CN210092063U

CN210092063U - High-power field effect tube pressing heat dissipation device

Info

Publication number: CN210092063U
Application number: CN201921221830.1U
Authority: CN
Inventors: 胡云峰; 张泽清; 林河北; 马伟宝
Original assignee: SHENZHEN JINYU SEMICONDUCTOR CO Ltd
Current assignee: SHENZHEN JINYU SEMICONDUCTOR CO Ltd
Priority date: 2019-07-29
Filing date: 2019-07-29
Publication date: 2020-02-18
Anticipated expiration: 2029-07-29

Abstract

The utility model discloses a high-power field effect tube pressure heat abstractor, including the thermal-arrest board, the middle part fixed mounting of thermal-arrest board upper surface has the fan, the last fixed surface of thermal-arrest board installs two sets of symmetrical fin, and two sets of fin are located the both sides of fan respectively, two sets of symmetrical supporting legs, every have been placed to the below of thermal-arrest board the one end that the supporting leg is close to the thermal-arrest board is all articulated mutually through the bottom surface of round pin axle with the thermal-arrest board. The utility model relates to a rational in infrastructure, it can be through inserting the inside of locating part with field effect tube, twist two screws, fix field effect tube by two soft rubber pads, make field effect tube and thermal-arrest board laminating for the heat conduction, when field effect tube work produced the heat, produce through the thermal-arrest board and lead to on the fin, fan circular telegram starts makes the air flow rapidly, drives the heat and volatilizees, avoids field effect tube to produce the high temperature and leads to the performance of circuit board inflation change circuit, has improved its life.

Description

High-power field effect tube pressing heat dissipation device

Technical Field

The utility model relates to a field effect transistor technical field specifically is a high-power field effect transistor compresses tightly heat abstractor.

Background

The Field Effect Transistor (FET) is a semiconductor device which controls the current of an output loop by using the electric field effect of a control input loop, is named after the field effect transistor, and is also called as a unipolar transistor because the field effect transistor is only conductive by the majority carriers in a semiconductor.

The existing field effect tube can generate a large amount of heat to generate high temperature when working, so that the operation of electrical elements around the field effect tube is influenced, the high temperature influences the size and the distance of a transmission line, circuits with millimeter wave frequency have extremely fine line width and distance, the performances of the circuits can be changed due to the expansion of a circuit board generated by the high temperature, the service life of the circuits is seriously influenced, and therefore, the high-power field effect tube compression heat dissipation device is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

One) technical problem to be solved

The utility model aims at providing a high-power field effect tube pressing and radiating device for making up the defects of the prior art.

II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-power field effect tube compresses tightly heat abstractor, includes the thermal-arrest board, the middle part fixed mounting of thermal-arrest board upper surface has the fan, the upper surface fixed mounting of thermal-arrest board has two sets of symmetrical fin, and two sets of fin are located the both sides of fan respectively, two sets of symmetrical supporting legs have been placed to the below of thermal-arrest board, every one end that the supporting leg is close to the thermal-arrest board all hinges mutually through the bottom surface of round pin axle with the thermal-arrest board, every the locating hole has all been seted up to the upper surface of supporting leg.

The bottom surface fixed mounting of thermal-arrest board has the locating part, field effect transistor has been placed to the below of thermal-arrest board, and field effect transistor is located the inside of locating part, the fixed embedding in bottom surface of locating part has two symmetrical screwed pipes, the below of locating part is provided with two screws, two the screw thread end of screw runs through two screwed pipes respectively and extends to the inside of locating part, two the equal fixedly connected with soft rubber pad of one end that the screw is close to field effect transistor.

Furthermore, the screw is made of ceramic materials, and the soft rubber pad is made of butyl rubber.

Furthermore, two symmetrical cavities are formed in the soft rubber pad, and a strong spring is fixedly connected to the inner wall of each cavity.

Furthermore, the supporting legs are Z-shaped and are positioned at four corners of the bottom surface of the heat collecting plate.

Furthermore, every the surface of fin all sets up the ventilation hole that the equidistance was arranged, and the quantity of ventilation hole is four at least.

Furthermore, a concave cover plate is arranged above the heat collecting plate, and the horizontal length value of the concave cover plate is larger than that of the fan.

III) beneficial effects

Compared with the prior art, the high-power field effect tube pressing heat dissipation device has the following beneficial effects:

firstly, the method comprises the following steps: the utility model discloses a with the inside of field effect transistor insertion locating part, twist two screws, fix field effect transistor by two soft rubber pads, make field effect transistor and thermal-arrest board laminating for the heat conduction, when the work of field effect transistor produced heat, produced through the thermal-arrest board and lead to on the fin, the fan circular telegram starts and makes the air flow rapidly, drives the heat and volatilizees, avoids field effect transistor to produce the performance that high temperature leads to circuit board inflation change circuit, has improved its life.

Secondly, the method comprises the following steps: the utility model discloses a be provided with cavity and powerful spring, can have certain shock-absorbing capacity when soft rubber pad and field effect transistor contact, cause the damage to field effect transistor when avoiding twisting the soft rubber pad, through being provided with concave type apron, can protect fin and fan, avoid producing the collision at the in-process of installation and influence its performance.

Drawings

FIG. 1 is a perspective view of a heat collecting plate according to the present invention;

FIG. 2 is a bottom view of the heat collecting plate of the present invention;

fig. 3 is a side view of the position limiting member of the present invention;

fig. 4 is a sectional view of the front view of the soft rubber pad of the present invention.

