CN217770766U - High-temperature-resistant street lamp case - Google Patents

High-temperature-resistant street lamp case Download PDF

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CN217770766U
CN217770766U CN202221866977.8U CN202221866977U CN217770766U CN 217770766 U CN217770766 U CN 217770766U CN 202221866977 U CN202221866977 U CN 202221866977U CN 217770766 U CN217770766 U CN 217770766U
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box
heat dissipation
fan
street lamp
temperature
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袁磊
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Shenzhen Fangxin Communication Engineering Co ltd
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Shenzhen Fangxin Communication Engineering Co ltd
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Abstract

本实用新型公开了一种耐高温路灯机箱,包括箱体,箱体的顶端开设有通孔,通孔内侧的顶部开设有卡槽,卡槽的内部卡合安装有半导体制冷片,半导体制冷片的两侧均固定设置有连接块,两个连接块远离半导体制冷片的一侧均开设有安装槽,两个安装槽的内部均设置有限位弹片,本实用新型一种耐高温路灯机箱,通过温控开关来对箱体内部的情况进行监测,通过半导体制冷片的制冷面产生冷空气来与箱体内部的热空气进行热交换,来起到降温的作用,来提高降温效率,通过第一风扇将外界空气导入箱体的内部,来加速箱体内部空气的流通,通过第二风扇来将箱体内部的热空气排出,来提高散热效率,进而提高箱体的耐高温性能。

Figure 202221866977

The utility model discloses a high temperature resistant street lamp case, which comprises a case body, a through hole is formed at the top of the case body, a clamping groove is formed at the top inside the through hole, and a semiconductor refrigerating chip is installed in the inner part of the clamping groove. A connecting block is fixedly arranged on both sides of the two connecting blocks, one side of the two connecting blocks away from the semiconductor refrigerating chip is provided with a mounting groove, and the interior of the two mounting grooves is provided with a limited elastic sheet. The temperature control switch is used to monitor the situation inside the box, and the cooling surface of the semiconductor refrigerating sheet generates cold air to exchange heat with the hot air inside the box to play a role in cooling and improve the cooling efficiency. The fan introduces the outside air into the inside of the box to accelerate the circulation of the air inside the box, and the second fan discharges the hot air inside the box to improve the heat dissipation efficiency, thereby improving the high temperature resistance of the box.

Figure 202221866977

Description

一种耐高温路灯机箱A high temperature resistant street lamp chassis

技术领域technical field

本实用新型涉及路灯机箱领域,具体为一种耐高温路灯机箱。The utility model relates to the field of street lamp cabinets, in particular to a high temperature resistant street lamp cabinet.

背景技术Background technique

路灯在我们的生活中随处可见,它通常需要使用控制机箱来对其进行集中控制,而机箱中安装有非常多的电子元件,电子元器件使用时产生的热量会导致机箱内部温度升高,但是现有路灯机箱的耐高温性能和散热性能不佳,进而机箱内部电子元件的使用寿命。Street lamps can be seen everywhere in our life. It usually needs to use a control box for centralized control, and there are a lot of electronic components installed in the box. The heat generated by the electronic components will cause the internal temperature of the box to rise, but The high temperature resistance and heat dissipation performance of the existing street lamp chassis are not good, and the service life of the electronic components inside the chassis is further reduced.

实用新型内容Utility model content

本实用新型的目的在于提供一种耐高温路灯机箱,以解决上述背景技术中提出的现有路灯机箱的耐高温性能和散热性能不佳,进而机箱内部电子元件的使用寿命的问题。The purpose of this utility model is to provide a high temperature resistant street lamp chassis to solve the problem of poor high temperature resistance and heat dissipation performance of the existing street lamp chassis proposed in the above background technology, and furthermore the problem of the service life of the electronic components inside the chassis.

