216389339 U CN 216389339U
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- semiconductor device
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- heat dissipation
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Abstract
The utility model discloses a semiconductor device with high-efficiency heat dissipation, which comprises a semiconductor device main body, wherein an insulating heat-conducting plate is arranged outside the semiconductor device main body, a heat dissipation mechanism is arranged below the insulating heat-conducting plate, a groove is formed in the top end of the insulating heat-conducting plate, the semiconductor device main body is positioned in the groove, a limiting frame is arranged on the outer wall of the semiconductor device main body, an insulating pressing plate is arranged at the top end of the limiting frame, a fixing mechanism used for fixing the insulating pressing plate and the limiting frame is arranged on the insulating pressing plate, a plurality of through holes penetrate through the insulating pressing plate, and the plurality of through holes are matched with pins of the semiconductor device main body. The utility model can transmit the heat generated by the semiconductor device main body during working to the heat dissipation plate and the plurality of heat dissipation plates through the arrangement of the insulating heat conduction plate, increases the heat dissipation area of the semiconductor device main body through the heat dissipation plate and the plurality of heat dissipation plates, and finally prolongs the service life of the semiconductor device main body.
Description
Technical Field
The utility model relates to the technical field of semiconductor devices, in particular to a semiconductor device with efficient heat dissipation.
Background
Semiconductor devices are electronic devices that are electrically conductive between a good electrical conductor and an insulator, and that use the special electrical properties of the semiconductor material to perform specific functions, which can be used to generate, control, receive, convert, amplify signals, and perform energy conversion. The semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, and can be used as a material for a rectifier, an oscillator, a light emitter, an amplifier, a photodetector, or the like.
Because the semiconductor device generates heat during operation, when the operating temperature of the semiconductor device is too high, the performance of the electronic device is affected, and even the electronic device may be damaged, so that the semiconductor device needs to be timely cooled by adopting a proper cooling structure. To solve the above technical problem, a solution is proposed as follows.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a semiconductor device with high-efficiency heat dissipation, which solves the problems that the performance of an electronic device is influenced and the electronic device is damaged due to overhigh working temperature of the semiconductor device.
The technical purpose of the utility model is realized by the following technical scheme:
the utility model provides a semiconductor device with high-efficient radiating, includes the semiconductor device main part, the insulating heat-conducting plate is installed outward to the semiconductor device main part, heat dissipation mechanism is installed to insulating heat-conducting plate below, insulating heat-conducting plate top is seted up flutedly, the semiconductor device main part is located inside the recess, spacing frame is installed to semiconductor device main part outer wall, spacing frame is inconsistent with insulating heat-conducting plate top, insulating clamp plate is installed on spacing frame top, install the fixed establishment who is used for fixed insulating clamp plate and spacing frame on the insulating clamp plate, it has a plurality of through-hole, a plurality of to run through on the insulating clamp plate the through-hole all cooperatees with the pin of semiconductor device main part.
Further, fixed establishment is including setting firmly two fixed blocks in insulating clamp plate bottom, two fixed slots with fixed block matched with, two are seted up on spacing frame top the slot has all been seted up to fixed slot one side, two the slot is linked together with two fixed slots respectively, two all install the L type inserted block of wearing to establish insulating clamp plate on the slot, two all install bolt one on the inserted block, the inserted block passes through bolt one with insulating clamp plate and fixes mutually.
Furthermore, the heat dissipation mechanism comprises a heat dissipation plate arranged below the insulating heat conduction plate, and a plurality of heat dissipation fins are fixedly arranged below the heat dissipation plate.
Furthermore, two bolts II are installed on the insulating heat conduction plate, and the insulating heat conduction plate and the heat dissipation plate are fixed through the two bolts II.
The utility model has the advantages that: thereby can spread the heat that sends of semiconductor device main part during operation to heating panel and a plurality of fin through the setting of insulating heat-conducting plate, through heating panel and a plurality of fin of installation, increased the heat radiating area to the semiconductor device main part, finally prolonged the life of semiconductor device main part.
Drawings
FIG. 1 is a cross-sectional view of the present invention;
fig. 2 is an enlarged view of a portion a of fig. 1.
Reference numerals: 1. a semiconductor device body; 11. a pin; 2. an insulating heat-conducting plate; 21. a groove; 22. a second bolt; 3. a limiting frame; 4. an insulating platen; 41. a through hole; 5. a heat dissipation mechanism; 51. a heat dissipation plate; 52. a heat sink; 6. a fixing mechanism; 61. a fixed block; 62. fixing grooves; 63. inserting a block; 64. a slot; 65. and a first bolt.
Detailed Description
The following description is only a preferred embodiment of the present invention, and the protection scope is not limited to the embodiment, and any technical solution that falls under the idea of the present invention should fall within the protection scope of the present invention. It should also be noted that modifications and embellishments within the scope of the utility model may occur to those skilled in the art without departing from the principle of the utility model.
As shown in fig. 1-2, a semiconductor device with high efficiency heat dissipation comprises a semiconductor device body 1, an insulating heat conducting plate 2 is installed outside the semiconductor device body 1, a heat dissipation mechanism 5 is installed below the insulating heat conducting plate 2, the heat dissipation mechanism 5 comprises a heat dissipation plate 51 installed below the insulating heat conducting plate 2, and a plurality of heat dissipation fins 52 are fixedly arranged below the heat dissipation plate 51; the heat radiation area to the semiconductor device main body 1 is increased by the heat radiation plate 51 and the plurality of heat radiation fins 52 mounted.