In the figure: 1. a heat collecting plate; 2. positioning holes; 3. supporting legs; 4. a vent hole; 5. a heat sink; 6. a fan; 7. a concave cover plate; 8. a pin shaft; 9. a field effect transistor; 10. a cavity; 11. a limiting member; 12. a screw; 13. a threaded pipe; 14. a soft rubber pad; 15. a strong spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, the utility model provides a technical solution: the utility model provides a high-power field effect tube presses heat abstractor tightly, including thermal-arrest board 1, the middle part fixed mounting of thermal-arrest board 1 upper surface has fan 6, the last fixed surface of thermal-arrest board 1 installs two sets of symmetrical fin 5, and two sets of fin 5 are located the both sides of fan 6 respectively, two sets of symmetrical supporting legs 3 have been placed to thermal-arrest board 1's below, every supporting leg 3 is close to the one end of thermal-arrest board 1 and all articulates through the bottom surface of round pin axle 8 with thermal-arrest board 1 mutually, locating hole 2 has all been seted up to the upper surface of every supporting leg 3.

A limiting piece 11 is fixedly installed on the bottom surface of the heat collecting plate 1, a field effect tube 9 is placed below the heat collecting plate 1, the field effect tube 9 is located inside the limiting piece 11, two symmetrical threaded tubes 13 are fixedly embedded on the bottom surface of the limiting piece 11, two screws 12 are arranged below the limiting piece 11, the threaded ends of the two screws 12 respectively penetrate through the two threaded tubes 13 and extend to the inside of the limiting piece 11, and one ends of the two screws 12, which are close to the field effect tube 9, are fixedly connected with soft rubber pads 14.

Further, the screw 12 is made of ceramic, and the soft rubber pad 14 is made of butyl rubber. The field-effect tube 9 can not deform and extend under a high-temperature environment, the connection strength cannot be reduced, and the fixing performance of the field-effect tube 9 is ensured.

Furthermore, two symmetrical cavities 10 are formed in the soft rubber pad 14, and a strong spring 15 is fixedly connected to the inner wall of each cavity 10. The soft rubber pad 14 has certain buffering performance when contacting with the field effect transistor 9, and damage to the field effect transistor 9 when screwing the soft rubber pad 14 is avoided.

Further, the supporting legs 3 are in a zigzag shape, and the supporting legs 3 are located at four corners of the bottom surface of the heat collecting plate 1. A certain gap can be formed between the field effect transistors 9, and the heat dissipation rate of the field effect transistors 9 is accelerated.

Furthermore, the surface of each cooling fin 5 is provided with ventilation holes 4 which are arranged at equal intervals, and the number of the ventilation holes 4 is at least four. The ventilation resistance is reduced, and the heat dissipation area and the heat dissipation effect can be further improved.

Further, a concave cover plate 7 is arranged above the heat collecting plate 1, and the horizontal length value of the concave cover plate 7 is greater than that of the fan 6. Can protect fin 5 and fan 6, avoid producing the collision and influence its performance in the in-process of installation.

The working principle is as follows: the fan 6 is communicated with a power supply, the field effect tube 9 is firstly inserted into the limiting part 11, the two screws 12 are screwed, the field effect tube 9 is fixed by the two soft rubber gaskets 14, the field effect tube 9 is attached to the heat collecting plate 1, heat conduction is accelerated, when the field effect tube 9 works to generate heat, the heat is conducted on the radiating fins 5 through the heat collecting plate 1, the fan 6 is electrified and started to enable air to flow rapidly, heat volatilization is driven, the phenomenon that the circuit board expands due to the high temperature generated by the field effect tube 9 to change the performance of a circuit is avoided, and the service life of the fan is prolonged.

It should be noted that, in this document, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-power field effect tube compresses tightly heat abstractor, includes the thermal-arrest board, its characterized in that: the fan is fixedly installed in the middle of the upper surface of the heat collection plate, two groups of symmetrical cooling fins are fixedly installed on the upper surface of the heat collection plate and are respectively located on two sides of the fan, two groups of symmetrical supporting legs are placed below the heat collection plate, one end, close to the heat collection plate, of each supporting leg is hinged to the bottom surface of the heat collection plate through a pin shaft, and a positioning hole is formed in the upper surface of each supporting leg; the bottom surface fixed mounting of thermal-arrest board has the locating part, field effect transistor has been placed to the below of thermal-arrest board, and field effect transistor is located the inside of locating part, the fixed embedding in bottom surface of locating part has two symmetrical screwed pipes, the below of locating part is provided with two screws, two the screw thread end of screw runs through two screwed pipes respectively and extends to the inside of locating part, two the equal fixedly connected with soft rubber pad of one end that the screw is close to field effect transistor.

2. The high power fet compact heat sink of claim 1, further comprising: the screw is made of ceramic materials, and the soft rubber pad is made of butyl rubber.

3. The high power fet compact heat sink of claim 1, further comprising: two symmetrical cavities are formed in the soft rubber pad, and a strong spring is fixedly connected to the inner wall of each cavity.

4. The high power fet compact heat sink of claim 1, further comprising: the supporting legs are Z-shaped and are positioned at four corners of the bottom surface of the heat collecting plate.

5. The high power fet compact heat sink of claim 1, further comprising: every the surface of fin all sets up the ventilation hole that the equidistance was arranged, and the quantity in ventilation hole is four at least.

6. The high power fet compact heat sink of claim 1, further comprising: and a concave cover plate is arranged above the heat collecting plate, and the horizontal length value of the concave cover plate is greater than that of the fan.