为实现上述目的,本实用新型提供如下技术方案:一种耐高温路灯机箱,包括箱体,所述箱体的顶端开设有通孔,所述通孔内侧的顶部开设有卡槽,所述卡槽的内部卡合安装有半导体制冷片,所述半导体制冷片的两侧均固定设置有连接块,两个所述连接块远离半导体制冷片的一侧均开设有安装槽,两个所述安装槽的内部均设置有限位弹片,所述卡槽内壁的两侧均开设有限位槽,所述箱体一侧的顶部和箱体另一侧的底部均设置有安装座,两个所述安装座内侧的一端分别固定安装有第一风扇和第二风扇,通过半导体制冷片的制冷面产生冷空气来与箱体内部的热空气进行热交换,来起到降温的作用,通过若干个散热翅片和若干个散热槽的配合设置便于对半导体制冷片散热面的散热,来提高降温效率,通过第一风扇将外界空气导入箱体的内部,来加速箱体内部空气的流通,通过第二风扇来将箱体内部的热空气排出,来提高散热效率,进而提高箱体的耐高温性能。In order to achieve the above purpose, the utility model provides the following technical solutions: a high temperature resistant street lamp chassis, including a box body, a through hole is opened on the top of the box body, and a card slot is opened on the top inside of the through hole, and the card The inside of the groove is fitted with a semiconductor refrigeration chip, and the two sides of the semiconductor refrigeration sheet are fixedly provided with connecting blocks, and the side of the two connection blocks away from the semiconductor refrigeration sheet is provided with a mounting groove. The inside of the slot is provided with limiting shrapnel, both sides of the inner wall of the card slot are provided with limiting grooves, the top of one side of the box and the bottom of the other side of the box are provided with mounting seats, and the two installations The first fan and the second fan are respectively fixedly installed on one end of the inner side of the seat, and the cold air is generated by the cooling surface of the semiconductor cooling plate to exchange heat with the hot air inside the box to cool down. The combination of fins and several cooling grooves facilitates the heat dissipation of the heat dissipation surface of the semiconductor cooling fin to improve the cooling efficiency. The first fan introduces the outside air into the inside of the box to accelerate the circulation of the air inside the box. The second fan To discharge the hot air inside the box to improve the heat dissipation efficiency, and then improve the high temperature resistance of the box.

优选的,所述第二风扇内壁的一侧固定安装有温控开关,所述第一风扇、半导体制冷片和第二风扇均通过温控开关与外接电源电性连接,通过温控开关来对箱体内部的温度进行检测。Preferably, a temperature control switch is fixedly installed on one side of the inner wall of the second fan, and the first fan, the semiconductor cooling chip and the second fan are all electrically connected to an external power supply through the temperature control switch, and the temperature control switch is used to control the temperature. The temperature inside the box is detected.

优选的,所述半导体制冷片的散热面固定设置有若干个均匀分布散热翅片,若干个所述散热翅片的顶端均开设有若干个均匀分布的散热槽,通过若干个散热翅片和若干个散热槽的配合设置便于对半导体制冷片散热面的散热,来提高制冷效率。Preferably, the heat dissipation surface of the semiconductor refrigeration sheet is fixedly provided with several uniformly distributed heat dissipation fins, and several uniformly distributed heat dissipation grooves are provided on the tops of the several heat dissipation fins, through which several heat dissipation fins and several The matching arrangement of the two heat dissipation grooves facilitates the heat dissipation of the heat dissipation surface of the semiconductor refrigeration sheet to improve the cooling efficiency.

优选的,所述箱体两侧的中部均开设有若干个散热窗,若干个所述散热窗的内部均固定设置有防尘网,通过防尘网的设置能够避免灰尘进入箱体的内部。Preferably, several heat dissipation windows are provided in the middle of both sides of the box body, and dust-proof nets are fixedly installed inside the several heat dissipation windows, so that dust can be prevented from entering the interior of the box body through the arrangement of the dust-proof nets.

优选的,两个所述安装座远离第一风扇的一侧均固定设置有隔尘网,隔尘网的设置能够起到隔绝灰尘的作用。Preferably, the sides of the two mounting bases far away from the first fan are fixedly provided with dust-proof nets, and the arrangement of the dust-proof nets can play a role of isolating dust.

优选的,所述箱体的正面铰接有密封门,所述密封门的中部开设有若干个均匀分布的散热孔,若干个散热孔的设置便于箱体的散热。Preferably, a sealed door is hinged on the front of the box, and several evenly distributed cooling holes are opened in the middle of the sealed door.

