CN210610168U - Radiating assembly, electric cabinet and air conditioning unit - Google Patents
Radiating assembly, electric cabinet and air conditioning unit Download PDFInfo
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- CN210610168U CN210610168U CN201921506749.8U CN201921506749U CN210610168U CN 210610168 U CN210610168 U CN 210610168U CN 201921506749 U CN201921506749 U CN 201921506749U CN 210610168 U CN210610168 U CN 210610168U
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- cold
- heat dissipation
- heat
- dissipating
- electric cabinet
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- 238000004378 air conditioning Methods 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
- 238000005057 refrigeration Methods 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 238000001816 cooling Methods 0.000 claims description 54
- 230000005494 condensation Effects 0.000 abstract description 7
- 238000009833 condensation Methods 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- UQMRAFJOBWOFNS-UHFFFAOYSA-N butyl 2-(2,4-dichlorophenoxy)acetate Chemical compound CCCCOC(=O)COC1=CC=C(Cl)C=C1Cl UQMRAFJOBWOFNS-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a radiating component, an electric cabinet and an air conditioning unit. The heat dissipation assembly comprises a semiconductor refrigeration sheet, a cold dissipation structure and a heat dissipation structure. The semiconductor refrigeration piece comprises a refrigeration surface and a heat dissipation surface, the cold dissipation structure is arranged on the refrigeration surface and used for dissipating cold, and the heat dissipation structure is arranged on the heat dissipation surface and used for dissipating heat. This technical scheme gives off cold volume through the cold structure that looses, can treat radiating electrical components air around effectively and cool down, simultaneously because the cold structure that looses does not link to each other with the electrical components that treat the heat dissipation, the condensation water that looses the cold structural production also is difficult for falling on the electrical components that treat the heat dissipation, has guaranteed electrical safety.
Description
Technical Field
The utility model relates to a radiator technical field particularly, relates to a radiator unit and electric cabinet and air conditioning unit.
Background
With the continuous development of industrial technology, people have higher and higher requirements on air conditioning units. The protection level requirement of the electric cabinet of the air conditioning unit is higher and higher, the sealing performance of the electric cabinet is better and better, and the heat dissipation of the electric cabinet becomes a primary problem. If the heating value of the components in the electric control box can not be timely reduced below a limit value, the electric components can lose efficacy due to high temperature, and the operation stability and reliability of the air conditioning unit are reduced.
At present, in order to solve the heat dissipation problem of the electrical component, a technical scheme of dissipating heat of the electrical component by means of a semiconductor refrigeration piece is provided, the refrigeration surface of the semiconductor refrigeration piece is directly attached to the surface of the electrical component to be dissipated, and a good heat dissipation effect can be achieved on the electrical component to be dissipated.
However, based on the refrigeration effect of the semiconductor refrigeration sheet, in an environment with a relatively high temperature, condensation water is easily generated on the refrigeration surface of the semiconductor refrigeration sheet, and then the condensation water easily falls on an electrical component to be cooled, so that the electrical safety problem is caused.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a radiator unit and electric cabinet and air conditioning unit to the condensation water that radiator unit exists among the solution prior art falls easily and treats radiating electrical apparatus part and cause the electrical safety problem.
An embodiment of the present application provides a heat dissipation assembly, including: the semiconductor refrigerating sheet comprises a refrigerating surface and a radiating surface; the cold dissipation structure is arranged on the refrigerating surface and used for dissipating cold; and the heat dissipation structure is arranged on the heat dissipation surface and used for dissipating heat.
In one embodiment, the cold dissipating structure includes cold dissipating fins mounted on the refrigerated surface.
In one embodiment, the cooling structure further comprises a cooling fan, and the cooling fan is arranged adjacent to the cooling fins.
In one embodiment, the air inlet surface of the cooling fan is opposite to the cooling fins, and the air outlet surface of the cooling fan is opposite to the cooling fins.
In one embodiment, the heat dissipating structure includes a heat sink mounted on the heat dissipating surface.
In one embodiment, the heat dissipation structure further comprises a heat dissipation fan disposed adjacent to the heat sink.
The application also provides an electric cabinet, including radiator unit, radiator unit is above-mentioned radiator unit, and the electric cabinet includes the casing, and the semiconductor refrigeration piece is installed on the casing, and the cold structure that looses is located the inside of casing, and the heat radiation structure is located the outside of casing.
In one embodiment, the electric cabinet is provided with a mounting hole, the semiconductor refrigeration piece is mounted on the mounting hole, the refrigeration surface is located inside the shell, and the heat dissipation surface is located outside the shell.
In one embodiment, the electric cabinet further comprises a fixing piece, and the semiconductor chilling plate is installed on the installation hole through the fixing piece.
The application also provides an air conditioning unit, which comprises the electric cabinet.