The top end of the insulating heat conduction plate 2 is provided with a groove 21, the semiconductor device main body 1 is positioned in the groove 21, and the insulating heat conduction plate 2 plays an insulating role and can also spread the heat of the semiconductor device main body 1; two bolts two 22 are installed on the insulating heat conduction plate 2, the insulating heat conduction plate 2 and the heat dissipation plate 51 are fixed through the two bolts two 22, and when the insulating heat conduction plate 2 and the heat dissipation plate 51 need to be separated, only the two bolts two 22 need to be removed.
The outer wall of the semiconductor device main body 1 is provided with a limiting frame 3, the limiting frame 3 is abutted against the top end of the insulating heat-conducting plate 2, and the limiting frame 3 is arranged to play a role of the semiconductor device main body 1; the top end of the limiting frame 3 is provided with an insulating pressing plate 4, and the insulating effect is achieved through the arrangement of the insulating pressing plate 4; a plurality of through holes 41 penetrate through the insulating pressing plate 4, the plurality of through holes 41 are matched with the pins 11 of the semiconductor device body 1, and welding of the plurality of pins 11 is facilitated through the arrangement of the plurality of through holes 41.
The fixing mechanism 6 for fixing the insulating pressing plate 4 and the limiting frame 3 is mounted on the insulating pressing plate 4, the fixing mechanism 6 comprises two fixing blocks 61 fixedly arranged at the bottom end of the insulating pressing plate 4, two fixing grooves 62 matched with the fixing blocks 61 are formed in the top end of the limiting frame 3, slots 64 are formed in one sides of the two fixing grooves 62 respectively, the two slots 64 are communicated with the two fixing grooves 62 respectively, L-shaped inserting blocks 63 penetrating through the insulating pressing plate 4 are mounted on the two slots 64 respectively, a first bolt 65 is mounted on each of the two inserting blocks 63, and the inserting blocks 63 and the insulating pressing plate 4 are fixed through the first bolts 65; when two fixed blocks 61 of insulating clamp plate 4 insert two fixed slots 62 respectively inside, insulating clamp plate 4 is inconsistent with spacing frame 3 top, inserts two L types again and inserts piece 63 respectively inside two slots 64 to can make insulating clamp plate 4 and spacing frame 3 tentatively fixed, thereby screw up two bolts 65 again and can further fix insulating clamp plate 4 and spacing frame 3.
The arrangement of the insulating heat conducting plate 2 can transmit the heat generated by the semiconductor device body 1 during working to the heat dissipation plate 51 and the plurality of heat dissipation fins 52, and the heat dissipation area of the semiconductor device body 1 is increased through the installed heat dissipation plate 51 and the plurality of heat dissipation fins 52, so that the service life of the semiconductor device body 1 is finally prolonged.
Claims (4)
1. A semiconductor device with efficient heat dissipation, comprising a semiconductor device body (1), characterized in that: install insulating heat-conducting plate (2) outward semiconductor device main part (1), heat dissipation mechanism (5) are installed to insulating heat-conducting plate (2) below, recess (21) have been seted up on insulating heat-conducting plate (2) top, inside semiconductor device main part (1) was located recess (21), spacing frame (3) are installed to semiconductor device main part (1) outer wall, spacing frame (3) and insulating heat-conducting plate (2) top are inconsistent, insulating clamp plate (4) are installed on spacing frame (3) top, install fixed establishment (6) that are used for fixed insulating clamp plate (4) and spacing frame (3) on insulating clamp plate (4), it has a plurality of through-hole (41), a plurality of to run through on insulating clamp plate (4) through-hole (41) all cooperate with pin (11) of semiconductor device main part (1).
2. A semiconductor device with efficient heat dissipation as recited in claim 1, wherein: fixed establishment (6) are including setting firmly two fixed blocks (61) in insulating clamp plate (4) bottom, two and fixed block (61) matched with fixed slot (62), two have been seted up on spacing frame (3) top slot (64), two have all been seted up on fixed slot (62) one side slot (64) are linked together with two fixed slot (62) respectively, two all install L type inserted block (63) of wearing to establish insulating clamp plate (4) on slot (64), two all install bolt (65) on inserted block (63), inserted block (63) are fixed mutually through bolt (65) with insulating clamp plate (4).
3. A semiconductor device with efficient heat dissipation as recited in claim 1, wherein: the heat dissipation mechanism (5) comprises a heat dissipation plate (51) arranged below the insulating heat conduction plate (2), and a plurality of heat dissipation fins (52) are fixedly arranged below the heat dissipation plate (51).
4. A semiconductor device with efficient heat dissipation as defined in claim 3, wherein: two second bolts (22) are installed on the insulating heat conduction plate (2), and the insulating heat conduction plate (2) and the heat dissipation plate (51) are fixed through the two second bolts (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123299523.5U CN216389339U (en) | 2021-12-24 | 2021-12-24 | Semiconductor device with high-efficient heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123299523.5U CN216389339U (en) | 2021-12-24 | 2021-12-24 | Semiconductor device with high-efficient heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216389339U true CN216389339U (en) | 2022-04-26 |
Family
ID=81238730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123299523.5U Active CN216389339U (en) | 2021-12-24 | 2021-12-24 | Semiconductor device with high-efficient heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216389339U (en) |
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2021
- 2021-12-24 CN CN202123299523.5U patent/CN216389339U/en active Active
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