与现有技术相比,本实用新型的有益效果是:通过温控开关来对箱体内部的情况进行监测,通过半导体制冷片的制冷面产生冷空气来与箱体内部的热空气进行热交换,来起到降温的作用,通过若干个散热翅片和若干个散热槽的配合设置便于对半导体制冷片散热面的散热,来提高降温效率,通过第一风扇将外界空气导入箱体的内部,来加速箱体内部空气的流通,通过第二风扇来将箱体内部的热空气排出,来提高散热效率,进而提高箱体的耐高温性能。Compared with the prior art, the beneficial effect of the utility model is: the temperature control switch is used to monitor the inside of the box, and the cooling surface of the semiconductor refrigeration sheet generates cold air to exchange heat with the hot air inside the box , to play the role of cooling, through the cooperation of several heat dissipation fins and several heat dissipation grooves, it is convenient to dissipate heat from the heat dissipation surface of the semiconductor cooling fin, so as to improve the cooling efficiency, and the outside air is introduced into the inside of the box through the first fan, To accelerate the circulation of the air inside the box, the hot air inside the box is discharged through the second fan, so as to improve the heat dissipation efficiency, and then improve the high temperature resistance of the box.

附图说明Description of drawings

图1为本实用新型的立体图;Fig. 1 is the perspective view of the utility model;

图2为本实用新型的正面剖视图;Fig. 2 is the front sectional view of the utility model;

图3为本实用新型局部A的放大图。Fig. 3 is an enlarged view of part A of the utility model.

图中:1、箱体;2、散热窗;3、防尘网;4、安装座;5、隔尘网;6、第一风扇;7、通孔;8、半导体制冷片;9、散热翅片;10、散热槽;11、温控开关;12、第二风扇;13、卡槽;14、连接块;15、安装槽;16、限位弹片;17、限位槽;18、密封门;19、散热孔。In the figure: 1. Box body; 2. Heat dissipation window; 3. Dust-proof net; 4. Mounting seat; 5. Dust-proof net; 6. First fan; 7. Through hole; 8. Semiconductor cooling plate; Fin; 10, heat sink; 11, temperature control switch; 12, second fan; 13, card slot; 14, connection block; 15, installation slot; 16, limit shrapnel; 17, limit slot; 18, seal Door; 19, cooling holes.

具体实施方式Detailed ways

下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

请参阅图1-3,本实用新型提供了一种耐高温路灯机箱,包括箱体1,箱体1的顶端开设有通孔7,通孔7内侧的顶部开设有卡槽13,卡槽13的内部卡合安装有半导体制冷片8,半导体制冷片8的两侧均固定设置有连接块14,两个连接块14远离半导体制冷片8的一侧均开设有安装槽15,两个安装槽15的内部均设置有限位弹片16,卡槽13内壁的两侧均开设有限位槽17,箱体1一侧的顶部和箱体1另一侧的底部均设置有安装座4,两个安装座4内侧的一端分别固定安装有第一风扇6和第二风扇12,通过半导体制冷片8的制冷面产生冷空气来与箱体1内部的热空气进行热交换,来起到降温的作用,通过若干个散热翅片9和若干个散热槽10的配合设置便于对半导体制冷片8散热面的散热,来提高降温效率,通过第一风扇6将外界空气导入箱体1的内部,来加速箱体1内部空气的流通,通过第二风扇12来将箱体1内部的热空气排出,来提高散热效率,进而提高箱体1的耐高温性能。Please refer to Figures 1-3, the utility model provides a high temperature resistant street lamp chassis, including a box body 1, a through hole 7 is opened on the top of the box body 1, and a card slot 13 is opened on the top of the inner side of the through hole 7, and the card slot 13 The interior of the semiconductor refrigeration sheet 8 is snapped and installed, and the two sides of the semiconductor refrigeration sheet 8 are fixedly provided with connecting blocks 14, and the side of the two connecting blocks 14 away from the semiconductor refrigeration sheet 8 is provided with a mounting groove 15, and the two mounting grooves The inside of 15 is all provided with limit shrapnel 16, and both sides of draw-in groove 13 inner wall all offer limit groove 17, and the top of box body 1 one side and the bottom of box body 1 other side are all provided with mounting seat 4, two install A first fan 6 and a second fan 12 are respectively fixedly installed at one end of the inner side of the seat 4, and the cooling surface of the semiconductor cooling chip 8 generates cold air to exchange heat with the hot air inside the box body 1 to reduce the temperature. Through the cooperative arrangement of several heat dissipation fins 9 and several heat dissipation grooves 10, it is convenient to dissipate heat on the heat dissipation surface of the semiconductor refrigeration sheet 8 to improve the cooling efficiency, and the first fan 6 introduces the outside air into the inside of the box body 1 to accelerate the box The circulation of the air inside the body 1 uses the second fan 12 to discharge the hot air inside the box body 1 to improve heat dissipation efficiency and further improve the high temperature resistance performance of the box body 1 .