In the above embodiment, the semiconductor cooling plate transfers heat from the cooling surface to the heat dissipation surface during operation, the heat on the cooling dissipation structure installed on the cooling surface is transferred to the heat dissipation surface, and then the heat on the heat dissipation surface is dissipated by the heat dissipation structure, so that the cooling dissipation structure can dissipate cold to perform low-temperature air cooling heat dissipation on the electrical component to be cooled. This technical scheme gives off cold volume through the cold structure that looses, can treat radiating electrical components air around effectively and cool down, simultaneously because the cold structure that looses does not link to each other with the electrical components that treat the heat dissipation, the condensation water that looses the cold structural production also is difficult for falling on the electrical components that treat the heat dissipation, has guaranteed electrical safety.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:
fig. 1 is a schematic structural diagram of an embodiment of a heat dissipation assembly according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.
Fig. 1 shows an embodiment of the heat dissipation assembly of the present invention, which includes a semiconductor cooling fin 10, a cooling structure 20 and a heat dissipation structure 30. The semiconductor refrigeration piece 10 comprises a refrigeration surface and a heat dissipation surface, the cold dissipation structure 20 is installed on the refrigeration surface and used for dissipating cold, and the heat dissipation structure 30 is installed on the heat dissipation surface and used for dissipating heat.
Use the technical scheme of the utility model, semiconductor refrigeration piece 10 is at the working process and migrates the cooling surface with the heat of refrigeration face, installs the heat on the cold structure 20 that looses of refrigeration face also can be transferred and migrate the cooling surface, and the heat on the cooling surface is distributed out by heat radiation structure 30 again, and cold structure 20 that looses just can give off cold volume and treat radiating electrical apparatus part and carry out the low temperature air cooling heat dissipation. This technical scheme gives off cold volume through cold structure 20 that looses, can treat radiating electrical components air around effectively and cool down, simultaneously because cold structure 20 that looses does not link to each other with the electrical components that treat the heat dissipation, the condensation water that produces on the cold structure 20 that looses also is difficult for falling on the electrical components that treat the heat dissipation, has guaranteed electrical safety.
As a preferred embodiment, the cooling structure 20 comprises cooling fins 21, and the cooling fins 21 are mounted on the cooling surface. The volume of the air contact can be increased through the cooling dissipation sheet 21, and the cooling effect on the air is enhanced. More preferably, as shown in fig. 1, the cooling structure 20 further includes a cooling fan 22, and the cooling fan 22 is disposed adjacent to the cooling fins 21. The air flow near the cooling fins 21 can be accelerated by the cooling fan 22, and the cooling efficiency of the cooling fins 21 to the air is improved.
Preferably, in the technical solution of this embodiment, an air inlet surface of the cooling fan 22 is opposite to the cooling fins 21, and an air outlet surface of the cooling fan 22 is opposite to the cooling fins 21. Therefore, the cooling fan 22 can transmit the cooling capacity of the cooling fins 21 to the electrical components to be cooled in time, so as to rapidly cool the electrical components to be cooled.
Alternatively, as shown in fig. 1, the heat dissipation structure 30 includes a heat sink 31, and the heat sink 31 is mounted on the heat dissipation surface. The heat sink 31 can increase the volume in contact with air, thereby enhancing the heat dissipation effect. More preferably, as shown in fig. 1, the heat dissipation structure 30 further includes a heat dissipation fan 32, and the heat dissipation fan 32 is disposed adjacent to the heat dissipation fins 31. The heat dissipation fan 32 accelerates the air flow near the heat dissipation fins 31, thereby improving the heat dissipation efficiency of the heat dissipation fins 31.
The cooling fins 21 and the cooling fins 31 may be fin-type heat exchangers, or may be heat exchangers having other structures.
The utility model also provides an electric cabinet, this electric cabinet include foretell radiator unit, and the electric cabinet includes casing 40, and semiconductor refrigeration piece 10 is installed on casing 40, and cold structure 20 that looses is located casing 40's inside, and heat radiation structure 30 is located casing 40's outside. When the cooling device is used, the semiconductor cooling plate 10 transfers heat of the cooling surface to the heat dissipation surface when in work, the heat on the cooling structure 20 located inside the shell 40 is also transferred to the heat dissipation surface, the heat is dissipated out of the shell 40 by the heat dissipation structure 30 located outside the shell 40, and the cooling structure 20 can dissipate cold to perform low-temperature air cooling heat dissipation on the electric appliance component to be cooled inside the shell 40. This technical scheme can cool down the air around the inside electrical components that treat the heat dissipation of casing 40 effectively, simultaneously because the structure 20 that looses cold does not link to each other with the electrical components that treat the heat dissipation, the condensation water that produces on the structure 20 that looses cold also is difficult for falling on the electrical components that treat the heat dissipation, has guaranteed the electrical safety of electric cabinet.