第二风扇12内壁的一侧固定安装有温控开关11,第一风扇6、半导体制冷片8和第二风扇12均通过温控开关11与外接电源电性连接,通过温控开关11来对箱体1内部的温度进行检测。One side of the inner wall of the second fan 12 is fixedly equipped with a temperature control switch 11, and the first fan 6, the semiconductor refrigeration sheet 8 and the second fan 12 are all electrically connected to an external power supply through the temperature control switch 11, and are controlled by the temperature control switch 11. The temperature inside the box body 1 is detected.

半导体制冷片8的散热面固定设置有若干个均匀分布散热翅片9,若干个散热翅片9的顶端均开设有若干个均匀分布的散热槽10,通过若干个散热翅片9和若干个散热槽10的配合设置便于对半导体制冷片8散热面的散热,来提高制冷效率。The heat dissipation surface of the semiconductor refrigeration sheet 8 is fixedly provided with several uniformly distributed heat dissipation fins 9, and the tops of the several heat dissipation fins 9 are provided with several uniformly distributed heat dissipation grooves 10, through which several heat dissipation fins 9 and several heat dissipation The cooperating arrangement of the groove 10 facilitates the heat dissipation of the heat dissipation surface of the semiconductor cooling sheet 8 to improve the cooling efficiency.

箱体1两侧的中部均开设有若干个散热窗2,若干个散热窗2的内部均固定设置有防尘网3,通过防尘网3的设置能够避免灰尘进入箱体1的内部。The middle part of both sides of the box body 1 is provided with several heat dissipation windows 2, and the interior of the several heat dissipation windows 2 is fixedly provided with dust-proof nets 3, which can prevent dust from entering the inside of the box body 1 by the setting of the dust-proof nets 3.

两个安装座4远离第一风扇6的一侧均固定设置有隔尘网5,隔尘网5的设置能够起到隔绝灰尘的作用。The sides of the two mounting bases 4 far away from the first fan 6 are fixedly provided with dust-proof nets 5 , which can function to isolate dust.

箱体1的正面铰接有密封门18,密封门18的中部开设有若干个均匀分布的散热孔19,若干个散热孔19的设置便于箱体1的散热。The front of the box body 1 is hinged with a sealed door 18, and the middle part of the sealed door 18 is provided with several evenly distributed heat dissipation holes 19, and the setting of the several heat dissipation holes 19 is convenient for the heat dissipation of the box body 1.