As an optional implementation manner, a mounting hole is formed in the electric cabinet, the semiconductor refrigeration piece 10 is mounted on the mounting hole, the refrigeration surface is located inside the housing 40, and the heat dissipation surface is located outside the housing 40. Preferably, the electric cabinet further comprises a fixing member 50, and the semiconductor chilling plate 10 is mounted on the mounting hole through the fixing member 50.
The electrical components in the electrical cabinet are environmentally demanding and the wet environment may cause irreparable damage to the components. Meanwhile, dust in the environment is too much, enters the electric cabinet and is continuously accumulated on the circuit board and the electrical components, short circuit and the like are possible to happen, and the reliability of the unit is reduced. By adopting the technical scheme of the electric cabinet, extra ventilation holes do not need to be formed in the electric cabinet for heat dissipation, the electric cabinet can adopt a fully-closed design, the dustproof and moistureproof grade is improved, the temperature in the electric cabinet can also be reduced, the influence of the environment on internal electric parts is greatly reduced, the service life of the electric parts is prolonged, and the operation stability and the reliability of the air conditioning unit are ensured.
As another alternative embodiment, the cooling fins 10 may be mounted inside the casing 40, the heat dissipation surface may be attached to the inside of the casing 40, and the casing 40 may be cooled by the heat dissipation structure 30 outside the casing 40.
The utility model also provides an air conditioning unit, this air conditioning unit include foretell electric cabinet. By adopting the electric cabinet, the stability, reliability and safety of the operation of the electric control system of the air conditioning unit can be ensured.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and it will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A heat sink assembly, comprising:
the semiconductor refrigeration piece (10) comprises a refrigeration surface and a heat dissipation surface;
the cold dissipation structure (20) is arranged on the refrigerating surface and used for dissipating cold;
a heat dissipating structure (30) mounted on the heat dissipating surface for dissipating heat.
2. The heat dissipating assembly of claim 1, wherein the cold dissipating structure (20) comprises cold dissipating fins (21), the cold dissipating fins (21) being mounted on the refrigerated surface.
3. The heat dissipating assembly of claim 2, wherein the cold dissipating structure (20) further comprises a cold dissipating fan (22), the cold dissipating fan (22) being disposed adjacent to the cold dissipating fins (21).
4. The heat dissipation assembly of claim 3, wherein the air inlet surface of the cooling fan (22) is opposite to the cooling fins (21), and the air outlet surface of the cooling fan (22) is opposite to the cooling fins (21).
5. The heat dissipating assembly of claim 1, wherein the heat dissipating structure (30) comprises a heat sink (31), the heat sink (31) being mounted on the heat dissipating surface.
6. The heat dissipation assembly of claim 5, wherein the heat dissipation structure (30) further comprises a heat dissipation fan (32), the heat dissipation fan (32) being disposed adjacent to the heat sink (31).
7. An electric cabinet comprising a heat dissipating assembly, characterized in that the heat dissipating assembly is as claimed in any one of claims 1 to 6, the electric cabinet comprising a housing (40), the semiconductor chilling plate (10) being mounted on the housing (40), the cold dissipating structure (20) being located inside the housing (40), the heat dissipating structure (30) being located outside the housing (40).
8. The electric cabinet according to claim 7, characterized in that the electric cabinet is provided with a mounting hole, the semiconductor refrigeration sheet (10) is mounted on the mounting hole, the refrigeration surface is located inside the housing (40), and the heat dissipation surface is located outside the housing (40).
9. The electric cabinet according to claim 8, characterized in that the electric cabinet further comprises a fixing member (50), and the semiconductor chilling plate (10) is mounted on the mounting hole through the fixing member (50).
10. An air conditioning unit comprising an electric cabinet, characterized in that the electric cabinet is according to any one of claims 7 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921506749.8U CN210610168U (en) | 2019-09-09 | 2019-09-09 | Radiating assembly, electric cabinet and air conditioning unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921506749.8U CN210610168U (en) | 2019-09-09 | 2019-09-09 | Radiating assembly, electric cabinet and air conditioning unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210610168U true CN210610168U (en) | 2020-05-22 |
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ID=70686809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921506749.8U Active CN210610168U (en) | 2019-09-09 | 2019-09-09 | Radiating assembly, electric cabinet and air conditioning unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210610168U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519970A (en) * | 2019-09-09 | 2019-11-29 | 珠海格力电器股份有限公司 | Radiating assembly, electric cabinet and air conditioning unit |
-
2019
- 2019-09-09 CN CN201921506749.8U patent/CN210610168U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519970A (en) * | 2019-09-09 | 2019-11-29 | 珠海格力电器股份有限公司 | Radiating assembly, electric cabinet and air conditioning unit |
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