本申请实施例在使用时:通过温控开关11来对箱体1内部的情况进行监测,当箱体1内部温度达到一定值时,会触发温控开关11,来控制第一风扇6、半导体制冷片8和第二风扇12均通电开始工作,通过半导体制冷片8的制冷面产生冷空气来与箱体1内部的热空气进行热交换,来起到降温的作用,通过若干个散热翅片9和若干个散热槽10的配合设置便于对半导体制冷片8散热面的散热,来提高降温效率,通过第一风扇6将外界空气导入箱体1的内部,来加速箱体1内部空气的流通,通过第二风扇12来将箱体1内部的热空气排出,来提高散热效率,进而提高箱体1的耐高温性能,通过若干个散热窗2和若干个散热孔19的设置能够提高箱体1的散热效果。When the embodiment of the present application is in use: the temperature control switch 11 is used to monitor the internal conditions of the box body 1. When the temperature inside the box body 1 reaches a certain value, the temperature control switch 11 will be triggered to control the first fan 6, semiconductor Both the refrigerating sheet 8 and the second fan 12 are energized and start to work. The cooling surface of the semiconductor refrigerating sheet 8 generates cold air to exchange heat with the hot air inside the box body 1 to reduce the temperature. 9 and a plurality of cooling grooves 10 are arranged to facilitate the heat dissipation of the heat dissipation surface of the semiconductor cooling sheet 8 to improve the cooling efficiency, and the first fan 6 introduces the outside air into the inside of the box body 1 to accelerate the circulation of the air inside the box body 1 , the hot air inside the box body 1 is discharged through the second fan 12 to improve the heat dissipation efficiency, and then improve the high temperature resistance of the box body 1, and the setting of several heat dissipation windows 2 and several heat dissipation holes 19 can improve the heat dissipation efficiency of the box body. 1 cooling effect.

尽管参照前述实施例对本实用新型进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换,凡在本实用新型的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art can modify the technical solutions described in the aforementioned embodiments, or perform equivalent replacements for some of the technical features. Within the spirit and principles of the present utility model, any modification, equivalent replacement, improvement, etc. should be included in the protection scope of the present utility model.

Claims (6)

1. The utility model provides a high temperature resistant street lamp machine case, includes box (1), its characterized in that: through-hole (7) have been seted up on the top of box (1), draw-in groove (13) have been seted up at the top of through-hole (7) inboard, semiconductor refrigeration piece (8) are installed to the inside block of draw-in groove (13), the both sides of semiconductor refrigeration piece (8) are all fixed and are provided with connecting block (14), two mounting groove (15), two have all been seted up to one side that semiconductor refrigeration piece (8) were kept away from in connecting block (14) the inside of mounting groove (15) all is provided with spacing shell fragment (16), spacing groove (17) have all been seted up to the both sides of draw-in groove (13) inner wall, the top of box (1) one side and the bottom of box (1) opposite side all are provided with mount pad (4), two there are first fan (6) and second fan (12) mount pad (4) inboard one end difference fixed mounting.
2. The high-temperature resistant street lamp case as claimed in claim 1, wherein: one side fixed mounting of second fan (12) inner wall has temperature detect switch (11), first fan (6), semiconductor refrigeration piece (8) and second fan (12) all pass through temperature detect switch (11) and external power supply electric connection.
3. The high-temperature-resistant street lamp case as claimed in claim 1, wherein: the heat dissipation surface of the semiconductor refrigeration piece (8) is fixedly provided with a plurality of uniformly distributed heat dissipation fins (9), and the top ends of the heat dissipation fins (9) are provided with a plurality of uniformly distributed heat dissipation grooves (10).
4. The high-temperature-resistant street lamp case as claimed in claim 1, wherein: the middle parts of the two sides of the box body (1) are respectively provided with a plurality of heat dissipation windows (2), and the insides of the heat dissipation windows (2) are respectively fixedly provided with a dust screen (3).
5. The high-temperature-resistant street lamp case as claimed in claim 1, wherein: two one sides of the installation seats (4) far away from the first fan (6) are fixedly provided with dust separation nets (5).
6. The high-temperature-resistant street lamp case as claimed in claim 1, wherein: the front surface of the box body (1) is hinged with a sealing door (18), and a plurality of radiating holes (19) which are uniformly distributed are formed in the middle of the sealing door (18).
CN202221866977.8U 2022-07-19 2022-07-19 High-temperature-resistant street lamp case Expired - Fee Related CN217770766U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120313242A (en) * 2025-06-17 2025-07-15 合肥智测电子有限公司 A semiconductor constant temperature electric control box

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120313242A (en) * 2025-06-17 2025-07-15 合肥智测电子有限公司 A semiconductor constant temperature electric control box

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Granted publication date: 20221108